CN206322688U - Chip thermal conductive metal plate provided with gallium alloy subsidiary layer - Google Patents

Chip thermal conductive metal plate provided with gallium alloy subsidiary layer Download PDF

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Publication number
CN206322688U
CN206322688U CN201621321572.0U CN201621321572U CN206322688U CN 206322688 U CN206322688 U CN 206322688U CN 201621321572 U CN201621321572 U CN 201621321572U CN 206322688 U CN206322688 U CN 206322688U
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China
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cavity
thermal conductive
conductive metal
gallium alloy
metallic plate
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CN201621321572.0U
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Chinese (zh)
Inventor
李延民
范勇
程亚东
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Shanghai Alaid Industrial Ltd By Share Ltd
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Shanghai Alaid Industrial Ltd By Share Ltd
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Abstract

The utility model is related to mechanical field, specific chip thermal conductive metal plate.Chip thermal conductive metal plate provided with gallium alloy subsidiary layer, including one metallic plate in the form of sheets, metallic plate is provided with the radiating fin with air heat-exchange, cavity in being provided with one in metallic plate, and gallium alloy is filled with middle cavity;The minimum range of the inwall of middle cavity to metallic plate outer wall is no more than 0.3mm;Middle cavity is in a rectangular-shape, and the ratio between the length of middle cavity is 12:10:3;Metallic plate upper surface is provided with least five strip projected parts, and using strip projected parts as radiating fin, at least five strip projected parts are evenly spaced in the upper surface of metallic plate.The utility model is filled out by using middle cavity in thermal conductive metal plate and sets gallium alloy, and using the characteristic of gallium alloy " liquid metal ", gallium alloy fusing point is low, and heat convection can be produced when being in a liquid state, compared to the thermal conductive metal plate of original aluminium alloy, with more preferable radiating effect.

Description

Chip thermal conductive metal plate provided with gallium alloy subsidiary layer
Technical field
The utility model is related to mechanical field, specific chip thermal conductive metal plate.
Background technology
The thermal conductive metal plate for being currently used for radiating is generally made of aluminium alloy, but is directed to hyperpyrexia when some are used Its radiating effect is unsatisfactory during chip.
Utility model content
The purpose of this utility model is to provide a kind of chip thermal conductive metal plate provided with gallium alloy subsidiary layer, with solution State technical problem.
The technical problem that the utility model is solved can be realized using following technical scheme:
Chip thermal conductive metal plate provided with gallium alloy subsidiary layer, including one metallic plate in the form of sheets, set on the metallic plate There is the radiating fin with air heat-exchange, it is characterised in that be filled with cavity in being provided with one in the metallic plate, the middle cavity Gallium alloy;
The minimum range of the inwall of the middle cavity to the metallic plate outer wall is no more than 0.3mm;
The middle cavity is in a rectangular-shape, and the ratio between the length of the middle cavity is 12:10:3;
The metallic plate upper surface is provided with least five strip projected parts, using the strip projected parts as the radiating fin, At least five strip projected parts are evenly spaced in the upper surface of the metallic plate.
The utility model is filled out by using middle cavity in thermal conductive metal plate and sets gallium alloy, utilizes gallium alloy " liquid metal " Characteristic, gallium alloy fusing point is low, and heat convection can be produced when being in a liquid state, compared to the thermal conductive metal plate of original aluminium alloy, with more Good radiating effect.
The strip projected parts of at least five improve heat transfer effect to increase the contact surface of metallic plate upper surface and air.
" liquid metal " is liquid at high temperature (such as more than 40 degree).When needing to radiate to chip, liquid is completed Conversion.The mobility of liquid, under upper and lower temperature difference effect, can produce convection current, thermal diffusivity is far longer than solid metallic.This patent will The heat loss through convection of liquid metal, and the thermal conductive metal plate that solid metallic is made are combined, and both ensure that the heat of liquid metal intensity Switching performance, realizes the sealing to liquid metal again, it is ensured that the security of circuit.
The ratio between length of middle cavity is 12:10:3, can still have in the case where ensureing that thermal conductive metal plate is relatively thin Preferable heat loss through convection effect.
As a kind of scheme, the length of the middle cavity in 12mm~13mm, the width of the middle cavity 10mm~ 11mm, the height of the middle cavity is in 3mm~5mm.The heat dissipation of electronic chip common available for existing market, with preferably scattered Thermal effect;The height of middle cavity can form preferable convection current when 3mm~5mm make it that gallium alloy reaches that its fusing point is in a liquid state Heat exchange, small volume, it is not necessary to increase equipment volume.
The height of the strip projected parts is in below 0.2mm.To ensure the bonding strength of strip projected parts and metallic plate upper surface. Spacing between the two neighboring strip projected parts is in 0.5mm~3mm.
The longitudinal section of the strip projected parts is triangular in shape.To ensure structural strength, while electronic component is more at chip, heat conduction Less, the radiating fin of triangle can ensure larger projection and the contact area of air to the installing space of sheet metal.
4/5ths of the length of the strip projected parts not less than the length of middle cavity.To ensure that it is hollow that strip projected parts are located at When above chamber, the radiating effect of cavity upper metal plate in can accelerating.
The gallium alloy uses one kind in indium gallium alloy, aluminum gallium alloy, copper gallium alloy.Indium gallium alloy, aluminum gallium alloy, copper Gallium alloy fills when making middle cavity filler, has more preferable radiating effect compared to original aluminium alloy thermal conductive metal plate.
The metallic plate can adopt the metallic plate being made of a steel.Gallium alloy has corrosivity to aluminium, compared to original aluminium alloy system Into thermal conductive metal plate, corrosion of the gallium alloy to metallic plate can be prevented using steel, while steel has preferable thermal conductivity.
The lower surface of the metallic plate is also pasted with an adhesion layer for being used to adhering to metallic plate into chip.The adhesion layer It is the adhesion layer being made of heat-conducting silicone grease.Heat-conducting silicone grease has electrical insulating property, there is excellent thermal conductivity again.
Brief description of the drawings
Fig. 1 is part-structure sectional view of the present utility model;
Fig. 2 is part-structure schematic diagram of the present utility model.
Embodiment
In order that technological means, creation characteristic, reached purpose and effect that the utility model is realized are easy to understand, under Face, which combines to be specifically illustrating, is expanded on further the utility model.
Referring to Fig. 1 and Fig. 2, the chip thermal conductive metal plate provided with gallium alloy subsidiary layer, including one metallic plate 1 in the form of sheets, Metallic plate 1 is provided with radiating fin with air heat-exchange, cavity 2 in being provided with one in metallic plate, is closed in middle cavity 2 filled with gallium Gold;The minimum range of the inwall of middle cavity to metallic plate outer wall is no more than 0.3mm;Middle cavity is in a rectangular-shape, middle cavity The ratio between length is 12:10:3;Metallic plate upper surface is used as radiating fin provided with least five strip projected parts using strip projected parts Piece, at least five strip projected parts are evenly spaced in the upper surface of metallic plate.The utility model is by using in thermal conductive metal plate Cavity, which is filled out, sets gallium alloy, using the characteristic of gallium alloy " liquid metal ", and gallium alloy fusing point is low, and convection current can be produced when being in a liquid state and is changed Heat, compared to the thermal conductive metal plate of original aluminium alloy, with more preferable radiating effect.
The strip projected parts of at least five improve heat transfer effect to increase the contact surface of metallic plate upper surface and air.
" liquid metal " is liquid at high temperature (such as more than 40 degree).When needing to radiate to chip, liquid is completed Conversion.The mobility of liquid, under upper and lower temperature difference effect, can produce convection current, thermal diffusivity is far longer than solid metallic.This patent will The heat loss through convection of liquid metal, and the thermal conductive metal plate that solid metallic is made are combined, and both ensure that the heat of liquid metal intensity Switching performance, realizes the sealing to liquid metal again, it is ensured that the security of circuit.
The ratio between length of middle cavity is 12:10:3, can still have in the case where ensureing that thermal conductive metal plate is relatively thin Preferable heat loss through convection effect.
As a kind of scheme, the length of middle cavity is in 12mm~13mm, and the width of middle cavity is in 10mm~11mm, middle cavity Height in 3mm~5mm.The heat dissipation of electronic chip common available for existing market, with preferably radiating effect;Middle cavity Height can form preferable heat convection, small volume is not required to when 3mm~5mm make it that gallium alloy reaches that its fusing point is in a liquid state Increase equipment volume.
Metallic plate upper surface is provided with the strip projected parts 3 of at least five, and at least five strip projected parts 3 are evenly spaced in metallic plate Upper surface.To increase the contact surface of metallic plate upper surface and air, heat transfer effect is improved.
The height of strip projected parts is in below 0.2mm.To ensure the bonding strength of strip projected parts and metallic plate upper surface.It is adjacent Spacing between two strip projected parts is in 0.5mm~3mm.
The longitudinal section of strip projected parts is triangular in shape.To ensure structural strength, while electronic component is more at chip, heat-conducting metal Less, the radiating fin of triangle can ensure larger projection and the contact area of air to the installing space of piece.
4/5ths of the length of strip projected parts not less than the length of middle cavity.To ensure that strip projected parts are located on middle cavity Fang Shi, the radiating effect of cavity upper metal plate in can accelerating.
Gallium alloy uses one kind in indium gallium alloy, aluminum gallium alloy, copper gallium alloy.Indium gallium alloy, aluminum gallium alloy, copper gallium are closed Gold fills when making middle cavity filler, has more preferable radiating effect compared to original aluminium alloy thermal conductive metal plate.
Metallic plate can adopt the metallic plate being made of a steel.Gallium alloy has corrosivity to aluminium, is made compared to original aluminium alloy Thermal conductive metal plate, corrosion of the gallium alloy to metallic plate can be prevented using steel, while steel has preferable thermal conductivity.
The lower surface of metallic plate is also pasted with an adhesion layer 4 for being used to adhering to metallic plate into chip.Adhesion layer 4 is to use The adhesion layer that heat-conducting silicone grease is made.Heat-conducting silicone grease has electrical insulating property, there is excellent thermal conductivity again.
General principle of the present utility model and principal character and advantage of the present utility model has been shown and described above.This The technical staff of industry is retouched in above-described embodiment and specification it should be appreciated that the utility model is not restricted to the described embodiments That states simply illustrates principle of the present utility model, on the premise of the utility model spirit and scope are not departed from, the utility model Various changes and modifications are also had, these changes and improvements are both fallen within the range of claimed the utility model.This practicality is new Scope is claimed by appending claims and its equivalent thereof in type.

Claims (7)

1. the chip thermal conductive metal plate provided with gallium alloy subsidiary layer, including one metallic plate in the form of sheets, the metallic plate is provided with With the radiating fin of air heat-exchange, it is characterised in that be filled with gallium in cavity in being provided with one in the metallic plate, the middle cavity Alloy;
The minimum range of the inwall of the middle cavity to the metallic plate outer wall is no more than 0.3mm;
The middle cavity is in a rectangular-shape, and the ratio between the length of the middle cavity is 12:10:3;
The metallic plate upper surface is provided with least five strip projected parts, using the strip projected parts as the radiating fin, at least Five strip projected parts are evenly spaced in the upper surface of the metallic plate.
2. the chip thermal conductive metal plate according to claim 1 provided with gallium alloy subsidiary layer, it is characterised in that:It is described hollow The length of chamber is in 12mm~13mm, and the width of the middle cavity is in 10mm~11mm, and the height of the middle cavity is in 3mm~5mm.
3. the chip thermal conductive metal plate according to claim 1 provided with gallium alloy subsidiary layer, it is characterised in that:The strip Raised height is in below 0.2mm;Spacing between the two neighboring strip projected parts is in 0.5mm~3mm.
4. the chip thermal conductive metal plate according to claim 3 provided with gallium alloy subsidiary layer, it is characterised in that:The strip Raised longitudinal section is triangular in shape.
5. the chip thermal conductive metal plate according to claim 4 provided with gallium alloy subsidiary layer, it is characterised in that:The strip 4/5ths of raised length not less than the length of middle cavity.
6. the chip thermal conductive metal plate according to claim 1 provided with gallium alloy subsidiary layer, it is characterised in that:The metal Plate adopts the metallic plate being made of a steel.
7. the chip thermal conductive metal plate according to claim 1 provided with gallium alloy subsidiary layer, it is characterised in that:The metal The lower surface of plate is also pasted with an adhesion layer for being used to adhering to metallic plate into chip;The adhesion layer is to use heat-conducting silicone grease system Into adhesion layer.
CN201621321572.0U 2016-12-05 2016-12-05 Chip thermal conductive metal plate provided with gallium alloy subsidiary layer Active CN206322688U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201621321572.0U CN206322688U (en) 2016-12-05 2016-12-05 Chip thermal conductive metal plate provided with gallium alloy subsidiary layer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201621321572.0U CN206322688U (en) 2016-12-05 2016-12-05 Chip thermal conductive metal plate provided with gallium alloy subsidiary layer

Publications (1)

Publication Number Publication Date
CN206322688U true CN206322688U (en) 2017-07-11

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CN201621321572.0U Active CN206322688U (en) 2016-12-05 2016-12-05 Chip thermal conductive metal plate provided with gallium alloy subsidiary layer

Country Status (1)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110416384A (en) * 2019-07-30 2019-11-05 深圳市两岸光电科技有限公司 A kind of packaging method promoting LED lamp bead light efficiency

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110416384A (en) * 2019-07-30 2019-11-05 深圳市两岸光电科技有限公司 A kind of packaging method promoting LED lamp bead light efficiency

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