CN206471326U - A kind of liquid-cooling heat radiator - Google Patents
A kind of liquid-cooling heat radiator Download PDFInfo
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- CN206471326U CN206471326U CN201720087686.1U CN201720087686U CN206471326U CN 206471326 U CN206471326 U CN 206471326U CN 201720087686 U CN201720087686 U CN 201720087686U CN 206471326 U CN206471326 U CN 206471326U
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- radiating tube
- heat abstractor
- radiating
- heat
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Abstract
The utility model discloses a kind of liquid-cooling heat radiator, its heat dispersion height and small volume, available for scenes such as highdensity high frequency switch powers.The heat abstractor includes the substrate and radiating tube that metal material is made, wherein, contained structure corresponding with radiating tube shape is provided with the substrate, the position contacted between radiating tube and substrate is set after tin cream by the contained structure on pressure press-in substrate, forming uniform fine and close tin paste layer between the position that radiating tube is contacted with substrate；Heat and form uniform fine and close metallurgical connection after tin cream between substrate and radiating tube.
Description
Technical field
The utility model is related to technical field of heat dissipation, more particularly to a kind of liquid-cooling heat radiator.
Background technology
With insulated gate bipolar transistor (Insulated Gate Bipolar Transistor, IGBT) constant power
The fast development of device, high frequency switch power is widely used in the industries such as crystal growth, electrolysis.It is increasingly fierce based on competition,
To power volume and the further requirement of cost, the direction of high frequency switch power forward direction densification is developed.However, power device
Heating be influence its service life, also influence heat-dissipating space volume.It is many in the prior art to be carried out using air blast cooling mode
Radiating, has that cooling effect is poor, the weak point such as volume is big.
Application publication number discloses a kind of new pressure-pipe type IGBT water for CN104681515A utility application
Cold drawing, it is flattened modified S-shaped runner by CNC surfaces external form working process, and ensures that modified S-shaped runner copper pipe exposes
Plane is with cooled plate substrate in same plane.And micro high-termal conductivity epoxy resin is filled between S-shaped runner and vallecular cavity.So
And, because its water-cooling base plate and runner copper pipe are that metal material is made, because centre has been only filled with micro epoxy resin, because
This, on the one hand, there is essential gap between water-cooling base plate and runner copper pipe, so as to reduce heat conductivility；On the other hand,
Epoxy resin and the water-cooling base plate and runner copper pipe of both sides metallurgical can not be connected, and cause the radiating effect of cooled plate to be limited to ring
The heat conductivility of oxygen tree fat.
Application publication number discloses a kind of water-cooling plate for CN105636415A utility application, and it includes
Water-cooling base plate, water cooled pipeline, scolding tin water cooled pipeline from one end of water-cooling base plate through the interior bone of water-cooling base plate in, then will
Scolding tin is placed in the elongated slot of water-cooling base plate upper surface, then melts scolding tin, the scolding tin of melting is filled in water-cooling base plate and water cooling
In gap between pipeline.In this way, although can partly make water-cooling base plate and water cooled pipeline metallurgy connection, still
Because it is to be filled in after scolding tin is melted between water-cooling base plate and water cooled pipeline, water-cooling base plate and water cooling can not be effectively filled
Small closed space between pipeline, therefore equally exist the problem of heat conductivility is not good.
Utility model content
One of the purpose of this utility model at least that, in view of the above-mentioned problems of the prior art, it is cold to provide a kind of liquid
Formula heat abstractor, its heat dispersion height and small volume, available for scenes such as highdensity high frequency switch powers.
To achieve these goals, the technical solution adopted in the utility model is：
A kind of liquid-cooling heat radiator, it includes the substrate and radiating tube that metal material is made, wherein, set on the substrate
Be equipped with the corresponding contained structure of radiating tube shape, the section of the contained structure is bottom slightly wide U-shaped, radiating tube and substrate
Between the position that contacts set after tin cream and to be pressed into by pressure in the contained structure on substrate, contacted in radiating tube with substrate
Uniform tin paste layer is formed between position；Heat and form uniform metallurgical connection after tin cream between substrate and radiating tube.
Preferably, the depth of section of the contained structure on the substrate is less than the depth of section of the radiating tube before press-in, pressure
Radiating tube and substrate surface formation flat surface after entering.
Preferably, the depth of section of the contained structure on the substrate is more than the depth of section of the radiating tube after press-in, leads to
Cross and be pressed into tin cream between upper surface of base plate and radiating tube upper surface, make radiating tube and substrate surface formation flat surface.
Preferably, section of the radiating tube before press-in substrate is O-shaped or D types.
Preferably, the substrate is rectangle or circle.
Preferably, the radiating tube is I shapes, U-shaped, M shapes, S-shaped or spiral shape.
Preferably, the entrance and exit of the radiating tube is located at the same side of substrate or not on ipsilateral.
Preferably, the substrate is made of aluminum or copper.
Preferably, the radiating tube is made of copper.
Preferably, the heat abstractor also includes connecting tube, and it has the mechanism of the entrance and exit of connection radiating tube, uses
In two or more radiating tube in parallel or in series.
In summary, by adopting the above-described technical solution, the utility model at least has the advantages that：
By after the outer surface tinning cream of radiating tube be pressed into substrate on contained structure in, can effectively exclude substrate with
Small closed space between hot channel, so as to improve heat transfer efficiency；Uniform fine and close smelting is formed between substrate and radiating tube
Gold connection, can further improve the heat dispersion of heat abstractor.
Brief description of the drawings
Fig. 1 is the dimensional structure diagram for the liquid-cooling heat radiator that the embodiment of the utility model one is provided；
Fig. 2 is the front view of liquid-cooling heat radiator shown in Fig. 1；
Fig. 3 is the dimensional structure diagram of substrate in the liquid-cooling heat radiator that the embodiment of the utility model one is provided；
Fig. 4 is the dimensional structure diagram for the liquid-cooling heat radiator that another embodiment of the utility model is provided；
Fig. 5 is the dimensional structure diagram for the liquid-cooling heat radiator that the another embodiment of the utility model is provided；
Fig. 6 is the front view of liquid-cooling heat radiator shown in Fig. 5.
Embodiment
Below in conjunction with the accompanying drawings and embodiment, the utility model is further elaborated, so that of the present utility model
Object, technical solution and advantage are more clearly understood.It should be appreciated that specific embodiment described herein is only to explain this reality
With new, it is not used to limit the utility model.
As depicted in figs. 1 and 2, a kind of liquid-cooling heat radiator disclosed in the embodiment of the utility model one, it includes metal
Substrate 1 and radiating tube 2 that material is made, wherein, contained structure 3 corresponding with radiating tube shape is provided with the substrate 1, is dissipated
The position contacted between heat pipe 2 and substrate 1 is set by the contained structure 3 on pressure press-in substrate after tin cream, in radiating tube 2
Uniform tin cream figure layer 4 is formed between the position contacted with substrate 1, compared to traditional approach, can form more fine and close
Tin cream figure layer；Heat and form uniform metallurgical connection after tin cream between substrate 1 and radiating tube 2, correspondingly result in more
Fine and close uniform metallurgical connection.
By after the outer surface tinning cream of radiating tube be pressed into substrate on contained structure in, can effectively exclude substrate with
Small closed space between hot channel, so as to improve heat transfer efficiency；Uniform fine and close smelting is formed between substrate and radiating tube
Gold connection, can further improve the heat dispersion of heat abstractor.
As shown in figure 3, in a preferred embodiment, the depth of section of the contained structure on substrate 1 is less than dissipating before press-in
The depth of section of heat pipe, and radiating tube and substrate surface the formation flat surface after being pressed into, so as to the portion of other in power supply
Part is fully contacted.
Further, the section of the contained structure on substrate 1 is that bottom is slightly wide U-shaped, can accommodate radiating tube and draw extruding
And the part expanded and the tin cream being pressed into, so as to so that radiating tube 2 is more densely connected with substrate 1, without forming sky
Chamber, accordingly the section of radiating tube 2 can be O-shaped or D types.
During manufacture, the contained structure 3 of M shapes corresponding with radiating tube shape is first formed on substrate as shown in Figure 3, also may be used
The shape matched is set to the caloric value or mounting means of power device in the power-supply device applied according to heat abstractor,
Such as can for I shapes, U-shaped, S-shaped, spiral shape.Likewise, power in the power-supply device that can be applied according to heat abstractor
The installation situation of device selects the shape of substrate, such as rectangle, the circle.
Can be in radiating bottom of the tube tin coating cream or contained structure on substrate after coating tin cream, now radiating tube
Then radiating tube and tin cream can be pressed into contained structure by pressure, make radiating tube in appearance with the surface of slightly protruding substrate
Deformation is produced in micro-nano structure, so that the various spaces between radiating tube and substrate are excluded, while tin cream is uniform because extruding is formed
Fine and close tin paste layer.Then overall heating is carried out to heat abstractor, melts tin cream, in radiating tube after its alloying component cooled and solidified
The metallurgy that even compact is formed between substrate is connected.
On the one hand, radiating tube and substrate is realized finer and close connection by tin cream by extruding, enhance radiating effect
Really, on the other hand, the metallurgical connection formed can further improve the thermal conductivity of heat abstractor.
In a preferred embodiment, the entrance and exit of single radiating tube can be located at the same side of substrate or not homonymy
On face, so as to adapt to different power supplys by heat abstractor reserve coolant flow to.As shown in Fig. 4, further excellent
In the embodiment of choosing, the entrance 6 of single radiating tube and outlet 7 are located on the not ipsilateral of substrate respectively, and the heat abstractor is also
Connecting tube 5 is may further include, there is the mechanism of the entrance and exit of connection radiating tube respectively (to be such as threadedly coupled, weld for it
Connect), so that two radiating tubes be connected, therefore the flow distance of cooling agent in radiating tube can be increased, so as to further carry
For radiating efficiency.
As shown in Figure 5 and Figure 6, in a preferred embodiment, can be by 4 I types radiating tubes by 3 shapes of connecting tube 5
Into M type radiating tubes, so as to reduce the shaping difficulty of radiating tube, the infrastructure cost of radiator is reduced, it is possible to realize radiating
The flexible assembling of device.Also, as shown in fig. 6, the depth of section of the contained structure on substrate is more than the radiating tube after press-in
Depth of section, by being pressed into tin cream between upper surface of base plate and radiating tube upper surface, makes radiating tube form flat with substrate surface
Whole surface.
Embodiment of above is merely to illustrate preferred embodiment of the present utility model, rather than to limitation of the present utility model.
Those skilled in the technology concerned in the case where not departing from principle of the present utility model and scope, the various replacements made,
Modification and improvement should be included within protection domain of the present utility model.
Claims (10)
1. a kind of liquid-cooling heat radiator, it is characterised in that the heat abstractor includes substrate and the radiating that metal material is made
Pipe, wherein, contained structure corresponding with radiating tube shape is provided with the substrate, the section of the contained structure is omited for bottom
Wide is U-shaped, is pressed into after the position setting tin cream contacted between radiating tube and substrate by pressure in the contained structure on substrate,
Uniform tin paste layer is formed between the position that radiating tube is contacted with substrate；Heat and formed after tin cream between substrate and radiating tube
Uniform metallurgical connection.
2. heat abstractor according to claim 1, it is characterised in that the depth of section of the contained structure on the substrate is small
In the depth of section of the radiating tube before press-in, radiating tube and substrate surface formation flat surface after press-in.
3. heat abstractor according to claim 1, it is characterised in that the depth of section of the contained structure on the substrate is big
In the depth of section of the radiating tube after press-in, by being pressed into tin cream between upper surface of base plate and radiating tube upper surface, make radiating
Pipe and substrate surface formation flat surface.
4. heat abstractor according to claim 1, it is characterised in that section of the radiating tube before press-in substrate is O
Type or D types.
5. heat abstractor according to claim 1, it is characterised in that the substrate is rectangle or circle.
6. heat abstractor according to claim 1, it is characterised in that the radiating tube be I shapes, U-shaped, M shapes, S-shaped or
Spiral shape.
7. heat abstractor according to claim 1, it is characterised in that the entrance and exit of the radiating tube is located at substrate
On the same side or not ipsilateral.
8. heat abstractor according to claim 1, it is characterised in that the substrate is made of aluminum or copper.
9. heat abstractor according to claim 1, it is characterised in that the radiating tube is made of copper.
10. heat abstractor according to claim 1, it is characterised in that the heat abstractor also includes connecting tube, and it has
The mechanism of the entrance and exit of radiating tube is connected, for two or more radiating tube in parallel or in series.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720087686.1U CN206471326U (en) | 2017-01-23 | 2017-01-23 | A kind of liquid-cooling heat radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720087686.1U CN206471326U (en) | 2017-01-23 | 2017-01-23 | A kind of liquid-cooling heat radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206471326U true CN206471326U (en) | 2017-09-05 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720087686.1U Active CN206471326U (en) | 2017-01-23 | 2017-01-23 | A kind of liquid-cooling heat radiator |
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| Country | Link |
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| CN (1) | CN206471326U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110901105A (en) * | 2019-11-22 | 2020-03-24 | 西安飞机工业（集团）有限责任公司 | RTM (resin transfer molding) mold structure capable of being heated or cooled rapidly and using method thereof |
| CN111933598A (en) * | 2020-07-16 | 2020-11-13 | 杰群电子科技（东莞）有限公司 | Heat dissipation type chip carrier and heat dissipation type semiconductor packaging product |
| CN111970891A (en) * | 2020-07-10 | 2020-11-20 | 广州龙辉电子科技有限公司 | Method for manufacturing water-cooling plate |
| CN112954949A (en) * | 2019-12-10 | 2021-06-11 | 台达电子工业股份有限公司 | Network equipment power supply and heat dissipation system for same |
-
2017
- 2017-01-23 CN CN201720087686.1U patent/CN206471326U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110901105A (en) * | 2019-11-22 | 2020-03-24 | 西安飞机工业（集团）有限责任公司 | RTM (resin transfer molding) mold structure capable of being heated or cooled rapidly and using method thereof |
| CN112954949A (en) * | 2019-12-10 | 2021-06-11 | 台达电子工业股份有限公司 | Network equipment power supply and heat dissipation system for same |
| CN112954949B (en) * | 2019-12-10 | 2024-05-03 | 台达电子工业股份有限公司 | Network equipment power supply and heat dissipation system for network equipment power supply |
| CN111970891A (en) * | 2020-07-10 | 2020-11-20 | 广州龙辉电子科技有限公司 | Method for manufacturing water-cooling plate |
| CN111933598A (en) * | 2020-07-16 | 2020-11-13 | 杰群电子科技（东莞）有限公司 | Heat dissipation type chip carrier and heat dissipation type semiconductor packaging product |
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