CN114857967B

CN114857967B - Ultrathin vapor chamber, preparation method thereof and electronic equipment

Info

Publication number: CN114857967B
Application number: CN202210541525.0A
Authority: CN
Inventors: 周峰; 周敬之; 周国辉; 淮秀兰
Original assignee: Institute of Engineering Thermophysics of CAS
Current assignee: Institute of Engineering Thermophysics of CAS
Priority date: 2022-05-17
Filing date: 2022-05-17
Publication date: 2024-04-16
Anticipated expiration: 2042-05-17
Also published as: CN114857967A

Abstract

The present disclosure provides an ultra-thin vapor chamber, comprising: the periphery of the upper shell plate (1) and the lower shell plate (4) are welded to form a closed cavity; the liquid injection pipe (2) is arranged on the closed cavity and is used for vacuumizing the closed cavity and injecting liquid into the closed cavity; the liquid suction core structure (3) is arranged inside the closed cavity, the liquid suction core structure (3) comprises a central liquid suction core (31) and a plurality of channel-shaped liquid suction cores (32) which are distributed on two sides of the liquid suction core (31) and are arranged in parallel, the channel-shaped liquid suction cores (32) form liquid reflux channels, a steam diffusion channel (33) is formed between every two adjacent channel-shaped liquid suction cores (32), the central liquid suction core (31) and the channel-shaped liquid suction cores (32) are composed of a first liquid suction core (34) and a second liquid suction core (35) which are overlapped, the direction of the second liquid suction core (35) is indicated along the first liquid suction core (34), the porosity of the liquid suction core structure (3) is in gradient change, and the surface of the liquid suction core structure forms a super-hydrophilic nano structure.

Description

Ultrathin vapor chamber, preparation method thereof and electronic equipment

Technical Field

The disclosure relates to the technical field of soaking plates, in particular to an ultrathin soaking plate, a preparation method thereof and electronic equipment.

Background

In recent years, portable electronic products are continuously developed towards high integration and miniaturization, the heat dissipation requirement of electronic chips in a limited space is higher and higher, and the development of novel efficient heat dissipation technology is crucial to the development of electronic products. The vapor chamber is used as a phase change heat transfer element to realize two-dimensional plane heat transfer, has the advantages of high heat transfer efficiency, strong vapor chamber performance, high reliability and the like, and is widely applied to various large heat dissipation fields at present. However, as the thickness of the vapor chamber is continuously reduced, particularly when the thickness is less than 3mm, the internal vapor diffusion thermal resistance is greatly increased, so that the thermal resistance is increased and the heat transfer limit is obviously reduced. In addition, the ultra-thin vapor chamber makes the manufacturing process complicated, increases the manufacturing cost, and reduces the overall mechanical strength. The wick serves as a core component of the vapor chamber and mainly plays a role in transporting condensed liquid to an evaporation center through capillary action. When condensate cannot flow back to the evaporation center in time and local burn-out occurs, the vapor chamber reaches the capillary limit. Therefore, the wick structure determines the critical heat flux density of the ultra-thin soaking plate to a large extent.

The traditional single-aperture liquid suction core structure is difficult to meet the design requirements of large capillary force and high permeability, and a great number of students have carried out a lot of work on the structural design and optimization of the liquid suction core, such as the heat transfer limit of a vapor chamber is improved through the technologies of a homogeneous/heterogeneous composite liquid suction core, a double-layer evaporation end liquid suction core, a nano liquid suction core and the like. However, the complex composite structure and the nano technology are not beneficial to the ultrathin development of the vapor chamber, and the manufacturing cost is increased, so that the mass industrial production of the ultrathin vapor chamber is not beneficial. In view of the above, the existing ultrathin vapor chamber still has a plurality of defects, and the design of the ultrathin vapor chamber with excellent heat transfer performance, easy processing and manufacturing and high mechanical strength is still a very important and significant research topic at present.

Disclosure of Invention

In view of the foregoing technical problem, a first aspect of the present disclosure provides an ultrathin vapor chamber, including: the periphery of the upper shell plate and the lower shell plate are welded to form a closed cavity; the liquid injection pipe is arranged on the closed cavity and is used for vacuumizing the closed cavity and injecting liquid into the closed cavity; the liquid suction core structure is arranged in the closed cavity and comprises a central liquid suction core and a plurality of channel-shaped liquid suction cores which are distributed on two sides of the liquid suction core and are arranged in parallel, the channel-shaped liquid suction cores form liquid return channels, a vapor diffusion channel is formed between every two adjacent channel-shaped liquid suction cores, the central liquid suction core and the channel-shaped liquid suction cores are composed of a first liquid suction core and a second liquid suction core which are stacked, the first liquid suction core points to the second liquid suction core along the direction of the first liquid suction core, and the porosity of the liquid suction core structure changes in a gradient mode.

According to the embodiment of the disclosure, a divergent vapor diffusion space is reserved between one end of the channel-shaped liquid suction core, which is far away from the central liquid suction core, and the inner wall of the closed chamber.

According to an embodiment of the present disclosure, a layer of super hydrophilic nanostructures is formed on a surface of a wick structure.

According to an embodiment of the present disclosure, the upper and lower shells are subjected to superhydrophobic treatment.

According to an embodiment of the present disclosure, the wick structure is welded to the periphery of the upper and lower shells.

In accordance with embodiments of the present disclosure, wherein the manner of welding the wick structure to the upper and lower shell plates comprises one or more of induction welding, molecular diffusion welding, brazing.

According to an embodiment of the present disclosure, the wick structure is comprised of a porous medium sintered from a metal powder or wire mesh or foam metal.

According to embodiments of the present disclosure, wherein the porosity of the wick structure is 20% to 80%.

According to an embodiment of the present disclosure, wherein the material of the upper and lower shells comprises a thermally conductive and solderable metal or an alloy of metal compositions.

According to an embodiment of the present disclosure, the thickness of the wick structure is 0.1mm to 0.7mm; the thickness of the upper shell plate and the lower shell plate is 0.05 mm-0.2 mm.

A second aspect of the present disclosure provides a method for preparing an ultrathin vapor chamber, including: manufacturing an upper shell plate and a lower shell plate, and performing super-hydrophobic treatment on the upper shell plate and the lower shell plate; manufacturing a liquid suction core structure and performing super-hydrophilic treatment on the liquid suction core structure; sintering the wick structure on the upper shell plate; welding the periphery of the upper shell plate and the lower shell plate with the liquid suction core structure together, and reserving a liquid filling port; and welding the liquid injection pipe at the reserved liquid filling port, and vacuumizing and liquid injection treatment are carried out on the soaking plate through the liquid filling port to obtain the ultrathin soaking plate.

The third aspect of the disclosure provides an electronic device, including a working module and a heat dissipation module, where the heat dissipation module includes an ultrathin vapor chamber as described above, or includes an ultrathin vapor chamber prepared by using a method as described above, where the ultrathin vapor chamber is used for dissipating heat from the working module.

According to the ultrathin vapor chamber provided by the embodiment of the disclosure, the following technical effects can be achieved:

The liquid suction core structure is arranged to be a central liquid suction core and a plurality of channel-shaped liquid suction cores which are distributed on two sides of the liquid suction core and are arranged in parallel, the channel-shaped liquid suction cores form liquid reflux channels, and steam diffusion channels are formed between the adjacent channel-shaped liquid suction cores, so that the separation of gas and liquid channels of working media is realized, the flow resistance of liquid and steam is reduced, and the problem of gas and liquid turbulence in the porous structure inside the ultrathin vapor chamber is solved. Meanwhile, the liquid suction core structure is set to be a double-layer liquid suction core, and the porosity of the double-layer liquid suction core is changed in a gradient manner, so that the capillary performance of the liquid suction core structure is excellent, the detachment and the growth of bubbles in a porous medium can be effectively promoted, the gas-liquid conversion efficiency in the vapor chamber is enhanced, the contradiction problem between the capillary force and the permeability in a single-core absorption structure is solved, and the heat transfer limit of the ultrathin vapor chamber is further improved.

Further, a gradually-expanding type steam diffusion space is reserved between one end of the channel-shaped liquid suction core far away from the central liquid suction core and the inner wall of the closed cavity, so that the internal limited space of the ultrathin vapor chamber is utilized to the maximum extent, and the problem that the steam diffusion thermal resistance is increased sharply after the vapor chamber is ultrathin is solved.

Furthermore, the liquid absorption core structure is provided with a layer of super-hydrophilic nano structure, so that the comprehensive capillary performance of the liquid absorption core structure can be further improved, the bubble dynamics in the porous medium can be effectively promoted, the contradiction problem between the capillary force and the permeability in the single absorption core structure can be solved, and the heat transfer limit of the ultrathin vapor chamber can be further improved. By performing superhydrophobic treatment on the upper shell plate and the lower shell plate, liquid film accumulation is prevented, and gas-liquid circulation inside the vapor-liquid soaking plate is accelerated.

In addition, the liquid absorption core is simple in structure, and is directly fixedly welded with the upper shell plate and the lower shell plate, a support column is not needed, and ultrathin development of the vapor chamber is facilitated.

Drawings

The above and other objects, features and advantages of the present disclosure will become more apparent from the following description of embodiments thereof with reference to the accompanying drawings in which:

fig. 1 schematically illustrates a structural exploded view of an ultra-thin vapor chamber based on an ultra-hydrophilic gradient wick according to an embodiment of the present disclosure.

Fig. 2 schematically illustrates a block diagram of a wick structure according to an embodiment of the present disclosure.

Fig. 3 schematically illustrates a block diagram of a wick structure according to another embodiment of the present disclosure.

Fig. 4 schematically illustrates an SEM image of a first wick according to an embodiment of the present disclosure.

Fig. 5 schematically illustrates an SEM image of a second wick according to an embodiment of the present disclosure.

Fig. 6 schematically illustrates an SEM image of a dual layer wick structure according to an embodiment of the present disclosure.

Fig. 7 schematically illustrates a flow chart of a method of fabricating ultra-thin soaking plates based on ultra-hydrophilic gradient wicks in accordance with an embodiment of the present disclosure

[ Reference numerals description ]

1-Upper shell plate, 2-filling pipe, 3-liquid suction core structure, 31-central liquid suction core, 32-channel liquid suction core, 33-vapor diffusion channel, 34-first liquid suction core, 35-second liquid suction core and 4-lower shell plate.

Detailed Description

For the purposes of promoting an understanding of the principles and advantages of the disclosure, reference will now be made to the embodiments illustrated in the drawings and specific language will be used to describe the same. It will be apparent that the described embodiments are some, but not all, of the embodiments of the present disclosure. Based on the embodiments in this disclosure, all other embodiments that a person of ordinary skill in the art would obtain without making any inventive effort are within the scope of protection of this disclosure.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. The terms "comprises," "comprising," and/or the like, as used herein, specify the presence of stated features, steps, operations, and/or components, but do not preclude the presence or addition of one or more other features, steps, operations, or components.

In the present disclosure, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; may be mechanically connected, may be electrically connected or may communicate with each other; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the terms in this disclosure will be understood by those of ordinary skill in the art as the case may be.

In the description of the present disclosure, it should be understood that the terms "longitudinal," "length," "circumferential," "front," "rear," "left," "right," "top," "bottom," "inner," "outer," and the like indicate an orientation or a positional relationship based on that shown in the drawings, merely to facilitate description of the present disclosure and to simplify the description, and do not indicate or imply that the subsystem or element being referred to must have a particular orientation, be configured and operated in a particular orientation, and thus should not be construed as limiting the present disclosure.

Like elements are denoted by like or similar reference numerals throughout the drawings. Conventional structures or constructions will be omitted when they may obscure the understanding of this disclosure. And the shape, size and position relation of each component in the figure do not reflect the actual size, proportion and actual position relation. In addition, in the present disclosure, any reference signs placed between parentheses shall not be construed as limiting the disclosure.

Similarly, in the foregoing description of exemplary embodiments of the disclosure, various features of the disclosure are sometimes grouped together in a single embodiment, figure, or description thereof for the purpose of streamlining the disclosure and aiding in the understanding of one or more of the various disclosed aspects. The description of the reference to the terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present disclosure. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present disclosure, the meaning of "a plurality" is at least two, such as two, three, etc., unless explicitly specified otherwise.

As shown in fig. 1, in an embodiment of the present disclosure, an ultra-thin vapor chamber based on an ultra-hydrophilic gradient wick may include, for example, an upper shell plate 1, a pour tube 2, a wick structure 3, and a lower shell plate 4. The peripheries of the upper shell plate 1 and the lower shell plate 4 are welded to form a closed cavity, and the liquid injection pipe 2 is arranged on the closed cavity and is suitable for vacuumizing the closed cavity and injecting liquid into the closed cavity. The wick structure 3 is disposed within the closed chamber.

As shown in fig. 2, in an embodiment of the present disclosure, the wick structure 3 includes a central wick 31 and a plurality of channel-shaped wicks 32 disposed in parallel on both sides of the central wick 31, the channel-shaped wicks 32 forming liquid return channels, and vapor diffusion channels 33 formed between adjacent channel-shaped wicks 32. Further, the plurality of channel-like wicks 32 may be, for example, uniformly distributed on both sides of the wick 31.

As shown in fig. 3, in another embodiment of the present disclosure, the central wick 31 and the channel-mounted wick 32 are each composed of a first wick 34 and a second wick 35 stacked, and the porosity of the wick structure 3 is graded along the direction in which the first wick 34 points toward the second wick 35. The porosity of the wick structure 3 may be, for example, 20% to 80%.

Fig. 4 schematically illustrates an SEM image of a first wick according to an embodiment of the present disclosure. Fig. 5 schematically illustrates an SEM image of a second wick according to an embodiment of the present disclosure. Fig. 6 schematically illustrates an SEM image of a dual layer wick structure according to an embodiment of the present disclosure.

As shown in fig. 4-6, the effective capillary pore size of the upper layer first wick 34 may be, for example, larger than the effective capillary pore size of the lower layer second wick 35, thereby exhibiting a gradient porosity characteristic in the vertical direction.

It should be appreciated that the effective capillary pore size of the upper first wick 34 may also be smaller than the effective capillary pore size of the lower second wick 35, for example, so as to exhibit a gradient porosity characteristic in the vertical direction.

With continued reference to fig. 2, in yet another embodiment of the present disclosure, a diverging vapor diffusion space may be reserved between the end of channel-like wick 32 remote from central wick 31 and the inner wall of the closed chamber. For example, the length of the channel-like wick 32 in the middle is gradually increased to both sides to form a "V" shape as shown in FIG. 2, thereby reserving a diverging vapor diffusion space.

It should be understood that the diverging steam diffusion space is not limited to "V" shape, for example, inverted "V" shape, and diagonal line shape may be used, so long as the diverging steam diffusion space is reserved, and the specific shape is not limited in the disclosure.

Further, in an embodiment of the present disclosure, the surface of the wick structure 3 is formed with a layer of super-hydrophilic nano-structure, which may be generated by a physical or chemical method, for example, and is used to enhance the capillary transport capability of the wick and improve the gas-liquid contact area. The upper shell plate 1 and the lower shell plate 4 can be subjected to super-hydrophobic treatment, for example, the treatment mode can be a physical or chemical method, and the upper shell plate and the lower shell plate after the super-hydrophobic treatment can prevent liquid films from accumulating and accelerate gas-liquid circulation in the vapor-liquid soaking plate.

Further, in yet another embodiment of the present disclosure, the wick structure 3 may be welded to the periphery of the upper shell plate 1 and the lower shell plate 4 by, for example, one or more of induction welding, molecular diffusion welding, and brazing. The liquid suction core structure is directly fixed and welded with the upper shell plate and the lower shell plate, so that a support column is not required for the liquid suction core structure, and the ultrathin development of the vapor chamber is facilitated.

Still further, in yet another embodiment of the present disclosure, the wick structure 3 may be constructed of, for example, porous media of different materials, different mesh numbers of metal powders, or wire mesh sintered or foam metal bonded. Illustratively, a porous medium obtained by sintering a 200-5000 mesh metal powder or a 100-1000 mesh wire mesh may be employed. The thickness of the wick structure 3 may be, for example, 0.1mm to 0.7mm.

The material of the upper shell plate 1 and the lower shell plate 4 includes a heat conductive and solderable metal or an alloy of a metal composition, such as one of a metal having good heat conductivity and solderability such as stainless steel, copper, aluminum, and the like, and an alloy thereof. The thickness of the lower shell plate 4 may be, for example, 0.05mm to 0.2mm.

Furthermore, the working medium for ultra-thin vapor chamber operation based on ultra-hydrophilic gradient wicks may comprise, for example, one or more mixtures of the following materials: deionized water, acetone, methanol, ethanol, FC-72, ammonia, freon, and the like.

Based on the same inventive concept, the embodiment of the disclosure also provides a preparation method of the ultra-thin vapor chamber based on the ultra-hydrophilic gradient liquid suction core.

Fig. 7 schematically illustrates a flow chart of a method of fabricating ultra-thin soaking plates based on ultra-hydrophilic gradient wicks according to an embodiment of the disclosure.

As shown in fig. 7, the preparation method may include operations S701 to S705, for example.

In operation S701, the upper and lower shells 1 and 4 are manufactured, and the upper and lower shells 1 and 4 are subjected to superhydrophobic treatment.

In the embodiment of the disclosure, the upper shell plate and the lower shell plate can be manufactured in a linear cutting, stamping or etching forming mode, and then surface cleaning, degreasing and oxide layer removal are carried out to obtain the upper shell plate and the lower shell plate.

In some embodiments, for example, a superhydrophobic layer (such as teflon, for example only) may be generated on the surfaces of the upper and lower shell plates by an electroplating method, and the superhydrophobic layer may prevent the condensed working medium from forming a liquid film in the steam channel, and reduce thermal resistance, so that the condensate may flow back rapidly, and the temperature uniformity of the ultrathin vapor chamber may be effectively improved.

In operation S702, the wick structure 3 is fabricated and subjected to super-hydrophilic treatment.

In the embodiment of the present disclosure, the wick structure 3 formed by stacking the first wick 34 and the second wick 35 may be obtained by sintering metal powder or metal mesh or foam metal with different materials and different mesh numbers, the middle area of the wick structure 3 is not treated as the central wick 31, two sides of the central wick 31 are etched to obtain a plurality of channel-shaped wicks 32 arranged in parallel, the channel-shaped wicks 32 form a liquid backflow channel, and a vapor diffusion channel 33 is formed between adjacent channel-shaped wicks 32. In addition, a material with a proper mesh number can be selected according to actual needs to obtain the wick structure with different gradient distribution in the vertical direction, which is not limited herein.

In embodiments of the present disclosure, for example, the wick structure 3 obtained by the sintering process may be immersed in a hydrogen peroxide solution having a concentration of 15% for 4 hours, thereby generating a layer of super-hydrophilic nanostructures on the surface of the wick structure 3. It should be noted that, the method for forming the super-hydrophilic nano-layer on the surface of the wick structure 3 is not limited to the above-described manner, and other suitable manners may be adopted, and is not particularly limited.

In operation S703, the wick structure 3 is sintered on the upper-shell plate 1.

In operation S704, the periphery of the upper and lower shells 1, 4 is welded to the wick structure 3, and a filling port is reserved.

In operation S705, the liquid filling pipe 2 is welded to the reserved liquid filling port, the soaking plate is vacuumized and filled with liquid through the liquid filling port, the ultra-thin soaking plate is obtained, and then the surface of the ultra-thin soaking plate is cleaned and subjected to antioxidation treatment.

According to the scheme, the preparation of the liquid suction core structure is realized in a simple and efficient mode, the ultrathin limited space is efficiently utilized, the steam diffusion space is effectively increased, the gas-liquid flow resistance is reduced, the gas-liquid two-phase conversion efficiency is increased, the heat transfer resistance is reduced, and the temperature uniformity and the heat transfer efficiency of the ultrathin vapor chamber are improved. In addition, the upper surface and the lower surface of the integrated super-hydrophilic gradient liquid suction core structure are used for supporting the upper shell plate and the lower shell plate, support columns are not needed, the preparation process is simplified, and the mechanical performance is effectively improved.

It should be noted that, although the steps of the method are described above in a specific order, embodiments of the present disclosure are not limited thereto, and the steps may be performed in other orders as needed.

It should be understood that the method embodiment portion corresponds to the product embodiment portion, and specific implementation details and technical effects brought about by the method embodiment portion are similar or identical, and specific reference is made to the product embodiment portion, which is not described herein again.

The embodiment of the disclosure further provides an electronic device, which includes a working module and a heat dissipation module, wherein the heat dissipation module includes all the technical features of the ultrathin vapor chamber described above, and the description is omitted here. The ultrathin soaking plate is used for radiating heat of the working module.

While the foregoing embodiments have been described in some detail for purposes of clarity of understanding, it will be understood that the foregoing embodiments are merely illustrative of the invention and are not intended to limit the invention, and that any modifications, equivalents, improvements, etc. that fall within the spirit and principles of the present disclosure are intended to be included within the scope of the present disclosure.

Claims

1. An ultra-thin vapor chamber, comprising:

The device comprises an upper shell plate (1) and a lower shell plate (4), wherein the peripheries of the upper shell plate (1) and the lower shell plate (4) are welded to form a closed cavity;

The liquid injection pipe (2) is arranged on the closed cavity and is used for vacuumizing the closed cavity and injecting liquid into the closed cavity;

The liquid suction core structure (3) is arranged inside the closed cavity, the liquid suction core structure (3) comprises a central liquid suction core (31) and a plurality of channel-shaped liquid suction cores (32) which are distributed on two sides of the liquid suction core (31) and are arranged in parallel, the channel-shaped liquid suction cores (32) form liquid backflow channels, a vapor diffusion channel (33) is formed between the adjacent channel-shaped liquid suction cores (32), the central liquid suction core (31) and the channel-shaped liquid suction cores (32) are composed of a first liquid suction core (34) and a second liquid suction core (35) which are stacked, the first liquid suction core (34) points to the direction of the second liquid suction core (35), the porosity of the liquid suction core structure (3) is in gradient change, and a gradually-expanding vapor diffusion space is reserved between one end of the channel-shaped liquid suction core (32) away from the central liquid suction core (31) and the inner wall of the closed cavity.

2. Ultra-thin soaking plate according to claim 1, wherein the wick structure (3) is formed with a layer of ultra-hydrophilic nanostructures on its surface.

3. Ultra-thin soaking plate according to claim 1, wherein the upper (1) and lower (4) shells have been subjected to a superhydrophobic treatment.

4. Ultra-thin soaking plate according to claim 1, wherein a wick structure (3) is welded to the periphery of the upper shell plate (1) and the lower shell plate (4).

5. Ultra-thin soaking plate according to claim 4, wherein the welding of the wick structure (3) to the upper shell plate (1) and the lower shell plate (4) comprises one or more of induction welding, molecular diffusion welding, brazing.

6. Ultra-thin soaking plate according to claim 1, wherein the wick structure (3) is constituted by a metal powder or a porous medium sintered with a wire mesh or a foamed metal.

7. Ultra-thin soaking plate according to claim 1, wherein the porosity of the wick structure (3) is 20% -80%.

8. Ultra-thin soaking plate according to claim 1, wherein the material of the upper shell plate (1) and the lower shell plate (4) comprises a heat conductive and solderable metal or an alloy of said metal composition.

9. Ultrathin vapor chamber according to claim 1, wherein the thickness of the wick structure (3) is 0.1 mm-0.7 mm; the thicknesses of the upper shell plate (1) and the lower shell plate (4) are 0.05 mm-0.2 mm.

10. A method of producing an ultra-thin soaking plate according to any one of claims 1 to 9, comprising:

Manufacturing an upper shell plate (1) and a lower shell plate (4), and performing super-hydrophobic treatment on the upper shell plate (1) and the lower shell plate (4);

manufacturing a liquid suction core structure (3) and performing super-hydrophilic treatment on the liquid suction core structure (3);

Sintering the wick structure (3) on the upper shell plate (1);

welding the periphery of an upper shell plate (1) and a lower shell plate (4) with a liquid suction core structure (3) together, and reserving a liquid filling port;

And welding the liquid injection pipe (2) at the reserved liquid filling port, and vacuumizing and liquid injection treatment are carried out on the soaking plate through the liquid filling port to obtain the ultrathin soaking plate.

11. An electronic device comprising a working module and a heat-dissipating module, the heat-dissipating module comprising the ultra-thin soaking plate according to any one of claims 1 to 9, or comprising an ultra-thin soaking plate obtained by the manufacturing method according to claim 10, the ultra-thin soaking plate being used for dissipating heat from the working module.