CN209257297U - A kind of mold of good cooling results - Google Patents
A kind of mold of good cooling results Download PDFInfo
- Publication number
- CN209257297U CN209257297U CN201821823598.4U CN201821823598U CN209257297U CN 209257297 U CN209257297 U CN 209257297U CN 201821823598 U CN201821823598 U CN 201821823598U CN 209257297 U CN209257297 U CN 209257297U
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- water tank
- mold
- fixedly connected
- downcomer
- good cooling
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Abstract
The utility model relates to technical field of mold, and disclose a kind of mold of good cooling results, including die ontology, the external activity of the die ontology is connected with outer block, side plate is fixedly connected at left and right sides of the outer block, the first cooling fin is fixedly connected at the top and bottom of the outer block, the left side of the left side side plate is fixedly connected with the first water tank, connecting tube is communicated at the top of first water tank, the top of the connecting tube is communicated with water pump, upper hose is communicated on the left of the water pump, the right side of the right side side plate is fixedly connected with the second water tank, the one end of the upper hose far from water pump is connected with the second water tank, the bottom of first water tank is communicated with downcomer, the one end of the downcomer far from the first water tank is connected with the second water tank, the inside of the outer block offers through-hole.The mold of the good cooling results realizes the purpose of good cooling results.
Description
Technical field
The utility model relates to technical field of mold, specially a kind of mold of good cooling results.
Background technique
Mold be in industrial production to be molded, be blow molded, squeeze out, the methods of die casting or forging and forming obtain required product
Various moulds and tool, in brief, mold are the tools for making formed article, and this tool is made of various parts,
Different molds is made of different parts, it mainly realizes article shape by the change of physical state of the formed material
Processing, is known as the title of " mother of industry ".
Existing mold facilitates injection molding, blow molding, extrusion, die casting or forging and forming and obtains required product, but in reality
Existing mold cooling effect is not good enough in the use process on border, and mold natural cooling after being heated at high temperature cools down, and will lead to
The time that mold is in high temperature is longer, and high temperature can have a negative impact to mold, so that the service life of mold is reduced, so mention
A kind of mold of good cooling results solves the problems, such as above-mentioned propose out.
Utility model content
(1) the technical issues of solving
In view of the deficiencies of the prior art, the utility model provides a kind of mold of good cooling results, has cooling effect
Good advantage, solves that existing mold cooling effect is not good enough, and mold natural cooling after being heated at high temperature cools down, and will lead to
The time that mold is in high temperature is longer, and high temperature can have a negative impact to mold, thus the problem of reducing the service life of mold.
(2) technical solution
For the purpose for realizing above-mentioned good cooling results, the utility model is provided the following technical solutions: a kind of good cooling results
Mold, including die ontology, the external activity of the die ontology be connected with outer block, and the left and right sides of the outer block is equal
It is fixedly connected with side plate, the first cooling fin, a left side for the left side side plate are fixedly connected at the top and bottom of the outer block
Side is fixedly connected with the first water tank, and connecting tube is communicated at the top of first water tank, and the top of the connecting tube is communicated with
Water pump, is communicated with upper hose on the left of the water pump, and the right side of the right side side plate is fixedly connected with the second water tank, it is described on
The one end of water pipe far from water pump is connected with the second water tank, and the bottom of first water tank is communicated with downcomer, the downcomer
One end far from the first water tank is connected with the second water tank, and the inside of the outer block offers through-hole, the inside of the through-hole
It is in contact with downcomer, semiconductor cooler, the semiconductor system is fixedly connected at the top and bottom of the die ontology
Cooler is fixedly connected with heat sink far from one end of die ontology, and the heat sink one side opposite with semiconductor cooler is fixed
Be connected with the second cooling fin, the heat sink it is opposite with semiconductor cooler be fixedly connected with heat-conducting block on one side.
Preferably, the quantity of first cooling fin is six, and the quantity of second cooling fin is six, described partly to lead
The quantity of chiller is four.
Preferably, the caliber of the downcomer and the caliber of upper hose are identical, and the length of the downcomer is greater than connecting tube
Length.
Preferably, first cooling fin is graphite, and the second cooling fin aluminium alloy, the heat sink is copper.
Preferably, first water tank includes cabinet and sealing cover, is connected with sealing cover on the left of cabinet, and described
Two water tanks are identical as the construction of the first water tank.
Preferably, the thickness of the heat sink is not less than two centimetres, and the thickness of the heat-conducting block is not less than one centimetre.
(3) beneficial effect
Compared with prior art, the utility model provides a kind of mold of good cooling results, have it is following the utility model has the advantages that
The mold of the good cooling results, the water flow between the first water tank and the second water tank pass through connecting tube, water pump, upper hose
It realizes and recycles with downcomer, wherein water pump is responsible for giving flow dynamic, when water flow flows in upper hose and downcomer, meeting
The heat on outer block is taken away, outer block plays the effect of heat on transmitting die ontology again, plays cooling effect, secondly outer
The first cooling fin at the top and bottom of set block plays the function of auxiliary heat dissipation, and semiconductor cooler cooling jacket block simultaneously passes heat
Heat sink is passed, the heat dissipation performance of heat sink itself adds the heat dissipation performance of the second cooling fin and heat-conducting block, quickly by heat
It disperses, realizes the purpose of good cooling results, extend the service life of die ontology.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the utility model；
Fig. 2 is the attachment structure schematic diagram of outer block and through-hole in the utility model.
In figure: 1 die ontology, 2 outer blocks, 3 side plates, 4 first cooling fins, 5 first water tanks, 6 connecting tubes, 7 water pumps, on 8
Water pipe, 9 semiconductor coolers, 10 heat-conducting blocks, 11 heat sinks, 12 second cooling fins, 13 downcomers, 14 second water tanks, 15 through-holes.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
The external activity of a kind of mold of good cooling results referring to FIG. 1-2, including die ontology 1, die ontology 1 connects
It is connected to outer block 2, the left and right sides of outer block 2 is fixedly connected to side plate 3, and the top and bottom of outer block 2 are fixedly connected with
There is the first cooling fin 4, the left side of left side side plate 3 is fixedly connected with the first water tank 5, and the top of the first water tank 5 is communicated with connection
Pipe 6, the top of connecting tube 6 are communicated with water pump 7, and the left side of water pump 7 is communicated with upper hose 8, and the right side of right side side plate 3 is fixed to be connected
It is connected to the second water tank 14, the one end of upper hose 8 far from water pump 7 is connected with the second water tank 14, and the bottom of the first water tank 5 is communicated with
Downcomer 13, the one end of downcomer 13 far from the first water tank 5 are connected with the second water tank 14, and the first water tank 5 includes cabinet and close
It covers, is connected with sealing cover on the left of cabinet, the second water tank 14 is identical as the construction of the first water tank 5, the inside of outer block 2
Through-hole 15 is offered, the inside of through-hole 15 is in contact with downcomer 13, and the caliber of downcomer 13 is identical as the caliber of upper hose 8,
The length of downcomer 13 is greater than the length of connecting tube 6, and the top and bottom of die ontology 1 are fixedly connected to semiconductor cooler
9, semiconductor cooler 9 refers to that the pyroelectric effect using semiconductor produces the device of cooling capacity, also known as thermoelectric cooler, is connected with conductor
Two blocks of different metals are connect, direct current is connected, then a junction temperature reduces, another junction temperature increases, semiconductor
Refrigerator 9 is fixedly connected with heat sink 11 far from one end of die ontology 1, and the thickness of heat sink 11 is thermally conductive not less than two centimetres
The thickness of block 10 be not less than one centimetre, heat sink 11 it is opposite with semiconductor cooler 9 be fixedly connected with the second cooling fin on one side
12, the quantity of the first cooling fin 4 is six, and the quantity of the second cooling fin 12 is six, and the quantity of semiconductor cooler 9 is four
A, the first cooling fin 4 is graphite, and graphite heat radiation fin is also referred to as heat conductive graphite piece, is a kind of completely new heat conduction and heat radiation material, has only
Special crystal grain orientation, uniform heat conduction, laminar structured to be well adapted for any surface in both directions, shields heat source and component
While improve consumer electronics product performance, 12 aluminium alloy of the second cooling fin, heat sink 11 be copper, heat sink 11 with partly lead
Chiller 9 it is opposite be fixedly connected with heat-conducting block 10 on one side, the water flow between the first water tank 5 and the second water tank 14 passes through connection
Pipe 6, water pump 7, upper hose 8 and downcomer 13 realize circulation, and wherein water pump 7 is responsible for giving flow dynamic, and water flow is in 8 He of upper hose
In downcomer 13 when flowing, the heat on outer block 2 can be taken away, outer block 2 plays heat on transmitting die ontology 1 again
Effect plays cooling effect, and secondly the first cooling fin 4 of 2 top and bottom of outer block plays the function of auxiliary heat dissipation, partly leads
9 cooling jacket block 2 of chiller simultaneously transfers heat to heat sink 11, and the heat dissipation performance of heat sink 11 itself is plus the second heat dissipation
The heat dissipation performance of piece 12 and heat-conducting block 10, quickly disperses heat, realizes the purpose of good cooling results, extends die ontology
1 service life.
In conclusion the mold of the good cooling results, the water flow between the first water tank 5 and the second water tank 14 passes through connecting tube
6, water pump 7, upper hose 8 and downcomer 13 realize circulation, and wherein water pump 7 is responsible for giving flow dynamic, and water flow is in upper hose 8 under
In water pipe 13 when flowing, the heat on outer block 2 can be taken away, outer block 2 plays the effect of heat on transmitting die ontology 1 again
Fruit plays cooling effect, and secondly the first cooling fin 4 of 2 top and bottom of outer block plays the function of auxiliary heat dissipation, semiconductor
9 cooling jacket block 2 of refrigerator simultaneously transfers heat to heat sink 11, and the heat dissipation performance of heat sink 11 itself adds the second cooling fin
12 and heat-conducting block 10 heat dissipation performance, quickly heat is dispersed, realizes the purpose of good cooling results, extends die ontology 1
Service life.
It should be noted that the terms "include", "comprise" or its any other variant are intended to the packet of nonexcludability
Contain, so that the process, method, article or equipment for including a series of elements not only includes those elements, but also including
Other elements that are not explicitly listed, or further include for elements inherent to such a process, method, article, or device.
In the absence of more restrictions, the element limited by sentence "including a ...", it is not excluded that including the element
Process, method, article or equipment in there is also other identical elements.
While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art,
It is understood that these embodiments can be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaired
Change, replacement and variant, the scope of the utility model is defined by the appended claims and the equivalents thereof.
Claims (6)
1. a kind of mold of good cooling results, including die ontology (1), it is characterised in that: the external of the die ontology (1) lives
It is dynamic to be connected with outer block (2), it is fixedly connected to side plate (3) at left and right sides of the outer block (2), the outer block (2)
Top and bottom are fixedly connected to the first cooling fin (4), and the left side of the left side side plate (3) is fixedly connected with the first water tank
(5), it is communicated with connecting tube (6) at the top of first water tank (5), the top of the connecting tube (6) is communicated with water pump (7), institute
It states and is communicated on the left of water pump (7) upper hose (8), the right side of the right side side plate (3) is fixedly connected with the second water tank (14),
The upper hose (8) is connected far from the one end of water pump (7) with the second water tank (14), the bottom connection of first water tank (5)
Have downcomer (13), the downcomer (13) is connected far from the one end of the first water tank (5) with the second water tank (14), the housing
The inside of block (2) offers through-hole (15), and the inside of the through-hole (15) is in contact with downcomer (13), the die ontology
(1) it is fixedly connected at the top and bottom of semiconductor cooler (9), the semiconductor cooler (9) is far from die ontology (1)
One end be fixedly connected with heat sink (11), the heat sink (11) is opposite with semiconductor cooler (9) to be fixedly connected on one side
Have the second cooling fin (12), the heat sink (11) and semiconductor cooler (9) it is opposite be fixedly connected with heat-conducting block on one side
(10)。
2. a kind of mold of good cooling results according to claim 1, it is characterised in that: first cooling fin (4)
Quantity is six, and the quantity of second cooling fin (12) is six, and the quantity of the semiconductor cooler (9) is four.
3. a kind of mold of good cooling results according to claim 1, it is characterised in that: the caliber of the downcomer (13)
Identical as the caliber of upper hose (8), the length of the downcomer (13) is greater than the length of connecting tube (6).
4. a kind of mold of good cooling results according to claim 1, it is characterised in that: first cooling fin (4) is
Graphite, the second cooling fin (12) aluminium alloy, the heat sink (11) are copper.
5. a kind of mold of good cooling results according to claim 1, it is characterised in that: first water tank (5) includes
Cabinet and sealing cover are connected with sealing cover, the construction phase of second water tank (14) and the first water tank (5) on the left of cabinet
Together.
6. a kind of mold of good cooling results according to claim 1, it is characterised in that: the thickness of the heat sink (11)
Not less than two centimetres, the thickness of the heat-conducting block (10) is not less than one centimetre.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821823598.4U CN209257297U (en) | 2018-11-07 | 2018-11-07 | A kind of mold of good cooling results |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821823598.4U CN209257297U (en) | 2018-11-07 | 2018-11-07 | A kind of mold of good cooling results |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209257297U true CN209257297U (en) | 2019-08-16 |
Family
ID=67554035
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821823598.4U Active CN209257297U (en) | 2018-11-07 | 2018-11-07 | A kind of mold of good cooling results |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209257297U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111386013A (en) * | 2020-03-09 | 2020-07-07 | 泰烯新材料科技(浙江)有限公司 | Graphene heat dissipation assembly and water-cooled radiator with same |
| CN112078177A (en) * | 2020-07-16 | 2020-12-15 | 大同新成新材料股份有限公司 | Semiconductor graphite mold capable of being cooled rapidly |
-
2018
- 2018-11-07 CN CN201821823598.4U patent/CN209257297U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111386013A (en) * | 2020-03-09 | 2020-07-07 | 泰烯新材料科技(浙江)有限公司 | Graphene heat dissipation assembly and water-cooled radiator with same |
| CN111386013B (en) * | 2020-03-09 | 2022-01-21 | 泰烯新材料科技(浙江)有限公司 | Graphene heat dissipation assembly and water-cooled radiator with same |
| CN112078177A (en) * | 2020-07-16 | 2020-12-15 | 大同新成新材料股份有限公司 | Semiconductor graphite mold capable of being cooled rapidly |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20200325 Address after: 311200 No.25, maiden bridge, Xintang street, Xiaoshan District, Hangzhou City, Zhejiang Province Patentee after: Hangzhou Jingji plastic mould Co., Ltd Address before: 518000 Guangdong city of Shenzhen province Futian District Fuhua Road No. 6 Building 1403 business tax Patentee before: Liu Chao |
|
| TR01 | Transfer of patent right |