201032696 六、發明說明： 【發明所屬之技術領域】 本發明係有關-種散熱元件，特別是關於一種適用於電子元件散熱之 一種超導元件結構。 【先前技術】 . 齡電子產品_輕量化、_化為設計重點，當電子元件尺寸走向 微型化、功能取向之際，使其單位面積的發熱密度也愈來愈高，傳統以散 熱鰭片配合風扇散逸於空氣的散熱方式，已不能滿足現今電子元件的需 © 求’因此散熱效率已經成為決定電子產品之壽命、可靠度及穩定性的重要 因素。熱管(Heat Pipe) ’是藉由工作流體液氣相間的相變化⑽咖change) 吸收熱量，並以氣體分子傳輸熱量的方式，因而可得到極高的熱傳導係數， 具有相當好的傳熱效果，現今已被廣泛應用於電子熱傳導領域，如電腦内 部中央處理器或發光二極體之散熱等。但由於熱管之毛細結構（wick structure)必須貼附於整根熱管内部管壁，雖然其提供了工作介質液體回流 之毛細力，但在其毛細結構内部之流動阻力也成為流動壓降的主要來源， ® 因此造成其性能在某些操作情形下會有大幅度遞減的情形。而均溫板(vap〇r chamber)則是將熱管由點的熱傳導更進一步地變成面的熱傳導，具有更高 效率的熱傳導特性，未來可能被大量應用的導熱元件之一。 我國專利證號第M345222號，其係為一種「均溫板及其支撐結構」，其 係主要將一殼體内部鋪設毛細組織，於内填充工作流鱧，並於殼體内鋪設 波浪片，該波浪片波峰波谷間係分別開設有穿孔，工作流體係流經間隔通 道及穿孔，以提升均溫板之熱傳導效率；然而，綜觀該項創作其熱傳導效 201032696 率仍不甚理想’且鋪設多層結構，如上層毛細組織、下層毛細組織波浪 片等’相對增加生產成本及組裝_，若能針對上述之缺失提出_種高熱 傳導效率的超導元件結構，相信更具經濟效益，也適合大量生產。 有鑑於此’本發明係針對上述之問題，提出一種超導元件結構，以克 服習知之缺點。 【發明内容】 本發明之主要目的，係在提供—種超導元件結構，錢具有—殼體， ❹殼體之内表面利用靜電塗佈方式，使其被覆—層金屬薄膜該金屬薄膜進 一步為-種毛細結構’及複數個粉末沖紅燒結柱體，該燒結柱體表面具 有毛細結構’藉由該等毛細結構，使工作流體產生二相流循環達到大量 散熱之目的。 本發明之另-目的，係在提供—種超導元件結構，其係具有構造簡單、 適合大量生產及符合經濟效益之優點。 為達上述之目的’本發明為一種超導元件結構，用於電子元件之散熱， ❹超導元件包括-殼體，殼艘進—步包括—上板片及—下座，上板片及下座 彼此可心S形成谷置空間，當上板片及下座接合後，其接觸邊緣藉由輝 接接合固定；上板片及下座之内表面利用靜電塗佈，使其被覆一層金屬薄 膜’金屬薄膜係為銅粉’利用靜電塗佈被覆於上板片及下座之内表面上， 金屬薄膜進-步為-種毛細結構；複數個燒結柱艘，置於容置空間内燒 結柱體係利用金屬粉末沖壓，進而燒結成柱體狀，金屬粉末係為銅粉，沖 壓燒結後形成多孔質結構，柱體表面進一步為毛細結構；以及一工作流體 填庄於今置工間中’並可於容置空間内流動，經由相變化傳輸熱能工作 201032696 流體為純水或超純水，工作流體為一種熱傳媒界，遇熱產生相變化，將電 子元件產生之熱能均勻傳送至殼體，殼體係為銅金屬材質，殼體並具有一 填充孔’使容置空間可進行抽真空，或由外部填充工作流體至容置空間内， 本發明更包含一散熱板，其係位於殼體之外表面上，並與殼體接觸，以增 進整體散熱性及熱傳性。 底下藉由具體實施例配合所附的圖式詳加說明，當更容易瞭解本發明 之目的、技術内容、特點及其所達成之功效。 ❹ 【實施方式】 第一囷為本發明之分解結構示意圖，如圖所示，超導元件10包括一殼 體12,殼體12進一步包括一上板片14及一下座16，上板片14及下座16 之内表面利用靜電塗佈，使其被覆一層金屬薄膜，形成一下座薄膜面162， 金屬薄膜係為銅粉，以靜電塗佈被覆於上板片14及下座16之内表面上， 金屬薄膜進一步為一種毛細結構，請同時參閱第二圖，第二圖為本發明之 另一視角分解結構示意圖，如圖所示，藉由此圖可更清晰觀察於上板片14 Ο 内表面，具有一上板片薄膜面142，上板片薄膜面142與下座薄膜面162相 肖’均是利用靜電塗佈，將金屬粉末塗佈被覆於上板片14及下座16之内 表面’上板片薄膜面14及下座薄膜面162均為一種細敏之毛細結構；請回 到第二圖’上板片14及下座16彼此可結合形成—容置空間17，超導元件 1〇包括複數個燒結柱艘18，置於容置空間17内，燒結柱體18係利用金屬 粉末沖壓，沖壓燒結後形成多孔質結構，進而形塑成柱體狀’柱體表面具 毛細結構’殼體12並具有-填充孔164，使容置空間17可進行抽真空或 填充流體。 5 201032696 第一圖為本發明之組合結構示意圖，如圖所示，上板片14及下座μ 已相結合’形成容置空間17，燒結柱體17係已裝設並規則排列固定於容 置空間17中；一工作流體4〇，填注於容置空間17中並可於容置空間17 内流動’並經由相變化傳輪能，工作流體4〇為純水或超純水，其為一種 熱傳媒界，遇熱產生相變化，並將電子元件2〇產生之熱能均勻傳送至殼體 12 ’殼體12係為銅金屬材質，殼體12旁之填充孔，使容置空間17可進行 抽真空’填充孔164並可由外部填充工作流體4〇至容置空間17内，上板 ® #14及下座16接合後’其接觸邊緣可藉由銲接接合固定。為更清楚觀察 本發明之_結構’將其沿Α_Α’關視圖，在以下做說明。 第四圖為本發明之剖視圖，藉由A A，圖可更清楚觀察本發明之内部 結構’ sf同時參照第五圖’第五圖為本發明之超導錯散熱示意圖，如圖 所示，超導元件10係置於一電子元件2〇與一散熱板3〇之間，並與電子元 件20接處，由於本發明之超導元件1〇之具有相當高之熱傳導率，電子元 件20所產生之熱能能快速藉由超導元件1〇傳導並散佈，並同時與散熱板 © 30接觸，可更有效增進碰散紐，憾板3()更進_步為純質之散熱韓 片。請回到第四圖，如圖所示，超導元件1〇接觸接觸熱源端為蒸發端1〇a， 另一相對端為冷凝端l〇b，假如熱源為電子元件2〇，位於超導元件1〇之下 方，蒸發端10a之工作流體因吸熱蒸發成汽態，飽和蒸汽a上升，並迅速擴 散至整個冷凝端1Gb ’冷凝端1Gb並與第巾之散熱板3G制，散熱板 30係位於殼體12之外表面上，並與殼體12接觸，同時可吸收冷凝端1〇b 之熱能’接著請回到第五圖，冷凝端1〇b之熱能被吸收之後，會使飽和蒸 n* a再度液化成工作流體b，工作流體b並會沿殼體上之上板片薄膜面142、 6 201032696 下座薄膜面162與柱狀結構18上之毛細結構，形成二相流循環，達到不斷 吸收熱能及散熱之效果。 本發明主要利用有別於傳統之靜電塗佈方式，將殼體之内表面被覆一 層金屬薄膜，該金屬薄膜進一步為一種具有毛細結構之薄膜層，配合於容 置空間内具有之粉末沖壓之燒結柱體，燒結柱體表面具有毛細結構，藉由 工作流體於容置空間内，配合該等毛細結構，形成二相流循環，能有效提 升整體超導元件之熱傳性及散熱性，相較於習知技術有較優良之熱傳效 〇 率，同時也較為符合經濟效益，適合大量生產。 惟以上所述者，僅為本發明之較佳實施例而已，其目的在使熟習該項 技藝者能夠瞭解本發明之内容而據以實施，並非用來限定本發明實施之範 圍；故舉凡依本發明申請專利範圍所述之形狀、構造、特徵及精神所為之 均等變化與修飾，均應涵蓋在本發明之申請專利範圍内。 【圖式簡單說明】 第一圖為本發明之分解結構示意圖。 〇 第二圖為本發明之另一視角分解結構示意圖。 第三圖為本發明之組合結構示意圖。 第四圖為本發明之剖視圖。 第五圖為本發明之超導元件散熱示意圖。 【主要元件符號說明】 10 超導元件 10a蒸發端 l〇b冷凝端 7 201032696 12 殼體 14 上板片 142 上板片薄膜面 16 下座 162 下座薄膜面 164 填充孔 17 容置空間 18 燒結柱艟 20 電子元件 30 散熱板201032696 VI. Description of the Invention: [Technical Field] The present invention relates to a heat dissipating component, and more particularly to a superconducting component structure suitable for heat dissipation of electronic components. [Prior Art] Age-age electronic products _lightweight, _ is the design focus, when the size of electronic components is miniaturized and functionally oriented, the heat density per unit area is also getting higher and higher, traditionally with heat sink fins The heat dissipation method of the fan dissipating air can no longer meet the demand of today's electronic components. Therefore, the heat dissipation efficiency has become an important factor determining the life, reliability and stability of electronic products. The Heat Pipe ' absorbs heat by the phase change between the working fluid and the gas phase, and transmits heat by the gas molecules, so that a very high heat transfer coefficient can be obtained, and the heat transfer effect is quite good. Nowadays, it has been widely used in the field of electronic heat conduction, such as the central processing unit of a computer or the heat dissipation of a light-emitting diode. However, since the wick structure of the heat pipe must be attached to the inner wall of the entire heat pipe, although it provides the capillary force of the liquid backflow of the working medium, the flow resistance inside the capillary structure also becomes the main source of the flow pressure drop. , ® thus causes a situation in which its performance will be greatly reduced under certain operating conditions. The vap〇r chamber is a heat conduction element that further changes the heat conduction of the heat pipe from the point to the surface, and has more efficient heat conduction characteristics, and may be one of the heat conduction components that may be widely used in the future. China Patent No. M345222, which is a "soaked plate and its supporting structure", which mainly lays a capillary structure inside a casing, fills the working flow inside, and lays a wave piece in the casing. The wave plate peaks and valleys are respectively provided with perforations, and the workflow system flows through the spacing channels and the perforations to improve the heat transfer efficiency of the uniform temperature plate; however, the overall heat transfer efficiency of the creation of the 201032696 is still not satisfactory. Structure, the above layer of capillary structure, the underlying capillary structure wave sheet, etc. 'relative increase in production cost and assembly _, if the above-mentioned lack of a superconducting element structure with high thermal conductivity, it is believed to be more economical and suitable for mass production. . In view of the above, the present invention is directed to the above problems, and a superconducting element structure is proposed to overcome the disadvantages of the prior art. SUMMARY OF THE INVENTION The main object of the present invention is to provide a superconducting element structure, the money has a shell, and the inner surface of the crucible shell is electrostatically coated to coat the metal film. - a capillary structure 'and a plurality of powder red sintered columns, the surface of the sintered cylinder has a capillary structure 'by the capillary structure, the working fluid generates a two-phase flow cycle to achieve a large amount of heat dissipation. Another object of the present invention is to provide a superconducting element structure which has the advantages of simple structure, suitability for mass production, and economical efficiency. In order to achieve the above purpose, the present invention is a superconducting element structure for heat dissipation of electronic components, and the superconducting superconducting element includes a casing, and the casing includes an upper plate and a lower seat, an upper plate and The lower seats form a valley space with each other. When the upper plate and the lower seat are joined, the contact edges thereof are fixed by the fusion bonding; the inner surfaces of the upper plate and the lower seat are electrostatically coated to be coated with a metal film. 'The metal film is copper powder' is coated on the inner surface of the upper plate and the lower seat by electrostatic coating, and the metal film is further into a capillary structure; a plurality of sintered columns are placed in the sintered column in the accommodating space. The system is stamped by metal powder and sintered into a column shape. The metal powder is copper powder. After punching and sintering, a porous structure is formed, and the surface of the column is further made into a capillary structure; and a working fluid is filled in the existing work room. Flows in the accommodating space and transmits thermal energy through phase change 201032696 The fluid is pure water or ultrapure water. The working fluid is a kind of thermal media. The phase change occurs when heat is generated, and the heat generated by the electronic components is evenly transmitted. The housing is made of a copper metal material, and the housing has a filling hole for allowing the accommodating space to be evacuated or externally filled with the working fluid into the accommodating space. The invention further comprises a heat dissipating plate, which is located The outer surface of the casing is in contact with the casing to improve overall heat dissipation and heat transfer. The purpose, technical contents, features and effects achieved by the present invention will become more apparent from the detailed description of the embodiments and the accompanying drawings. [Embodiment] The first embodiment is a schematic exploded view of the present invention. As shown, the superconducting element 10 includes a casing 12, and the casing 12 further includes an upper plate 14 and a lower seat 16, and the upper plate 14 And the inner surface of the lower seat 16 is electrostatically coated to cover a metal film to form a lower film surface 162. The metal film is copper powder and is electrostatically coated on the inner surface of the upper plate 14 and the lower seat 16. The metal film is further a capillary structure. Please refer to the second figure at the same time. The second figure is another perspective view of the present invention. As shown in the figure, the upper plate 14 can be more clearly observed by the figure. The inner surface has an upper plate film surface 142, and the upper plate film surface 142 and the lower film surface 162 are both coated by electrostatic coating, and the metal powder is coated on the upper plate 14 and the lower seat 16 The inner surface 'upper sheet film surface 14 and the lower seat film surface 162 are all a fine-sensitive capillary structure; please return to the second figure 'the upper sheet 14 and the lower seat 16 can be combined with each other to form an accommodating space 17, superconducting Component 1〇 includes a plurality of sintered column vessels 18, placed in an empty space In the 17th, the sintered cylinder 18 is stamped by metal powder, and formed into a porous structure after being stamped and sintered, and then shaped into a columnar-shaped "cylinder surface with capillary structure" casing 12 and having a filling hole 164 for accommodating space. 17 can be vacuumed or filled with fluid. 5 201032696 The first figure is a schematic view of the combined structure of the present invention. As shown in the figure, the upper plate 14 and the lower seat μ have been combined to form the accommodating space 17, and the sintered cylindrical body 17 has been installed and regularly arranged and fixed. a working fluid 17; a working fluid 4〇, filled in the accommodating space 17 and flowing in the accommodating space 17 and passing through the phase change transfer wheel, the working fluid 4 is pure water or ultrapure water, For a kind of thermal media, a phase change occurs when heat is generated, and the heat energy generated by the electronic component 2 is uniformly transmitted to the casing 12. The casing 12 is made of a copper metal material, and the filling hole beside the casing 12 makes the accommodation space 17 A vacuum can be made to fill the hole 164 and the working fluid can be filled into the accommodating space 17 from the outside. After the upper plate® #14 and the lower seat 16 are joined, the contact edge can be fixed by welding. For a clearer observation of the structure of the present invention, it will be described in the following section along the Α_Α'. The fourth figure is a cross-sectional view of the present invention. The internal structure of the present invention can be more clearly observed by AA, while referring to the fifth figure, the fifth figure is a schematic diagram of the superconducting heat dissipation of the present invention, as shown in the figure, The guiding element 10 is disposed between an electronic component 2A and a heat sink 3A, and is connected to the electronic component 20. Since the superconducting component 1 of the present invention has a relatively high thermal conductivity, the electronic component 20 generates The heat energy can be quickly transmitted and distributed by the superconducting element 1 ,, and at the same time, it can be more effectively enhanced by the contact with the heat sink © 30, and the board 3 () is further a pure heat sink. Please return to the fourth figure. As shown in the figure, the superconducting element 1〇 contact contact heat source end is the evaporation end 1〇a, and the other opposite end is the condensation end l〇b. If the heat source is the electronic component 2〇, it is located in the superconducting Below the element 1〇, the working fluid of the evaporation end 10a evaporates into a vapor state due to heat absorption, the saturated steam a rises, and rapidly diffuses to the entire condensation end 1Gb 'condensing end 1Gb and is made with the heat sink 3G of the towel, the heat sink 30 system It is located on the outer surface of the casing 12 and is in contact with the casing 12, and at the same time absorbs the heat energy of the condensing end 1〇b. Then, returning to the fifth figure, the heat energy of the condensing end 1〇b is absorbed, and the steam is saturated. n* a is liquefied again into working fluid b, and the working fluid b will form a two-phase flow cycle along the capillary structure on the upper film surface 162, 6 201032696 and the capillary structure on the columnar structure 18. Achieve continuous absorption of heat and heat. The invention mainly utilizes an electrostatic coating method different from the conventional one, and the inner surface of the casing is coated with a metal film, and the metal film is further a film layer having a capillary structure, which is matched with the sintering of the powder stamping in the accommodating space. The cylinder body has a capillary structure on the surface of the sintered cylinder. The working fluid is placed in the accommodating space, and the capillary structure is combined to form a two-phase flow cycle, which can effectively improve the heat transfer and heat dissipation of the overall superconducting element. The conventional technology has a relatively good heat transfer efficiency, and is also more economical and suitable for mass production. The above is only the preferred embodiment of the present invention, and it is intended to enable those skilled in the art to understand the contents of the present invention and is not intended to limit the scope of the present invention; The variations, modifications, and modifications of the shapes, structures, features, and spirits of the present invention are intended to be included within the scope of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS The first figure is a schematic exploded view of the present invention. 〇 The second figure is a schematic view of another perspective exploded structure of the present invention. The third figure is a schematic view of the combined structure of the present invention. The fourth figure is a cross-sectional view of the present invention. The fifth figure is a schematic diagram of heat dissipation of the superconducting element of the present invention. [Main component symbol description] 10 Superconducting element 10a Evaporating end l〇b Condensing end 7 201032696 12 Housing 14 Upper plate 142 Upper plate film surface 16 Lower seat 162 Lower film surface 164 Filling hole 17 accommodating space 18 Sintering Column 艟 20 electronic components 30 heat sink