CN112078177A - Semiconductor graphite mold capable of being cooled rapidly - Google Patents
Semiconductor graphite mold capable of being cooled rapidly Download PDFInfo
- Publication number
- CN112078177A CN112078177A CN202010686658.8A CN202010686658A CN112078177A CN 112078177 A CN112078177 A CN 112078177A CN 202010686658 A CN202010686658 A CN 202010686658A CN 112078177 A CN112078177 A CN 112078177A
- Authority
- CN
- China
- Prior art keywords
- base
- heat
- graphite mold
- cooling
- semiconductor graphite
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 title claims abstract description 15
- 229910002804 graphite Inorganic materials 0.000 title claims abstract description 15
- 239000010439 graphite Substances 0.000 title claims abstract description 15
- 239000004065 semiconductor Substances 0.000 title claims abstract description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 26
- 238000001816 cooling Methods 0.000 claims abstract description 19
- 239000000498 cooling water Substances 0.000 claims abstract description 18
- 230000017525 heat dissipation Effects 0.000 claims description 15
- 229910000838 Al alloy Inorganic materials 0.000 claims description 3
- 239000000956 alloy Substances 0.000 claims description 2
- 238000010791 quenching Methods 0.000 description 5
- 230000000171 quenching effect Effects 0.000 description 3
- 238000005507 spraying Methods 0.000 description 2
- 235000017166 Bambusa arundinacea Nutrition 0.000 description 1
- 235000017491 Bambusa tulda Nutrition 0.000 description 1
- 241001330002 Bambuseae Species 0.000 description 1
- 235000015334 Phyllostachys viridis Nutrition 0.000 description 1
- 238000003723 Smelting Methods 0.000 description 1
- 206010053615 Thermal burn Diseases 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 239000011425 bamboo Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000000071 blow moulding Methods 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 239000000110 cooling liquid Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000004512 die casting Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000005242 forging Methods 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B30—PRESSES
- B30B—PRESSES IN GENERAL
- B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
- B30B15/02—Dies; Inserts therefor; Mounting thereof; Moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B30—PRESSES
- B30B—PRESSES IN GENERAL
- B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
- B30B15/34—Heating or cooling presses or parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a semiconductor graphite die capable of being rapidly cooled, which comprises a base, wherein a heat conducting groove is formed in the middle of the inner top of the base, a die is arranged on the inner side of the heat conducting groove, handles are symmetrically arranged on the tops of two sides of the die, two groups of radiating fans are symmetrically arranged at two ends of two sides of the base, a plurality of radiating fins are arranged at the bottom of the heat conducting groove, a plurality of jacks are symmetrically formed in the surfaces of the radiating fins, a same cooling water pipe is wound in the jacks, one end of the cooling water pipe extends to the outer part of the base, a water pump is fixedly connected to one end of the base, and a water inlet and a water outlet of the water pump are respectively communicated with the extending parts of the cooling water pipe; the device absorbs the heat of the body by surface contact under the action of the heat conduction groove, reduces the temperature of the body and prevents the loss caused by rapid cooling of the die.
Description
Technical Field
The invention relates to the technical field of mold cooling, in particular to a semiconductor graphite mold capable of being rapidly cooled.
Background
The mould is used in the industrial production to get various moulds and tools of the required products by injection moulding, blow moulding, extrusion, die casting or forging forming, smelting, stamping, etc., in short, the mould is the tool used for making the shaped article, this kind of tool is formed by various parts, different moulds are formed by different parts, it mainly realizes the processing of the article appearance through the change of the physical state of the shaped material, the name of the "industrial mother" is plain;
the prior device has the following defects:
1. most of the existing cooling methods of the mold are that cooling water is directly sprayed on the mold to quench the mold, the rapid quenching of the mold is reduced under the state of thermal expansion, the damage to the mold is great, and the service life of the mold is shortened.
2. The water is used for spraying and cooling the die, so that water resources are wasted, the resources cannot be recycled, and the processing cost is increased.
Disclosure of Invention
The invention aims to provide a semiconductor graphite mould capable of being rapidly cooled, and the cooling method of the existing mould is provided in the background technology, most of cooling modes are that cooling water directly showers the mould to quench the mould, the rapid quenching of the mould is reduced under the state of thermal expansion, the damage to the mould is great, and the service life of the mould is reduced; the water is used for spraying and cooling the die, so that water resources are wasted, the resources cannot be recycled, and the processing cost is increased.
In order to achieve the purpose, the invention provides the following technical scheme: the utility model provides a semiconductor graphite mould that can cool off fast, includes the base, the intermediate position at top is provided with the heat conduction groove in the base, the inboard of heat conduction groove is provided with the mould, the top symmetry of mould both sides is provided with the handle, the both ends symmetry of base both sides is provided with two sets of radiator fan, the bottom of heat conduction groove is provided with a plurality of radiating fin, a plurality of jacks have been seted up to multiunit radiating fin's surface symmetry, and around having connect same root condenser tube in the jack, condenser tube's one end extends to the outside of base, the one end fixedly connected with water pump of base, the water inlet and the delivery port of water pump communicate with the position that condenser tube extended each other respectively.
Preferably, the bottom of the die is provided with a clamping block, the top of the heat conducting groove is provided with a clamping groove, and the clamping groove and the clamping block are matched with each other.
Preferably, the outer side of the extending part of the cooling water pipe is sleeved with cooling fins, and a plurality of groups of cooling cylinders are uniformly arranged on the outer side of each cooling fin.
Preferably, a mounting plate is arranged right below the water pump.
Preferably, one side of the handle is of a bevel structure.
Preferably, the heat dissipation cylinder, the heat dissipation fins and the heat dissipation fins are all made of aluminum alloy materials.
Preferably, one end of the base is provided with a heat dissipation hole.
Compared with the prior art, the invention has the beneficial effects that: the semiconductor graphite mold capable of being rapidly cooled;
1. under the action of the heat conduction groove, the heat of the body is absorbed by utilizing surface contact, the temperature of the body is reduced, and the loss caused by quenching of the die is prevented;
2. under the cooperation through condenser tube and water pump, make the inside water of condenser tube circulate, absorb the heat on the heat-conducting groove, cool down the mould, fix condenser tube through the fin, prevent that condenser tube from droing, can absorb the heat on heat-conducting groove surface again simultaneously, take away the heat through condenser tube for the radiating rate.
3. The temperature of the heat conducting groove is reduced by inwards blowing through the heat radiating fan, the heat dissipation of cooling water inside the cooling water pipe can be accelerated, and the heat carried by the cooling water in the cooling water pipe is quickly dissipated under the action of the heat radiating cylinder and the heat radiating fins.
Drawings
FIG. 1 is a front cross-sectional view of the present invention;
FIG. 2 is a top view of the present invention;
FIG. 3 is a bottom cross-sectional view of the present invention;
fig. 4 is a side cross-sectional view of the present invention.
In the figure: 1. a base; 2. a cooling water pipe; 3. a card slot; 4. a clamping block; 5. a heat conducting groove; 6. a mold; 7. a handle; 8. a heat radiation fan; 9. a water pump; 10. a heat-dissipating cylinder; 11. a heat sink; 12. and heat dissipation fins.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-4, the present invention provides an embodiment: the utility model provides a semiconductor graphite mould that can cool off fast, which comprises a base 1, the intermediate position at top is provided with heat conduction groove 5 in the base 1, the inboard of heat conduction groove 5 is provided with mould 6, the top symmetry of 6 both sides of mould is provided with handle 7, the both ends symmetry of 1 both sides of base is provided with two sets of radiator fan 8, the bottom of heat conduction groove 5 is provided with a plurality of radiating fin 12, a plurality of jacks have been seted up to multiunit radiating fin 12's surface symmetry, and around having connect same root condenser tube 2 in the jack, condenser tube 2's one end extends to base 1's outside, base 1's one end fixedly connected with water pump 9, water pump 9's water inlet and delivery port communicate with each other with the position that condenser tube 2 extended.
The water pump 9 and the cooling fan 8 in the device are the prior art, and the composition structure and the connection mode of the device are completely the same as those of the prior device.
Further, the bottom of mould 6 is provided with fixture block 4, and the top of heat conduction groove 5 is provided with draw-in groove 3, and draw-in groove 3 and fixture block 4 mutual adaptation are fixed the position of mould 6.
Furthermore, the outer side of the extending part of the cooling water pipe 2 is sleeved with a cooling fin 11, and the outer side of the cooling fin 11 is uniformly provided with a plurality of groups of cooling cylinders 10, so that the heat of the cooling liquid in the cooling water pipe 2 is rapidly dissipated.
Furthermore, a mounting plate is arranged right below the water pump 9, so that the water pump 9 is convenient to place.
Furthermore, one side of the handle 7 is an inclined plane structure, which can play a certain protection role and prevent scald due to residual heat.
Furthermore, the heat dissipation cylinder 10, the heat dissipation fins 11, and the heat dissipation fins 12 are made of aluminum alloy, and have good heat conductivity and low price.
Furthermore, one end of the base 1 is provided with a heat dissipation hole, so that heat can be conveniently discharged.
The working principle is as follows: the device power consumption part all is supplied power by external power source, when will dispel the heat, switch on, put into heat conduction groove 5 with mould 6 in, heat conduction groove 5 absorbs the heat on mould 6 surface, water pump 9 drives the hydrologic cycle in condenser tube 2 and flows, absorb and take away the heat on heat conduction groove 5 surface, cooling tube 2 is fixed to fin 12, prevent that condenser tube 2 from droing, can absorb again simultaneously and take away some heat on heat conduction groove 5 surface through condenser tube 2 with these heats, accelerate the radiating rate.
Blow to base 1 inside through radiator fan 8 for the air flow speed on heat-conducting groove 5 and radiating fin 12 surface has accelerated the cooling rate, has also accelerated the speed that 2 inside cooling water heats of condenser tube dispel simultaneously, and the effect is quick outside scattering to base 1 with the heat that 2 inside cooling water of condenser tube carried through heat dissipation section of thick bamboo 10 and fin 11.
When the mold is to be taken out, the mold 6 is taken out through the handle 7, the inclined surface structure on one side of the handle 7 prevents the residual heat on the surface of the mold 6 from scalding people, and the mold 6 is prevented from being separated from the inside of the heat conducting groove 5 through the action of the clamping block 4 and the clamping groove 3, so that the mold is heated more fully.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (7)
1. A semiconductor graphite mold capable of being rapidly cooled comprises a base (1) and is characterized in that: the middle position at top in base (1) is provided with heat conduction groove (5), the inboard of heat conduction groove (5) is provided with mould (6), the top symmetry of mould (6) both sides is provided with handle (7), the both ends symmetry of base (1) both sides is provided with two sets of radiator fan (8), the bottom of heat conduction groove (5) is provided with a plurality of radiating fin (12), and the multiunit a plurality of jacks have been seted up to the surface symmetry of radiating fin (12), and around having connect same root cooling water pipe (2) in the jack, the one end of condenser tube (2) extends to the outside of base (1), the one end fixedly connected with water pump (9) of base (1), the water inlet and the delivery port of water pump (9) communicate with the position that cooling water pipe (2) extend respectively each other.
2. The rapidly coolable semiconductor graphite mold of claim 1, wherein: the bottom of the die (6) is provided with a clamping block (4), the top of the heat conducting groove (5) is provided with a clamping groove (3), and the clamping groove (3) and the clamping block (4) are matched with each other.
3. The rapidly coolable semiconductor graphite mold of claim 1, wherein: the cooling water pipe (2) is sleeved with cooling fins (11) on the outer side of the extending part, and a plurality of groups of cooling cylinders (10) are uniformly arranged on the outer side of each cooling fin (11).
4. The rapidly coolable semiconductor graphite mold of claim 1, wherein: and a mounting plate is arranged right below the water pump (9).
5. The rapidly coolable semiconductor graphite mold of claim 1, wherein: one side of the handle (7) is of an inclined plane structure.
6. The rapidly coolable semiconductor graphite mold of claim 3, wherein: the heat dissipation cylinder (10), the heat dissipation fins (11) and the heat dissipation fins (12) are all made of aluminum alloy materials.
7. The rapidly coolable semiconductor graphite mold of claim 1, wherein: one end of the base (1) is provided with a heat dissipation hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010686658.8A CN112078177A (en) | 2020-07-16 | 2020-07-16 | Semiconductor graphite mold capable of being cooled rapidly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010686658.8A CN112078177A (en) | 2020-07-16 | 2020-07-16 | Semiconductor graphite mold capable of being cooled rapidly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112078177A true CN112078177A (en) | 2020-12-15 |
Family
ID=73735057
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010686658.8A Pending CN112078177A (en) | 2020-07-16 | 2020-07-16 | Semiconductor graphite mold capable of being cooled rapidly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112078177A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20130305802A1 (en) * | 2012-05-16 | 2013-11-21 | Sungwoo Hitech Co., Ltd. | Mold for hot stamping |
| CN209054797U (en) * | 2018-11-20 | 2019-07-02 | 广东东麟碳素科技有限公司 | A kind of graphite jig cooling structure |
| CN209257297U (en) * | 2018-11-07 | 2019-08-16 | 柳超 | A kind of mold of good cooling results |
| CN210139048U (en) * | 2019-04-28 | 2020-03-13 | 惠州市湘联金属制品有限公司 | Environment-friendly die casting die cooling device |
| CN210547508U (en) * | 2019-09-27 | 2020-05-19 | 东莞市新精准模具有限公司 | Quick cooling mechanism is used in auto-parts stamping die production |
| CN210651495U (en) * | 2019-07-22 | 2020-06-02 | 重庆秦川三立车灯有限公司 | Car light manufacturing mould convenient to quick cooling |
-
2020
- 2020-07-16 CN CN202010686658.8A patent/CN112078177A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20130305802A1 (en) * | 2012-05-16 | 2013-11-21 | Sungwoo Hitech Co., Ltd. | Mold for hot stamping |
| CN209257297U (en) * | 2018-11-07 | 2019-08-16 | 柳超 | A kind of mold of good cooling results |
| CN209054797U (en) * | 2018-11-20 | 2019-07-02 | 广东东麟碳素科技有限公司 | A kind of graphite jig cooling structure |
| CN210139048U (en) * | 2019-04-28 | 2020-03-13 | 惠州市湘联金属制品有限公司 | Environment-friendly die casting die cooling device |
| CN210651495U (en) * | 2019-07-22 | 2020-06-02 | 重庆秦川三立车灯有限公司 | Car light manufacturing mould convenient to quick cooling |
| CN210547508U (en) * | 2019-09-27 | 2020-05-19 | 东莞市新精准模具有限公司 | Quick cooling mechanism is used in auto-parts stamping die production |
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| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20201215 |
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| RJ01 | Rejection of invention patent application after publication |