CN213288633U - Aluminum profile vertical plate die for furniture - Google Patents

Aluminum profile vertical plate die for furniture Download PDF

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Publication number
CN213288633U
CN213288633U CN202120877845.4U CN202120877845U CN213288633U CN 213288633 U CN213288633 U CN 213288633U CN 202120877845 U CN202120877845 U CN 202120877845U CN 213288633 U CN213288633 U CN 213288633U
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CN
China
Prior art keywords
heat dissipation
die
base block
mould
bed die
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Expired - Fee Related
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CN202120877845.4U
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Chinese (zh)
Inventor
贺学初
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Foshan Qingshi Furniture Co ltd
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Foshan Qingshi Furniture Co ltd
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Priority to CN202120877845.4U priority Critical patent/CN213288633U/en
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Publication of CN213288633U publication Critical patent/CN213288633U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model belongs to the technical field of aluminum plate, especially, be an aluminium alloy riser mould for furniture, including last mould, the top of going up the mould is connected with the filling opening, the bottom of going up the mould is connected with the bed die, the surface mounting of bed die has the location fixed column, fixed connection board is all installed on the surface of going up mould and bed die, fixed connection board's surface threaded connection has fixing bolt, the louvre has all been seted up on the surface at bed die both ends, the one end of bed die inner wall is connected with vice heat dissipation mechanism. This aluminium alloy riser mould makes the aluminium that melts through the filling opening, waters in the inner chamber between last mould and the bed die, in the heat conduction oil of the inside heat conduction oil of side cooling basic block is conducted to the heat that the bed die produced through the fixed baseplate of both sides, in conducting the heat radiation fins surface through the heat conduction oil, makes the temperature dispel through the louvre, when the high temperature, carries out quick cooling through the semiconductor refrigeration piece to heat radiation fins, makes the radiating efficiency improve.

Description

Aluminum profile vertical plate die for furniture
Technical Field
The utility model belongs to the technical field of aluminum plate, concretely relates to aluminium alloy riser mould for furniture.
Background
The aluminum plate is a rectangular plate rolled by an aluminum ingot and is classified into a pure aluminum plate, an alloy aluminum plate, a thin aluminum plate, a medium-thick aluminum plate and a pattern aluminum plate, wherein the aluminum plate is an aluminum plate or an aluminum sheet with a thickness of 0.2mm to 500mm, a width of 200mm or more and a length of 16m or less, the aluminum plate is an aluminum material with a thickness of 0.2mm or less, and the aluminum plate is a row material or a strip material within 200mm (naturally, with the progress of large equipment, the aluminum plate with the maximum width of 600mm is also more).
In short, the mold is a tool for manufacturing a molded article, the tool is composed of various parts, different molds are composed of different parts, and the finished product in the mold needs natural cooling, so that the production efficiency is reduced.
SUMMERY OF THE UTILITY MODEL
To solve the problems set forth in the background art described above. The utility model provides an aluminium alloy riser mould for furniture has solved the finished product in the mould and has needed the natural cooling to reduce production efficiency's problem.
In order to achieve the above object, the utility model provides a following technical scheme: an aluminum profile vertical plate die for furniture comprises an upper die, wherein the top of the upper die is connected with an injection port, the bottom of the upper die is connected with a lower die, the surface of the lower die is provided with a positioning fixing column, the bottom of the upper die is provided with a positioning hole for inserting and matching the positioning fixing column, the surfaces of the upper die and the lower die are both provided with a fixed connecting plate, the corresponding fixed connecting plates of the upper die and the lower die are mutually overlapped, the surface of the fixed connecting plate is in threaded connection with a fixed bolt, the fixed bolt penetrates through and is fixedly connected with the two overlapped fixed connecting plates, the surfaces of two ends of the lower die are both provided with heat dissipation holes, one end of the inner wall of the lower die is connected with an auxiliary heat dissipation mechanism, one side of the auxiliary heat dissipation mechanism is provided with a semiconductor refrigeration sheet, the other side of the auxiliary heat dissipation, the heat dissipation device comprises a main gear, a driven gear, a servo motor and a servo motor fixing column, wherein the center of the main gear is connected with a heat dissipation fan blade, the surface of the main gear is connected with the driven gear in a meshed mode, the center of the driven gear is connected with the driven heat dissipation fan blade, the servo motor is connected below the main gear, and the servo motor fixing column is installed at the bottom of the servo motor.
Preferably, the heat dissipation mechanism comprises a main body heat dissipation base block, the bottom of the main body heat dissipation base block is connected with a connecting copper plate, a semiconductor refrigerator is arranged on the surface of the main body heat dissipation base block, and a cooling copper pipe is connected to the surface of the semiconductor refrigerator.
Preferably, the auxiliary heat dissipation mechanism comprises a side cooling base block, a fixed substrate is mounted on the surface of the top of the side cooling base block, and heat dissipation fins are connected inside the side cooling base block.
Preferably, cooling water is arranged inside the main body heat dissipation base block, and the cooling copper pipe penetrates through the main body heat dissipation base block and is connected with the semiconductor refrigerator.
Preferably, the inner wall of the side cooling base block is provided with heat conducting oil, and one third of the heat radiating fins extend into the side cooling base block.
Preferably, a funnel is arranged at the top of the injection port, and the peripheral diameter of the funnel is larger than that of the injection port.
Preferably, the surface of the bottom of the lower die is provided with a supporting leg, and the surface of the bottom of the supporting leg is provided with a rubber round pad.
Compared with the prior art, the beneficial effects of the utility model are that:
in the aluminum profile vertical plate die, molten aluminum water is poured into an inner cavity between an upper die and a lower die through an injection port, heat generated by the lower die is conducted into heat conducting oil in a side cooling base block through fixing base plates on two sides, then conducted to the surfaces of heat radiating fins through the heat conducting oil, and then dissipated through heat dissipation holes if the temperature is too high, the semiconductor refrigerating sheet is used for rapidly cooling the radiating fins to improve the radiating efficiency, and then cooling water in the main radiating base block is used for cooling the radiating fins, the main heat of the lower die is conducted, then the cooling water is cooled by conducting cold air through the cooling copper pipe by the semiconductor refrigerator, and then the main gear is driven by the servo motor to rotate, therefore, the main gear is linked with the driven gear to rotate, so that the heat dissipation fan blades and the driven heat dissipation fan blades rotate to rapidly cool the connecting copper plate and other areas of the lower die.
Drawings
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention. In the drawings:
FIG. 1 is a three-dimensional structure of the present invention;
FIG. 2 is a three-dimensional cross-sectional structure view of the lower mold of the present invention;
FIG. 3 is a three-dimensional sectional structure view of the side cooling base block of the present invention;
FIG. 4 is a first three-dimensional sectional structure view of the main body heat dissipation base block of the present invention;
fig. 5 is a second three-dimensional cross-sectional structure view of the main body heat dissipation base block of the present invention.
In the figure: 1, mounting a mold; 2, lower die; 3, an injection port; 4, a semiconductor refrigerator; 5 fixing the bolt; 6, fixing the connecting plate; 7 servo motor fixing column; 8, supporting legs; 9 rubber round pad; 10 heat dissipation fan blades; 11 a driven gear; 12 driven heat dissipation fan blades; 13 positioning and fixing the column; 14 heat dissipation holes; a 15-side cooling base block; 16 a main gear; 17 a servo motor; 18 a main body heat-dissipating base block; 19 semiconductor refrigerating sheets; 20, cooling the copper pipe; 21 connecting the copper plates; 22 fixing the substrate; 23 heat sink fins.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-5, the present invention provides the following technical solutions: an aluminum profile vertical plate die for furniture comprises an upper die 1, wherein the top of the upper die 1 is connected with an injection port 3, the bottom of the upper die 1 is connected with a lower die 2, the surface of the lower die 2 is provided with a positioning fixing column 13, the bottom of the upper die 1 is provided with a positioning hole for inserting the positioning fixing column 13, the surfaces of the upper die 1 and the lower die 2 are both provided with a fixing connecting plate 6, the corresponding fixing connecting plates 6 of the upper die 1 and the lower die 2 are mutually overlapped, the surface of the fixing connecting plate 6 is in threaded connection with a fixing bolt 5, the fixing bolt 5 penetrates through and is fixedly connected with the two overlapped fixing connecting plates 6, the surfaces of two ends of the lower die 2 are both provided with heat dissipation holes 14, one end of the inner wall of the lower die 2 is connected with an auxiliary heat dissipation mechanism, one side of the auxiliary heat dissipation, a main gear 16 is arranged below the heat dissipation mechanism, a heat dissipation fan blade 10 is connected to the center of the main gear 16, a driven gear 11 is meshed and connected to the surface of the main gear 16, a driven heat dissipation fan blade 12 is connected to the center of the driven gear 11, a servo motor 17 is connected to the lower portion of the main gear 16, and a servo motor fixing column 7 is installed at the bottom of the servo motor 17.
Specifically, heat dissipation mechanism includes main part heat dissipation base block 18, and the bottom of main part heat dissipation base block 18 is connected with connection copper 21, and the surface of main part heat dissipation base block 18 is provided with semiconductor cooler 4, and semiconductor cooler 4's surface is connected with cooling copper pipe 20, through the inside cooling water of main part heat dissipation base block 18, conducts 2 main heats of bed die, and rethread semiconductor cooler 4 conducts air conditioning through cooling copper pipe 20, makes the cooling water cooling.
Specifically, vice heat dissipation mechanism is including side cooling base block 15, the surface mounting at side cooling base block 15 top has fixed baseplate 22, side cooling base block 15 internal connection has heat radiation fins 23, fixed baseplate 22 through both sides conducts the heat that bed die 2 produced in the inside conduction oil of side cooling base block 15, conduct heat radiation fins 23 surface through the conduction oil again, rethread louvre 14 makes the temperature go away, when the high temperature, carry out quick cooling through semiconductor refrigeration piece 19 to heat radiation fins 23, make the radiating efficiency improve.
Specifically, cooling water is arranged inside the main body heat dissipation base block 18, the cooling copper pipe 20 penetrates through the main body heat dissipation base block 18 to be connected with the semiconductor refrigerator 4, and the cooling water arranged enables the main body heat dissipation base block 18 to conduct heat better.
Specifically, heat conduction oil is arranged inside the side cooling base block 15, one third of the radiating fins 23 extend into the side cooling base block 15, and the device can conduct heat dissipation treatment more quickly through the position design of the radiating fins 23.
Specifically, the top of sprue 3 is provided with the funnel, and the peripheral diameter of funnel is greater than sprue 3, thereby avoids the aluminium that melts through the funnel, does not pour into the inner chamber between cope match-plate pattern 1 and the bed match-plate pattern 2 well.
Specifically, the surface mounting of 2 bottoms of bed die has supporting leg 8, and the surface mounting of 8 bottoms of supporting leg has rubber round pad 9, when aluminum plate shaping through supporting leg 8, makes the heat dissipation mechanism of 2 bottoms of bed die dispel the heat better.
The utility model discloses a theory of operation and use flow: after the utility model is installed, molten aluminum water is poured into an inner cavity between an upper die 1 and a lower die 2 through an injection port 3, heat generated by the lower die 2 is conducted into heat conducting oil inside a side cooling base block 15 through fixing base plates 22 at two sides, then the heat conducting oil is conducted to the surface of a cooling fin 23, temperature is dissipated through a heat dissipation hole 14, if the temperature is too high, the cooling fin 23 is rapidly cooled through a semiconductor refrigeration sheet 19, the heat dissipation efficiency is improved, then main heat of the lower die 2 is conducted through cooling water inside a main body cooling base block 18, cold air is conducted through a cooling copper pipe 20 through a semiconductor refrigerator 4, the cooling water is cooled, a main gear 16 is driven by a servo motor 17 to rotate, the main gear 16 is linked with a driven gear 11 to rotate, the cooling fan blades 10 and a driven cooling copper plate 12 are rotated to rapidly cool other areas of the connecting part 21 and the lower die 2, all the electric equipment in the device are powered by an external power supply.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (7)

1. The utility model provides an aluminium alloy riser mould for furniture, includes mould (1), its characterized in that: the top of the upper die (1) is connected with an injection opening (3), the bottom of the upper die (1) is connected with a lower die (2), the surface of the lower die (2) is provided with a positioning fixing column (13), the bottom of the upper die (1) is provided with a positioning hole for inserting the positioning fixing column (13) into the matching hole, the surfaces of the upper die (1) and the lower die (2) are both provided with a fixed connecting plate (6), the corresponding fixed connecting plates (6) of the upper die (1) and the lower die (2) are mutually overlapped, the surface of the fixed connecting plate (6) is in threaded connection with a fixed bolt (5), the fixed bolt (5) passes through and is fixedly connected with the two overlapped fixed connecting plates (6), the surfaces of the two ends of the lower die (2) are both provided with heat dissipation holes (14), one end of the inner wall of the lower die (2) is connected, semiconductor refrigeration piece (19) are installed to one side of vice heat dissipation mechanism, heat dissipation mechanism is installed to vice heat dissipation mechanism's opposite side, heat dissipation mechanism below is provided with master gear (16), the center department of master gear (16) is connected with heat dissipation fan blade (10), the surface meshing of master gear (16) is connected with driven gear (11), the center department of driven gear (11) is connected with driven heat dissipation fan blade (12), the below of master gear (16) is connected with servo motor (17), servo motor fixed column (7) are installed to the bottom of servo motor (17).
2. The aluminum profile vertical plate die for furniture according to claim 1, characterized in that: the heat dissipation mechanism comprises a main body heat dissipation base block (18), the bottom of the main body heat dissipation base block (18) is connected with a connecting copper plate (21), a semiconductor refrigerator (4) is arranged on the surface of the main body heat dissipation base block (18), and a cooling copper pipe (20) is connected to the surface of the semiconductor refrigerator (4).
3. The aluminum profile vertical plate die for furniture according to claim 1, characterized in that: vice heat dissipation mechanism is including side cooling base block (15), the surface mounting at side cooling base block (15) top has fixed baseplate (22), side cooling base block (15) internal connection has heat radiation fins (23).
4. The aluminum profile vertical plate die for furniture according to claim 2, characterized in that: the cooling copper pipe (20) penetrates through the main body heat dissipation base block (18) and is connected with the semiconductor refrigerator (4).
5. The aluminum profile vertical plate die for furniture according to claim 3, characterized in that: the heat conduction oil is arranged in the side cooling base block (15), and one third of the heat dissipation fins (23) extend into the side cooling base block (15).
6. The aluminum profile vertical plate die for furniture according to claim 1, characterized in that: the top of the filling opening (3) is provided with a funnel, and the peripheral diameter of the funnel is larger than that of the filling opening (3).
7. The aluminum profile vertical plate die for furniture according to claim 1, characterized in that: the surface mounting of bed die (2) bottom has supporting leg (8), the surface mounting of supporting leg (8) bottom has rubber round pad (9).
CN202120877845.4U 2021-04-27 2021-04-27 Aluminum profile vertical plate die for furniture Expired - Fee Related CN213288633U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202120877845.4U CN213288633U (en) 2021-04-27 2021-04-27 Aluminum profile vertical plate die for furniture

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202120877845.4U CN213288633U (en) 2021-04-27 2021-04-27 Aluminum profile vertical plate die for furniture

Publications (1)

Publication Number Publication Date
CN213288633U true CN213288633U (en) 2021-05-28

Family

ID=76017330

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202120877845.4U Expired - Fee Related CN213288633U (en) 2021-04-27 2021-04-27 Aluminum profile vertical plate die for furniture

Country Status (1)

Country Link
CN (1) CN213288633U (en)

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Granted publication date: 20210528