CN207051829U - Cloud Server chip liquid metal heat radiation system - Google Patents
Cloud Server chip liquid metal heat radiation system Download PDFInfo
- Publication number
- CN207051829U CN207051829U CN201720413001.8U CN201720413001U CN207051829U CN 207051829 U CN207051829 U CN 207051829U CN 201720413001 U CN201720413001 U CN 201720413001U CN 207051829 U CN207051829 U CN 207051829U
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- strip groove
- liquid metal
- chip
- sheet metal
- cover plate
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
It the utility model is related to field of computer technology.Cloud Server chip liquid metal heat radiation system, including a chip, the top of chip is provided with cooling system, cooling system includes sheet metal in the form of sheets, the upper surface of sheet metal is provided with the strip groove that at least three opening upwards are equidistantly arranged, the depth of strip groove is 1mm 2mm, and for the length of strip groove not less than 3/4ths of the length of sheet metal, the spacing of two neighboring strip groove is not more than 4mm；Liquid metal, 2/3rds of volume no more than the volume of strip groove of liquid metal, and 1/3rd of the volume not less than strip groove are filled with strip groove；A cover plate is stamped on each strip groove, using cover plate as radiating fin, the lower surface of cover plate is connected to contact the plates of liquid metal, and heat exchanger is used as using plates.This patent optimizes carries out radiating and cooling using the sheet metal of filling liquid metal, and thermal diffusivity is far longer than solid metallic.
Description
Technical field
It the utility model is related to field of computer technology, and in particular to Cloud Server chip.
Background technology
With widely using for Cloud Server, the chip integration among server increases substantially, and computing is fast, carries energy
Power is big, is worked for a long time at a high temperature of relative, and the stability of system is challenged, and the radiating for chip, which turns into, urgently to be solved
Certainly the problem of.
Existing cooling system is typically that fin, fin generally use aluminium alloy, brass or green grass or young crops are adhered on chip
Copper.But this radiating effect is slower, it is difficult to adapts to the demand for reading and storing at a high speed now.
Utility model content
The purpose of this utility model is, there is provided Cloud Server chip liquid metal heat radiation system, with solve it is above-mentioned at least
One technical problem.
The technical problem that the utility model solves can be realized using following technical scheme：
Cloud Server chip liquid metal heat radiation system, including a chip, the top of the chip are provided with a cooling system,
It is characterized in that：
The cooling system includes the sheet metal one in the form of sheets, the upper surface of the sheet metal provided with least three be open to
On the strip groove equidistantly arranged；
The depth of the strip groove is 1mm-2mm, and the length of the strip groove is not less than the length of the sheet metal
3/4ths；
Liquid metal is filled with the strip groove, the volume of the liquid metal is not more than the appearance of the strip groove
Long-pending 2/3rds, and 1/3rd of the volume not less than the strip groove；
A cover plate is stamped on each strip groove, radiating fin is used as using the cover plate；
The lower surface of the cover plate is connected to contact the plates of liquid metal, and heat exchanger is used as using the plates.
This patent, which optimizes traditional die, to be needed to rely on copper or aluminum alloy heat sink progress radiating and cooling, and uses filling
The sheet metal of liquid metal carries out radiating and cooling, and sheet metal is more close as the contact between heat dissipating layer and chip, is more conducive to
Radiating.Liquid metal is liquid at high temperature (such as more than 40 degree) simultaneously, when needing to radiate to chip, completes liquid
Conversion, the mobility of liquid, under upper and lower temperature difference effect, convection current can be produced, thermal diffusivity is far longer than solid metallic.
Other this patent is by the heat loss through convection of liquid metal, and thermal conductive metal plate is combined made of solid metallic, is both protected
The heat exchange performance of liquid metal intensity has been demonstrate,proved, has realized the sealing to liquid metal again, ensure that the security of circuit.Simultaneously
This patent is by the way that the volume of liquid metal is optimized, and while radiating is realized, saves the cost of liquid metal.
The liquid metal is gallium alloy, preferably indium gallium alloy.
The liquid metal that this patent uses is gallium alloy, when gallium alloy uses indium gallium alloy as groove filler, is compared
Original aluminium alloy thermal conductive metal plate has more preferable radiating effect.
The lower section of the chip is provided with a sheet fin, and the fin is a graphite heat radiation fin；
The contact surface of the fin and the chip also coats a heat conduction silicone, and the thickness of the heat conduction silicone is
0.1mm-0.2mm。
What is selected in this patent above and below chip is different radiating modes.The top of chip is using liquid gold
Category radiating, liquid metal are filled in the lower section of groove, can be to playing good radiating effect, while liquid gold above chip
Belong to and be not filled with full groove, because liquid metal is more expensive, saved cost.The lower section of chip using graphite heat radiation fin, and
It is not liquid metal, also can be to playing good radiating effect below chip while cost is reduced.In addition in fin
With chip contact surface coated with thermally conductive layer of silica gel, the heat that chip is sent is set more effectively to be transmitted on fin, then through fin
It is dispersed into surrounding air.
The spacing of the lower surface of sheet metal described in the distance from bottom of the strip groove is not more than 0.5mm.It is easy to ensure recessed
Radiating of the liquid metal to chip in groove.
An adhesion layer for being used to adhering to sheet metal into chip is also adhered in the lower surface of the sheet metal, and the adhesion layer is
The adhesion layer made of heat conductive silica gel, the thickness of the adhesion layer are not more than 0.2mm.
This patent is easy to implement being connected for chip and sheet metal by adhesion layer, in addition, adhesion layer is also by with radiating
The material conducts heat silicone grease of property, heat-conducting silicone grease have electrical insulating property, there is excellent thermal conductivity again.
The sheet metal is a sheet metal piece, and the cover plate is steel cover plate, and the plates are steel plates.Gallium
Alloy has corrosivity to aluminium, and compared to thermal conductive metal plate made of original aluminium alloy, gallium alloy can be prevented using sheet metal piece
Corrosion to sheet metal, while steel has preferable thermal conductivity.
The height of the cover plate is not more than 3mm；
The length of the cover plate is more than the length of the strip groove, and difference between the two is 1mm-2mm；
The width of the cover plate is more than the width of the strip groove, and difference between the two is 1mm-2mm.
This patent is by optimizing the size of cover plate, while thermal diffusivity is realized, ensures that cover plate can cover all bar
Shape groove, and improve the radiating effect of sheet metal.
Brief description of the drawings
Fig. 1 is structural representation of the present utility model；
Fig. 2 is sectional view of the present utility model.
Embodiment
In order that technological means, creation characteristic, reached purpose and effect that the utility model is realized are easy to understand, under
Face, which combines to be specifically illustrating, is expanded on further the utility model.
Reference picture 1, Fig. 2, Cloud Server chip liquid metal heat radiation system, including a chip 5, the top of chip 5 are provided with
One cooling system.Cooling system includes the sheet metal 1 one in the form of sheets, and the upper surface of sheet metal 1 is provided with least three opening upwards
The strip groove 4 equidistantly arranged.The depth of strip groove 4 is 1mm-2mm, and the length of strip groove 4 is not less than sheet metal 1
3/4ths of length, the spacing of two neighboring strip groove 4 are not more than 4mm.Liquid metal, liquid are filled with strip groove 4
The volume of state metal no more than strip groove 4 volume 2/3rds, and not less than strip groove 4 volume three/
One.A cover plate 2 is stamped on each strip groove 4, radiating fin is used as using cover plate 2.The lower surface of cover plate 2 is connected to Fluid Contacting
The plates of state metal, heat exchanger is used as using plates.
This patent, which optimizes traditional die 5, to be needed to rely on copper or aluminum alloy heat sink progress radiating and cooling, and use is filled out
The sheet metal 1 for filling liquid metal carries out radiating and cooling, and sheet metal 1 is more close as the contact between heat dissipating layer and chip 5, more
Beneficial to radiating.Liquid metal is liquid at high temperature (such as more than 40 degree) simultaneously, when needing to radiate to chip 5, is completed
Liquid converts, the mobility of liquid, under upper and lower temperature difference effect, can produce convection current, thermal diffusivity is far longer than solid metallic.
Other this patent is by the heat loss through convection of liquid metal, and thermal conductive metal plate 1 is combined made of solid metallic, is both protected
The heat exchange performance of liquid metal intensity has been demonstrate,proved, has realized the sealing to liquid metal again, ensure that the security of circuit.Simultaneously
This patent is by the way that the volume of liquid metal is optimized, and while radiating is realized, saves the cost of liquid metal.
The outline of sheet metal 1 is in a cuboid, and a length of 5mm-8mm of cuboid, a width of 2mm-4mm of cuboid are long
A height of 2mm-3mm of cube.Using the structure of cuboid, the radiating to heater element is easy to implement.
Liquid metal is gallium alloy, preferably indium gallium alloy.The liquid metal that this patent uses is gallium alloy, and gallium alloy uses
When indium gallium alloy is as groove filler, there is more preferable radiating effect compared to original aluminium alloy thermal conductive metal plate 1.
The lower section of chip 5 is provided with a sheet fin 6, and fin 6 is a graphite heat radiation fin 6.Fin 6 and the chip
5 contact surface also coats a heat conduction silicone 7, and the thickness of the heat conduction silicone 7 is 0.1mm-0.2mm.In core in this patent
What is selected above and below piece 5 is different radiating modes.The top of chip 5 uses liquid metal heat radiation, and liquid metal is filled out
Fill in the lower section of groove, can play good radiating effect to the top of chip 5, while liquid metal and be not filled with completely recessed
Groove, because liquid metal is more expensive, cost is saved.The lower section of chip 5 using graphite heat radiation fin 6, rather than liquid metal,
While cost is reduced can also good radiating effect be played to the lower section of chip 5.Contacted in addition in fin 6 and chip 5
Face coated with thermally conductive layer of silica gel 7, the heat that chip 5 is sent more effectively is transmitted on fin 6, then be dispersed into through fin 6
In surrounding air.
The spacing of the lower surface of the distance from bottom sheet metal 1 of strip groove 4 is not more than 0.5mm.It is easy to ensure in groove
Radiating of the liquid metal to chip 5.
The lower surface of sheet metal 1 also adheres to one and is used to adhering to sheet metal 1 into the adhesion layer 3 of chip 5, adhesion layer 3 be by
Adhesion layer 3 made of heat conductive silica gel, the thickness of adhesion layer 3 are not more than 0.2mm.This patent is easy to implement chip 5 by adhesion layer 3
With being connected for sheet metal 1, in addition, adhesion layer 3 is also by the material conducts heat silicone grease with thermal diffusivity, heat-conducting silicone grease, which has, to be electrically insulated
Property, there is excellent thermal conductivity again.
Sheet metal 1 is a sheet metal piece 1, and cover plate 2 is steel cover plate 2, and plates are steel plates.Gallium alloy is to aluminium
With corrosivity, compared to thermal conductive metal plate 1 made of original aluminium alloy, using sheet metal piece 1 gallium alloy can be prevented to metal
The corrosion of piece 1, while steel has preferable thermal conductivity.
The height of cover plate 2 is not more than 3mm.The length of cover plate 2 is more than the length of strip groove 4, and difference between the two is
1mm-2mm.The width of cover plate 2 is more than the width of strip groove 4, and difference between the two is 1mm-2mm.This patent passes through optimization
The size of cover plate 2, while thermal diffusivity is realized, ensure that cover plate 2 can cover all strip groove 4, and improve sheet metal 1
Radiating effect.
The general principle and principal character and advantages of the present invention of the present invention has been shown and described above.The technology of the industry
Personnel are it should be appreciated that the present invention is not limited to the above embodiments, and the simply explanation described in above-described embodiment and specification is originally
The principle of invention, without departing from the spirit and scope of the present invention, various changes and modifications of the present invention are possible, these changes
Change and improvement all fall within the protetion scope of the claimed invention.The claimed scope of the invention by appended claims and its
Equivalent thereof.
Claims (4)
1. Cloud Server chip liquid metal heat radiation system, including a chip, the top of the chip is provided with a cooling system, its
It is characterised by：
The cooling system includes the sheet metal one in the form of sheets, and the upper surface of the sheet metal is provided with least three opening upwards etc.
The strip groove of spacing arrangement；
The depth of the strip groove is 1mm-2mm, and the length of the strip groove is not less than the four of the length of the sheet metal
/ tri-；
Liquid metal is filled with the strip groove, the volume of the liquid metal is no more than the volume of the strip groove
2/3rds, and 1/3rd of the volume not less than the strip groove；
A cover plate is stamped on each strip groove, radiating fin is used as using the cover plate；
The lower surface of the cover plate is connected to contact the plates of liquid metal, and heat exchanger is used as using the plates.
2. Cloud Server chip liquid metal heat radiation system according to claim 1, it is characterised in that：The liquid metal
It is indium gallium alloy.
3. Cloud Server chip liquid metal heat radiation system according to claim 2, it is characterised in that：Under the chip
Side is provided with a sheet fin, and the fin is a graphite heat radiation fin；
The contact surface of the fin and the chip also coats a heat conduction silicone, and the thickness of the heat conduction silicone is
0.1mm-0.2mm。
4. the Cloud Server chip liquid metal heat radiation system according to any one in claim 1-3, it is characterised in that：
The spacing of the lower surface of sheet metal described in the distance from bottom of the strip groove is not more than 0.5mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720413001.8U CN207051829U (en) | 2017-04-19 | 2017-04-19 | Cloud Server chip liquid metal heat radiation system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720413001.8U CN207051829U (en) | 2017-04-19 | 2017-04-19 | Cloud Server chip liquid metal heat radiation system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207051829U true CN207051829U (en) | 2018-02-27 |
Family
ID=61490014
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720413001.8U Active CN207051829U (en) | 2017-04-19 | 2017-04-19 | Cloud Server chip liquid metal heat radiation system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207051829U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108769187A (en) * | 2018-05-28 | 2018-11-06 | 北京梦之墨科技有限公司 | A kind of internet of things control system and control method |
| CN116033703A (en) * | 2021-10-27 | 2023-04-28 | 荣耀终端有限公司 | Heat conduction pad, heat dissipation module and electronic equipment |
-
2017
- 2017-04-19 CN CN201720413001.8U patent/CN207051829U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108769187A (en) * | 2018-05-28 | 2018-11-06 | 北京梦之墨科技有限公司 | A kind of internet of things control system and control method |
| CN116033703A (en) * | 2021-10-27 | 2023-04-28 | 荣耀终端有限公司 | Heat conduction pad, heat dissipation module and electronic equipment |
| WO2023071485A1 (en) * | 2021-10-27 | 2023-05-04 | 荣耀终端有限公司 | Heat conduction pad, heat dissipation module and electronic device |
| CN116033703B (en) * | 2021-10-27 | 2024-08-27 | 荣耀终端有限公司 | Electronic equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 200433 Room 201, No. 465, Guohe Road, Minhang District, Shanghai Patentee after: Shanghai kangtao Information Technology Co.,Ltd. Address before: 200433, room 465, country road 201, Shanghai, Yangpu District Patentee before: SHANGHAI PAKKA INFORMATION TECHNOLOGY Co.,Ltd. |
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| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20200428 Address after: 201100 room 319-b, No. 28, Yuanwen Road, Minhang District, Shanghai Patentee after: Shanghai Debye Data Technology Co.,Ltd. Address before: 200433 Room 201, No. 465, Guohe Road, Minhang District, Shanghai Patentee before: Shanghai kangtao Information Technology Co.,Ltd. |
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| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20201119 Address after: 201100 room 319-a, No. 28, Yuanwen Road, Minhang District, Shanghai Patentee after: Shanghai Paco Information Technology Co.,Ltd. Address before: 201100 room 319-b, No. 28, Yuanwen Road, Minhang District, Shanghai Patentee before: Shanghai Debye Data Technology Co.,Ltd. |