CN114857967A

CN114857967A - Ultrathin soaking plate, preparation method thereof and electronic equipment

Info

Publication number: CN114857967A
Application number: CN202210541525.0A
Authority: CN
Inventors: 周峰; 周敬之; 周国辉; 淮秀兰
Original assignee: Institute of Engineering Thermophysics of CAS
Current assignee: Institute of Engineering Thermophysics of CAS
Priority date: 2022-05-17
Filing date: 2022-05-17
Publication date: 2022-08-05
Anticipated expiration: 2042-05-17
Also published as: CN114857967B

Abstract

The present disclosure provides an ultra-thin vapor chamber, comprising: the device comprises an upper shell plate (1) and a lower shell plate (4), wherein the peripheries of the upper shell plate (1) and the lower shell plate (4) are welded to form a closed cavity; the liquid injection pipe (2) is arranged on the closed cavity and is used for vacuumizing the closed cavity and injecting liquid into the closed cavity; wick structure (3), locate airtight cavity inside, wherein, wick structure (3) are including central wick (31) and distribute in wick (31) both sides and many channel form wicks (32) of parallel arrangement, channel form wick (32) form liquid backflow passageway, form vapor diffusion passageway (33) between the adjacent channel form wick (32), central wick (31) and channel form wick (32) constitute by first wick (34) and second wick (35) of establishing of folding, indicate the direction of second wick (35) along first wick (34), the porosity of wick structure (3) is gradient change and the super hydrophilic nanostructure of surface formation.

Description

Ultrathin soaking plate, preparation method thereof and electronic equipment

Technical Field

The disclosure relates to the technical field of vapor chamber, in particular to an ultrathin vapor chamber, a preparation method thereof and electronic equipment.

Background

In recent years, portable electronic products are continuously developed towards high integration and miniaturization, the heat dissipation requirement of electronic chips in a limited space is higher and higher, and the development of a novel efficient heat dissipation technology is crucial to the development of electronic products. The vapor chamber is used as a phase-change heat transfer element to realize two-dimensional plane heat transfer, has the advantages of high heat transfer efficiency, strong temperature equalization performance, high reliability and the like, and is widely applied to various heat dissipation fields at present. However, as the thickness of the soaking plate is reduced, particularly when the thickness is less than 3mm, the internal steam diffusion thermal resistance is increased sharply, so that the thermal resistance is increased, and the heat transfer limit is reduced remarkably. Further, the thinning of the soaking plate makes the manufacturing process complicated, increases the manufacturing cost, and also lowers the overall mechanical strength. The liquid absorbing core is used as a core part of the vapor chamber and mainly plays a role in transporting condensed liquid to an evaporation center through capillary action. When the condensate cannot flow back to the evaporation center in time and local drying occurs, the vapor chamber reaches the capillary limit. The wick structure thus determines to a large extent the critical heat flux density of ultra-thin vapor chambers.

The traditional wick structure with a single pore diameter is difficult to meet the design requirements of large capillary force and high permeability at the same time, and a large number of students have already carried out a lot of work on the structural design and optimization of the wick, such as improving the heat transfer limit of the vapor chamber by using the technologies of homogeneous/heterogeneous composite wick, double-layer evaporation end wick, nano wick and the like. However, the complex composite structure and nanotechnology are not conducive to the ultra-thinning development of the soaking plate, and the manufacturing cost thereof is increased to be not conducive to the mass industrial production of the ultra-thin soaking plate. In summary, the existing ultra-thin soaking plate still has many defects, and designing the ultra-thin soaking plate with excellent heat transfer performance, easy processing and manufacturing and high mechanical strength is still a very important and significant research subject at present.

Disclosure of Invention

In view of the above technical problem, a first aspect of the present disclosure provides an ultra-thin soaking plate, including: the periphery of the upper shell plate and the lower shell plate are welded to form a closed cavity; the liquid injection pipe is arranged on the closed cavity and used for vacuumizing the closed cavity and injecting liquid into the closed cavity; wick structure, locate inside airtight cavity, wherein, wick structure includes central wick and distributes in wick both sides and parallel arrangement's many channel form wicks, channel form wick forms liquid reflux channel, form the vapor diffusion passageway between the adjacent channel form wick, central wick and channel form wick constitute by first wick and the second wick of overlapping establishing, along the direction of the directional second wick of first wick, the porosity of wick structure is the gradient and changes.

According to the embodiment of the disclosure, a gradually expanding vapor diffusion space is reserved between one end of the channel-shaped liquid absorption core, which is far away from the central liquid absorption core, and the inner wall of the closed chamber.

According to an embodiment of the present disclosure, a layer of superhydrophilic nanostructures is formed on a surface of the wick structure.

According to an embodiment of the present disclosure, wherein the upper and lower shells are subjected to a superhydrophobic treatment.

According to an embodiment of the present disclosure, the wick structure is welded to the periphery of the upper and lower shell plates.

According to an embodiment of the present disclosure, the welding of the wick structure to the upper and lower shell plates includes one or more of induction welding, molecular diffusion welding, and brazing.

According to an embodiment of the present disclosure, the wick structure is comprised of a porous medium sintered from a metal powder or a wire mesh or a metal foam.

According to embodiments of the present disclosure, wherein the porosity of the wick structure is between 20% and 80%.

According to an embodiment of the present disclosure, wherein the material of the upper and lower skin comprises a thermally conductive and weldable metal or alloy of metals.

According to an embodiment of the present disclosure, wherein the thickness of the wick structure is 0.1mm to 0.7 mm; the thickness of the upper shell plate and the lower shell plate is 0.05 mm-0.2 mm.

The second aspect of the present disclosure provides a method for manufacturing an ultrathin soaking plate, including: manufacturing an upper shell plate and a lower shell plate, and performing super-hydrophobic treatment on the upper shell plate and the lower shell plate; manufacturing a liquid absorption core structure and carrying out super-hydrophilic treatment on the liquid absorption core structure; sintering the wick structure on the upper shell plate; welding the peripheries of the upper shell plate and the lower shell plate with the liquid absorption core structure together, and reserving a liquid filling port; and welding the liquid injection pipe at the reserved liquid injection port, and vacuumizing and injecting the soaking plate through the liquid injection port to obtain the ultrathin soaking plate.

A third aspect of the present disclosure provides an electronic device, including a working module and a heat dissipation module, where the heat dissipation module includes the ultra-thin vapor chamber as described above, or includes the ultra-thin vapor chamber prepared by the method as described above, where the ultra-thin vapor chamber is used for dissipating heat from the working module.

According to the ultra-thin soaking plate provided by the embodiment of the disclosure, the following technical effects can be realized:

the liquid absorbing cores are arranged into a structure with central liquid absorbing cores and a plurality of channel-shaped liquid absorbing cores which are distributed on two sides of the liquid absorbing cores and arranged in parallel, the channel-shaped liquid absorbing cores form a liquid backflow channel, and a vapor diffusion channel is formed between every two adjacent channel-shaped liquid absorbing cores, so that the separation of a gas-liquid channel of a working medium is realized, the flowing resistance of liquid and vapor is reduced, and the problem of gas-liquid turbulence in the porous structure inside the ultrathin soaking plate is solved. Meanwhile, the liquid absorption core structure is set to be a double-layer liquid absorption core, and the porosity of the double-layer liquid absorption core is in gradient change, so that the capillary performance of the liquid absorption core structure is excellent, the separation and growth of bubbles in a porous medium can be effectively promoted, the gas-liquid conversion efficiency in the soaking plate is enhanced, the problem of contradiction between capillary force and permeability in a single wicking structure is solved, and the heat transfer limit of the ultrathin soaking plate is further improved.

Furthermore, a gradually expanding vapor diffusion space is reserved between one end, far away from the central liquid absorbing core, of the groove-shaped liquid absorbing core and the inner wall of the closed cavity, so that the limited space in the ultrathin soaking plate is utilized to the maximum extent, and the problem that the vapor diffusion thermal resistance is increased sharply after the soaking plate is thinned is solved.

Furthermore, the liquid absorption core structure is provided with the super-hydrophilic nano structure, so that the comprehensive capillary performance of the liquid absorption core structure can be further improved, the bubble dynamics in the porous medium is effectively promoted, the problem of contradiction between capillary force and permeability in a single wicking structure is solved, and the heat transfer limit of the ultrathin soaking plate is further improved. The super-hydrophobic treatment is carried out on the upper shell plate and the lower shell plate, so that liquid films are prevented from accumulating, and gas-liquid circulation in the vapor chamber is accelerated.

In addition, the liquid absorption core is simple in structure, and is directly fixedly welded with the upper shell plate and the lower shell plate without supporting columns, so that the ultrathin development of the soaking plate is facilitated.

Drawings

The above and other objects, features and advantages of the present disclosure will become more apparent from the following description of embodiments of the present disclosure with reference to the accompanying drawings, in which:

fig. 1 schematically shows an exploded view of the structure of an ultra-thin vapor chamber based on an ultra-hydrophilic gradient wick according to an embodiment of the present disclosure.

Figure 2 schematically illustrates a structural view of a wick structure according to an embodiment of the disclosure.

Figure 3 schematically illustrates a block diagram of a wick structure according to another embodiment of the disclosure.

Figure 4 schematically shows an SEM image of a first liquid absorbent core according to an embodiment of the present disclosure.

Figure 5 schematically illustrates an SEM image of a second wick according to an embodiment of the present disclosure.

Figure 6 schematically illustrates an SEM image of a double-layer wick structure according to an embodiment of the disclosure.

Fig. 7 schematically shows a flow chart of a method for preparing an ultra-thin vapor chamber based on an ultra-hydrophilic gradient wick according to an embodiment of the disclosure

[ description of reference ]

1-upper shell plate, 2-liquid injection pipe, 3-liquid absorption core structure, 31-central liquid absorption core, 32-channel liquid absorption core, 33-vapor diffusion channel, 34-first liquid absorption core, 35-second liquid absorption core and 4-lower shell plate.

Detailed Description

For the purpose of promoting a better understanding of the objects, aspects and advantages of the present disclosure, reference is made to the following detailed description taken in conjunction with the accompanying drawings. It is to be understood that the described embodiments are only a few, and not all, of the disclosed embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments disclosed herein without making any creative effort, shall fall within the protection scope of the present disclosure.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. The terms "comprises," "comprising," and the like, as used herein, specify the presence of stated features, steps, operations, and/or components, but do not preclude the presence or addition of one or more other features, steps, operations, or components.

In the present disclosure, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integral; can be mechanically connected, electrically connected or can communicate with each other; either directly or indirectly through intervening media, either internally or in any other suitable relationship. The specific meaning of the above terms in the present disclosure can be understood by those of ordinary skill in the art as appropriate.

In the description of the present disclosure, it is to be understood that the terms "longitudinal," "length," "circumferential," "front," "rear," "left," "right," "top," "bottom," "inner," "outer," and the like are used in the orientation or positional relationship indicated in the drawings for convenience in describing the present disclosure and for simplicity in description, and are not intended to indicate or imply that the referenced subsystems or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present disclosure.

Throughout the drawings, like elements are represented by like or similar reference numerals. Conventional structures or constructions will be omitted when they may obscure the understanding of the present disclosure. And the shapes, sizes and positional relationships of the components in the drawings do not reflect the actual sizes, proportions and actual positional relationships. In addition, in the present disclosure, any reference signs placed between parentheses shall not be construed as limiting the present disclosure.

Similarly, in the above description of exemplary embodiments of the disclosure, various features of the disclosure are sometimes grouped together in a single embodiment, figure, or description thereof for the purpose of streamlining the disclosure and aiding in the understanding of one or more of the various disclosed aspects. Reference to the description of the terms "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the disclosure. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present disclosure, "a plurality" means at least two, e.g., two, three, etc., unless explicitly specifically limited otherwise.

As shown in fig. 1, in the disclosed embodiment, an ultra-thin vapor chamber based on ultra-hydrophilic gradient wicks may include, for example, an upper housing plate 1, a liquid injection pipe 2, a wick structure 3, and a lower housing plate 4. The peripheries of the upper shell plate 1 and the lower shell plate 4 are welded to form a closed chamber, and the liquid injection pipe 2 is arranged on the closed chamber and is suitable for vacuumizing the closed chamber and injecting liquid into the closed chamber. The wick structure 3 is provided inside the closed chamber.

As shown in fig. 2, in an embodiment of the present disclosure, the wick structure 3 includes a central wick 31 and a plurality of channel-shaped wicks 32 distributed on two sides of the central wick 31 and arranged in parallel, the channel-shaped wicks 32 form a liquid return channel, and a vapor diffusion channel 33 is formed between adjacent channel-shaped wicks 32. Further, a plurality of channel-shaped wicks 32 may be uniformly distributed on both sides of wick 31, for example.

Figure 3 schematically illustrates a structural view of a wick structure according to another embodiment of the disclosure.

In another embodiment of the present disclosure, as shown in fig. 3, the central wick 31 and the channel-mounted wick 32 are each composed of a first liquid-absorbing core 34 and a second wick 35 stacked together, and the porosity of the wick structure 3 varies in a gradient along the direction from the first liquid-absorbing core 34 to the second wick 35. The porosity of wick structure 3 may be, for example, 20% to 80%.

Figure 4 schematically shows an SEM image of a first liquid absorbent core according to an embodiment of the present disclosure. Figure 5 schematically illustrates an SEM image of a second wick according to an embodiment of the present disclosure. Figure 6 schematically illustrates an SEM image of a double-layer wick structure according to an embodiment of the disclosure.

As shown in fig. 4-6, the upper first wick 34 can illustratively have an effective capillary pore size that is greater than the effective capillary pore size of the lower second wick 35, thereby exhibiting a gradient porosity characteristic in the vertical direction.

It will be appreciated that the effective capillary pore size of the upper first wick 34 can also be smaller than the effective capillary pore size of the lower second wick 35, for example, to exhibit a gradient porosity characteristic in the vertical direction.

With continued reference to fig. 2, in yet another embodiment of the present disclosure, a gradually expanding vapor diffusion space may be reserved between one end of channel-shaped wick 32 away from central wick 31 and the inner wall of the sealed chamber. For example, the length of the middle channel-shaped wick 32 gradually increases toward both sides to form a V-shape as shown in fig. 2, thereby reserving a divergent vapor diffusion space.

It should be understood that the divergent vapor diffusion space is not limited to the "V" shape, such as an inverted "V" shape, but may be an oblique line shape, as long as the divergent vapor diffusion space is reserved, and the specific shape is not limited in this disclosure.

Further, in one embodiment of the present disclosure, the surface of the wick structure 3 is formed with a layer of superhydrophilic nanostructures, which may be generated by physical or chemical methods, for example, and which are used to enhance the capillary transport capability of the wick and improve the gas-liquid contact area. The upper shell plate 1 and the lower shell plate 4 can be subjected to super-hydrophobic treatment, for example, the treatment mode can be a physical or chemical method, and the super-hydrophobic treated upper shell plate and lower shell plate can prevent liquid films from accumulating and accelerate gas-liquid circulation in the soaking plate.

Further, in yet another embodiment of the present disclosure, wick structure 3 may be welded to the periphery of upper and

lower housing plates

1, 4, for example, by one or more of induction welding, molecular diffusion welding, and brazing. The mode of directly fixedly welding the liquid absorbing core structure and the upper and lower shell plates enables the liquid absorbing core structure to be free of supporting columns, and ultrathin development of the vapor chamber is facilitated.

Still further, in yet another embodiment of the present disclosure, wick structure 3 may be formed from, for example, different materials, different mesh sizes of metal powder, or a porous medium formed by sintering or foaming metal with a wire mesh. For example, metal powder of 200-5000 meshes or a porous medium obtained by sintering a metal wire mesh of 100-1000 meshes can be adopted. The thickness of wick structure 3 may be, for example, 0.1mm to 0.7 mm.

The material of the upper and

lower case plates

1 and 4 includes a heat conductive and weldable metal or an alloy of metals, such as stainless steel, copper, aluminum, and the like, which are excellent in heat conductivity and weldability, and one of their alloys. The thickness of the lower shell plate 4 may be, for example, 0.05mm to 0.2 mm.

In addition, working substances for working the ultrathin soaking plate based on the super-hydrophilic gradient wick can comprise one or more mixtures of the following materials: deionized water, acetone, methanol, ethanol, FC-72, ammonia, freon, and the like.

Based on the same inventive concept, the embodiment of the disclosure also provides a preparation method of the ultrathin soaking plate based on the super-hydrophilic gradient liquid absorption core.

Fig. 7 schematically shows a flow chart of a method for preparing an ultra-thin vapor chamber based on an ultra-hydrophilic gradient wick according to an embodiment of the disclosure.

As shown in fig. 7, the preparation method may include operations S701 to S705, for example.

In operation S701, the upper and

lower sheathing plates

1 and 4 are fabricated, and the upper and

lower sheathing plates

1 and 4 are subjected to superhydrophobic treatment.

In the embodiment of the present disclosure, the upper and lower shells may be manufactured by wire cutting, stamping or etching, and then surface cleaning, oil stain removal and oxidation layer are performed to obtain the upper and lower shells.

In some embodiments, for example, a super-hydrophobic layer (for example, teflon, only an example) may be further formed on the surfaces of the upper and lower casing plates by an electroplating method, and the super-hydrophobic layer may prevent the condensed working medium from forming a liquid film in the vapor channel, so as to reduce thermal resistance, thereby enabling the condensed liquid to rapidly flow back, and effectively improving the temperature equalization performance of the ultra-thin vapor chamber.

In operation S702, a wick structure 3 is fabricated and super-hydrophilic treatment is performed.

In the embodiment of the present disclosure, the wick structure 3 formed by stacking the first wick 34 and the second wick 35 may be obtained by sintering metal powder or metal wire mesh or sintering metal foam with different materials and different mesh numbers, the central region of the wick structure 3 is not processed to be used as the central wick 31, two sides of the central wick 31 are etched to obtain a plurality of channel-shaped wicks 32 arranged in parallel, the channel-shaped wicks 32 form a liquid return channel, and the vapor diffusion channel 33 is formed between the adjacent channel-shaped wicks 32. In addition, the wick structure with different gradient distributions in the vertical direction can be obtained by selecting materials with proper mesh number according to actual needs, which is not limited here.

In the disclosed embodiment, for example, wick structure 3 obtained by the sintering process may be immersed in a hydrogen peroxide solution having a concentration of 15% for 4 hours, so as to form a layer of superhydrophilic nanostructures on the surface of wick structure 3. It should be noted that the method for generating the superhydrophilic nano-layer on the surface of the wick structure 3 is not limited to the above-described method, and other suitable methods may be adopted, and is not particularly limited.

In operation S703, wick structure 3 is sintered onto upper shell plate 1.

In operation S704, the peripheries of the upper shell plate 1 and the lower shell plate 4 are welded to the wick structure 3, and a liquid filling port is reserved.

In operation S705, the liquid injection pipe 2 is welded at the reserved liquid injection port, the vapor chamber is vacuumized and subjected to liquid injection through the liquid injection port to obtain an ultrathin vapor chamber, and then the surface of the ultrathin vapor chamber is cleaned and subjected to antioxidant treatment.

According to the scheme of the embodiment of the invention, the liquid absorption core structure is prepared in a simple and efficient manner, the ultrathin limited space is efficiently utilized, the vapor diffusion space is effectively increased, the gas-liquid flow resistance is reduced, the gas-liquid two-phase conversion efficiency is increased, the heat transfer resistance is reduced, and the temperature equalizing performance and the heat transfer efficiency of the ultrathin vapor chamber are improved. In addition, the upper surface and the lower surface of the integrated super-hydrophilic gradient liquid absorption core structure are used for supporting the upper shell plate and the lower shell plate, supporting columns are not needed, the preparation process is simplified, and the mechanical performance is effectively improved.

It should be noted that although the steps of the method are described in a specific order, the embodiments of the present disclosure are not limited thereto, and the steps may be performed in other orders as needed.

It should be understood that the method embodiment corresponds to the product embodiment, and specific implementation details and technical effects are similar or identical to each other.

Embodiments of the present disclosure also provide an electronic device, which includes a working module and a heat dissipation module, where the heat dissipation module includes all the technical features of the ultrathin soaking plate described above, and is not described herein again. The ultrathin soaking plate is used for radiating the working module.

The above-mentioned embodiments are intended to illustrate the objects, aspects and advantages of the present disclosure in further detail, and it should be understood that the above-mentioned embodiments are only illustrative of the present disclosure and are not intended to limit the present disclosure, and any modifications, equivalents, improvements and the like made within the spirit and principle of the present disclosure should be included in the scope of the present disclosure.

Claims

1. An ultra-thin vapor chamber comprising:

the device comprises an upper shell plate (1) and a lower shell plate (4), wherein the peripheries of the upper shell plate (1) and the lower shell plate (4) are welded to form a closed cavity;

the liquid injection pipe (2) is arranged on the closed cavity and used for vacuumizing the closed cavity and injecting liquid into the closed cavity;

wick structure (3) are located inside the airtight cavity, wherein, wick structure (3) include central wick (31) and distribute in wick (31) both sides and parallel arrangement's many channel form wick (32), channel form wick (32) form liquid backflow passageway, form vapor diffusion passageway (33) between the adjacent channel form wick (32), central wick (31) with channel form wick (32) constitute by first wick (34) and second wick (35) of establishing of folding, follow first wick (34) are directional the direction of second wick (35), the porosity of wick structure (3) is the gradient and changes.

2. The ultra-thin vapor chamber according to claim 1, wherein a divergent vapor diffusion space is reserved between one end of the channel-shaped liquid absorbing core (32) far away from the central liquid absorbing core (31) and the inner wall of the closed chamber.

3. Ultra-thin vapor chamber according to claim 1, wherein the surface of the wick structure (3) is formed with a layer of ultra-hydrophilic nanostructures.

4. The ultra-thin vapor chamber according to claim 1, wherein the upper shell plate (1) and the lower shell plate (4) are super-hydrophobic treated.

5. Ultra-thin vapor chamber according to claim 1, wherein the wick structure (3) is welded to the periphery of the upper shell plate (1) and the lower shell plate (4).

6. Ultra-thin vapor chamber according to claim 5, wherein the welding of the wick structure (3) to the upper shell plate (1) and the lower shell plate (4) comprises one or more of induction welding, molecular diffusion welding, and brazing.

7. Ultra-thin vapor chamber according to claim 1, wherein the wick structure (3) is made of a porous medium sintered from metal powder or wire mesh or from foamed metal.

8. Ultra-thin vapor chamber according to claim 1, wherein the porosity of the wick structure (3) is comprised between 20% and 80%.

9. Ultra-thin vapor chamber according to claim 1, wherein the material of the upper shell plate (1) and the lower shell plate (4) comprises a thermally conductive and weldable metal or an alloy of said metals.

10. Ultra-thin vapor chamber according to claim 1, wherein the thickness of the wick structure (3) is comprised between 0.1mm and 0.7 mm; the thickness of the upper shell plate (1) and the lower shell plate (4) is 0.05 mm-0.2 mm.

11. A method of making an ultra-thin vapor chamber as claimed in any one of claims 1 to 10 comprising:

manufacturing an upper shell plate (1) and a lower shell plate (4), and performing super-hydrophobic treatment on the upper shell plate (1) and the lower shell plate (4);

manufacturing a liquid absorption core structure (3) and carrying out super-hydrophilic treatment on the liquid absorption core structure (3);

sintering the wick structure (3) on the upper shell plate (1);

welding the peripheries of the upper shell plate (1) and the lower shell plate (4) with the liquid absorption core structure (3) together, and reserving a liquid filling port;

and welding the liquid injection pipe (2) at the reserved liquid injection port, and vacuumizing and injecting liquid to the soaking plate through the liquid injection port to obtain the ultrathin soaking plate.

12. An electronic device comprising a working module and a heat dissipation module, the heat dissipation module comprising the ultra-thin vapor chamber according to any one of claims 1 to 10 or the ultra-thin vapor chamber obtained by the manufacturing method according to claim 11, the ultra-thin vapor chamber being used for dissipating heat from the working module.