CN203689426U - Semiconductor radiator for computer CPU - Google Patents
Semiconductor radiator for computer CPU Download PDFInfo
- Publication number
- CN203689426U CN203689426U CN201420038909.1U CN201420038909U CN203689426U CN 203689426 U CN203689426 U CN 203689426U CN 201420038909 U CN201420038909 U CN 201420038909U CN 203689426 U CN203689426 U CN 203689426U
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- computer cpu
- heat
- silica gel
- radiator
- fan
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a semiconductor radiator for a computer CPU. The semiconductor radiator comprises first air fans and a radiating aluminum profile, wherein the first air fans are connected with one surface of the aluminum profile. The semiconductor radiator further comprises a refrigeration sheet, a first silica gel layer and a second silica gel, wherein a heat absorption surface of the refrigeration sheet is connected with the computer CPU through the first silica gel layer, and a radiating surface of the refrigeration sheet is connected with the other surface of the radiating aluminum profile through the second silica gel. The semiconductor radiator for the computer CPU solves the problems of poor radiating effect and complex structure of the existing computer CPU, the refrigeration sheet is used for achieving heat conduction of the computer CPU, and radiation of the computer CPU is quickened by means of the two radiating air fans.
Description
Technical field
The utility model relates to a kind of computer CPU radiator, relates in particular to a kind of computer CPU radiator for semiconductor.
Background technology
The Die of CPU is conventionally less than 2 square centimeters, but power consumption reaches tens, upper hectowatt, if can not in time heat be conducted, once heat gathers in Die, will cause serious consequence.Concerning heating radiator, the most important thing is the heat that its base can be at short notice can absorption CPU as much as possible discharges, moment heat absorption capacity, this metal that only possesses high heat-conduction coefficient could be competent at.For metal heat-conducting material, specific heat and heat-conduction coefficient are two important parameters.
Heat-conduction coefficient is defined as: per unit length, every K, can transmit the energy of how many W, and unit is W/mK.Wherein " W " refers to thermal power unit, and " m " represents long measure rice, and " K " is absolute temperature unit.The larger explanation heat conductivility of this numerical value is better.Below the heat-conduction coefficient table of several frequently seen metal:
Heat-conduction coefficient (unit: W/mK)
Silver 429 bronze medals 401
Gold 317 aluminium 237
Iron 80 lead 34.8
1070 type aluminium alloy 226 1050 type aluminium alloys 209
6063 type aluminium alloy 201 6061 type aluminium alloys 155
This shows, silver and copper are best Heat Conduction Materials, are secondly gold and aluminium.But gold, silver too expensive, so heat radiator is mainly become with copper by aluminium now.But because copper density is large, complex process, price is more expensive, adopt lighter aluminium to make so present common fan, certainly, concerning air-cooled radiator, considering in material except heat-conduction coefficient, also must consider the thermal capacity of heating radiator, comprehensively these two parameters, the superiority of aluminium just embodies.Improve the thermal conduction capability of foot of radiator, selecting the material with higher heat-conduction coefficient is on the one hand, also will resolve but then thermal source as the tightness degree problem of the combination of CPU and foot of radiator.According to heat conducting law, under the fixing prerequisite of material, transmissibility is directly proportional to contact area, and contacts distance and is inversely proportional to.Contact area is larger, just can make heat more quickly distribute, but its Die fixes concerning CPU, so Binding distance just becomes more important.
Although theoretically, cooling fin fin base is energy and CPU close contact, but objective in fact, no matter how level and smooth two surface of contact have, and still have space between them, there is air, and the heat conductivility of air is very poor, this just needs the fastener that design is excellent, grasp is powerful that heat radiator is closely buckled in to CPU above, in addition, need to be with some heat conductivilitys better and flexible thing replace air to fill up these spaces, as heat-conducting silicone grease or heat radiation adhesive tape.Ideal situation is exactly that fastener is tightly fixed on CPU above by heat radiator, and contacting of heat radiator and CPU is completely parallel to keep in touch area maximum, and between them, thermal resistance minimum is filled to keep in touch by silicone grease completely in some small spaces.
Above-mentioned is common CPU heating radiator, but all exists radiating effect deficiency and baroque problem.
Utility model content
The purpose of this utility model is just to provide in order to address the above problem a kind of computer CPU radiator for semiconductor.
In order to achieve the above object, the utility model has adopted following technical scheme: a kind of computer CPU radiator for semiconductor, comprise the first fan and heat-dissipation aluminum sectional material, described the first fan is connected with the one side of described aluminium section bar, also comprise cooling piece, the first layer of silica gel and the second layer of silica gel, the heat-absorbent surface of described cooling piece is connected with computer CPU by described the first layer of silica gel, and the radiating surface of described cooling piece is connected with the another side of described heat-dissipation aluminum sectional material by described the second layer of silica gel.
Particularly, described heating radiator also comprises the second fan, and described the second fan is arranged on the mainboard of computer, and acts on power lead outlet one side of described cooling piece.
Add the second fan discharge heat that can help, and can give the power lead cooling of cooling piece.
Particularly, the surrounding of computer CPU is provided with clay.
Be sealed in around CPU slot with clay, can thermal-insulating waterproof, and prevent that the temperature difference from producing dewfall.
The beneficial effects of the utility model are: the utility model is a kind of computer CPU radiator for semiconductor, radiating effect deficiency and baroque problem that existing computer CPU exists are solved, adopt the heat conduction of cooling piece for computer CPU, and adopt two radiator fans, accelerate the heat radiation of computer CPU.
Accompanying drawing explanation
Fig. 1 is the structural representation of a kind of computer CPU of the utility model radiator for semiconductor.
In figure: 1-the first fan, 2-heat-dissipation aluminum sectional material, 3-the second layer of silica gel, 4-cooling piece, 5-the first layer of silica gel, 6-computer CPU, 7-the second fan.
Embodiment
Below in conjunction with accompanying drawing, the utility model is described in further detail: as shown in Figure 1, the utility model is a kind of computer CPU radiator for semiconductor, comprise the first fan 1 and heat-dissipation aluminum sectional material 2, the first fan 1 is connected with the one side of aluminium section bar 2, also comprise cooling piece 4, the first layer of silica gel 5 and the second layer of silica gel 3, the heat-absorbent surface of cooling piece 4 is connected with computer CPU 6 by the first layer of silica gel 5, and the radiating surface of cooling piece 4 is connected with the another side of heat-dissipation aluminum sectional material 2 by the second layer of silica gel 3.
Heating radiator also comprises that the second fan 7, the second fans 7 are arranged on the mainboard of computer, and acts on power lead outlet one side of cooling piece 4.Add the second fan 7 discharge heat that can help, and can give the power lead cooling of cooling piece 4
The surrounding of computer CPU 6 is provided with clay (not shown).Be sealed in computer CPU with clay and insert around 6 grooves, can thermal-insulating waterproof, and prevent that the temperature difference from producing dewfall.
In the utility model, adoptable cooling piece parameter is as follows: TEC1-12712 Imax 12A Umax 15.4V Qcmax 114.5W Tmax 65C Dimensions 50*50*3.8 maximum current 12 is pacified 114.5 watts of maximum temperature differences 65 of 15.4 volts of maximum refrigeratory capacitys of maximum voltage and spent physical dimension 50*50*3.8.
Claims (3)
1. a computer CPU radiator for semiconductor, comprise the first fan and heat-dissipation aluminum sectional material, described the first fan is connected with the one side of described aluminium section bar, it is characterized in that: also comprise cooling piece, the first layer of silica gel and the second layer of silica gel, the heat-absorbent surface of described cooling piece is connected with computer CPU by described the first layer of silica gel, and the radiating surface of described cooling piece is connected with the another side of described heat-dissipation aluminum sectional material by described the second layer of silica gel.
2. a kind of computer CPU radiator for semiconductor according to claim 1, is characterized in that: described heating radiator also comprises the second fan, and described the second fan is arranged on the mainboard of computer, and acts on power lead outlet one side of described cooling piece.
3. a kind of computer CPU radiator for semiconductor according to claim 1, is characterized in that: the surrounding of computer CPU is provided with clay.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420038909.1U CN203689426U (en) | 2014-01-22 | 2014-01-22 | Semiconductor radiator for computer CPU |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420038909.1U CN203689426U (en) | 2014-01-22 | 2014-01-22 | Semiconductor radiator for computer CPU |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203689426U true CN203689426U (en) | 2014-07-02 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420038909.1U Expired - Fee Related CN203689426U (en) | 2014-01-22 | 2014-01-22 | Semiconductor radiator for computer CPU |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203689426U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107020320A (en) * | 2017-05-27 | 2017-08-08 | 歌尔股份有限公司 | A kind of manufacture craft of carrier band |
-
2014
- 2014-01-22 CN CN201420038909.1U patent/CN203689426U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107020320A (en) * | 2017-05-27 | 2017-08-08 | 歌尔股份有限公司 | A kind of manufacture craft of carrier band |
| CN107020320B (en) * | 2017-05-27 | 2019-12-13 | 歌尔股份有限公司 | manufacturing process of carrier tape |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140702 Termination date: 20150122 |
|
| EXPY | Termination of patent right or utility model |