CN206819982U - Semiconductor refrigeration sheet - Google Patents
Semiconductor refrigeration sheet Download PDFInfo
- Publication number
- CN206819982U CN206819982U CN201720675064.0U CN201720675064U CN206819982U CN 206819982 U CN206819982 U CN 206819982U CN 201720675064 U CN201720675064 U CN 201720675064U CN 206819982 U CN206819982 U CN 206819982U
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- China
- Prior art keywords
- contact
- metallic plate
- thermally conductive
- insulating layer
- conductive insulating
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 44
- 238000005057 refrigeration Methods 0.000 title claims abstract description 31
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- 239000011159 matrix material Substances 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 239000011889 copper foil Substances 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 abstract description 12
- 239000002184 metal Substances 0.000 abstract description 12
- 230000009286 beneficial effect Effects 0.000 abstract description 3
- 239000000463 material Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 230000005679 Peltier effect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000002800 charge carrier Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a kind of semiconductor refrigeration sheet, semiconductor layer including two end plates and between two end plates, end plate includes metallic plate, thermally conductive insulating layer and multiple contacts, metallic plate is provided with multiple hollow-out parts, thermally conductive insulating layer covers on a metal plate, in thermally conductive insulating layer, openwork part is distributed on the metallic plate around contact for contact；The one side that two end plates are provided with contact is oppositely arranged, and semiconductor layer is electrically connected to form conducting wire with contact.The beneficial effects of the utility model are：The temperature difference formed on two end plates can reach 80 degrees Celsius, and refrigeration is also more preferable, can be applied to wide range；Meanwhile metallic plate caused harmomegathus under high/low temperature can be received due to the setting of hollow-out parts, the metal plates entirety where high temperature lower contact is expanded to hollow-out parts, and contact will not be destroyed because of the internal stress of metallic plate, it is ensured that the reliability of product.
Description
Technical field
It the utility model is related to semiconductor product field, more particularly to a kind of semiconductor refrigeration sheet.
Background technology
Existing semiconductor refrigeration sheet manufactures low temperature using peltier effect, allows direct current to pass through one piece of N-type semiconductor
The galvanic couple that material and one piece of p-type semiconductor material are coupled to, because the direction that direct current is passed through is different, it will be produced at galvanic couple node
Heat absorption and exothermic phenomenon.Its principle is that charge carrier is in different energy levels in different materials, when it from high level to
When low-lying level is moved, unnecessary energy is just discharged；On the contrary, when being moved from low-lying level to high level, energy, energy are absorbed from the external world
Amount absorbs or released in the form of heat at the interface of two materials.At present, the cold and hot both ends of semiconductor refrigeration sheet typically use
The aluminum oxide or al nitride ceramic board that can be insulated have the small advantage of deformation under high/low temperature, make to be made from it as carrier
Product structure stability it is good.
But compared with metal material, ceramic material poor thermal conductivity is relatively low as the producible temperature difference in cold and hot both ends, at present may be used
The temperature difference of realization generally only has 40~65 degrees Celsius, and the temperature difference deficiency at semiconductor refrigeration sheet both ends can not just produce preferable system
Cold effect, refrigerating efficiency are low.Conversely, according to carrier of the good metal material of thermal conductivity as hot and cold side, under high/low temperature
The deformation of metal is larger, the contact that is attached on metal can be caused to tear in expanded by heating and breaking.
Utility model content
Technical problem to be solved in the utility model is to provide a kind of new semiconductor refrigeration sheet, cold and hot both ends energy
The caused temperature difference is higher compared with prior art.
In order to solve the above-mentioned technical problem, the technical solution adopted in the utility model is：A kind of semiconductor refrigeration sheet, including
Two end plates and the semiconductor layer between two end plates, the end plate include metallic plate, thermally conductive insulating layer and multiple contacts,
Metallic plate is provided with multiple hollow-out parts, and thermally conductive insulating layer covers on a metal plate, and contact is in thermally conductive insulating layer, hollow-out parts distribution
On metallic plate around the contact；The one side that two pieces of end plates are provided with the contact is oppositely arranged, semiconductor layer and contact electricity
Connection forms conducting wire.
Further, the contact is arranged in the thermally conductive insulating layer in matrix.
Further, the profile of the hollow-out parts is in " recessed " shape, and the interior recess of hollow-out parts is set towards the contact.
Further, the metallic plate is made using aluminum.
Further, the metallic plate is made using red copper.
Further, the contact is made using copper foil.
The beneficial effects of the utility model are：Using end plate of the metallic plate as hot and cold side, metal heat-conducting is good,
The temperature difference formed after semiconductor layer is powered on two end plates can reach 80 degrees Celsius, and it is Celsius at least to improve 15 compared with the prior art
Degree, caused refrigeration is also more preferable, can be applied to wide range；Meanwhile metallic plate is caused by under high/low temperature
Harmomegathus can be received due to the setting of hollow-out parts, and the metal plates where high temperature lower contact are overall to be expanded to hollow-out parts, is touched
Point will not be destroyed because of the internal stress of metallic plate, it is ensured that the reliability of product.
Brief description of the drawings
Fig. 1 is the structural representation of the semiconductor refrigeration sheet of the utility model embodiment.
Fig. 2 is the partial structural diagram of the end plate of the semiconductor refrigeration sheet of the utility model embodiment.
Label declaration：
10th, end plate；11st, metallic plate；110th, hollow-out parts；12nd, thermally conductive insulating layer；13rd, contact；
20th, semiconductor layer.
Embodiment
To describe technology contents of the present utility model, construction feature, the objects and the effects in detail, below in conjunction with implementation
Mode simultaneously coordinates accompanying drawing to be explained in detail.
The design of the utility model most critical is:Material directly using metallic plate as cold and hot end plate, heat-conducting effect is more
Good, the cold and hot both ends temperature difference is bigger, and the hollow-out parts opened up on a metal plate can absorb the deformation of metallic plate under high/low temperature, avoid
Cause the disconnection of circuit because contact is damaged.
Referring to Fig.1 and 2, the utility model provides a kind of semiconductor refrigeration sheet, including two end plates 10 and located at two
Semiconductor layer 20 between block end plate 10, the end plate 10 include metallic plate 11, thermally conductive insulating layer 12 and multiple contacts 13, metal
Plate 11 is provided with multiple hollow-out parts 110, and 12 layers of heat conductive insulating is covered on metallic plate 11, and contact 13 is located in thermally conductive insulating layer 12,
Hollow-out parts 110 are distributed on the metallic plate 11 around contact 13；The one side that two pieces of end plates 10 are provided with the contact 13 is relative
Set, semiconductor layer 20 is electrically connected to form conducting wire with contact.
It was found from foregoing description, the beneficial effects of the utility model are：Using end plate of the metallic plate as hot and cold side, gold
Category thermal conductivity is good, and the temperature difference formed after semiconductor layer energization on two end plates can reach 80 degrees Celsius, compared with the prior art
15 degrees Celsius are at least improved, caused refrigeration is also more preferable, can be applied to wide range；Meanwhile metallic plate
Caused harmomegathus can be received due to the setting of hollow-out parts under high/low temperature, and the metal plates where high temperature lower contact are overall
Expanded to hollow-out parts, contact will not be destroyed because of the internal stress of metallic plate, it is ensured that the reliability of product.
Further, as shown in Fig. 2 the contact 13 is arranged in the thermally conductive insulating layer in matrix.
Seen from the above description, the arrangement mode of contact determines the line alignment of semiconductor layer, and the arrangement of matrix form can
The peltier effect of semiconductor is allowed to reach preferable effect.
Further, as shown in Fig. 2 the profile of the hollow-out parts 110 is in " recessed " shape, the interior recess of hollow-out parts is described in
Contact is set.
Seen from the above description, the profile of hollow-out parts in " recessed " shape and sets contact in the position towards its interior recess and can made
Metallic plate integrally moves when being produced expansion by high temperature towards the inside of hollow-out parts, will not produce internal stress and destroy contact.
Further, the metallic plate 11 is made using aluminium or red copper, and the contact 13 is made using copper foil.
Fig. 1 and Fig. 2 are referred to, embodiment one of the present utility model is：A kind of semiconductor refrigeration sheet, including two end plates 10
And the semiconductor layer 20 between two end plates 10, the end plate 10 include metallic plate 11, the and of thermally conductive insulating layer 12 of aluminum
Multiple copper foil contacts 13, metallic plate 11 are provided with the hollow-out parts 110 that multiple profiles are in " recessed " shape, and thermally conductive insulating layer 12 is covered in metal
On plate 11, contact 13 is arranged in thermally conductive insulating layer 12 and in matrix, and hollow-out parts 110 are distributed in the metallic plate around contact 13
On 11, the interior recess of hollow-out parts 110 is set towards the contact 13；Two pieces of end plates 10 are provided with the one side phase of the contact 13
To setting, semiconductor layer 20 is electrically connected to form conducting wire with contact 13.
Above-mentioned semiconductor refrigeration sheet need to also set one layer of closing material before use between two end plates, outside semiconductor layer
Material need to be electrically connected to the head end and tail of conducting wire so as to be played a protective role to the semiconductor layer of inside using wire
End, used with accessing power supply energization.Semiconductor refrigeration sheet after powered up, will soon produce low temperature simultaneously on the end plate of cold end
High temperature is produced on the end plate in hot junction, only need to outwards be distributed the heat on the end plate in hot junction by certain heat dissipating method, it is cold
The end plate at end can just continue to keep low temperature to play the purpose of refrigeration.Because the cold and hot both ends of the present embodiment can reach 80
Degree Celsius the temperature difference, as long as therefore keep hot-side temperature less than 80 degrees Celsius, cold end can just continue to produce be not higher than it is 0 Celsius
The refrigeration of degree, therefore when this programme is to reach in general refrigeration, compared with prior art to the cooling requirements in hot junction
It is significantly reduced, if on the other hand obtained preferably to the radiating control in hot junction, cold end can just produce extremely low temperature, refrigeration
Effect just has significant raising compared with the prior art.
The manufacturing process steps of above-mentioned semiconductor refrigeration sheet are as follows：
Multiple hollow-out parts are molded on a metal plate；
Metallic plate, thermally conductive insulating layer and conductive layer are combined as a whole using laminating technology end plate is made；
It is molded multiple contacts on the electrically conductive using etch process；
Semi-conducting material is respectively welded on the contact of two end plates and forms conducting wire.
In summary, the refrigeration of semiconductor refrigeration sheet provided by the utility model has larger compared with the prior art
Improve, and manufacture craft is also relatively simple.
Embodiment of the present utility model is the foregoing is only, not thereby limits the scope of the claims of the present utility model, it is every
The equivalents made using the utility model specification and accompanying drawing content, or directly or indirectly it is used in the technology neck of correlation
Domain, similarly it is included in scope of patent protection of the present utility model.
Claims (6)
1. a kind of semiconductor refrigeration sheet, including two end plates and the semiconductor layer between two end plates, it is characterised in that institute
Stating end plate includes metallic plate, thermally conductive insulating layer and multiple contacts, and metallic plate is provided with multiple hollow-out parts, and thermally conductive insulating layer is covered in gold
Belong on plate, in thermally conductive insulating layer, openwork part is distributed on the metallic plate around contact for contact；Two pieces of end plates are provided with institute
The one side for stating contact is oppositely arranged, and semiconductor layer is electrically connected to form conducting wire with contact.
2. semiconductor refrigeration sheet according to claim 1, it is characterised in that the contact is in the thermally conductive insulating layer
Matrix is arranged.
3. semiconductor refrigeration sheet according to claim 1, it is characterised in that the profile of the hollow-out parts is in " recessed " shape, is engraved
The interior recess in empty portion is set towards the contact.
4. semiconductor refrigeration sheet according to claim 1, it is characterised in that the metallic plate is made using aluminum.
5. semiconductor refrigeration sheet according to claim 1, it is characterised in that the metallic plate is made using red copper.
6. semiconductor refrigeration sheet according to claim 1, it is characterised in that the contact is made using copper foil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720675064.0U CN206819982U (en) | 2017-06-12 | 2017-06-12 | Semiconductor refrigeration sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720675064.0U CN206819982U (en) | 2017-06-12 | 2017-06-12 | Semiconductor refrigeration sheet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206819982U true CN206819982U (en) | 2017-12-29 |
Family
ID=60759615
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720675064.0U Active CN206819982U (en) | 2017-06-12 | 2017-06-12 | Semiconductor refrigeration sheet |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206819982U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107093585A (en) * | 2017-06-12 | 2017-08-25 | 厦门帕尔帖电子科技有限公司 | Semiconductor refrigeration sheet and semiconductor refrigeration sheet manufacture craft |
| CN110361517A (en) * | 2019-07-16 | 2019-10-22 | 深圳市中昌检测技术有限公司 | A kind of automatic detection system |
-
2017
- 2017-06-12 CN CN201720675064.0U patent/CN206819982U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107093585A (en) * | 2017-06-12 | 2017-08-25 | 厦门帕尔帖电子科技有限公司 | Semiconductor refrigeration sheet and semiconductor refrigeration sheet manufacture craft |
| CN110361517A (en) * | 2019-07-16 | 2019-10-22 | 深圳市中昌检测技术有限公司 | A kind of automatic detection system |
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