CN213704327U - Cover mould with circulative cooling structure - Google Patents

Abstract

The utility model discloses a cover mould with circulative cooling structure, including mould structure, water inlet and delivery port, mould structure side is close to the upper surface position and sets up the water inlet, mould structure side is located the water inlet below the position and sets up the delivery port, delivery port fixed connection rapid cooling pipe, and rapid cooling pipe end fixed connection cooling structure, the fixed booster pump that communicates in cooling structure below, and cooling structure tip and water inlet fixed connection, be equipped with heat radiation structure between mould structure and the cooling structure, lead into the water conservancy diversion chamber through the booster pump with rivers from the water inlet on the mould structure, absorb and take away the heat in the mould intracavity, through rapid cooling pipe and heat radiation structure, lead into the mould structure inside once more after dispelling the heat in the rivers, play the refrigerated effect of circulative cooling, through hydrologic cycle cooling, the cooling time for product molding is greatly saved, and the production efficiency is well improved.

Description

Cover mould with circulative cooling structure

Technical Field

The utility model relates to the technical field of mold, specifically a cover mould with circulative cooling structure.

Background

The mould is a common manufacturing device in industrial production, various moulds and tools for obtaining required products by injection molding, blow molding, extrusion, die casting or forging forming, smelting, stamping and other methods are used in industrial production, the mould is a tool for manufacturing a molded article, the tool is composed of various parts, different moulds are composed of different parts, the processing of the appearance of the article is realized mainly by changing the physical state of the molded material, the injection molding processing is a common processing mode, in the last demoulding link, demoulding can be performed after thermoplastic cooling forming in a cavity, excessive time is wasted in the process of waiting for cooling, and the production efficiency is greatly reduced.

To this end, we propose a hood mold with a circulating cooling structure.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a cover mould with circulative cooling structure to solve the problem that proposes among the above-mentioned background art.

In order to realize the above purpose, the utility model provides a following technical scheme a cover mould with circulative cooling structure, including mould structure, water inlet and delivery port, the water inlet is seted up near upper surface position to mould structure side, mould structure side is located water inlet below position and sets up the delivery port, delivery port fixed connection rapid cooling pipe, and rapid cooling pipe tip fixed connection cooling structure, the fixed intercommunication booster pump in cooling structure below, and cooling structure tip and water inlet fixed connection, be equipped with heat radiation structure between mould structure and the cooling structure.

Preferably, the mold structure comprises an upper mold, a mold cavity, a lower mold and a flow guide cavity, wherein the upper mold is fixedly matched with the lower mold in a press fit manner, the mold cavity is formed between the upper mold and the lower mold, the flow guide cavity is formed around the mold cavity, and the end part of the flow guide cavity is respectively and fixedly communicated with the water inlet and the water outlet.

Preferably, cooling structure includes support, heat dissipation strip and time type pipe, mould structure side fixed mounting support, and even fixed mounting heat dissipation strip between the support, the support is fixed with the fixed perpendicular interlude of heat dissipation strip and is installed time type pipe, time type pipe end oral area and water inlet fixed connection, and another tip of time type pipe and the fixed intercommunication of rapid cooling pipe.

Preferably, the semiconductor cooler is uniformly and fixedly arranged on the outer side of the rapid cooling pipe.

Preferably, the heat radiation structure comprises a balancing weight and a fan, the balancing weight is arranged between the cooling structure and the mold structure, the fan is fixedly installed on the upper surface of the balancing weight, and the wind direction of the fan is one side far away from the mold structure.

Preferably, the heat dissipation strip is made of an aluminum alloy material.

Compared with the prior art, the beneficial effects of the utility model are that:

the utility model discloses, after mould assembly moulding-die shaping, lead into water conservancy diversion chamber through the booster pump with rivers from the structural water inlet of mould, absorb to take away the heat in the mould intracavity, through rapid cooling pipe and heat radiation structure, with the heat in rivers inside leading-in mould structure once more after removing, play the refrigerated effect of cooling down of circulation, through the hydrologic cycle cooling, saved the fashioned cool time of product greatly, fine improvement production efficiency.

Drawings

FIG. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is a schematic view of the interior of the mold structure of the present invention;

FIG. 3 is a schematic view of the interior of the mold structure of the present application;

FIG. 4 is a schematic view of the cooling structure of the present invention;

FIG. 5 is a schematic view of the installation of the semiconductor cooler of the present invention;

fig. 6 is a schematic view of the heat dissipation structure of the present invention.

In the figure: 1. a mold structure; 11. an upper die; 12. a mold cavity; 13. a lower die; 14. a flow guide cavity; 2. a water inlet; 3. a water outlet; 4. a cooling structure; 41. a support; 42. a heat dissipating strip; 43. a return pipe; 5. a rapid cooling tube; 51. a semiconductor refrigerator; 6. a booster pump; 7. a heat dissipation structure; 71. a balancing weight; 72. a fan.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1, 2 and 3, a cover mold with a circulating cooling structure comprises a mold structure 1, a water inlet 2 and a water outlet 3, wherein the water inlet 2 is arranged on the side surface of the mold structure 1 close to the upper surface, the water outlet 3 is arranged on the side surface of the mold structure 1 below the water inlet 2, the water outlet 3 is fixedly connected with a rapid cooling pipe 5, the end part of the rapid cooling pipe 5 is fixedly connected with a cooling structure 4, a booster pump 6 is fixedly communicated below the cooling structure 4, the end part of the cooling structure 4 is fixedly connected with the water inlet 2, a heat dissipation structure 7 is arranged between the mold structure 1 and the cooling structure 4, water flows into the mold structure 1 through the water inlet 2, absorbs heat from the water outlet 3, is well cooled through the rapid cooling pipe 5 and then flows into the cooling structure 4 to continue cooling, a fan 72 blows air to dissipate heat, and continues to flow into the mold structure 1 through the water inlet 2 after the heat, therefore, the whole circulating cooling system is realized, the cooling time consumption is greatly reduced, and the production efficiency is improved.

Referring to fig. 2 and 3, the mold structure 1 includes an upper mold 11, a mold cavity 12, a lower mold 13 and a flow guide cavity 14, the upper mold 11 is fixed and press-fitted to the lower mold 13, the mold cavity 12 is formed between the upper mold 11 and the lower mold 13, the flow guide cavity 14 is formed around the mold cavity 12, the end of the flow guide cavity 14 is respectively and fixedly communicated with the water inlet 2 and the water outlet 3, water flows into the flow guide cavity 14 inside the mold structure 1 from the water inlet 2, the flow guide cavity 14 surrounds the mold cavity 12, heat in the mold cavity 12 is absorbed and flows out from the water outlet 3, cooling time is reduced, and product molding is accelerated.

Referring to fig. 4, the cooling structure 4 includes a support 41, heat dissipation strips 42 and a loop pipe 43, the support 41 is fixedly installed on the side surface of the mold structure 1, the heat dissipation strips 42 are uniformly and fixedly installed between the support 41, the support 41 and the heat dissipation strips 42 are fixedly and vertically inserted and installed with the loop pipe 43, an end opening portion of the loop pipe 43 is fixedly connected with the water inlet 2, the other end portion of the loop pipe 43 is fixedly communicated with the rapid cooling pipe 5, when the rapid cooling pipe 5 is cooled, water flows along the loop pipe 43, at this time, the heat dissipation strips 42 absorb some remaining heat, and heat in the water flow is well absorbed.

Referring to fig. 5, a semiconductor refrigerator 51 is uniformly and fixedly installed outside the rapid cooling pipe 5, and the water flow flowing out from the water outlet 3 flows into the rapid cooling pipe 5, so as to rapidly reduce the temperature of the water flow under the action of the semiconductor refrigerator 51.

Referring to fig. 6, the heat dissipation structure 7 includes a weight 71 and a fan 72, the weight 71 is disposed between the cooling structure 4 and the mold structure 1, the fan 72 is fixedly mounted on the upper surface of the weight 71, the wind direction of the fan 72 is far away from one side of the mold structure 1, and the fan 72 blows the heat absorbed by the heat dissipation strip 42 to perform a timely cooling function.

The heat dissipation strip 42 is made of an aluminum alloy material, and the aluminum alloy material has strong thermal conductivity and can well absorb heat in the return tube 43.

The working principle is as follows: when the product in the mold structure 1 cools off the shaping, open whole water cooling device, at first rivers flow into the inside water conservancy diversion chamber 14 of mold structure 1 from water inlet 2 under the effect of booster pump 6, water conservancy diversion chamber 14 encircles die cavity 12, absorb the heat in the die cavity 12 and flow out from delivery port 3, rivers flow in rapid cooling pipe 5 this moment, rivers cool down fast under semiconductor cooler 51's effect, later rivers can flow along returning type pipe 43, some remaining heats can be absorbed to heat dissipation strip 42 this moment, fine heat absorption with in the rivers, fan 72 blows off the heat in heat dissipation strip 42, obtain the lower rivers of temperature, continue to get into inside the mold structure 1 through water inlet 2, form water cycle cooling.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (6)

1. The utility model provides a cover mould with circulative cooling structure, includes mould structure (1), water inlet (2) and delivery port (3), mould structure (1) side is close to the upper surface position and offers water inlet (2), mould structure (1) side is located water inlet (2) below position and offers delivery port (3), its characterized in that: delivery port (3) fixed connection rapid cooling pipe (5), and rapid cooling pipe (5) tip fixed connection cooling structure (4), fixed intercommunication booster pump (6) in cooling structure (4) below, and cooling structure (4) tip and water inlet (2) fixed connection, be equipped with heat radiation structure (7) between mould structure (1) and cooling structure (4).

2. The cover mold with the circulating cooling structure according to claim 1, wherein: mould structure (1) is including last mould (11), die cavity (12), lower mould (13) and water conservancy diversion chamber (14), go up fixed pressfitting cooperation lower mould (13) of mould (11), and set up die cavity (12) between last mould (11) and lower mould (13), die cavity (12) are around seting up water conservancy diversion chamber (14), and water conservancy diversion chamber (14) tip is fixed intercommunication water inlet (2) and delivery port (3) respectively.

3. The cover mold with the circulating cooling structure according to claim 2, wherein: cooling structure (4) are including support (41), heat dissipation strip (42) and time type pipe (43), mould structure (1) side fixed mounting support (41), and even fixed mounting heat dissipation strip (42) between support (41), support (41) and heat dissipation strip (42) are fixed to be interlude perpendicularly and are installed time type pipe (43), time type pipe (43) port portion and water inlet (2) fixed connection, and time type pipe (43) another tip and rapid cooling pipe (5) fixed intercommunication.

4. The cover mold with the circulating cooling structure according to claim 3, wherein: and a semiconductor refrigerator (51) is uniformly and fixedly arranged on the outer side of the rapid cooling pipe (5).

5. The cover mold with the circulating cooling structure according to claim 1, wherein: the heat dissipation structure (7) comprises a balancing weight (71) and a fan (72), the balancing weight (71) is arranged between the cooling structure (4) and the die structure (1), the fan (72) is fixedly installed on the upper surface of the balancing weight (71), and the wind direction of the fan (72) is far away from one side of the die structure (1).

6. The cover mold with the circulating cooling structure according to claim 3, wherein: the heat dissipation strip (42) is made of an aluminum alloy material.

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