CN106604607A - No-wick ultrathin heat pipe device - Google Patents
No-wick ultrathin heat pipe device Download PDFInfo
- Publication number
- CN106604607A CN106604607A CN201611050154.7A CN201611050154A CN106604607A CN 106604607 A CN106604607 A CN 106604607A CN 201611050154 A CN201611050154 A CN 201611050154A CN 106604607 A CN106604607 A CN 106604607A
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- Prior art keywords
- heat pipe
- channel
- hydrophobic
- hydrophilic
- liquid
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
Abstract
The invention discloses a no-wick ultrathin heat pipe device. A heat pipe is suitable for the cooling of a microelectonic device with the high heat flow intensity. The technical scheme of the invention is that inner wall surfaces of an ultrathin heat pipe are provided with a hydrophilic surface and a hydrophobic surface, which are prepared at an interval; an upper wall surface and a lower wall surface form a symmetric structure, and respectively form a hydrophilic channel region and a hydrophobic channel region; and self-wetting liquid serves as a working medium and is injected into the heat pipe. The hydrophobic channel region serves as a gaseous phase conveying channel of the working medium, and the hydrophilic channel region serves as a liquid phase backflow channel of the working medium. According to the invention, the device achieves the effective operation and high-efficiency heat transfer of the ultrathin heat pipe without a wick structure through the construction of the hydrophilic surface and the hydrophobic surface on the inner wall surfaces of the heat pipe and the application of the self-wetting liquid. The device is simple in structure, is small in thickness, and is high in heat transfer performance and drying limit.
Description
Technical field
The present invention relates to the cooling technical field of microelectronic component or smart mobile phone, specially a kind of super without liquid-sucking core
Thin heat-pipe apparatus.
Background technology
In recent years, with the fast development of technology, various information communication products are just realizing at an unprecedented rate height
Integrated and microminaturization, directly results in dramatically increasing for its work thermic load and unit area caloric value, has a strong impact on whole
The security reliability of system, shortens product service life, and becomes the important bottleneck of its development of restriction.By taking smart mobile phone as an example,
For computer heat radiation, its heat-dissipating space size significantly reduces, and radiating condition is more difficult, and to the portable of heat abstractor
Property also has bigger requirement.It is that modern electronics set and ultrathin heat pipe is the characteristics of have small volume, lightweight and high thermal conductivity
The radiating of standby (the particularly smart mobile phone of space structure highly compact) provides a kind of effective means.But, how in drop
Its high thermal conductivity is maintained while low-heat tube thickness, is a difficult problem urgently to be resolved hurrily in current ultrathin heat pipe research.Passing
In the ultrathin heat pipe of system, liquid sucting core structure is its crucial part, is the important prerequisite for realizing heat pipe effectively work.Such as public affairs
The number of opening proposes the ultrathin heat pipe that a kind of chamber is contained within groove and powder sintered portion for the patent of 103940274A, axially extending
Groove and the wire netting for adhering to thereon it is integral by sinter bonded, not only heat pipe sizes can significantly reduce, while also can
Enough ensure good heat transfer efficiency and stability.But, this kind of composite liquid sucking cored structure will also improve ultrathin heat pipe manufacturing process
Complexity and cost, and liquid sucting core structure does not allow heat pipe itself to produce certain deformation, therefore limits its application neck
Domain and the further reduction of size.Lewis etc. exists《Science Bulletin》Deliver on (2015,60 (7): 701-706)
" Microfabricated Ultra-thin All-polymer Thermal Ground Planes " text proposes one kind
The flexible ultra-thin heat pipe made using macromolecular material, and columnar arrays are produced on its surface by photoetching technique realize suction
The function of wick-containing structure, made heat pipe thickness is only 0.3mm, and with good heat transfer property and dryouies characteristic.But examine
Consider the bigger lifting of process costs and heat transfer property, find or realize liquid-sucking core using other eased practical methods and tie
The function of structure, has very high potential using value ultrathin heat pipe technical elements are promoted.
The content of the invention
For the deficiencies in the prior art, the invention provides one kind is without liquid-sucking core ultrathin heat pipe device, by certainly
The unique phase transformation shuttling movement in ultrathin heat pipe of wetting working medium realizes effective operation of heat pipe, and overcoming traditional ultrathin heat pipe needs
The restriction of complicated liquid sucting core structure so as to can preferably be applied to the radiating to microelectronic components such as smart mobile phone, intelligent watch
Cooling.
The present invention is to realize above-mentioned technical purpose by following technological means.
One kind is without liquid-sucking core ultrathin heat pipe device, it is characterised in that including heat pipe package, working medium,
The heat pipe package is closing housing, including evaporator section, adiabatic section, condensation segment；
The heat pipe package be provided with the side surface of condensation segment vacuumize/fill fluid apertures；
The evaporator section and condensation segment, including hydrophilic channel；The adiabatic section includes hydrophilic channel, hydrophobic channel；
There is transition of the hydrophobic surface regions to hydrophobic surface area in the intersection of the evaporator section, adiabatic section and condensation segment
Area, the internal face of heat pipe package is hydrophobe gradient energy surface, i.e. working medium connecing on the internal face of heat pipe package in transition region
Feeler changes from small to big and change in gradient, and heat pipe package internal face becomes hydrophobic hydrophobic surface regions by hydrophobic surface regions.
The adiabatic section is divided into three passages, and symmetrical two wing passage is hydrophilic channel, and center-aisle is dredged for single
The combination of aquaporin or the hydrophilic channel being spaced apart for several and hydrophobic channel；
Hydrophilic channel, the hydrophobic channel of the adiabatic section runs through along its length adiabatic section；
The hydrophilic channel is interconnected by evaporator section, adiabatic section, condensation segment.
The material of the heat pipe package is the metal material that easy processing is moulding, heat conductivility is strong, heat resistance and air-tightness are good
Or macromolecular material.
The heat pipe package, makes mutually corresponding water-wetted surface in the upper and lower surface for the heat pipe package of metal material
Region, hydrophobic surface area are so as to obtaining hydrophilic channel, hydrophobic channel；Or addition is applied in the upper and lower surface inside heat pipe package
Layer makes mutually corresponding hydrophobic surface regions, hydrophobic surface area so as to obtain hydrophilic channel, hydrophobic channel；Wherein, it is hydrophobic
Used as the vapor transportation space of heat pipe intraductal working medium, hydrophilic channel is then the liquid-phase reflux space of working medium to passage.
The working medium is, from wetting working medium, can to make its spontaneous from heat from the wetting inverse Marangani effects that have of working medium
The condensation segment of pipe is back to evaporator section, completes the phase transformation shuttling movement of working medium.The structure of close and distant aquaporin and certainly wetting working medium
Use, make ultrathin heat pipe that effectively operation is capable of achieving in the case of without the need for liquid sucting core structure；
The coating, in hydrophobic surface regions Nano-meter SiO_2 is used2Hydrophilic coating material, in hydrophobic surface area, using stone
Ink film has the organic siliconresin class nano paint or fluorine carbon type nano paint of self-cleaning characteristic.
The adiabatic section center-aisle, the channel width ratio that hydrophilic channel and hydrophobic channel are spaced successively is 1: 1 or 1: 2.
The shape of cross section of the heat pipe package is trapezoidal, rectangle or triangle.
When making without liquid-sucking core ultrathin heat pipe device, by with the hydrophobic surface regions and hydrophobic surface area being spaced apart
Two pieces of sheet metals in domain or macromolecule material film, by silver soldering, cementing or other related process by two pieces of symmetrical thin plates
Connect as one in engagement.Or directly produce hydrophobic surface regions and hydrophobic surface on the heat pipe package internal face of closing
Region, and it is made as ultrathin heat pipe by flattening technique.
The present invention has the advantage that and effect relative to prior art：
By using building hydrophobic surface regions and hydrophobic surface area from wetting liquid and on heat pipe package internal face,
Made ultrathin heat pipe device can just realize effectively work in the case of without the need for liquid sucting core structure, can greatly optimize life
Production. art simultaneously effectively reduces cost.The device not only can make the integral thickness of heat pipe thinner due to no liquid sucting core structure,
And more traditional ultrathin heat pipe has bigger vapour transport space, so as to improve the steam flow limit of intraductal working medium, edge is reduced
The thermograde of heat pipe length direction.Meanwhile, what the working medium of wetting certainly used can be spontaneous is back to evaporator section from condensation segment, the spy
Property can significantly improve the limit of dryouting of ultrathin heat pipe, make up Micro/Miniature Heat Pipes as during efficient heat transfer device in service behaviour side
The deficiency in face.Made can be made without liquid-sucking core ultrathin heat pipe by metal or processing of high molecular material, can preferably be expired
Various application demands such as sufficient intelligent watch, smart mobile phone or other mobile devices, and effective guarantee high power microelectronic component
Maintained in safe range using temperature.Therefore, the present invention can effectively ensure that its work while ultrathin heat pipe thickness is reduced
Performance, device overall structure is simpler, has the advantages that highly reliable, low manufacture cost, applied range.
Description of the drawings
Fig. 1 is a kind of structural profile schematic diagram without liquid-sucking core ultrathin heat pipe device of the present invention.
Fig. 2 is a kind of structural representation of the adiabatic section without liquid-sucking core ultrathin heat pipe device of the present invention.
Fig. 3 is the adiabatic section structural representation that center-aisle hydrophobe channel width ratio of the present invention is 1: 1.
Fig. 4 is the adiabatic section structural representation that center-aisle hydrophobe channel width ratio of the present invention is 1: 2.
Wherein, 1, evaporator section, 2, adiabatic section, 3, condensation segment, 4, vacuumize/fill fluid apertures, 5, hydrophobic surface area, 6, parent
Water surface region, 7, hydrophilic channel, 8, hydrophobic channel, 9, heat pipe package.
Specific embodiment
With reference to specific embodiment and accompanying drawing, the present invention is described in further detail, but the embodiment party of the present invention
Formula not limited to this.
One kind is without liquid-sucking core ultrathin heat pipe, it is characterised in that including heat pipe package 9, working medium,
The heat pipe package 9 is closing housing, including, evaporator section 1, adiabatic section 2, condensation segment 3；
The heat pipe package 9 is provided with the side surface of condensation segment 3 and vacuumizes/fill fluid apertures 4；
The evaporator section 1 and condensation segment 3, including hydrophilic channel 7；Adiabatic section 2 includes hydrophilic channel 7, hydrophobic channel 8；
There are hydrophobic surface regions 6 to hydrophobic surface area 5 in the intersection of the evaporator section 1, adiabatic section 2 and condensation segment 3
Transition region, in transition region the internal face of heat pipe package 9 be hydrophobe gradient energy surface, i.e. inwall of the working medium in heat pipe package 9
Contact angle on face changes from small to big and change in gradient, and the internal face of heat pipe package 9 becomes hydrophobic water-wetted surface by hydrophobic surface regions 6
Region 5.
2 points of the adiabatic section is three passages, and symmetrical two wing passage is hydrophilic channel 7, and center-aisle is single
Hydrophobic channel 8 or several hydrophilic channels 7 for being spaced apart and hydrophobic channel 8；
Hydrophilic channel 7, the hydrophobic channel 8 of the adiabatic section 2 runs through along its length adiabatic section 2；
The hydrophilic channel 7 is interconnected by evaporator section 1, adiabatic section 2, condensation segment 3.
The material of the heat pipe package 9 is the metal material that easy processing is moulding, heat conductivility is strong, heat resistance and air-tightness are good
Or macromolecular material.
The heat pipe package 9, is made mutually by chemical method in the upper and lower surface of the heat pipe package 9 for metal material
Corresponding hydrophobic surface regions 6, hydrophobic surface area 5 are so as to obtaining hydrophilic channel 7, hydrophobic channel 8；The heat pipe package 9, leads to
Cross physical method and add coating making mutually corresponding hydrophobic surface regions 6, hydrophobic surface in the upper and lower surface of heat pipe package 9
Region 5 so as to obtain hydrophilic channel 7, hydrophobic channel 8, wherein, hydrophobic channel 8 is empty as the vapor transportation of heat pipe intraductal working medium
Between, hydrophilic channel 7 is then the liquid-phase reflux space of working medium.
The working medium is, from wetting working medium, can to make its spontaneous from heat from the wetting inverse Marangani effects that have of working medium
The condensation segment 3 of pipe is back to evaporator section 1, completes the phase transformation shuttling movement of working medium；Hydrophilic channel 7, the structure of hydrophobic channel 8 and from
The use of wetting working medium, makes ultrathin heat pipe that effectively operation is capable of achieving in the case of without the need for liquid sucting core structure.
The operation principle without liquid sucting core structure ultrathin heat pipe of the present invention is as follows:
First in the evaporator section 1 of heat pipe, thermal evaporation is received from wetting working medium in pipe, in pressure action lower edge hydrophobic channel 8
Transfer heat to condensation segment 3 and complete heat exchange, because heat pipe evaporator section 1 and condensation segment 3 have the temperature difference, condense the wetting certainly for being formed
Liquid spontaneous in the presence of surface tension gradient can flow back from condensation segment 3 to evaporator section 1, so as to complete from the phase for soaking working medium
Become shuttling movement and heat transfer is exchanged.Simultaneously for the hydrophilic channel 7 of heat pipe inner wall face both sides, the flat knot of heat pipe itself
The edge that structure is formed can be conducive to improving startup and the biography of heat pipe to provide extra capillary force from the backflow of wetting liquid
Hot property.
Embodiment 1
As depicted in figs. 1 and 2, one kind of the embodiment of the present invention without liquid-sucking core ultrathin heat pipe device mainly by heat pipe package 9
Internal face makes the two pieces of copper foils up and down for having the hydrophobic surface regions 6 being spaced apart and hydrophobic surface area 5 and constitutes, the enforcement
The length of evaporator section 1, adiabatic section 2 and condensation segment 3 along heat pipe axial direction is respectively 20mm, 70mm and 30mm in example.
When the hydrophobic surface regions 6, hydrophobic surface area 5 without liquid-sucking core ultrathin heat pipe device are made, first, by heat pipe
Shell 9 is cleaned by dilute sulfuric acid and cleaning agent to surface, is put into by 2.5mol/L potassium hydroxide and 0.065mol/ after being dried
In the corrosive liquid that L potassium peroxydisulfates are mixed, corrosion temperature is 70 DEG C, is corroded 30 minutes, and on the surface of heat pipe package 9 one is formed
Layer copper oxide coating；
Further, the heat pipe package 9 by material for copper foil is entirely immersed in the wax of melting, makes wax be covered in heating pipe
The surface of shell 9 forms corrosion protective layer, takes out, and after cooling, removing needs to be made into the wax of hydrophobic surface regions 6；
Further, deionized water rinse copper oxide coating, and in an oven 180 DEG C heat 30 minutes, in cupric oxide
Coating surface obtains ultra-hydrophilic surface；
Further, ultra-hydrophilic surface is soaked 20 minutes in dilute sulfuric acid, surface stays after copper coating to be oxidized disappears
Corrosion micro-structural, forms hydrophobic surface regions 6；
Further, heat pipe package 9 immersed in the paraffin of melting again, removing will be made into hydrophobic surface area 5
Wax, cleaning soaks heat pipe package 9 30 minutes after air-drying in the 18 burning base thiol solutions of 0.0025mol/L, soaking temperature
For 70 DEG C, corrosion surface is formed；
Finally, heat pipe package 9 is taken out, corrosion surface is cleaned with ethanol, prepare hydrophobic surface area 5.
Hydrophilic channel 7 and dredge that the hydrophobic surface regions 6 of upper and lower two pieces of copper foils preparation, hydrophobic surface area 5 are constituted
The width ratio of water channel 8 is 1：2.
Embodiment 2
As depicted in figs. 1 and 2, it is that heat pipe package material used is graphite film or macromolecule with the difference of embodiment 1
Material PI films, and the physical method using addition coating directly builds hydrophobic surface regions 6, hydrophobic surface area on film
5.To hydrophilic channel 7, selection uses Nano-meter SiO_22Hydrophilic coating material；For hydrophobic channel 8, can directly using materials such as graphite films
The hydrophobic property of material itself, is to strengthen hydrophobicity, also may be selected to be applied using organic siliconresin class nano paint or fluorine carbon type nanometer
The self-cleaning coatings such as material.
Embodiment 3
Such as Fig. 3, with embodiment 1, embodiment 2, except that in the cross section of heat pipe adiabatic section 2, except tube wall both sides are
Outside hydrophilic channel 7, mid portion is several hydrophilic channels 7 for being spaced apart and hydrophobic channel 8, and adjacent single hydrophilic logical
Road 7 and the width of hydrophobic channel 8 are equal.
Embodiment 4
If Fig. 4 is with embodiment 1, embodiment 2, except that in the cross section of heat pipe adiabatic section 2, except tube wall both sides are parent
Outside aquaporin, mid portion is several hydrophilic channels 7 for being spaced apart and hydrophobic channel 8, and adjacent single hydrophilic channel 7
It is 1 with the width ratio of hydrophobic channel 8：2.
Embodiment 5
With embodiment 1, embodiment 2, except that the working medium of heat pipe for mass concentration be respectively 0.5%, 1.0% or
The 1.5% n-amyl alcohol aqueous solution or mass concentration are respectively 0.05%, the 0.10% or 0.15% n-heptanol aqueous solution.
Embodiment 6
With embodiment 1, embodiment 2, except that the shape of cross section of heat pipe package 9 is trapezoidal, rectangle or triangle.
In the description of this specification, reference term " one embodiment ", " some embodiments ", " illustrative examples ",
The description of " example ", " specific example " or " some examples " etc. means to combine specific features, the knot that the embodiment or example are described
Structure, material or feature are contained at least one embodiment of the present invention or example.In this manual, to above-mentioned term
Schematic representation is not necessarily referring to identical embodiment or example.And, the specific features of description, structure, material or spy
Point can in an appropriate manner be combined in any one or more embodiments or example.
Although an embodiment of the present invention has been shown and described, it will be understood by those skilled in the art that：Not
These embodiments can be carried out with various changes, modification, replacement and modification in the case of the principle and objective that depart from the present invention, this
The scope of invention is limited by claim and its equivalent.
Claims (8)
1. one kind is without liquid-sucking core ultrathin heat pipe device, it is characterised in that including heat pipe package (9) and working medium,
The heat pipe package (9) is closing housing, including evaporator section (1), adiabatic section (2), condensation segment (3)；
The heat pipe package (9) is provided with the side surface of condensation segment (3) and vacuumizes/fill fluid apertures (4)；
The evaporator section (1) and condensation segment (3), including hydrophilic channel (7)；Adiabatic section (2) includes hydrophilic channel (7), hydrophobic
Passage (8)；
The adiabatic section (2) is divided into three passages, and symmetrical two wing passage is hydrophilic channel (7), and center-aisle is single
The combination of hydrophobic channel (8) or the hydrophilic channel (7) being spaced apart for several and hydrophobic channel (8)；
Hydrophilic channel (7), the hydrophobic channel (8) of the adiabatic section (2) runs through adiabatic section (2) along its length；
The hydrophilic channel (7) is interconnected by evaporator section (1), adiabatic section (2), condensation segment (3).
2. one kind according to claim 1 is characterized in that the working medium is from wetting work without liquid-sucking core ultrathin heat pipe device
Matter.
3. it is according to claim 1 one kind without liquid-sucking core ultrathin heat pipe device, it is characterized in that, the heat pipe package (9)
Material is the metal material or macromolecular material that easy processing is moulding, heat conductivility is strong.
4. it is according to claim 1 one kind without liquid-sucking core ultrathin heat pipe device, it is characterized in that, the heat pipe package (9),
To have mutual corresponding hydrophobic surface regions (6), hydrophobic surface area in the internal upper and lower surface of the heat pipe package (9) of metal material
Domain (5) is so as to forming hydrophilic channel (7), hydrophobic channel (8).
5. it is according to claim 1 one kind without liquid-sucking core ultrathin heat pipe device, it is characterized in that, the heat pipe package (9),
There are mutual corresponding hydrophobic surface regions (6), hydrophobic surface area (5) coating in the upper and lower surface of heat pipe package (9), so as to shape
Into hydrophilic channel (7), hydrophobic channel (8).
6. one kind according to claim 5 is characterized in that, the coating, in hydrophilic table without liquid-sucking core ultrathin heat pipe device
Face region (6) uses Nano-meter SiO_22Hydrophilic coating material, in hydrophobic surface area (5), using graphite film or has self-cleaning characteristic
Organic siliconresin class nano paint or fluorine carbon type nano paint.
7. one kind according to claim 1 is characterized in that the adiabatic section (2) is middle without liquid-sucking core ultrathin heat pipe device
The channel width ratio that passage, hydrophilic channel (7) and hydrophobic channel (8) are spaced successively is 1: 1 or 1: 2.
8. it is according to claim 1 one kind without liquid-sucking core ultrathin heat pipe device, it is characterized in that, the heat pipe package (9)
Shape of cross section is trapezoidal, rectangle or triangle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611050154.7A CN106604607B (en) | 2016-11-25 | 2016-11-25 | A kind of no liquid-sucking core ultrathin heat pipe device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611050154.7A CN106604607B (en) | 2016-11-25 | 2016-11-25 | A kind of no liquid-sucking core ultrathin heat pipe device |
Publications (2)
| Publication Number | Publication Date |
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| CN106604607A true CN106604607A (en) | 2017-04-26 |
| CN106604607B CN106604607B (en) | 2019-01-08 |
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ID=58593141
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107131660A (en) * | 2017-06-28 | 2017-09-05 | 广东工业大学 | Solar energy loop circuit heat pipe heat pump hybrid system based on Fresnel Lenses thermal-arrest |
| CN108235666A (en) * | 2018-02-11 | 2018-06-29 | 中国科学院工程热物理研究所 | Surface regulation and control flexible microflute group is heat sink, radiator and method |
| CN111238277A (en) * | 2020-01-09 | 2020-06-05 | 广东工业大学 | Flat heat pipe with composite liquid absorption core structure |
| CN112261830A (en) * | 2020-09-17 | 2021-01-22 | 华南理工大学 | Hydrophilic and hydrophobic matching plate, preparation method thereof and vapor chamber |
| RU2745379C1 (en) * | 2020-03-24 | 2021-03-24 | Федеральное государственное бюджетное научное учреждение "Российский научно-исследовательский институт проблем мелиорации" (ФГБНУ "РосНИИПМ") | Device for reducing hydraulic losses in pipeline |
| CN112601418A (en) * | 2020-11-20 | 2021-04-02 | 上海航天控制技术研究所 | Integrated heat conduction microstructure of space ray apparatus structure |
| CN112702899A (en) * | 2021-02-07 | 2021-04-23 | 广东省华创热控科技有限公司 | Ultrathin soaking plate based on self-wetting fluid as working solution and application |
| CN112781421A (en) * | 2021-02-04 | 2021-05-11 | 广东机电职业技术学院 | Ultrathin heat pipe with bionic liquid absorption core |
| CN113655053A (en) * | 2021-08-09 | 2021-11-16 | 立讯电子科技（昆山）有限公司 | Cuvette and preparation method thereof |
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| CN107131660A (en) * | 2017-06-28 | 2017-09-05 | 广东工业大学 | Solar energy loop circuit heat pipe heat pump hybrid system based on Fresnel Lenses thermal-arrest |
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| CN112601418B (en) * | 2020-11-20 | 2022-10-18 | 上海航天控制技术研究所 | Integrated heat conduction microstructure of space ray apparatus structure |
| CN112601418A (en) * | 2020-11-20 | 2021-04-02 | 上海航天控制技术研究所 | Integrated heat conduction microstructure of space ray apparatus structure |
| CN112781421A (en) * | 2021-02-04 | 2021-05-11 | 广东机电职业技术学院 | Ultrathin heat pipe with bionic liquid absorption core |
| CN112702899A (en) * | 2021-02-07 | 2021-04-23 | 广东省华创热控科技有限公司 | Ultrathin soaking plate based on self-wetting fluid as working solution and application |
| CN112702899B (en) * | 2021-02-07 | 2024-04-05 | 广东省华创热控科技有限公司 | Ultrathin vapor chamber based on self-wetting fluid as working fluid and application thereof |
| CN113655053A (en) * | 2021-08-09 | 2021-11-16 | 立讯电子科技（昆山）有限公司 | Cuvette and preparation method thereof |
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