CN111238277A - Flat heat pipe with composite liquid absorption core structure - Google Patents
Flat heat pipe with composite liquid absorption core structure Download PDFInfo
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- CN111238277A CN111238277A CN202010022998.0A CN202010022998A CN111238277A CN 111238277 A CN111238277 A CN 111238277A CN 202010022998 A CN202010022998 A CN 202010022998A CN 111238277 A CN111238277 A CN 111238277A
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- cover plate
- upper cover
- heat pipe
- lower cover
- flat
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/043—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure forming loops, e.g. capillary pumped loops
Abstract
The application discloses dull and stereotyped heat pipe with compound wick structure includes: an upper cover plate and a lower cover plate; the upper cover plate and the lower cover plate are respectively used as a condensation end and an evaporation end of the flat heat pipe; the upper cover plate and the lower cover plate are sealed through a sealing ring, and a cavity capable of containing two-phase working media is formed between the upper cover plate and the lower cover plate; the sealing ring is provided with a liquid filling port; a supporting structure for supporting is arranged between the upper cover plate and the lower cover plate; the inner surface of the upper cover plate is provided with a hydrophilic and hydrophobic composite micro-nano structure; the inner surface of the lower cover plate is provided with a liquid absorption core structure. The invention effectively improves the heat transfer performance and the burn-out limit, and can meet the heat dissipation requirement of the current high-power electronic product.
Description
Technical Field
The application relates to the technical field of electronic product heat dissipation, in particular to a flat heat pipe with a composite liquid absorption core structure.
Background
With the development of microelectronic technology and the progress of electronic product industry, the performance of electronic products is continuously improved, the frequency of updating is also continuously accelerated, and accordingly, the heat dissipation problem which needs to be solved urgently is solved. For example, when a mobile phone plays a large-scale game, the screen of the mobile phone is hot, which affects user experience, and problems caused by insufficient heat dissipation, such as overheating and burning of a computer CPU display card, are more common. Therefore, the manufacturers must consider safety, stability and comfort issues while ensuring the performance of the electronic products. The traditional heat dissipation mode of electronic products is natural convection cooling, and this mode can only satisfy low-power electronic device's heat dissipation demand, and to present high performance smart mobile phone, 4K surpasses clear display screen even 8K, and natural cooling's mode is difficult to competed far away, so need seek a more efficient heat dissipation mode now.
The heat pipe technology originated in the united states in 1963, which makes full use of the principle of heat conduction and the property of rapid heat transfer of phase-change media to rapidly transfer heat from a heat-generating object to the outside of a heat source through a heat pipe, and the heat transfer capacity of the heat pipe exceeds that of any known metal. At present, heat pipes are widely used in fields such as electronic products, automobiles, aerospace and solar thermal utilization, and in order to meet heat dissipation requirements and product structure compactness in different fields, various branches are derived from the heat pipes, such as loop heat pipes with long-distance heat transport capability, pulsating heat pipes with ultrahigh heat conductivity, and flat heat pipes capable of adapting to miniaturization of electronic products and flat shapes of chips.
The flat heat pipe is mainly characterized by flat shape and two-dimensional heat conduction, and compared with the traditional columnar heat pipe, the flat evaporation section of the flat heat pipe can be well matched with the chip, so that the thermal contact resistance between the flat evaporation section and the chip is greatly reduced. Compared with the traditional one-dimensional heat conduction of the columnar heat pipe, the flat heat pipe is added with radial heat conduction besides axial heat conduction, and the heat dissipation performance of the heat pipe can be greatly improved by matching with a larger heat dissipation surface of the flat heat pipe. The flat heat pipe has the advantages that the flat heat pipe is one of the best methods for solving the heat dissipation problem of the electronic product, but the heat transfer performance and the burn-out limit of the conventional flat heat pipe are lower at present, and the heat dissipation requirement of the conventional high-power electronic product is difficult to meet.
Disclosure of Invention
The embodiment of the application provides a flat heat pipe with a composite liquid absorption core structure, so that the heat transfer performance and the burn-out limit are effectively improved, and the heat dissipation requirement of the current high-power electronic product can be further met.
In view of the above, the present application provides a flat heat pipe with a composite wick structure, comprising: an upper cover plate and a lower cover plate;
the upper cover plate and the lower cover plate are respectively used as a condensation end and an evaporation end of the flat heat pipe;
the upper cover plate and the lower cover plate are sealed through a sealing ring, and a cavity capable of containing two-phase working media is formed between the upper cover plate and the lower cover plate;
the sealing ring is provided with a liquid filling port;
a supporting structure for supporting is arranged between the upper cover plate and the lower cover plate;
the inner surface of the upper cover plate is provided with a hydrophilic and hydrophobic composite micro-nano structure;
the inner surface of the lower cover plate is provided with a liquid absorption core structure.
Optionally, the hydrophilic and hydrophobic composite micro-nano structure comprises a super-hydrophilic micro-structure and a super-hydrophobic micro-structure;
the super-hydrophilic microstructures are distributed on the super-hydrophobic microstructures at intervals.
Optionally, the super-hydrophobic microstructure is a bionic multistage micro-nano structure.
Optionally, the superhydrophobic microstructure is disposed on an inner surface of the upper cover plate by electroplating.
Optionally, a wave-shaped bulge is arranged on the inner surface of the upper cover plate;
the super-hydrophobic microstructures are arranged on the outer surfaces of the wavy bulges, and the included angle between the wavy bulges and the horizontal plane is larger than the rolling angle of the surfaces of the super-hydrophobic microstructures;
the super-hydrophilic microstructures are located at the vertexes of the wavy bulges.
Optionally, the wick structure comprises a first wick and a second wick;
the first liquid absorbing core and the second liquid absorbing core are both of porous structures.
Optionally, the first wick is positioned above the second wick and has a porosity that is lower than the porosity of the second wick.
Optionally, the support structure comprises a plurality of support columns;
the supporting columns are uniformly distributed between the upper cover plate and the lower cover plate, the upper ends of the supporting columns are connected with the upper cover plate, and the lower ends of the supporting columns are connected with the lower cover plate.
Optionally, the support column is a cylindrical copper column.
Optionally, the upper cover plate and the lower cover plate are both made of copper.
According to the technical scheme, the embodiment of the application has the following advantages: the flat heat pipe comprises an upper cover plate and a lower cover plate, wherein the upper cover plate and the lower cover plate are respectively used as a condensation end and an evaporation end of the flat heat pipe, the upper cover plate and the lower cover plate are sealed through a sealing ring, a cavity capable of containing two-phase working media is formed between the upper cover plate and the lower cover plate, a liquid filling port is formed in the sealing ring, and a supporting structure is arranged between the upper cover plate and the lower cover plate, so that the supporting effect can be achieved, and the flat heat pipe is prevented from being deformed under pressure after being; the inner surface of the upper cover plate is provided with a hydrophilic and hydrophobic composite micro-nano structure, and the inner surface of the lower cover plate is provided with a liquid absorption core structure. The hydrophilic and hydrophobic composite micro-nano structure is formed on the inner surface of the upper cover plate after surface treatment, so that the size and the separation frequency of condensed liquid drops can be effectively controlled, the inner surface of a condensation end is kept in a bead-shaped condensation state, the thermal resistance of condensation heat transfer is greatly reduced, the condensation heat transfer in the flat heat pipe and the backflow effect of working media can be enhanced, the heat transfer performance and the dry burning limit of the flat heat pipe are effectively improved, and the heat dissipation requirement of the current high-power electronic product can be further met.
Drawings
Fig. 1 is a schematic structural diagram of a flat heat pipe having a composite wick structure according to an embodiment of the present application;
FIG. 2 is an exploded view of a flat plate heat pipe having a composite wick structure according to an embodiment of the present application;
FIG. 3 is a cross-sectional view of the upper cover plate of FIG. 2 taken along line A-A;
FIG. 4 is an enlarged schematic view of the surface topography of the upper cover plate in an embodiment of the present application;
FIG. 5 is a schematic distribution diagram of support columns in the embodiment of the present application;
wherein the reference numerals are:
1-upper cover plate, 2-lower cover plate, 3-liquid filling port, 4-sealing ring, 5-second liquid absorption core, 6-first liquid absorption core, 7-support column, 11-wave-shaped bulge, 12-super-hydrophobic microstructure and 13-super-hydrophilic microstructure.
Detailed Description
In order to make the technical solutions of the present application better understood, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
Unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are intended to be inclusive and mean, for example, that they may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.
One embodiment of a flat heat pipe with a composite wick structure is provided, and is described with particular reference to fig. 1.
The flat heat pipe having a composite wick structure in this embodiment includes: upper cover plate 1 and lower apron 2, upper cover plate 1 and lower apron 2 are as dull and stereotyped heat pipe's condensation end and evaporating end respectively, upper cover plate 1 is sealed through sealing ring 4 with lower apron 2, and constitute the cavity that can hold double-phase working medium between upper cover plate 1 and the lower apron 2, be provided with on the sealing ring 4 and fill liquid mouth 3, be provided with the bearing structure who is used for playing the supporting role between upper cover plate 1 and the lower apron 2, be provided with hydrophilic hydrophobic compound micro-nano structure on the internal surface of upper cover plate 1, the internal surface of lower apron 2 is provided with the imbibition core structure.
It should be noted that: the flat heat pipe comprises an upper cover plate 1 and a lower cover plate 2, wherein the upper cover plate 1 and the lower cover plate 2 are respectively used as a condensation end and an evaporation end of the flat heat pipe, the upper cover plate 1 and the lower cover plate 2 are sealed through a sealing ring 4, a cavity capable of containing two-phase working media is formed between the upper cover plate 1 and the lower cover plate 2, a liquid filling port 3 is formed in the sealing ring 4, and a supporting structure is arranged between the upper cover plate 1 and the lower cover plate 2, so that the supporting effect can be achieved, and the flat heat pipe is prevented from being deformed under pressure after being; the inner surface of the upper cover plate 1 is provided with a hydrophilic and hydrophobic composite micro-nano structure, and the inner surface of the lower cover plate 2 is provided with a liquid absorption core structure. The hydrophilic and hydrophobic composite micro-nano structure is formed on the inner surface of the upper cover plate 1 after surface treatment, so that the size and the separation frequency of condensed liquid drops can be effectively controlled, the inner surface of a condensation end is kept in a bead-shaped condensation state, the thermal resistance of condensation heat transfer is greatly reduced, the condensation heat transfer in the flat heat pipe and the reflux effect of a working medium can be enhanced, the heat transfer performance and the burnout limit of the flat heat pipe are effectively improved, and the heat dissipation requirement of the current high-power electronic product can be further met.
The above is a first embodiment of a flat heat pipe with a composite wick structure provided in the embodiments of the present application, and the following is a second embodiment of a flat heat pipe with a composite wick structure provided in the embodiments of the present application, specifically referring to fig. 1 to 5.
The flat heat pipe having a composite wick structure in this embodiment includes: the upper cover plate 1 and the lower cover plate 2, the upper cover plate 1 and the lower cover plate 2 are respectively used as a condensation end and an evaporation end of the flat heat pipe, the upper cover plate 1 and the lower cover plate 2 are sealed through a sealing ring 4, a cavity capable of containing two-phase working media is formed between the upper cover plate 1 and the lower cover plate 2, and a liquid filling port 3 is formed in the sealing ring 4 and used for filling the working media; a supporting structure for supporting is arranged between the upper cover plate 1 and the lower cover plate 2, a hydrophilic and hydrophobic composite micro-nano structure is arranged on the inner surface of the upper cover plate 1, and a liquid absorption core structure is arranged on the inner surface of the lower cover plate 2.
Specifically, the upper cover plate 1 can be manufactured by precision milling or stamping, and the upper cover plate 1, the lower cover plate 2, the sealing ring 4 and the liquid filling port 3 are welded together under certain pressure and in a protective gas environment. And performing primary tightness inspection before liquid filling, then performing vacuum pumping, liquid filling and sealing on the flat heat pipe, and finally performing tightness inspection and performance test on the finished heat pipe.
The hydrophilic and hydrophobic composite micro-nano structure comprises a super-hydrophilic micro-structure 13 and a super-hydrophobic micro-structure 12, wherein the super-hydrophilic micro-structures 13 are distributed on the super-hydrophobic micro-structure 12 at intervals, namely the super-hydrophobic micro-structure 12 is used as a substrate, and the super-hydrophilic micro-structures 13 are uniformly distributed in the super-hydrophobic micro-structure 12; the super-hydrophilic microstructures 13 can increase the nucleation speed in the condensation process and reduce the initial supercooling degree of condensation.
The super-hydrophobic microstructure 12 is a bionic multistage micro-nano structure, and adopts a bionic multistage micro-nano structure similar to a lotus leaf, so that the working medium has a large static contact angle and a small rolling angle on the surface.
The superhydrophobic microstructure 12 is arranged on the inner surface of the upper cover plate 1 in an electroplating manner, and is formed in the electroplating manner, so that the superhydrophobic microstructure has high physical and chemical stability, and it can be understood that: the superhydrophobic microstructure 12 can also be formed by chemical deposition or other methods, which are not limited herein.
As shown in fig. 3 and 4, a wave-shaped protrusion 11 is arranged on the inner surface of the upper cover plate 1, a super-hydrophobic microstructure 12 is arranged on the outer surface of the wave-shaped protrusion 11, an included angle between the wave-shaped protrusion 11 and a horizontal plane is larger than a rolling angle of the surface of the super-hydrophobic microstructure 12, and a super-hydrophilic microstructure 13 is located at the vertex of the wave-shaped protrusion 11, that is, the peak of the upper cover plate 1 is subjected to hydrophilic treatment, wherein the super-hydrophobic microstructure 12 at the peak is removed by polishing, and then hydrogen peroxide is used for oxidation to form the super-hydrophilic microstructure 13.
It should be noted that: the wavy bulge 11 is used for providing a rolling angle for condensed liquid drops, and combined with the super-hydrophobic micro structure 12 (micro-nano scale) on the surface of the slope, the liquid drops can be promoted to roll and fall off, condensed liquid drops along the way can be taken away in the process, and then the formed liquid drops are prevented from accumulating to form a film, so that the wavy bulge 11 is a surface structure (millimeter scale) for promoting the liquid drops to roll. The inner surface of the upper cover plate 1 (condensation end) is machined to form a millimeter-sized wavy bulge 11 structure, and the included angle between a wavy inclined plane and the substrate is larger than the rolling angle of the working medium on the surface of the super-hydrophobic microstructure 12, so that liquid drops can more easily leave the inner surface of the condensation end, the formation of film-shaped condensation is inhibited, and the backflow supplement of the liquid working medium to the evaporation end is accelerated.
As shown in fig. 2, the wick structure comprises a first wick 6 and a second wick 5, and both the first wick 6 and the second wick 5 are porous structures; the first liquid absorbing core 6 is positioned above the second liquid absorbing core 5, and the porosity of the first liquid absorbing core 6 is lower than that of the second liquid absorbing core 5; the second liquid absorbing core 5 and the first liquid absorbing core 6 are formed by sequentially sintering copper powder with different purposes, and the porosity of the bottom layer is higher than that of the top layer.
Specifically, the lower cover plate 2 is a polished optical plate, and a second liquid absorption core 5 with high porosity and a first liquid absorption core 6 with low porosity are sequentially sintered on the lower cover plate 2. The lower cover plate 2 is cleaned before sintering, then the lower cover plate is buckled on a sintering mold filled with metal powder, each bolt is locked, then the clamp is turned over at 180 degrees, the whole clamp is sintered in a sintering furnace under protective gas, the sintering temperature is 800 degrees, the sintering time is 60 minutes, finally, the sintered powder is adhered to the metal cover plate under the action of gravity to form a liquid absorption core structure, after the first sintering is completed and cooled to the room temperature, the steps are repeated, the sintering of a second layer of copper powder is completed on the surface of a first layer of copper powder, and the diameters of the copper powder used in the two sintering processes are respectively 30 micrometers and 90 micrometers.
It should be noted that: two layers of porous structures with different porosities are sintered on the inner surface of the lower cover plate 2 (evaporation end) to serve as liquid absorbing cores, the porosity difference exists between the two layers of porous structures, the capillary force difference between the two layers of porous structures can be enabled to form capillary driving force for the backflow of working media, meanwhile, the porous structures are almost connected with the upper cover plate 1, and when liquid drops formed on the inner surface of the condensation end are larger than the gap size and contact with the first liquid absorbing core 6, the liquid drops can be rapidly transported to an evaporation center along the capillary pressure difference direction.
It can be understood that: the liquid absorption core structure can also adopt a multilayer structure with more than two layers, namely the liquid absorption core structure comprises the multilayer liquid absorption cores, the porosity of each layer of liquid absorption core is different, so that the capillary force is different, the capillary force difference can be used as the power for driving the working medium to flow back, and the two-layer structure is preferably adopted in consideration of the whole thickness and the manufacturing cost.
As shown in fig. 5, the supporting structure includes a plurality of support columns 7, a plurality of support columns 7 evenly distributed are at upper cover plate 1 and under between apron 2, and the upper end and the upper cover plate 1 of support column 7 are connected, the lower extreme is connected with apron 2 down, it is concrete, a plurality of support columns 7 mainly distribute at the position that is close to the centre of a circle between upper cover plate 1 and under apron 2, play the supporting role, prevent that dull and stereotyped heat pipe from collapsing under the negative pressure effect, the cross-sectional area of support column 7 is as little as possible in order to avoid the hindrance of supporting structure to gaseous state working medium diffusion simultaneously, thereby guarantee the temperature uniformity nature of dull.
Specifically, the upper cover plate 1 and the lower cover plate 2 are both made of copper.
The above embodiments are only used for illustrating the technical solutions of the present application, and not for limiting the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions in the embodiments of the present application.
Claims (10)
1. A flat heat pipe having a composite wick structure, comprising: an upper cover plate and a lower cover plate;
the upper cover plate and the lower cover plate are respectively used as a condensation end and an evaporation end of the flat heat pipe;
the upper cover plate and the lower cover plate are sealed through a sealing ring, and a cavity capable of containing two-phase working media is formed between the upper cover plate and the lower cover plate;
the sealing ring is provided with a liquid filling port;
a supporting structure for supporting is arranged between the upper cover plate and the lower cover plate;
the inner surface of the upper cover plate is provided with a hydrophilic and hydrophobic composite micro-nano structure;
the inner surface of the lower cover plate is provided with a liquid absorption core structure.
2. The flat plate heat pipe with a composite wick structure according to claim 1, wherein the hydrophilic and hydrophobic composite micro-nano structure comprises a super-hydrophilic micro-structure and a super-hydrophobic micro-structure;
the super-hydrophilic microstructures are distributed on the super-hydrophobic microstructures at intervals.
3. The flat plate heat pipe with the composite wick structure according to claim 2, wherein the superhydrophobic microstructure is a biomimetic multi-level micro-nano structure.
4. A flat-plate heat pipe with a composite wick structure according to claim 2, wherein the superhydrophobic microstructure is disposed on the inner surface of the upper cover plate by electroplating.
5. A flat-plate heat pipe with a composite wick structure according to claim 2, wherein the inner surface of the upper cover plate is provided with wave-shaped protrusions;
the super-hydrophobic microstructures are arranged on the outer surfaces of the wavy bulges, and the included angle between the wavy bulges and the horizontal plane is larger than the rolling angle of the surfaces of the super-hydrophobic microstructures;
the super-hydrophilic microstructures are located at the vertexes of the wavy bulges.
6. A flat-plate heat pipe having a composite wick structure according to claim 1, wherein the wick structure comprises a first wick and a second wick;
the first liquid absorbing core and the second liquid absorbing core are both of porous structures.
7. A flat panel heat pipe having a composite wick structure according to claim 6, wherein the first wick is located above the second wick and has a porosity that is lower than the porosity of the second wick.
8. A flat-plate heat pipe having a composite wick structure according to claim 1, wherein the support structure comprises a plurality of support columns;
the supporting columns are uniformly distributed between the upper cover plate and the lower cover plate, the upper ends of the supporting columns are connected with the upper cover plate, and the lower ends of the supporting columns are connected with the lower cover plate.
9. A flat panel heat pipe having a composite wick structure according to claim 8, wherein the support columns are cylindrical copper columns.
10. A flat-plate heat pipe with a composite wick structure according to claim 1, wherein the upper cover plate and the lower cover plate are both made of copper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202010022998.0A CN111238277A (en) | 2020-01-09 | 2020-01-09 | Flat heat pipe with composite liquid absorption core structure |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010022998.0A CN111238277A (en) | 2020-01-09 | 2020-01-09 | Flat heat pipe with composite liquid absorption core structure |
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| CN111238277A true CN111238277A (en) | 2020-06-05 |
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| CN202010022998.0A Pending CN111238277A (en) | 2020-01-09 | 2020-01-09 | Flat heat pipe with composite liquid absorption core structure |
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Cited By (5)
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| CN113008060A (en) * | 2021-03-16 | 2021-06-22 | 北京航空航天大学 | Flat heat pipe with one-way heat conduction and controllable opening degree |
| CN113782874A (en) * | 2021-08-13 | 2021-12-10 | 哈尔滨工业大学（深圳） | Power battery thermal management system |
| WO2022033289A1 (en) * | 2020-08-10 | 2022-02-17 | 深圳市顺熵科技有限公司 | Flat plate heat pipe and manufacturing method therefor, and heat exchanger |
| TWI782668B (en) * | 2021-08-19 | 2022-11-01 | 國立臺北科技大學 | Vaporizing plate and its modified manufacturing method |
| TWI798146B (en) * | 2021-08-19 | 2023-04-01 | 國立臺北科技大學 | Vapor chamber and manufacturing method thereof |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113782874B (en) * | 2021-08-13 | 2023-11-10 | 哈尔滨工业大学（深圳） | Power battery thermal management system |
| TWI782668B (en) * | 2021-08-19 | 2022-11-01 | 國立臺北科技大學 | Vaporizing plate and its modified manufacturing method |
| TWI798146B (en) * | 2021-08-19 | 2023-04-01 | 國立臺北科技大學 | Vapor chamber and manufacturing method thereof |
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