CN203659934U - Microgroove group heat radiating device of high-power LED (light emitting diode) - Google Patents
Microgroove group heat radiating device of high-power LED (light emitting diode) Download PDFInfo
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- CN203659934U CN203659934U CN201320722266.8U CN201320722266U CN203659934U CN 203659934 U CN203659934 U CN 203659934U CN 201320722266 U CN201320722266 U CN 201320722266U CN 203659934 U CN203659934 U CN 203659934U
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- heat
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- power led
- led
- heat radiating
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- 238000001704 evaporation Methods 0.000 claims abstract description 6
- 230000008020 evaporation Effects 0.000 claims abstract description 6
- 238000004806 packaging method and process Methods 0.000 claims description 16
- 229910000679 solder Inorganic materials 0.000 claims description 7
- 230000005494 condensation Effects 0.000 abstract description 4
- 238000009833 condensation Methods 0.000 abstract description 4
- 230000000694 effects Effects 0.000 abstract description 4
- 239000007788 liquid Substances 0.000 abstract description 4
- 239000000758 substrate Substances 0.000 abstract 2
- 239000000463 material Substances 0.000 description 7
- 238000001816 cooling Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000037361 pathway Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
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Abstract
The utility model relates to a microgroove group heat radiating device of a high-power LED (light emitting diode). The technical scheme is that a package substrate of the high-power LED is used to act en evaporation end of the microgroove group radiator, the surface of the LED package substrate is provided with a microgroove group, a heat taking medium liquid absorbs heat on the microgroove surface and is vaporized into steam, the steam sends the heat to a condensation end under the action of pressure gradient, the steam releases the heat at the condensation end, and the condensed liquid flows back to the evaporation end. The heat radiating technology reduces heat resistance because the heat radiating path is shortened to be the shortest, thereby achieving an effect of reducing the LED chip junction temperature.
Description
Technical field
The utility model relates to a kind of microflute group heat abstractor of great power LED, specifically, relates to the microflute group heat abstractor of great power LED, belongs to LED field.
Background technology
The microflute group heat abstractor of existing great power LED as shown in Figure 1, mainly by LED chip group (1), solder layer (2), LED base plate for packaging (3), Heat Conduction Material (4), the parts compositions such as microflute group radiator (5), its heat dissipation path is LED chip group (1) >> solder layer (2) >>LED base plate for packaging (3) >> Heat Conduction Material (4) >> microflute group radiator (5) >> air, wherein the conductive coefficient of Heat Conduction Material is little, base plate for packaging also has certain thickness simultaneously, therefore introduce to such an extent that thermal resistance is larger, the simultaneously application of Heat Conduction Material whether evenly and the fineness on base plate for packaging and liquid cooling heat radiator surface and the technological level of application Heat Conduction Material also can affect the heat-conducting effect after Heat Conduction Material application, this just makes the radiating effect consistency of current heat abstractor not good, the problems such as poor reliability and thermal resistance are large are never solved well.
Summary of the invention
The purpose of this utility model is exactly the defects such as, poor reliability not good for the consistency of existing great power LED microflute group heat abstractor and thermal resistance are large, provides a kind of simple in structure, high conformity, dependable performance, the great power LED microflute group heat abstractor that thermal resistance is little.
Its technical scheme is: great power LED microflute group heat abstractor comprises high-power LED chip group (1), solder layer (2), microflute group radiator (7), it is characterized in that: described high-power LED chip group (1) is encapsulated on LED base plate for packaging (9) by solder layer, described LED base plate for packaging (9) is the evaporation ends of groove group radiator (7), is provided with micron-sized microflute group (6) at the heat-delivery surface of described LED base plate for packaging (9).
The beneficial effects of the utility model are:
1. compared with existing great power LED microflute group heat abstractor, there is no thermal conductive material layer and LED base plate for packaging layer, thermally conductive pathways obviously shortens, and thermal resistance obviously reduces.
2. owing to not needing application Heat Conduction Material, heat radiation high conformity, reliability is high.
Accompanying drawing explanation
Fig. 1 is existing great power LED microflute group heat abstractor schematic diagram;
Fig. 2 is the utility model great power LED microflute group heat abstractor schematic diagram;
Embodiment
Below in conjunction with accompanying drawing 2, the utility model is described in further detail, LED chip group (1) is encapsulated on LED base plate for packaging (9) by solder layer (2), be provided with micron-sized microflute group (6) at the heat-delivery surface of LED base plate for packaging (9), LED base plate for packaging (9) is the evaporation ends of microflute group radiator (7), heat-obtaining media fluid absorbs the heat of LED chip generation and is vaporized into steam at microchanneled surface, steam is delivered to condensation end (8) heat under the effect of barometric gradient, steam is in condensation end release heat, be condensed into liquid backflow to evaporation ends, circulation realization like this is cooling to LED chip.Wherein, microflute group region need cover all LED chip packaging areas, and microflute section width is less than 0.8mm, and the degree of depth is greater than 1 times of width, and density is every centimetre and is greater than 10.
Claims (2)
1. the microflute group heat abstractor of a great power LED, comprise high-power LED chip group (1), solder layer (2), microflute group radiator (7), it is characterized in that: described high-power LED chip group (1) is encapsulated on LED base plate for packaging (9) by solder layer, described LED base plate for packaging (9) is the evaporation ends of groove group radiator (7), is provided with micron-sized microflute group (6) at the heat-delivery surface of described LED base plate for packaging (9).
2. the microflute group heat abstractor of a kind of great power LED according to claim 1, described microflute group (6) region covers all LED chip groups' packaging area, and microflute section width is less than 0.8mm, the degree of depth is greater than 1 times of width, and density is every centimetre and is greater than 10.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320722266.8U CN203659934U (en) | 2013-11-17 | 2013-11-17 | Microgroove group heat radiating device of high-power LED (light emitting diode) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320722266.8U CN203659934U (en) | 2013-11-17 | 2013-11-17 | Microgroove group heat radiating device of high-power LED (light emitting diode) |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203659934U true CN203659934U (en) | 2014-06-18 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320722266.8U Expired - Fee Related CN203659934U (en) | 2013-11-17 | 2013-11-17 | Microgroove group heat radiating device of high-power LED (light emitting diode) |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203659934U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105066028A (en) * | 2015-04-01 | 2015-11-18 | 湖南微酷光电科技有限公司 | Ultrahigh-power LED high-pole lamp |
| CN106152080A (en) * | 2015-04-01 | 2016-11-23 | 湖南玖泓节能科技有限公司 | A kind of super-high-power LED stage lighting |
| CN111735147A (en) * | 2020-07-24 | 2020-10-02 | 湖南微酷光电科技有限公司 | Disinfection subassembly based on ultraviolet UVC |
| CN113864743A (en) * | 2021-10-21 | 2021-12-31 | 中国科学院工程热物理研究所 | Photothermal integrated radiator |
-
2013
- 2013-11-17 CN CN201320722266.8U patent/CN203659934U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105066028A (en) * | 2015-04-01 | 2015-11-18 | 湖南微酷光电科技有限公司 | Ultrahigh-power LED high-pole lamp |
| CN106152080A (en) * | 2015-04-01 | 2016-11-23 | 湖南玖泓节能科技有限公司 | A kind of super-high-power LED stage lighting |
| CN111735147A (en) * | 2020-07-24 | 2020-10-02 | 湖南微酷光电科技有限公司 | Disinfection subassembly based on ultraviolet UVC |
| CN113864743A (en) * | 2021-10-21 | 2021-12-31 | 中国科学院工程热物理研究所 | Photothermal integrated radiator |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140618 Termination date: 20181117 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |