CN101453859A - Loop type heat pipe radiator and manufacturing method thereof - Google Patents
Loop type heat pipe radiator and manufacturing method thereof Download PDFInfo
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- CN101453859A CN101453859A CNA2007101947367A CN200710194736A CN101453859A CN 101453859 A CN101453859 A CN 101453859A CN A2007101947367 A CNA2007101947367 A CN A2007101947367A CN 200710194736 A CN200710194736 A CN 200710194736A CN 101453859 A CN101453859 A CN 101453859A
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Abstract
The invention discloses a loop-type heat pipe radiator and a method for making the same. The radiator comprises a plate-type evaporation chamber, a porous capillary structure and outside pipelines. The porous capillary structure is filled into the plate-type evaporation chamber; the outside pipelines are connected with both ports of the plate-type evaporation chamber; the outside pipelines and the plate-type evaporation chamber form a closed loop; working fluid is filled in the plate-type evaporation chamber; and one end of the plate-type evaporation chamber is connected with a fluid charging pipe. The making method comprises the following steps of forming the plate-type evaporation chamber, configuring the capillary structure, pressing edges and welding, pouring fluid to make vacuum, sealing and electric welding. The radiator can effectively save space because of the thinner wall of the plate-type evaporation chamber, can save contact thermal resistance between heating elements and the plate-type evaporation chamber because the heating surface is a plane, can solve the problem that the density of heat flow of the heating elements increases gradually because of the high heat radiating power, can increase the heat transferring distance because of the longer outside pipelines, and meanwhile can achieve mass production because of simple structure and production process.
Description
Technical field
The present invention relates to a kind of heat abstractor and preparation method thereof, particularly a kind of loop type heat pipe radiator and preparation method thereof.
Background technology
The thermal source of electronic component is mainly from chip itself, as long as energising uses, can produce heat because of the resistance of chip itself and the electric current of circulation.Continuous downsizing along with integrated circuit manufacture process, increasing function is incorporated on the one chip, relatively in notebook computer, master chip CPU also is encapsulated on same the CPU because of raising and many core processors of computing frequency, though the operational speed of a computer and activity duration can be raised greatly, also hurriedly rise to high wattage from low wattage with respect to the heat that CPU produced.The radiating mode of notebook computer mostly is made of heat pipe, radiating fin and three kinds of heat dissipation elements of fan at present, its radiating mode mainly is a large amount of thermals source that produced by CPU, two-phase flow by inside heat pipe after the heat pipe contact changes, fast heat is sent to the notebook computer casing edge and engages, bestow the forced convertion mode through fan again and cool off with fin.Because of fan need give extra accessory power supply and can produce certain noise when rotating, not only can shorten service time the battery of notebook computer own, the noise that fan itself is produced also can produce the workplace and disturb, and, tend to cause under the useful space of notebook computer make system failure because of heat pipe heat passes quantity not sufficient because the length of heat pipe is big or small with caliber and different its maximal heat transfer efficient that all can influence of shape.
Summary of the invention
In order to overcome the defective of the contradiction that exists between the heat-dissipating space and heating power in the prior art, the invention provides a kind of heat abstractor of hypomegetic high-power heat radiation.
To achieve these goals, technical scheme of the present invention is achieved in that a kind of loop type heat pipe radiator, comprise plate vaporization chamber, porous capillary structure and exterior line, described porous capillary structure is filled in the plate vaporization chamber, described exterior line is connected the two-port of plate vaporization chamber, described exterior line and plate vaporization chamber form the loop of a sealing, be loaded with a certain amount of working fluid in the described plate vaporization chamber, the charging quantity of described working fluid is to be covered with half of vaporization chamber, and the latter half of exterior line to the fluid mass of vaporization chamber.
As preferably,, on described exterior line, radiating fin is set in order to quicken heat diffusion derivation in the exterior line.
The one side that described plate vaporization chamber is relative with heater element is lamellar plane, and thickness is greater than 1mm.
The material of the shell of described plate vaporization chamber is the metal material with elasticity, high-termal conductivity, can be copper, copper alloy, aluminium, aluminium alloy or stainless steel.
The porous capillary structure that is filled in the described plate vaporization chamber is provided with groove, described groove structure can be sintered porous structure or agglomerate bodies by sintering mold, machining or with the formed groove structure of the method for chemical etching, the number of described groove is more than 1, and the shape of cross section of described groove is an any regular or irregularly shaped.Preferably, described groove is opened on the upper and lower surface of porous capillary structure or is only opened lower surface at porous capillary structure, and the shape of cross section of described groove is a triangle, trapezoidal or square.
Described plate vaporization chamber is divided into two zones, and one is the porous capillary structure district, and another is the workflow tagma.
The described powder that is used for sintered porous capillary structure is copper powder, aluminium powder, nickel powder or nano-carbon powder.
The described material that is connected in the exterior line of plate vaporization chamber two-port is copper, aluminium or stainless steel.The body external diameter of described exterior line is greater than 1mm, and the shape of described exterior line can have any shape.
The material of described radiating fin is the metal material of high-termal conductivity, as copper, copper alloy, aluminum or aluminum alloy etc.
The described working fluid that is filled in plate vaporization chamber and the portion of external pipeline is the fluid that boiling point is lower than heater element place temperature, as water, kerosene or alcohol etc.
Another object of the present invention has provided a kind of manufacture method of loop type heat pipe radiator, and this method may further comprise the steps:
1), the moulding of plate vaporization chamber, the hollow circular-tube of both ends open is crimped onto certain thickness, make the above and below form lamellar planar structure, promptly form plate vaporization chamber;
2), porous capillary structure is disposed in the plate vaporization chamber;
3), the two-port of the plate vaporization chamber after the described flattening is complete open type, the port that two ends reservation of plate vaporization chamber and pipeline are connected with the fluid injection vacuum tube then, lower wall surface welds pressing place to pressing together again on other of the plate vaporization chamber two ends that the reservation port is outer;
4), the pipeline two-port that exterior line and plate vaporization chamber are reserved is docked and is welded together;
5), liquid injection pipe is inserted the port that the vaporization chamber end is reserved, and welded together with vaporization chamber;
6), in plate vaporization chamber, inject working fluid by liquid injection pipe, and then plate vaporization chamber and exterior line are vacuumized through the fluid injection mouth of pipe, utilize anchor clamps that liquid injection pipe is sealed and, so just finished the making of a loop type heat pipe radiator liquid injection pipe seal location welding.
As preferably, after step 6), at the place, centre position of described exterior line radiating fin is set again, radiating fin can weld also together with exterior line, also can adopt other modes to link together.
Compared with prior art, beneficial effect of the present invention is:
1, the present invention adopts plate vaporization chamber, the wall of described plate vaporization chamber is lamellar structure, wall thickness is thin to have only several millimeters, can effectively save the space, and the face that plate vaporization chamber is relative with heater element is the plane, increased contact area, can reduce the contact heat resistance between heater element and the flat vaporization chamber, can be effectively the heat of heater element have been shed.
2, the present invention utilizes the phase change of working fluid to conduct heat, and the externally interior effectively separation of pipeline of gas-liquid, can bear the heat higher than general heat pipe, and the length of exterior line is distant simultaneously, so heat transfer distances is distant.
3, heat radiation power of the present invention is big, can solve the problem that the heater element density of heat flow rate increases day by day.
4, structure of the present invention and manufacture craft are simple, can realize that a large amount of productions, particularly the present invention can be applicable in the notebook computer heat dissipation design.
Description of drawings
Fig. 1 is the cutaway view of loop type heat pipe radiator of the present invention.
Fig. 2 is another cutaway view of loop type heat pipe radiator of the present invention.
Fig. 3 for the A-A of Fig. 1 to cuing open figure.
Fig. 4 is the structural representation of a kind of porous capillary structure of the present invention.
Fig. 5 is the another kind of structural representation of porous capillary structure of the present invention.
Fig. 6 is the manufacture method flow chart of loop type heat pipe radiator of the present invention.
The accompanying drawing sign
The plate vaporization chamber 2-of 1-porous capillary structure 3-working fluid
4-exterior line 5-radiating fin 6-groove
7-fluid injection vacuum tube 8-fluid mass 9-Steam area
Embodiment
Below in conjunction with the drawings and specific embodiments the present invention is described in further detail, but not as a limitation of the invention.
Loop type heat pipe radiator as shown in Figure 1 and Figure 2, comprise flat vaporization chamber 1, porous capillary structure 2 and exterior line, described porous capillary structure 2 is filled in the plate vaporization chamber 1, described exterior line 4 is connected the two-port of plate vaporization chamber 1, described exterior line 4 forms a loop of sealing with plate vaporization chamber 1, described exterior line 4 is divided into Steam area 9 and fluid mass 8, and described Steam area 9 is connected with a port of the plate vaporization chamber 1 that is provided with porous capillary structure 2.Be loaded with a certain amount of working fluid 3 in the described plate vaporization chamber 1, working fluid 3 be filled in space that plate vaporization chamber 1 is not provided with porous capillary structure 2 with fluid mass 8 that this end is connected in.The amount of charging into of working fluid 3 to be can be well shedding the heat of heater element, and its working fluid 3 can in whole closed-loop path, well gasify be condensed into suitable.
As shown in Figure 1, as preferably,, on described exterior line 4, radiating fin 5 is set in order to quicken heat diffusion derivation in the exterior line 4.Described radiating fin 5 preferably is arranged on the Steam area 9 of exterior line 4 and the intersection of fluid mass 8; Described radiating fin 5 can weld also together with exterior line 4, also can adopt other modes to link together.The material of described radiating fin 5 is the metal material of high-termal conductivity, as copper, copper alloy, aluminum or aluminum alloy etc.
Described porous capillary structure 2 can be sintered porous structure, the formed groove structure of groove structure or agglomerate bodies, the number of described groove 6 is more than 1, groove 6 on the described porous capillary structure 2 be shaped as any regular or irregularly shaped, cross section as groove 6 can be triangle, trapezoidal, the square different shape that waits, as preferably, as Fig. 3, shown in Figure 4, described groove 6 is arranged on the lower surface of porous capillary structure 2, and the shape of cross section of groove 6 is square, as further preferred, as shown in Figure 5, described porous capillary structure 2 on, be respectively arranged with square trench 6 on the lower surface.Described groove 6 can adopt methods such as machining, etching, design grinding tool sintering to be made.
The described powder that is used for sintered porous capillary structure 2 is copper powder, aluminium powder, nickel powder or nano-carbon powder.
The one side that described plate vaporization chamber 1 is relative with heater element is lamellar plane, and thickness is greater than 1 millimeter.For heat is transmitted fast, the material of the shell of described plate vaporization chamber 1 is the metal material with elasticity, high-termal conductivity, can be copper, copper alloy, aluminium, aluminium alloy or stainless steel.
The described material that is connected in the exterior line 4 of plate vaporization chamber 1 two-port is copper, aluminium or stainless steel.The body external diameter of described exterior line 4 is greater than 1mm, and the shape of described exterior line 1 can have any shape.
The described working fluid that is filled in plate vaporization chamber 1 and the portion of external pipeline 4 is the fluid that boiling point is lower than heater element place temperature, as water, kerosene or alcohol etc.
As shown in Figure 6, be the manufacture method flow chart of loop type heat pipe radiator of the present invention, described manufacture method may further comprise the steps:
1), the moulding of plate vaporization chamber 1, the hollow circular-tube of both ends open is crimped onto certain thickness, make the above and below form lamellar planar structure, promptly form plate vaporization chamber 1;
2), porous capillary structure 2 is disposed in the plate vaporization chamber 1;
3), the two-port of the plate vaporization chamber after the described flattening is complete open type, the port that two ends reservation of plate vaporization chamber and pipeline are connected with the fluid injection vacuum tube then, lower wall surface welds pressing place to pressing together again on other of the plate vaporization chamber two ends that the reservation port is outer;
4), the pipeline two-port that exterior line and plate vaporization chamber are reserved is docked and is welded together;
5), liquid injection pipe is inserted the port that the vaporization chamber end is reserved, and welded together with vaporization chamber;
6), in plate vaporization chamber, inject working fluid by liquid injection pipe, and then plate vaporization chamber and exterior line are vacuumized through the fluid injection mouth of pipe, utilize anchor clamps that liquid injection pipe is sealed and, so just finished the making of a loop type heat pipe radiator liquid injection pipe seal location welding.
In the described step 1) hollow pipe flattened to adopt hollow pipe is put into mould through die cast or by dull and stereotyped punch forming.
As preferably, after step 6), at the place, centre position of described exterior line 4 radiating fin 5 is set again, described radiating fin 5 can weld also together with exterior line 4, also can adopt other modes to link together.
Below operation principle is described:
Be filled with working fluid 3 in the workflow tagma of plate vaporization chamber 1, and porous capillary structure 2 is also inhaled working fluid 3, because the lower surface and the heater element of plate vaporization chamber 1 are adjacent, and the lower surface of plate vaporization chamber 1 is lamellar planar structure, bigger with the opposite face of heater element, and contact heat resistance is little, working fluid 3 can be effectively with the heat absorption of heater element, and formation gaseous state, the working fluid of gaseous state enters the Steam area 9 of exterior line 4 through the groove 6 of porous capillary structure, because the existence of porous capillary structure 2 stops the direction motion of gaseous working fluid to the workflow tagma.Gaseous working fluid externally distributes heat in the pipeline 4 interior processes of moving gradually, because exterior line is longer, is enough to make gaseous working fluid externally to be condensed into liquid state in the pipeline.For heat is shed, gaseous working fluid liquefaction externally connects radiating fin 5 on the pipeline 4.Through being back under the pressure of condensed working fluid gaseous working fluid in Steam area 9 in the plate vaporization chamber 1.So circulation is just constantly taken away the heat of heater element and is distributed.
Claims (13)
1, a kind of loop type heat pipe radiator, it is characterized in that, comprise plate vaporization chamber, porous capillary structure, exterior line and liquid injection pipe, described porous capillary structure is filled in the plate vaporization chamber, described exterior line is connected the two-port of plate vaporization chamber, described exterior line and plate vaporization chamber form the loop of sealing, are loaded with working fluid in the described plate vaporization chamber, and described liquid injection pipe is connected plate vaporization chamber one end.
2, loop type heat pipe radiator according to claim 1 is characterized in that, on described exterior line radiating fin is set, and the material of described radiating fin is metal material of copper, copper alloy, the aluminum or aluminum alloy of high-termal conductivity.
3, loop type heat pipe radiator according to claim 1 is characterized in that, the one side that described plate vaporization chamber is relative with heater element is lamellar plane, and thickness is greater than 1mm.
4, loop type heat pipe radiator according to claim 1 is characterized in that, the material of the shell of described plate vaporization chamber is copper, copper alloy, aluminium, aluminium alloy or the stainless steel with metal material of elasticity, high-termal conductivity.
5, loop type heat pipe radiator according to claim 1, it is characterized in that, the porous capillary structure that is filled in the described plate vaporization chamber is provided with groove, and the number of described groove is more than 1, and the shape of cross section of described groove is an any regular or irregularly shaped.
6, loop type heat pipe radiator according to claim 5 is characterized in that, described groove is opened on the upper and lower surface of porous capillary structure or only opened lower surface at porous capillary structure, and the shape of cross section of described groove is a triangle, trapezoidal or square.
7, loop type heat pipe radiator according to claim 1 is characterized in that, the described powder that is used for sintered porous capillary structure is copper powder, aluminium powder, nickel powder or nano-carbon powder.
8, loop type heat pipe radiator according to claim 1 is characterized in that, the described material that is connected in the exterior line of plate vaporization chamber two-port is copper, aluminium or stainless steel; The body external diameter of described exterior line is greater than 1mm.
9, loop type heat pipe radiator according to claim 1 is characterized in that, the working fluid that is filled in described plate vaporization chamber and the portion of external pipeline is water, kerosene or alcohol.
10, loop type heat pipe radiator according to claim 1 is characterized in that, the material of the liquid injection pipe of a described end that is connected plate vaporization chamber is copper, aluminium or stainless steel, and its external diameter is greater than 1mm.
According to the manufacture method of each described loop type heat pipe radiator in the claim 1 to 10, it is characterized in that 11, this method may further comprise the steps:
1), the moulding of plate vaporization chamber, the hollow circular-tube of both ends open is crimped onto certain thickness, make the above and below form lamellar planar structure;
2), porous capillary structure is disposed in the plate vaporization chamber;
3), the two-port of the plate vaporization chamber after the described flattening is complete open type, the port that two ends reservation of plate vaporization chamber and pipeline are connected with the fluid injection vacuum tube then, lower wall surface welds pressing place to pressing together again on other of the plate vaporization chamber two ends that the reservation port is outer;
4), the pipeline two-port that exterior line and plate vaporization chamber are reserved is docked and is welded together;
5), liquid injection pipe is inserted the port that the vaporization chamber end is reserved, and welded together with vaporization chamber;
6), in plate vaporization chamber, inject working fluid by liquid injection pipe, and then plate vaporization chamber and exterior line are vacuumized through the fluid injection mouth of pipe, utilize anchor clamps that liquid injection pipe is sealed and, so just finished the making of a loop type heat pipe radiator liquid injection pipe seal location welding.
12, the manufacture method of loop type heat pipe radiator according to claim 11 is characterized in that, in the described step 1) hollow pipe is flattened employing hollow pipe is put into mould through die cast or by dull and stereotyped punch forming.
13, the manufacture method of loop type heat pipe radiator according to claim 11, it is characterized in that, after step 6), at the place, centre position of described exterior line radiating fin is set again, radiating fin and exterior line adopt welding or other modes to link together.
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| Application Number | Priority Date | Filing Date | Title |
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| CN2007101947367A CN101453859B (en) | 2007-11-29 | 2007-11-29 | Loop type heat pipe radiator and manufacturing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007101947367A CN101453859B (en) | 2007-11-29 | 2007-11-29 | Loop type heat pipe radiator and manufacturing method thereof |
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| CN101453859A true CN101453859A (en) | 2009-06-10 |
| CN101453859B CN101453859B (en) | 2011-06-08 |
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| CN101808494A (en) * | 2010-03-26 | 2010-08-18 | 海能达通信股份有限公司 | Radio frequency high-power heat pipe radiator |
| CN102208375A (en) * | 2011-04-11 | 2011-10-05 | 锘威科技(深圳)有限公司 | Circulation radiator, and manufacturing method and components thereof |
| CN102221187A (en) * | 2010-04-15 | 2011-10-19 | 龙逸科技股份有限公司 | Radiator with self-adjusting loop and manufacturing method thereof |
| CN102374807A (en) * | 2010-08-20 | 2012-03-14 | 富准精密工业(深圳)有限公司 | Loop heat pipe |
| CN102425968A (en) * | 2012-01-04 | 2012-04-25 | 中国电子科技集团公司第三十八研究所 | Compact type loop heat pipe device |
| CN102922107A (en) * | 2012-11-12 | 2013-02-13 | 上海交通大学 | Sweating plate radiator for inverter type welding machine |
| CN107160122A (en) * | 2017-06-20 | 2017-09-15 | 太仓陶氏电气有限公司 | A kind of low temperature resistant salt spray proof welds the welding procedure of radiator |
| TWI626416B (en) * | 2017-01-12 | 2018-06-11 | Asia Vital Components Co Ltd | Capillary structure and loop heat pipe having the capillary structure |
| CN109121355A (en) * | 2017-06-23 | 2019-01-01 | 泽鸿(广州)电子科技有限公司 | The electronic device of loop hot-pipe and the application loop hot-pipe |
| CN109405605A (en) * | 2017-08-18 | 2019-03-01 | 泽鸿(广州)电子科技有限公司 | Loop type heat pipe |
| CN109871108A (en) * | 2019-02-28 | 2019-06-11 | 昆山新力精密五金有限公司 | Vacuum liquid feeding heat-dissipating pipe |
| CN110248521A (en) * | 2016-11-18 | 2019-09-17 | 双鸿科技股份有限公司 | Has the heat dissipation element of thermal resistance mechanism |
| CN111669944A (en) * | 2020-06-22 | 2020-09-15 | 深圳市鸿富诚屏蔽材料有限公司 | 3D phase change superconducting radiator |
| WO2023103808A1 (en) * | 2021-12-07 | 2023-06-15 | 华为技术有限公司 | Heat conduction structure and preparation method therefor, radiator and electronic device having same |
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| CN2569345Y (en) * | 2002-01-10 | 2003-08-27 | 财团法人工业技术研究院 | Loop type heat pipe structure |
| CN100370890C (en) * | 2005-06-27 | 2008-02-20 | 中山大学 | Highly effective flat-type loop heat-pipe apparatus |
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| CN101808494A (en) * | 2010-03-26 | 2010-08-18 | 海能达通信股份有限公司 | Radio frequency high-power heat pipe radiator |
| CN101808494B (en) * | 2010-03-26 | 2012-03-21 | 海能达通信股份有限公司 | Radio frequency high-power heat pipe radiator |
| CN102221187A (en) * | 2010-04-15 | 2011-10-19 | 龙逸科技股份有限公司 | Radiator with self-adjusting loop and manufacturing method thereof |
| CN102374807A (en) * | 2010-08-20 | 2012-03-14 | 富准精密工业(深圳)有限公司 | Loop heat pipe |
| CN102208375A (en) * | 2011-04-11 | 2011-10-05 | 锘威科技(深圳)有限公司 | Circulation radiator, and manufacturing method and components thereof |
| CN102208375B (en) * | 2011-04-11 | 2012-11-21 | 锘威科技(深圳)有限公司 | Circulation radiator, and manufacturing method and components thereof |
| CN102425968A (en) * | 2012-01-04 | 2012-04-25 | 中国电子科技集团公司第三十八研究所 | Compact type loop heat pipe device |
| CN102922107B (en) * | 2012-11-12 | 2014-08-20 | 上海交通大学 | Sweating plate radiator for inverter type welding machine |
| CN102922107A (en) * | 2012-11-12 | 2013-02-13 | 上海交通大学 | Sweating plate radiator for inverter type welding machine |
| CN110248521A (en) * | 2016-11-18 | 2019-09-17 | 双鸿科技股份有限公司 | Has the heat dissipation element of thermal resistance mechanism |
| TWI626416B (en) * | 2017-01-12 | 2018-06-11 | Asia Vital Components Co Ltd | Capillary structure and loop heat pipe having the capillary structure |
| CN107160122A (en) * | 2017-06-20 | 2017-09-15 | 太仓陶氏电气有限公司 | A kind of low temperature resistant salt spray proof welds the welding procedure of radiator |
| CN109121355A (en) * | 2017-06-23 | 2019-01-01 | 泽鸿(广州)电子科技有限公司 | The electronic device of loop hot-pipe and the application loop hot-pipe |
| CN109405605A (en) * | 2017-08-18 | 2019-03-01 | 泽鸿(广州)电子科技有限公司 | Loop type heat pipe |
| CN109405605B (en) * | 2017-08-18 | 2024-05-03 | 泽鸿(广州)电子科技有限公司 | Loop type heat pipe |
| CN109871108A (en) * | 2019-02-28 | 2019-06-11 | 昆山新力精密五金有限公司 | Vacuum liquid feeding heat-dissipating pipe |
| CN111669944A (en) * | 2020-06-22 | 2020-09-15 | 深圳市鸿富诚屏蔽材料有限公司 | 3D phase change superconducting radiator |
| WO2023103808A1 (en) * | 2021-12-07 | 2023-06-15 | 华为技术有限公司 | Heat conduction structure and preparation method therefor, radiator and electronic device having same |
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| CN101453859B (en) | 2011-06-08 |
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