CN203298523U - Semiconductor refrigeration device - Google Patents
Semiconductor refrigeration device Download PDFInfo
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- CN203298523U CN203298523U CN2013201827309U CN201320182730U CN203298523U CN 203298523 U CN203298523 U CN 203298523U CN 2013201827309 U CN2013201827309 U CN 2013201827309U CN 201320182730 U CN201320182730 U CN 201320182730U CN 203298523 U CN203298523 U CN 203298523U
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- heat
- chilling plate
- cooling device
- fuel factor
- semiconductor chilling
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Abstract
The utility model discloses a semiconductor refrigeration device which comprises a semiconductor refrigeration piece, a heat insulation structure, a metal sheet, a group of heat pipes, and a group of heat dissipation fins, wherein the semiconductor refrigeration piece is provided with a heat effect face and a cold effect face; the heat insulation structure enables the heat effect face and the cold effect face of the semiconductor refrigeration piece to be separated; the upper surface of the metal sheet is tightly attached to the cold effect face of the semiconductor refrigeration piece, and the lower surface of the metal sheet makes contact with liquid to be cooled; first ends of the group of the heat pipes are attached to the heat effect face of the semiconductor refrigeration piece, and second ends of the group of the heat pipes extend out of the heat insulation structure; the group of the heat dissipation fins are installed at the second ends of the heat pipes. The semiconductor refrigeration device enables the heat effect face and the cold effect face of the semiconductor refrigeration piece to be completely separated, heat energy at the heat ends under a sealed state is transferred out through the heat pipes, heat dissipation is carried out through the external heat dissipation fins, refrigeration efficiency of the semiconductor refrigeration is greatly improved, and meanwhile because the semiconductor refrigeration device is made into a cover type structure, the semiconductor refrigeration device is conveniently utilized on a utensil with an opening in any one end.
Description
Technical field
The utility model relates to refrigerating field, particularly relates to a kind of semiconductor cooling device.
Background technology
Except the compression refrigerating machine of commonly using and the Absorption Refrigerator and steam jet refrigerator progressively promoted, the use of semiconductor chilling plate is also more and more extensive at present.Semiconductor chilling plate, also be thermoelectric module, is a kind of heat pump.Its advantage is there is no slide unit, is applied in some spaces and is restricted, and reliability requirement is high, without the occasion of cold-producing medium pollution.But semiconductor chilling plate is because of its volume restrictions, and its fuel factor face and cold effect surface are more approaching, easily produces heat exchange each other when work, thereby affects refrigerating efficiency.In addition, the refrigerating efficiency of its cold effect surface also depends on the radiating efficiency of fuel factor face.That is, heat conduction velocity, the radiating effect of fuel factor face are better, and the refrigeration of cold effect surface is just better.
The utility model content
The technical problem that the utility model mainly solves is to provide a kind of semiconductor cooling device, and refrigerating efficiency is high.
For solving the problems of the technologies described above, the technical scheme that the utility model adopts is: a kind of semiconductor cooling device is provided, comprises:
Semiconductor chilling plate, have fuel factor face and cold effect surface;
Heat insulation structural, with the described fuel factor face of described semiconductor chilling plate and the isolation of cold effect surface heat, the isoplanar, bottom surface of described cold effect surface and described heat insulation structural, described fuel factor face is by described heat insulation structural parcel wherein;
Sheet metal, the cold effect surface of the upper surface of described sheet metal and described semiconductor chilling plate fits tightly, and the lower surface of described sheet metal contacts with liquid to be cooled;
One group of heat pipe, the fuel factor face laminating of first end and described semiconductor chilling plate, the second end extends outside heat insulation structural;
One group of radiating fin, be arranged on the second end of described heat pipe.
in preferred embodiment of the utility model, described heat insulation structural, comprise thermal insulation layer, described thermal insulation layer comprises compound successively lower thermal insulation board, heat-barrier material and stiffener, one stepped through hole is arranged on described thermal insulation layer, the surface of internal cavity of described through hole has packing material, described semiconductor chilling plate is placed in the lower end of described through hole, and with the lower end closed of described through hole, described cold effect surface outwardly and with the lower surface of described lower thermal insulation board at grade, the fuel factor face laminating of the first end of described heat pipe and described semiconductor chilling plate, the second end extends outside through hole.
In preferred embodiment of the utility model, described semiconductor cooling device comprises cover plate, and described cover plate is the upper end closed of described through hole, and is fixed on described heat insulation structural, described cover plate be connected the junction of stiffener and connect with heat-conducting glue.
in preferred embodiment of the utility model, the fuel factor face of described heat pipe and described semiconductor chilling plate is fixed by metal derby, the fuel factor face of described semiconductor chilling plate and the upper surface of described lower thermal insulation board are at grade, described heat pipe is L-shaped, the first end of described heat pipe is embedded in described metal derby, the lower surface of the first end of heat pipe is made into plane, the lower surface that is embedded in metal derby is in same plane, fit with the fuel factor face, the fuel factor face of the lower surface of described metal derby and described semiconductor chilling plate and the upper surface of described lower thermal insulation board fit.
In preferred embodiment of the utility model, the lower surface of described metal derby is coated with the plane thermal conductive material layer.
In preferred embodiment of the utility model, the surface area of described sheet metal is greater than the surface area of the cold effect surface of described semiconductor chilling plate.
In preferred embodiment of the utility model, the upper surface of described sheet metal is coated with the plane thermal conductive material layer.
In preferred embodiment of the utility model, described plane thermal conductive material layer is graphite flake or the Graphene of thickness＜0.02mm.
In preferred embodiment of the utility model, described metal derby is copper billet or aluminium block.
In preferred embodiment of the utility model, described lower thermal insulation board is glass mat, and described heat-barrier material is the foaming PVC material, and described stiffener and described cover plate are aluminium flake, and described packing material is phenolic aldehyde, and described sheet metal is copper coin or aluminium sheet.
The beneficial effects of the utility model are: the utility model semiconductor cooling device, described fuel factor face and the cold effect surface of described semiconductor chilling plate are isolated fully; , by at fuel factor face and cold effect surface, covering very thin high plane thermal conductive material layer,, in the situation that conductive heat loss is very little longitudinally, increased plane samming speed and the heat transfer area of sheet metal/metal derby; The heat energy that will be in the hot junction under closed state by heat pipe transmits out fast, dispel the heat by large-area stiffener surface, outside and fin surface, greatly improved the refrigerating efficiency of semiconductor cooling device, the lid formula structure of making simultaneously, the convenient use on the vessel of any end opening.The bonding high-heat-conductivity glue that all uses as thin as a wafer between the stiff dough of all heat conductors, guarantee that reliability, anti-vibration resistance and the low-heat of thermo-contact laminating between stiff dough is resistive.All all have been full of with foaming technique fully between heat carrier and insulator thermal resistance is higher, the better phenolic materials of heat-resisting quantity, guarantees the unidirectional guiding that heat is mobile.
Description of drawings
Fig. 1 is the structural representation of the utility model semiconductor cooling device one preferred embodiment.
The specific embodiment
Below in conjunction with accompanying drawing, preferred embodiment of the present utility model is described in detail, thereby so that advantage of the present utility model and feature can be easier to be it will be appreciated by those skilled in the art that, protection domain of the present utility model is made more explicit defining.
See also Fig. 1, the utility model embodiment comprises:
A kind of semiconductor cooling device comprises: semiconductor chilling plate 10, heat insulation structural, sheet metal 30, one group of heat pipe 40, one group of radiating fin 50, metal derby 60 and plane Heat Conduction Material 70.
Described semiconductor chilling plate 10, have fuel factor face 11 and cold effect surface 12.
described heat insulation structural, with the described fuel factor face 11 of described semiconductor chilling plate 10 and 12 isolation of cold effect surface, comprise thermal insulation layer, described thermal insulation layer comprises compound successively lower thermal insulation board 211, heat-barrier material 212 and stiffener 213, one stepped through hole (not mark) is arranged on described thermal insulation layer, the inner chamber of described stepped through hole comprises the cascaded surface 2131 that connects successively, 2121, 2122, 2111, 2112, described cascaded surface 2121 is the part of the upper surface of heat-barrier material 212, described cascaded surface 2111 is the part of the upper surface of lower thermal insulation board 211, described cascaded surface 2122, there is packing material 214 on 2112 surfaces, described semiconductor chilling plate 10 is placed in the lower end of described through hole, and with the lower end closed of described through hole, described cold effect surface 12 outwardly and with the outerplanar of described lower thermal insulation board 211 at grade.213 3 layers of the lower thermal insulation board 211 of described thermal insulation layer, heat-barrier material 212 and stiffeners are colded pressing compound by glue, form insulating composite board, described cover plate 218 is with the upper end closed of described through hole, and by bolt 216, cover plate 218 is fixed on described heat insulation structural, 216, described bolt is positioned on described cover plate 218, described bolt 216 tails are arranged in described lower thermal insulation board 211, described cover plate 218 be connected the junction of stiffener 213 and connect with heat-conducting glue 215.Preferably, described lower thermal insulation board 211 is glass mat, is used for levels heat insulation, and intensity is larger simultaneously, but set bolt; Described heat-barrier material 212 is the foaming PVC material; Described stiffener 213 and described cover plate 218 are aluminium flake, heat-barrier material 212 are played the effect of reinforcement; Described packing material 214 is phenolic aldehyde, mainly plays heat insulation effect, at described lower thermal insulation board 211 and described semiconductor chilling plate 10, also can fill described packing material 214 for sealing and heat insulation.Phenolic materials is high temperature resistant, can fill all spaces, prevents that heat from spreading to both sides, and foaming PVC material non-refractory, adopt phenolic aldehyde can effectively protect the PVC material not affected by the semiconductor chip hot junction simultaneously.On copper billet, aluminium sheet carries out stepped the connection by bolt with heat-barrier material 212, has guaranteed fixing between heat abstractor and heat insulation structural.Described cover plate 218 be connected the junction of stiffener 213 and connect with heat-conducting glue 215, make described cover plate 218 and described stiffener 213 be connected to a heat conduction integral body by heat-conducting glue., because described cover plate 218 has laminating with heat pipe,, therefore the heat conduction integral body that the cover plate 218 of whole upper surface and described stiffener 213 connect into becomes the part of fin, further enlarged area of dissipation.
Levels and the metal derby of described thermal insulation layer are hard material, and foaming PVC is also harder, and by bolted, structure is very reliable.
Described heat pipe 40, the coated on bottom side of first end 41 is covered with plane Heat Conduction Material 70, and plane Heat Conduction Material 70 contacts with the fuel factor face 11 of described semiconductor chilling plate 10, and the second end 42 extends outside the through hole of heat insulation structural.In the present embodiment, the fuel factor face 11 of described heat pipe 40, plane Heat Conduction Material 70 and described semiconductor chilling plate 10,60 of metal derbies are fixed and are completed with heat-conducting glue is bonding.The fuel factor face 11 of described semiconductor chilling plate 10 and the upper surface of described lower thermal insulation board 211 are at grade, described heat pipe 40 is embedded in described metal derby 60, the fuel factor face 11 bonding laminatings of use heat-conducting glue of the lower surface of described metal derby 60 and described semiconductor chilling plate 10, fit with adiabatic gum is bonding with the upper surface of described lower thermal insulation board 211.Described metal derby 60 is preferably the good copper billet of heat-transfer effect or aluminium block.The outer surface that the heat of the fuel factor face 11 of described semiconductor chilling plate 10 can be transferred to so described stiffener 213 dispels the heat, and has further enlarged area of dissipation.Because the Area Ratio fuel factor face 11 of metal derby 60 wants large, and Heat Conduction Material 70 uniform temperatures in plane are good, therefore the heat conduction efficiency of metal derby 60 is well a lot.In the present embodiment, the first end of described heat pipe 40 41 is extended to the upper surface of described lower thermal insulation board 211, increased the contact-making surface of heat pipe 40 with metal derby 60 lower surfaces, plane Heat Conduction Material 70, the heat absorptivity of the first end 41 of described heat pipe 40 gets a promotion.Simultaneously, the bonding laminating of lower surface heat-conducting glue of the upper surface of described metal derby 60 and described cover plate 218, directly conduct heat to described cover plate 218 by metal derby 60.Certainly, the upper surface of described metal derby 60 can not fitted with the lower surface of described cover plate 218 yet, gap between the lower surface of the upper surface of described metal derby 60 and described cover plate 218 is filled up by the phenolic aldehyde packing material, such structure, the not direct and described cover plate 218 of described metal derby 60 produces the heat conduction, but avoided metal derby to connect because of hard with cover plate, and the vibrated damage that causes of possibility, structure is more firm.
Described radiating fin 50, be arranged on the second end 42 of described heat pipe 40, can dispel the heat to described radiating fin 50 by incorporated fan etc.
Preferably, the upper surface of the lower surface of described metal derby 60 and described sheet metal 30 is coated with plane thermal conductive material layer 70.Described plane thermal conductive material layer 70 is graphite flake or the Graphene of thickness＜0.02mm.The horizontal thermal conductivity factor of graphite flake or Graphene, up to 1500 ~ 5500, is several times as much as the metal materials such as copper.Because plane thermal conductive material layer 70 is very thin, vertically the thermal conductivity impact is little, so very thin material can play good horizontal stroke/vertical heat-conducting effect.Described plane thermal conductive material layer 70 is very fast in horizontal heat conducting speed, pyroconductivity is slightly poor and longitudinally, therefore be coated with a very thin layer plane thermal conductive material layer 70 at the lower surface of described metal derby 60 and the upper surface of described sheet metal 30, can give full play to the plane thermal conductive material layer in horizontal heat conducting superiority, the described fuel factor face 11 of described semiconductor chilling plate 10 and the rapid cross conduction of cold effect surface 12 are gone out, seeing through sheet metal 30 or metal derby 60, by heat make progress, cold downward vertically conducting.The heat that the fuel factor face 11 of semiconductor chilling plate 10 produces can be led more large area region fast by graphite linings, then dispel the heat by heat pipe and metal derby, larger area can be arranged more heat pipes, improve heat absorption capacity, phenolic aldehyde and thermal insulation board is horizontal and lower to protection simultaneously, and heat is difficult to thermal insulation layer and huyashi-chuuka (cold chinese-style noodles) diffusion.Equally,, to cold effect surface 12, be also such.
Equally, also can apply the plane thermal conductive material layer 70 that is formed by graphite or Graphene on described fin 50, make radiating efficiency higher.
The thermal resistivity of the material that the utility model uses is descending puts in order as packing material phenolic aldehyde, thermal insulation layer foaming PVC, thermal insulation board PCB, metal, graphite (Graphene).
The descending volume of intensity of the different-thickness material that the utility model uses puts in order as metal derby, thermal insulation board, stiffener, sheet metal, thermal insulation layer, packing material, graphite.
The utility model semiconductor cooling device comprises: semiconductor chilling plate has fuel factor face and cold effect surface; Heat insulation structural, carry out the heat isolation with the described fuel factor face of described semiconductor chilling plate and cold effect surface with high heat-barrier material and structure.Cold effect surface and isoplanar, heat insulation structural bottom surface, the fuel factor face is wrapped up wherein by heat insulation structural; Sheet metal, the cold effect surface of the upper surface of described sheet metal and described semiconductor chilling plate fits tightly, and passes through horizontal high heat conduction paste layer therebetween, has greatly expanded the thermocontact area of cold effect surface.The lower surface of affiliated sheet metal contacts with liquid to be cooled; One group of heat pipe, the fuel factor face laminating of first end and described semiconductor chilling plate, the second end extends outside heat insulation structural; Metal derby, the bottom surface of described metal derby and an end heat pipe flat bed, and by horizontal high heat conduction paste layer and fuel factor face, fit tightly, greatly expanded the thermocontact area of fuel factor face in heat pipe, metal derby; One group of radiating fin, be arranged on the large tracts of land radiating fin of the second end of described heat pipe, improves radiating effect.The utility model semiconductor cooling device, isolate described fuel factor face and the cold effect surface of described semiconductor chilling plate effectively fully, and out, the fin by outside dispels the heat the thermal energy transfer that will be in the hot junction under closed state by heat pipe., due to the pad pasting that has adopted high horizontal thermal conductivity and high vertically sheet metal (piece) composite construction of thermal conductivity, greatly improved the cold and hot conduction efficiency of semiconductor chilling plate, the lid formula structure of making simultaneously, the convenient use on the vessel of any end opening.
The foregoing is only embodiment of the present utility model; not thereby limit the scope of the claims of the present utility model; every equivalent structure or equivalent flow process conversion that utilizes the utility model specification and accompanying drawing content to do; or directly or indirectly be used in other relevant technical fields, all in like manner be included in scope of patent protection of the present utility model.
Claims (10)
1. a semiconductor cooling device, is characterized in that, comprising:
Semiconductor chilling plate, have fuel factor face and cold effect surface;
Heat insulation structural, with the described fuel factor face of described semiconductor chilling plate and the isolation of cold effect surface heat, the isoplanar, bottom surface of described cold effect surface and described heat insulation structural, described fuel factor face is by described heat insulation structural parcel wherein;
Sheet metal, the cold effect surface of the upper surface of described sheet metal and described semiconductor chilling plate fits tightly, and the lower surface of described sheet metal contacts with liquid to be cooled;
One group of heat pipe, the fuel factor face laminating of first end and described semiconductor chilling plate, the second end extends outside heat insulation structural;
One group of radiating fin, be arranged on the second end of described heat pipe.
2. semiconductor cooling device according to claim 1, it is characterized in that, described heat insulation structural, comprise thermal insulation layer, described thermal insulation layer comprises compound successively lower thermal insulation board, heat-barrier material and stiffener, one stepped through hole is arranged on described thermal insulation layer, the surface of internal cavity of described through hole has packing material, described semiconductor chilling plate is placed in the lower end of described through hole, and with the lower end closed of described through hole, described cold effect surface outwardly and with the lower surface of described lower thermal insulation board at grade, the fuel factor face laminating of the first end of described heat pipe and described semiconductor chilling plate, the second end extends outside through hole.
3. semiconductor cooling device according to claim 2, it is characterized in that, described semiconductor cooling device comprises cover plate, and described cover plate is with the upper end closed of described through hole, and be fixed on described heat insulation structural, described cover plate be connected the junction of stiffener and connect with heat-conducting glue.
4. semiconductor cooling device according to claim 2, it is characterized in that, the fuel factor face of described semiconductor chilling plate and the upper surface of described lower thermal insulation board are at grade, described heat pipe is L-shaped, the first end of described heat pipe is embedded in metal derby, the lower surface of the first end of heat pipe is made into plane, the lower surface that is embedded in metal derby is in same plane, with the laminating of fuel factor face, the fuel factor face of the lower surface of described metal derby and described semiconductor chilling plate and the upper surface of described lower thermal insulation board fit.
5. semiconductor cooling device according to claim 2, is characterized in that, the lower surface of described metal derby is coated with the plane thermal conductive material layer.
6. semiconductor cooling device according to claim 1, is characterized in that, the surface area of described sheet metal is greater than the surface area of the cold effect surface of described semiconductor chilling plate.
7. semiconductor cooling device according to claim 6, is characterized in that, the upper surface of described sheet metal is coated with the plane thermal conductive material layer.
8. according to claim 5 or 7 described semiconductor cooling devices, is characterized in that, described plane thermal conductive material layer is graphite flake or the Graphene of thickness＜0.02mm.
9. semiconductor cooling device according to claim 5, is characterized in that, described metal derby is copper billet or aluminium block.
10. semiconductor cooling device according to claim 3, is characterized in that, described lower thermal insulation board is glass mat, described heat-barrier material is the foaming PVC material, described stiffener and described cover plate are aluminium flake, and described packing material is phenolic aldehyde, and described sheet metal is copper coin or aluminium sheet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013201827309U CN203298523U (en) | 2013-04-12 | 2013-04-12 | Semiconductor refrigeration device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013201827309U CN203298523U (en) | 2013-04-12 | 2013-04-12 | Semiconductor refrigeration device |
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| Publication Number | Publication Date |
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| CN203298523U true CN203298523U (en) | 2013-11-20 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2013201827309U Withdrawn - After Issue CN203298523U (en) | 2013-04-12 | 2013-04-12 | Semiconductor refrigeration device |
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| CN (1) | CN203298523U (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103206805A (en) * | 2013-04-12 | 2013-07-17 | 苏州市莱赛电车技术有限公司 | Semiconductor refrigerating device |
| CN105277468A (en) * | 2014-07-11 | 2016-01-27 | 上海邦安检测工程有限公司 | Thermoelectric refrigeration Brookfield low temperature viscosity tester and test method thereof |
| CN106793679A (en) * | 2016-11-29 | 2017-05-31 | 无锡小天鹅股份有限公司 | The circuit board module of device for clothing processing and device for clothing processing |
| CN107322349A (en) * | 2017-06-07 | 2017-11-07 | 楹联新能源科技南通有限公司 | A kind of new, efficient electric minor refrigerator tray grip device |
| CN107990212A (en) * | 2017-11-30 | 2018-05-04 | 东莞市闻誉实业有限公司 | Hang top pendent lamp |
| CN110244014A (en) * | 2019-07-15 | 2019-09-17 | 石家庄铁路职业技术学院 | Water quality testing meter based on open source hardware |
-
2013
- 2013-04-12 CN CN2013201827309U patent/CN203298523U/en not_active Withdrawn - After Issue
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103206805A (en) * | 2013-04-12 | 2013-07-17 | 苏州市莱赛电车技术有限公司 | Semiconductor refrigerating device |
| CN103206805B (en) * | 2013-04-12 | 2015-04-15 | 苏州市莱赛电车技术有限公司 | Semiconductor refrigerating device |
| CN105277468A (en) * | 2014-07-11 | 2016-01-27 | 上海邦安检测工程有限公司 | Thermoelectric refrigeration Brookfield low temperature viscosity tester and test method thereof |
| CN106793679A (en) * | 2016-11-29 | 2017-05-31 | 无锡小天鹅股份有限公司 | The circuit board module of device for clothing processing and device for clothing processing |
| CN107322349A (en) * | 2017-06-07 | 2017-11-07 | 楹联新能源科技南通有限公司 | A kind of new, efficient electric minor refrigerator tray grip device |
| CN107990212A (en) * | 2017-11-30 | 2018-05-04 | 东莞市闻誉实业有限公司 | Hang top pendent lamp |
| CN107990212B (en) * | 2017-11-30 | 2020-11-24 | 东莞市闻誉实业有限公司 | Ceiling lamp |
| CN110244014A (en) * | 2019-07-15 | 2019-09-17 | 石家庄铁路职业技术学院 | Water quality testing meter based on open source hardware |
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| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20131120 Effective date of abandoning: 20150415 |
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| RGAV | Abandon patent right to avoid regrant |