CN207054000U - The pouring-in electromagnetic signal shielding harness of liquid metal - Google Patents

The pouring-in electromagnetic signal shielding harness of liquid metal Download PDF

Info

Publication number
CN207054000U
CN207054000U CN201621321903.0U CN201621321903U CN207054000U CN 207054000 U CN207054000 U CN 207054000U CN 201621321903 U CN201621321903 U CN 201621321903U CN 207054000 U CN207054000 U CN 207054000U
Authority
CN
China
Prior art keywords
cover
layer
liquid metal
chip
electromagnetic signal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201621321903.0U
Other languages
Chinese (zh)
Inventor
李延民
尚晨光
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shanghai Alaid Industrial Ltd By Share Ltd
Original Assignee
Shanghai Alaid Industrial Ltd By Share Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shanghai Alaid Industrial Ltd By Share Ltd filed Critical Shanghai Alaid Industrial Ltd By Share Ltd
Priority to CN201621321903.0U priority Critical patent/CN207054000U/en
Application granted granted Critical
Publication of CN207054000U publication Critical patent/CN207054000U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Abstract

It the utility model is related to mechanical field, specific electromagnetic signal shielding harness.The pouring-in electromagnetic signal shielding harness of liquid metal, include the carrier of bearing integrated chip, and one is used to be located at the cover body outside IC chip, cover body includes internal layer, outer layer, be hollow space between internal layer and outer layer, internal layer with connected at outer layer lower edge, form a sealing cavity;Liquid metal is filled in sealing cavity.The utility model is by setting a cover body being located at outside IC chip, a sealing cavity is provided with cover body, the liquid metal injected using sealing cavity, which is filled, does electro-magnetic screen layer, electro-magnetic screen layer can be made suitably to be located at outside IC chip, obtain preferable effectiveness.

Description

The pouring-in electromagnetic signal shielding harness of liquid metal
Technical field
It the utility model is related to mechanical field, specific electromagnetic signal shielding harness.
Background technology
The electromagnetic signal shielding harness for being currently used for electronic product typically arrives electronic product using wire netting, metal film encirclement Outside, but IC chip is when in use, can nearby install multiple Small electronic components close to each other, wire netting, gold Category film can not be installed properly, can not play preferable effectiveness.
Utility model content
The purpose of this utility model is to provide a kind of liquid metal pouring-in electromagnetic signal shielding harness, above-mentioned to solve Technical problem.
The technical problem that the utility model solves can be realized using following technical scheme:
The pouring-in electromagnetic signal shielding harness of liquid metal, include the carrier of bearing integrated chip, and one is used to cover The cover body being located at outside IC chip, it is characterised in that the cover body includes internal layer, outer layer, is between internal layer and outer layer Connected at hollow space, internal layer and outer layer lower edge, form a sealing cavity;
Liquid metal is filled in the sealing cavity.
It is empty to be provided with a sealing by setting a cover body being located at outside IC chip for the utility model in cover body Chamber, the liquid metal injected using sealing cavity, which is filled, does electro-magnetic screen layer, electro-magnetic screen layer can be made suitably to be located at integrated Outside circuit chip, preferable effectiveness is obtained.
Cover body directly can be located at outside IC chip by this design, and a confined air is formed by cover body and carrier Between, IC chip is located in confined space, is arranged on without changing original IC chip on carrier (e.g., circuit board) Structure, reduce cost.
The thickness of the cover body is between 0.8mm~2mm;The thickness of the sealing cavity is between 0.5mm~1.7mm. To ensure preferable effectiveness.The ratio between the volume of the sealing cavity and the volume of the cover body are 3:5.
The cover body can use cover body made of graphite or carbon fibre material.Cover body contacts with IC chip, uses Graphite and carbon fibre material can prevent conduction, while can prevent the corrosivity of liquid metal, and graphite, carbon fibre material have Preferable thermal conductivity, there is radiating effect.
Also include an adhesion layer for being used to be adhesively joined cover body and IC chip, the adhesion layer is covered in close to collection Into the internal layer surface of circuit chip side.The adhesion layer is to use adhesion layer made of heat-conducting silicone grease.Heat-conducting silicone grease has electricity Insulating properties, there is excellent thermal conductivity again.
A cooling system is provided with inside the cover body, the cooling system includes a sheet metal, divided above the sheet metal It is furnished with least 5 steel thermal column bodies;
At least 5 highly consistent strip projected parts are provided with below the sheet metal;
At least 5 steel radiating cylinders penetrate the internal layer, insert liquid metal.
Liquid metal is liquid at high temperature (such as more than 40 degree).When needing to radiate to chip, complete liquid and turn Change.The mobility of liquid, under upper and lower temperature difference effect, convection current can be produced, thermal diffusivity is far longer than solid metallic.This patent is by liquid The heat loss through convection of state metal, and solid-state cover body combine, and both ensure that the heat exchange performance of liquid metal intensity, and have realized again to liquid The sealing of state metal, it ensure that the security of circuit.In addition, the steel radiating cylinder being formed from steel especially is used in this patent, Rather than using conventional aluminium radiator.Avoid the dissolved corrosion of same phase metal.
For the sheet metal between the cover body internal layer and the adhesion layer, the strip projected parts are embedded into the adhesion In layer, the spacing between two neighboring strip projected parts is not more than 3mm.Frictional force is improved, increases the bonding strength of structure, carries simultaneously High heat transfer effect.
The height of the strip projected parts is no more than 1mm.Preventing, which influences cover body cover, sets IC chip, while has preferably Fastness.
The liquid metal is using one kind in indium gallium alloy, aluminum gallium alloy, copper gallium alloy.Indium gallium alloy, aluminum gallium alloy, Copper gallium alloy fills when making middle cavity filler, has more preferable radiating effect.
Brief description of the drawings
Fig. 1 is the part-structure schematic diagram of longitudinal section of the present utility model.
Embodiment
In order that technological means, creation characteristic, reached purpose and effect that the utility model is realized are easy to understand, under Face, which combines to be specifically illustrating, is expanded on further the utility model.
Referring to Fig. 1, the pouring-in electromagnetic signal shielding harness of liquid metal, include the carrier of bearing integrated chip, and One is used to be located at the cover body outside IC chip, and cover body includes internal layer 12, outer layer 11, is hollow between internal layer and outer layer Connected at part, internal layer 12 and the lower edge of outer layer 11, form a sealing cavity 2;Liquid metal is filled in sealing cavity.This reality With new by setting a cover body being located at outside IC chip, a sealing cavity is provided with cover body, utilizes sealing sky The liquid metal of chamber injection, which fills, does electro-magnetic screen layer, electro-magnetic screen layer can be made suitably to be located at outside IC chip, taken Obtain preferable effectiveness.
This design does not have to change the structure that original IC chip is arranged on mainboard, cover body directly can be located at into collection Into outside circuit chip, cost is reduced.
The ratio between the volume of sealing cavity and the volume of cover body are 3:5.The thickness of cover body is between 0.8mm~2mm;Sealing is empty The thickness of chamber is between 0.5mm~1.7mm.To ensure preferable effectiveness.
Cover body can use cover body made of graphite or carbon fibre material.Cover body contacts with IC chip, using graphite Conduction can be prevented with carbon fibre material, while the corrosivity of liquid metal can be prevented, and graphite, carbon fibre material have preferably Thermal conductivity, there is radiating effect.
Also include an adhesion layer 4 for being used to be adhesively joined cover body and IC chip, adhesion layer is covered in close to integrated The internal layer surface of circuit chip side.Adhesion layer 4 is to use adhesion layer made of heat-conducting silicone grease.Heat-conducting silicone grease has electric insulation Property, there is excellent thermal conductivity again.
A cooling system is provided with inside cover body, cooling system includes a sheet metal 6, at least 5 are distributed with above sheet metal Steel radiating cylinder 5;
The lower section of sheet metal 6 is provided with least 5 highly consistent strip projected parts 3;
At least 5 steel thermal column bodies 5 penetrate internal layer, insert liquid metal.
Liquid metal is liquid at high temperature (such as more than 40 degree).When needing to radiate to chip, complete liquid and turn Change.The mobility of liquid, under upper and lower temperature difference effect, convection current can be produced, thermal diffusivity is far longer than solid metallic.This patent is by liquid The heat loss through convection of state metal, and solid-state cover body combine, and both ensure that the heat exchange performance of liquid metal intensity, and have realized again to liquid The sealing of state metal, it ensure that the security of circuit.In addition, the steel radiating cylinder being formed from steel especially is used in this patent, Rather than using conventional aluminium radiator.Avoid the dissolved corrosion of same phase metal.
Between cover body internal layer and adhesion layer, strip projected parts 3 are embedded into adhesion layer sheet metal, and two neighboring strip is convex Spacing between rising is not more than 3mm.Frictional force is improved, increases the bonding strength of structure, while improve heat transfer effect.
The height of strip projected parts is no more than 1mm.Preventing, which influences cover body cover, sets IC chip, while has preferable jail Solidity.
Liquid metal is using one kind in indium gallium alloy, aluminum gallium alloy, copper gallium alloy.Indium gallium alloy, aluminum gallium alloy, copper gallium Alloy fills when making middle cavity filler, has more preferable radiating effect.
The advantages of general principle and principal character of the present utility model and the utility model has been shown and described above.This The technical staff of industry is retouched in above-described embodiment and specification it should be appreciated that the utility model is not restricted to the described embodiments That states simply illustrates principle of the present utility model, on the premise of the spirit and scope of the utility model is not departed from, the utility model Various changes and modifications are also had, these changes and improvements are both fallen within claimed the scope of the utility model.This practicality is new Scope is claimed by appended claims and its equivalent thereof in type.

Claims (7)

1. the pouring-in electromagnetic signal shielding harness of liquid metal, include the carrier of bearing integrated chip, and one sets for cover Cover body outside IC chip, it is characterised in that the cover body includes internal layer, outer layer, in being between internal layer and outer layer Connected at empty part, internal layer and outer layer lower edge, form a sealing cavity;
Liquid metal is filled in the sealing cavity.
2. the pouring-in electromagnetic signal shielding harness of liquid metal according to claim 1, it is characterised in that:The sealing is empty The ratio between the volume of chamber and the volume of the cover body are 3:5;The thickness of the cover body is between 0.8mm~2mm;The sealing cavity Thickness between 0.5mm~1.7mm.
3. the pouring-in electromagnetic signal shielding harness of liquid metal according to claim 1, it is characterised in that:The cover body is adopted The cover body made of graphite or carbon fibre material.
4. the pouring-in electromagnetic signal shielding harness of liquid metal according to claim 1, it is characterised in that:Also include one to use In the adhesion layer for being adhesively joined cover body and IC chip, the adhesion layer is covered in close to the interior of IC chip side Layer surface;The adhesion layer is to use adhesion layer made of heat-conducting silicone grease.
5. the pouring-in electromagnetic signal shielding harness of liquid metal according to claim 1, it is characterised in that:In the cover body Portion is provided with a cooling system, and the cooling system includes a sheet metal, and at least 5 steel radiatings are distributed with above the sheet metal Cylinder;
At least 5 highly consistent strip projected parts are provided with below the sheet metal;
At least 5 steel radiating cylinders penetrate the internal layer, insert liquid metal.
6. the pouring-in electromagnetic signal shielding harness of liquid metal according to claim 5, it is characterised in that:Also include one to use In the adhesion layer for being adhesively joined cover body and IC chip, the adhesion layer is covered in close to the interior of IC chip side Layer surface;The adhesion layer is to use adhesion layer made of heat-conducting silicone grease;
For the sheet metal between the cover body internal layer and the adhesion layer, the strip projected parts are embedded into the adhesion layer Interior, the spacing between two neighboring strip projected parts is not more than 3mm.
7. the pouring-in electromagnetic signal shielding harness of liquid metal according to claim 5, it is characterised in that:The strip is convex The height risen is no more than 1mm.
CN201621321903.0U 2016-12-05 2016-12-05 The pouring-in electromagnetic signal shielding harness of liquid metal Active CN207054000U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201621321903.0U CN207054000U (en) 2016-12-05 2016-12-05 The pouring-in electromagnetic signal shielding harness of liquid metal

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201621321903.0U CN207054000U (en) 2016-12-05 2016-12-05 The pouring-in electromagnetic signal shielding harness of liquid metal

Publications (1)

Publication Number Publication Date
CN207054000U true CN207054000U (en) 2018-02-27

Family

ID=61488592

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201621321903.0U Active CN207054000U (en) 2016-12-05 2016-12-05 The pouring-in electromagnetic signal shielding harness of liquid metal

Country Status (1)

Country Link
CN (1) CN207054000U (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108513526A (en) * 2018-04-28 2018-09-07 厦门理工学院 A kind of electromagnetic screen
CN109952011A (en) * 2019-02-25 2019-06-28 中国科学院理化技术研究所 Production method, electromagnetic shielding system and the chip detecting equipment of electromagnetic shielding system
CN110470873A (en) * 2019-09-07 2019-11-19 贵州中信宏业科技股份有限公司 Telecommunication circuit tests shielded box
CN110970167A (en) * 2019-11-29 2020-04-07 维沃移动通信有限公司 Data transmission line and mobile terminal

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108513526A (en) * 2018-04-28 2018-09-07 厦门理工学院 A kind of electromagnetic screen
CN109952011A (en) * 2019-02-25 2019-06-28 中国科学院理化技术研究所 Production method, electromagnetic shielding system and the chip detecting equipment of electromagnetic shielding system
CN109952011B (en) * 2019-02-25 2020-07-14 中国科学院理化技术研究所 Manufacturing method of electromagnetic shielding system, electromagnetic shielding system and chip detection equipment
CN110470873A (en) * 2019-09-07 2019-11-19 贵州中信宏业科技股份有限公司 Telecommunication circuit tests shielded box
CN110970167A (en) * 2019-11-29 2020-04-07 维沃移动通信有限公司 Data transmission line and mobile terminal

Similar Documents

Publication Publication Date Title
CN207054000U (en) The pouring-in electromagnetic signal shielding harness of liquid metal
CN104813760B (en) A kind of radiating subassembly and electronic equipment
CN206181696U (en) Cell -phone shielding heat radiation structure of low thermal resistance and cell -phone that has this structure
CN205389320U (en) Heat dissipation shield assembly
CN105828571A (en) Shielding and heat-dissipation structure of electronic device chip and electronic device
CN207816070U (en) A kind of new support construction of temperature-uniforming plate upper and lower covers
CN100449741C (en) Heat radiating structure for cpu
CN208424886U (en) A kind of circuit board adding radiator
CN103607872B (en) Radiating shell
CN107052308B (en) A kind of liquid metal thermal interface material that foam copper is compound
CN210958129U (en) Power box
CN204047004U (en) Compound fin
CN207051829U (en) Cloud Server chip liquid metal heat radiation system
CN203968561U (en) A kind of heat abstractor and electronic equipment
CN206322690U (en) Chip is shielded using the radiating of low temperature liquid metal coating
CN207283896U (en) A kind of multi-layer PCB board with radiator structure
CN208028050U (en) A kind of spliced uniform-temperature plate heat dissipating device
CN206963172U (en) A kind of high cooling circuit board
CN107454737B (en) A kind of electronic equipment and its circuit board assemblies
CN205902310U (en) Filter housing's high heat radiation structure for communication
CN107426940B (en) A kind of automobile-used DC/DC converter heat dissipating method
CN206558402U (en) 400 cabinets double-fracture breaker
CN207486724U (en) A kind of Novel LED light heat-dissipating casing structure
CN202634887U (en) Large power LED circuit board structure
CN206929746U (en) A kind of waterproof radiating structure of lamp power

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant