CN220862712U - Metal mold with cooling function - Google Patents
Metal mold with cooling function Download PDFInfo
- Publication number
- CN220862712U CN220862712U CN202322442593.4U CN202322442593U CN220862712U CN 220862712 U CN220862712 U CN 220862712U CN 202322442593 U CN202322442593 U CN 202322442593U CN 220862712 U CN220862712 U CN 220862712U
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- CN
- China
- Prior art keywords
- cooling
- metal mold
- mounting
- heat dissipation
- mounting frame
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- 238000001816 cooling Methods 0.000 title claims abstract description 71
- 239000002184 metal Substances 0.000 title claims abstract description 18
- 239000004065 semiconductor Substances 0.000 claims abstract description 26
- 230000017525 heat dissipation Effects 0.000 claims description 25
- 238000005057 refrigeration Methods 0.000 claims description 18
- 238000009423 ventilation Methods 0.000 claims description 12
- 230000001681 protective effect Effects 0.000 claims description 9
- 229910001220 stainless steel Inorganic materials 0.000 claims description 4
- 239000010935 stainless steel Substances 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000005266 casting Methods 0.000 description 9
- 239000007788 liquid Substances 0.000 description 2
- 239000004576 sand Substances 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to a metal mold with a cooling function, which comprises a bottom plate, a mounting frame and a cooling box, wherein the mounting frame is fixedly arranged at the top of the bottom plate, the bottom of the cooling box is arranged at the top of the bottom plate through four supporting seats, the metal mold further comprises a lower mold, an upper mold, an air cylinder, a semiconductor refrigerating sheet, a radiating component, a pipe body and a cooling groove, the lower mold is fixedly arranged at the top of the bottom plate, the upper mold is slidably arranged on the surface of the mounting frame, two air cylinders for moving the upper mold are arranged in the mounting frame, the semiconductor refrigerating sheet is embedded at the bottom of the cooling box, external air is sucked into the cooling box through a starting fan body, the refrigerating surface of the semiconductor refrigerating sheet is arranged in the cooling box, the cold air is blown into the pipe body and enters the cooling groove in the lower mold, and cold air is continuously output to the lower mold, so that the lower mold is rapidly cooled, and the blanking is facilitated.
Description
Technical Field
The utility model relates to the technical field of pouring die equipment, in particular to a metal die with a cooling function.
Background
The casting mold is to make the structural shape of the part by using other materials easy to mold in advance, then put the mold in the sand mold, so that a cavity with the same structural size as the part is formed in the sand mold, then the liquid is poured into the cavity, the liquid can be cooled and solidified to form the part with the same shape and structure as the mold, the pouring mold does not have the function of quick cooling, so that the casting cannot be taken out quickly after pouring is finished, and the working efficiency of people is reduced
A metal mould (application number: 202022397579.3) belongs to the field of moulds, and the technical scheme is characterized in that the metal mould comprises an upper mould and a lower mould, wherein a guide post is arranged on one side, close to the lower mould, of the upper mould, a positioning groove is arranged on one side, close to the upper mould, of the lower mould, the guide post is detachably connected with the upper mould, a guide sleeve matched with the guide post is coaxially arranged in the positioning groove, and the guide sleeve is detachably connected with the positioning groove.
The casting mold of the above patent does not have the function of rapid cooling, so that the casting cannot be rapidly cooled after casting is completed, the casting cannot be rapidly taken out, and the working efficiency of people is reduced, so that the metal mold with the cooling function is needed.
Disclosure of utility model
The present utility model is directed to a metal mold with cooling function, which solves the problems set forth in the background art.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a metal mold with cooling function, includes bottom plate, mounting bracket and cooling tank, the top fixed mounting of bottom plate has the mounting bracket, the bottom of cooling tank is installed through four supporting seats the top of bottom plate still includes bed die, last mould, cylinder, semiconductor refrigeration piece, radiator unit, body and cooling tank, the top fixed mounting of bottom plate has the bed die, the surface sliding mounting of mounting bracket has the bed die, just the internally mounted of mounting bracket has two cylinders that are used for right the bed die removes, the bottom of cooling tank is embedded with the semiconductor refrigeration piece, the face that generates heat of semiconductor refrigeration piece sets up the bottom of cooling tank, just radiator unit is installed to the face that generates heat of semiconductor refrigeration piece, the bed die with the intercommunication has the body between the cooling tank, just the cooling tank with the body intercommunication has been seted up to the inside of bed die.
Preferably, the heat dissipation assembly comprises a heat dissipation fin plate and mounting bolts, the heat dissipation fin plate is mounted on a heating surface of the semiconductor refrigeration, and the surface of the heat dissipation fin plate is fixedly mounted at the bottom of the cooling box through the four mounting bolts.
Preferably, the heat dissipation fin structure further comprises a ventilation groove, wherein the ventilation groove is formed in the bottom plate, and the ventilation groove is located at the bottom of the heat dissipation fin plate.
Preferably, the cooling box further comprises an air inlet piece for air inlet in the cooling box, the air inlet piece comprises a mounting frame and a fan body, the mounting frame is mounted at the top of the cooling box, and the fan body is mounted in the mounting frame.
Preferably, the top of the lower die is integrally processed with four guide posts, four guide grooves matched with the four guide posts are formed in the upper die, and an exhaust part is formed in one side of the lower die.
Preferably, both sides of the upper die are fixedly provided with sliding seats, and the insides of the two sliding seats are slidably arranged on the surface of the mounting frame.
Preferably, a protective net is fixedly arranged at the top of the mounting frame, and the protective net is a stainless steel net.
Compared with the prior art, the utility model has the beneficial effects that:
According to the utility model, the fan body is started to suck external air into the cooling box, the cooling surface of the semiconductor refrigerating sheet is arranged in the cooling box, cold air is blown into the pipe body and enters the cooling groove in the lower die, and cold air is continuously output to the lower die, so that the lower die is rapidly cooled, the blanking is facilitated, and the problem that the casting cannot be rapidly cooled after the casting is finished due to the fact that the casting die does not have the rapid cooling function is avoided.
Drawings
FIG. 1 is a schematic perspective view of the structure of the present utility model;
FIG. 2 is a perspective cross-sectional view of a heat dissipating assembly of the present utility model;
FIG. 3 is a cross-sectional view of the lower mold of the present utility model;
fig. 4 is a perspective view of an air intake member of the present utility model.
In the figure: 1. a bottom plate; 2. a mounting frame; 3. a cooling box; 5. a lower die; 6. an upper die; 7. a cylinder; 8. a semiconductor refrigeration sheet; 9. a heat dissipation assembly; 91. a heat dissipation fin; 92. installing a bolt; 10. a tube body; 11. a cooling tank; 14. a ventilation groove; 15. an air inlet piece; 151. a fan body; 152. a mounting frame; 16. a guide post; 17. a guide groove; 18. a sliding seat; 19. and a protective net.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1-4, the present utility model provides a technical solution: the utility model provides a metal mold with cooling function, including bottom plate 1, mounting bracket 2 and cooling tank 3, the top fixed mounting of bottom plate 1 has mounting bracket 2, the bottom of cooling tank 3 is installed at the top of bottom plate 1 through four supporting seats, still include bed die 5, go up mould 6, cylinder 7, semiconductor refrigeration piece 8, radiator unit 9, body 10 and cooling tank 11, the top fixed mounting of bottom plate 1 has bed die 5, the surface sliding mounting of mounting bracket 2 has last mould 6, and the internally mounted of mounting bracket 2 has two cylinders 7 that are used for removing last mould 6, the bottom of cooling tank 3 is embedded to have semiconductor refrigeration piece 8, the face that generates heat of semiconductor refrigeration piece 8 sets up in the bottom of cooling tank 3, and the radiator unit 9 is installed to the face that generates heat of semiconductor refrigeration piece 8, the intercommunication has body 10 between bed die 5 and the cooling tank 3, and the inside of bed die 5 has seted up the cooling tank 11 with body 10 intercommunication.
The heat dissipation assembly 9 includes a heat dissipation fin plate 91 and mounting bolts 92, the heat dissipation fin plate 91 is mounted on a heat generating surface of semiconductor refrigeration, and the surface of the heat dissipation fin plate 91 is fixedly mounted at the bottom of the cooling box 3 through the four mounting bolts 92, in this embodiment, the heat dissipation fin plate 91 is attached to the heat generating surface of the semiconductor refrigeration piece 8, the generated heat is rapidly absorbed and discharged, and the heat dissipation fin plate 91 is tightly mounted on the semiconductor refrigeration piece 8 through the four mounting bolts 92.
The heat dissipation fin plate comprises a base plate 1, and is characterized by further comprising a ventilation groove 14, wherein the ventilation groove 14 is formed in the base plate 1, the ventilation groove 14 is positioned at the bottom of the heat dissipation fin plate 91, the ventilation groove 14 is formed in the base plate 1, and the ventilation groove 14 is positioned at the bottom of the heat dissipation fin plate 91, so that heat dissipation of the heat dissipation fin plate 91 is facilitated.
The cooling box comprises a cooling box body 3, and is characterized by further comprising an air inlet piece 15 for air inlet in the cooling box body 3, wherein the air inlet piece 15 comprises a mounting frame 152 and a fan body 151, the mounting frame 152 is mounted at the top of the cooling box body 3, the fan body 151 is mounted in the mounting frame 152, external air is sucked into the cooling box body 3 by starting the fan body 151, a refrigerating surface of a semiconductor refrigerating sheet 8 is arranged in the cooling box body 3, and cold air is blown into a pipe body 10 and enters a cooling groove 11 in the lower die 5.
Four guide posts 16 are integrally machined at the top of the lower die 5, four guide grooves 17 matched with the four guide posts 16 are formed in the upper die 6, an exhaust part is formed on one side of the lower die 5, and in the embodiment, the guide posts 16 at the top of the lower die 5 are clamped with the guide grooves 17 in the upper die 6, so that the upper die 6 is conveniently mounted on the lower die 5.
Both sides of the upper die 6 are fixedly provided with sliding seats 18, the insides of the two sliding seats 18 are slidably mounted on the surface of the mounting frame 2, and in the embodiment, the insides of the two sliding seats 18 are slidably mounted on the surface of the mounting frame 2, so that stability is enhanced for movement of the upper die 6.
The top of the mounting frame 152 is fixedly provided with a protective net 19, the protective net 19 is set to be a stainless steel net, the service life of the protective net 19 is prolonged by setting the protective net 19 to be a stainless steel net, and the fan body 151 is protected.
The device sucks external air into the cooling box 3 by starting the fan body 151, the refrigerating surface of the semiconductor refrigerating sheet 8 is arranged in the cooling box 3, cold air is blown into the pipe body 10 and enters the cooling groove 11 in the lower die 5, cold air is continuously output in the lower die 5, the lower die 5 is rapidly cooled, discharging is facilitated, the heat radiating fin plates 91 are adhered to the heating surface of the semiconductor refrigerating sheet 8, generated heat is rapidly absorbed and discharged, and the heat radiating fin plates 91 are tightly mounted on the semiconductor refrigerating sheet 8 through the four mounting bolts 92.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. The utility model provides a metal mold with cooling function, includes bottom plate (1), mounting bracket (2) and cooling tank (3), the top fixed mounting of bottom plate (1) has mounting bracket (2), the bottom of cooling tank (3) is installed through four supporting seats the top of bottom plate (1), its characterized in that: still include bed die (5), go up mould (6), cylinder (7), semiconductor refrigeration piece (8), radiator unit (9), body (10) and cooling tank (11), the top fixed mounting of bottom plate (1) has bed die (5), the surface sliding mounting of mounting bracket (2) has last mould (6), just the internally mounted of mounting bracket (2) has and is used for right two cylinders (7) that go up mould (6) and remove, the bottom of cooling tank (3) has embedded semiconductor refrigeration piece (8), the face that generates heat of semiconductor refrigeration piece (8) sets up the bottom of cooling tank (3), just radiator unit (9) are installed to the face that generates heat of semiconductor refrigeration piece (8), bed die (5) with the intercommunication has body (10) between cooling tank (3), just cooling tank (11) with body (10) intercommunication are seted up to the inside of bed die (5).
2. A metal mold with cooling function according to claim 1, characterized in that: the heat dissipation assembly (9) comprises a heat dissipation fin plate (91) and mounting bolts (92), the heat dissipation fin plate (91) is mounted on a heating surface of semiconductor refrigeration, and the surface of the heat dissipation fin plate (91) is fixedly mounted at the bottom of the cooling box (3) through the four mounting bolts (92).
3. A metal mold with cooling function according to claim 2, characterized in that: the heat dissipation plate further comprises a ventilation groove (14), wherein the ventilation groove (14) is formed in the bottom plate (1), and the ventilation groove (14) is located at the bottom of the heat dissipation fin plate (91).
4. A metal mold with cooling function according to claim 1, characterized in that: the cooling box is characterized by further comprising an air inlet piece (15) for air inlet in the cooling box (3), wherein the air inlet piece (15) comprises a mounting frame (152) and a fan body (151), the mounting frame (152) is mounted at the top of the cooling box (3), and the fan body (151) is mounted in the mounting frame (152).
5. A metal mold with cooling function according to claim 1, characterized in that: four guide posts (16) are integrally machined at the top of the lower die (5), four guide grooves (17) matched with the four guide posts (16) are formed in the upper die (6), and an exhaust part is formed in one side of the lower die (5).
6. A metal mold with cooling function according to claim 1, characterized in that: both sides of the upper die (6) are fixedly provided with sliding seats (18), and the insides of the two sliding seats (18) are slidably arranged on the surface of the mounting frame (2).
7. The metal mold with cooling function according to claim 4, wherein: the top of the mounting frame (152) is fixedly provided with a protective net (19), and the protective net (19) is a stainless steel net.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322442593.4U CN220862712U (en) | 2023-09-08 | 2023-09-08 | Metal mold with cooling function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322442593.4U CN220862712U (en) | 2023-09-08 | 2023-09-08 | Metal mold with cooling function |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220862712U true CN220862712U (en) | 2024-04-30 |
Family
ID=90818575
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322442593.4U Active CN220862712U (en) | 2023-09-08 | 2023-09-08 | Metal mold with cooling function |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220862712U (en) |
-
2023
- 2023-09-08 CN CN202322442593.4U patent/CN220862712U/en active Active
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| GR01 | Patent grant |