CN209054797U - A graphite mold cooling structure - Google Patents

Abstract

The utility model discloses a graphite mold cooling structure, including last mould, lower mould, water-cooling chamber and air-cooling chamber, one side of lower mould is provided with the support, and the top of support installs the water pump, one side of water pump is provided with the water inlet, the opposite side of water pump is provided with the inlet tube, the top of lower mould is provided with the mould, and just one side of going up the mould is provided with air conditioning and takes place the room, the internally mounted that room was taken place to air conditioning has the semiconductor refrigeration piece, and one side that room was taken place to air conditioning is provided with the air inlet, the air inlet extends to the inside that room was taken place to air conditioning, the opposite side that room was taken place to air. The utility model discloses a be provided with water-cooling chamber and air-cooling chamber, water-cooling effect is though good, but cooling rate is too fast, is applicable to the position that needs cooling rate to be fast, and air-cooling is slow, is applicable to the position that cooling rate is slow, and the two mutually supports, has promoted cooling efficiency greatly.

Description

A graphite mold cooling structure

technical field

The utility model relates to the technical field of mold cooling, in particular to a graphite mold cooling structure.

Background technique

In recent years, the mold industry has developed rapidly. Graphite materials, new processes and the increasing number of mold factories continue to impact the mold market. Graphite has gradually become the preferred material for mold making due to its good physical and chemical properties. A graphite mold cooling structure is now required.

First, the traditional graphite mold cooling structure has low structural strength, and the mold may be damaged when encountering severe temperature differences.

Second, the cooling effect of the traditional graphite mold cooling structure is poor, and the graphite mold cannot be cooled rapidly.

Third, the cooling efficiency of the traditional graphite mold cooling structure is low, and the cooling method cannot be changed according to the different materials in the mold.

Utility model content

The purpose of the present invention is to provide a graphite mold cooling structure, so as to solve the problems of low structural strength, poor cooling effect and low cooling efficiency proposed in the above-mentioned background art.

In order to achieve the above purpose, the utility model provides the following technical solutions: a graphite mold cooling structure, including an upper mold, a lower mold, a water-cooled cavity and an air-cooled cavity, one side of the lower mold is provided with a bracket, and the top of the bracket is installed with a bracket. A water pump, one side of the water pump is provided with a water inlet, the other side of the water pump is provided with a water inlet pipe, and a water outlet pipe is arranged on the lower mold below the water inlet pipe, the top of the lower mold is provided with an upper mold, and One side of the upper mold is provided with a cold air generating chamber, the interior of the cold air generating chamber is installed with a semiconductor refrigerating sheet, and one side of the cold air generating chamber is provided with an air inlet, and the air inlet extends to the interior of the cold air generating chamber, The other side of the cold air generating chamber is provided with an air intake pipe, the other side of the upper mold is installed with a control panel, and the inside of the control panel is installed with a single-chip microcomputer, the bottom end inside the lower mold and the inner side of the semiconductor refrigeration chip are installed. The top end is evenly provided with heat dissipation holes, the inside of the lower mold is provided with a water-cooled cavity, the inside of the upper mold is provided with an air-cooled cavity, and the top and bottom ends of the inside of the air-cooled cavity are evenly provided with windshields. The side of the air pipe that is far away from the cold air generating chamber passes through the side wall of the air-cooling cavity and extends to the inside of the air-cooling cavity. The side passes through the side wall of the cold air generating chamber and extends to the interior of the cold air generating chamber. The side walls of the water cooling chamber and the air cooling chamber are provided with spiral rubber columns, and the output end of the control panel is connected to the input end of the single chip through a wire The output end of the single-chip microcomputer is electrically connected to the input end of the air inlet through a wire, and the output end of the single-chip microcomputer is electrically connected to the input end of the water pump through a wire.

Preferably, the heat dissipation holes are distributed at equal intervals.

Preferably, a welding integrated structure is formed between the cold air generating chamber and the upper mold.

Preferably, a dismounting and mounting structure is formed between the bracket and the lower mold.

Preferably, water cooling pipes are evenly arranged inside the water cooling chamber, the side of the water inlet pipe away from the water pump passes through the side wall of the water cooling chamber and extends to the interior of the water cooling chamber and is connected to one end of the water cooling pipe, and the water outlet pipe is connected to the side wall of the water cooling chamber. The other end of the water cooling pipe is connected, and the water cooling pipe is in the shape of "S".

Preferably, the spiral rubber column is in a spiral shape.

Compared with the prior art, the beneficial effect of the present utility model is that the cooling structure of the graphite mold is reasonable and has the following advantages:

1. Spiral rubber columns are evenly arranged on the side walls of the water-cooled cavity and the air-cooled cavity. The spiral rubber columns are helical and equally spaced, which can greatly improve the strength of the graphite mold and prevent the graphite mold from cooling due to a fast cooling speed. Excessive temperature difference can cause damage.

2. By providing a water-cooling cavity, the water-cooling tube inside the water-cooling cavity is in an "S" shape, which increases the contact area. The air duct is also in the shape of "S", the contact area between the cold air and the mold is increased, and after the cold air acts, it becomes hot air and continues to circulate into the air-cooling cavity, which improves the cooling effect.

3. By setting up a water-cooling cavity and an air-cooling cavity, although the cooling effect of water-cooling is good, the cooling speed is too fast, which is suitable for the parts that need a fast cooling speed, and the air-cooling cooling is slow, which is suitable for the parts with a slow cooling speed. The two cooperate with each other. , greatly improving the cooling efficiency.

Description of drawings

Fig. 1 is the front view sectional structure schematic diagram of the present utility model;

Fig. 2 is the top view structure schematic diagram of the water cooling pipe of the utility model;

Fig. 3 is the enlarged structural schematic diagram at A in Fig. 1 of the utility model;

FIG. 4 is a system block diagram of the present invention.

In the figure: 1. Heat dissipation hole; 2. Air inlet pipe; 3. Cold air generating chamber; 4. Air inlet; 5. Semiconductor refrigeration sheet; 6. Upper mold; 7. Lower mold; 8. Water pump; 10. Water outlet pipe; 11. Water inlet; 12. Bracket; 13. Water cooling chamber; 14. Water cooling pipe; 15. Control panel; 16. Single chip computer; 17. Air outlet pipe; 18. Windshield; 19. Air cooling chamber; 20. Spiral rubber column.

Detailed ways

The technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the implementations. example. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the protection scope of the present invention.

1-4, an embodiment provided by the present invention: a graphite mold cooling structure, including an upper mold 6, a lower mold 7, a water-cooled cavity 13 and an air-cooled cavity 19, and one side of the lower mold 7 is provided with a bracket 12. A disassembly and installation structure is formed between the bracket 12 and the lower die 7, which is convenient for disassembly and maintenance. The top of the bracket 12 is installed with a water pump 8. The model of the water pump 8 can be ISGD. One side of the water pump 8 is provided with a water inlet 11. The other side is provided with a water inlet pipe 9, and the lower mold 7 below the water inlet pipe 9 is provided with a water outlet pipe 10, the top of the lower mold 7 is provided with an upper mold 6, and one side of the upper mold 6 is provided with a cold air generating chamber 3 , a welding integrated structure is formed between the cold air generating chamber 3 and the upper mold 6, which improves the stability. The semiconductor refrigeration sheet 5 is installed inside the cold air generating chamber 3, and the air inlet 4 is provided on one side of the cold air generating chamber 3. The air inlet 4 extends to the inside of the cold air generation chamber 3, the other side of the cold air generation chamber 3 is provided with an air intake pipe 2, the other side of the upper mold 6 is installed with a control panel 15, and the inside of the control panel 15 is installed with a single chip 16. , the model of the single chip microcomputer 16 can be HT66F017, the bottom end of the lower mold 7 and the top of the semiconductor cooling chip 5 are evenly provided with heat dissipation holes 1, and the heat dissipation holes 1 are distributed at equal intervals, which improves the heat dissipation effect. There is a water-cooling chamber 13, and water-cooling pipes 14 are evenly arranged inside the water-cooling chamber 13. The side of the water-inlet pipe 9 away from the water pump 8 passes through the side wall of the water-cooling chamber 13 and extends to the interior of the water-cooling chamber 13 and is connected to one end of the water-cooling pipe 14. The water pipe 10 is connected to the other end of the water cooling pipe 14. The water cooling pipe 14 is in an "S" shape, which improves the cooling effect. The upper mold 6 is provided with an air cooling cavity 19, and the top and bottom ends of the air cooling cavity 19 are evenly arranged. There is a windshield 18, and the side of the air intake pipe 2 away from the cold air generating chamber 3 passes through the side wall of the air-cooling cavity 19 and extends to the interior of the air-cooling cavity 19. The air pipe 17, and the side of the air outlet pipe 17 away from the air-cooling chamber 19 passes through the side wall of the cold-air generating chamber 3 and extends to the interior of the cold-air generating chamber 3. The side walls of the water-cooling chamber 13 and the air-cooling chamber 19 are provided with spiral rubber. The column 20 and the spiral rubber column 20 are in a spiral shape, which improves the structural strength. The output end of the control panel 15 is electrically connected to the input end of the single-chip microcomputer 16 through the wire, and the output end of the single-chip microcomputer 16 is electrically connected to the input end of the air inlet 4 through the wire. The output terminal of the single-chip microcomputer 16 is electrically connected to the input terminal of the water pump 8 through a wire.

Working principle: During use, the temperature of the parts in the mold is too high and needs to be cooled. Since the top end of the upper mold 6 and the bottom end of the lower mold 7 are provided with heat dissipation holes 1, it can help the mold to cool down. When the internal parts need to be cooled quickly , start the water pump 8, and the water pump 8 injects water into the water cooling pipe 14. Since the water cooling pipe 14 has multiple layers and is in an "S" shape, the cooling area is increased, thereby improving the cooling effect. When the internal parts need to be cooled slowly, start The semiconductor refrigeration sheet 5 cools the incoming air, and the cooling air is transported into the air-cooling cavity 19 by the air pump. Since the top and bottom ends of the air-cooling cavity 19 are evenly provided with air baffles 18, the air duct is The "S" shape also improves the cooling effect. At the same time, because the air outlet pipe 17 is connected to the cold air generating chamber 3, the incoming gas can circulate to cool the mold. The combination of air cooling and water cooling greatly improves the heat dissipation of the mold. At the same time, since the spiral rubber columns 20 are evenly arranged on the inner walls of the air-cooled cavity 19 and the water-cooled cavity 13, the structural strength is improved, so that the mold will not be easily damaged under severe temperature differences.

It will be apparent to those skilled in the art that the present invention is not limited to the details of the above-described exemplary embodiments, and that the present invention may be implemented in other specific forms without departing from the spirit or essential characteristics of the present invention. Therefore, the embodiments are to be considered in all respects as exemplary and not restrictive, and the scope of the present invention is defined by the appended claims rather than the foregoing description, and it is therefore intended that the All changes within the meaning and range of the required equivalents are embraced within the present invention. Any reference signs in the claims shall not be construed as limiting the involved claim.

Claims (6)

1. a kind of graphite jig cooling structure, including upper mold (6), lower die (7), waterway (13) and air cooling chamber (19), feature Be: the side of the lower die (7) is provided with bracket (12), and the top of bracket (12) is equipped with water pump (8), the water pump (8) side is provided with water inlet (11), and the other side of the water pump (8) is provided with water inlet pipe (9), and below water inlet pipe (9) Lower die (7) on be provided with outlet pipe (10), the top of the lower die (7) is provided with upper mold (6), and the side of upper mold (6) is set It is equipped with cold air and room (3) occurs, the inside that room (3) occur for the cold air is equipped with semiconductor chilling plate (5), and room occurs for cold air (3) side is provided with air inlet (4), and the air inlet (4) extends to the inside that room (3) occur for cold air, and the cold air occurs The other side of room (3) is provided with air inlet pipe (2), and the other side of the upper mold (6) is equipped with control panel (15), and control panel (15) inside is equipped with single-chip microcontroller (16), and the top of the internal bottom end of the lower die (7) and semiconductor chilling plate (5) inside is equal Even to be provided with heat release hole (1), the lower die (7) is internally provided with waterway (13), and the upper mold (6) is internally provided with gas Cold chamber (19), and top of air cooling chamber (19) inside and bottom end are evenly arranged with wind deflector (18), the air inlet pipe (2) is far from cold The side that room (3) occur for gas passes through the side wall of air cooling chamber (19) and extends to the inside of air cooling chamber (19), the air cooling chamber (19) Side far from air inlet pipe (2) is provided with escape pipe (17), and escape pipe (17) passes through cold air far from the side of air cooling chamber (19) The side wall of room (3) occurs and extends to the inside that room (3) occur for cold air, on the side wall of the waterway (13) and air cooling chamber (19) It is provided with spiral rubber column (20), the output end of the control panel (15) passes through conducting wire and the input terminal of single-chip microcontroller (16) electricity Property connection, the output end of the single-chip microcontroller (16) is electrically connected by conducting wire and the input terminal of air inlet (4), the single-chip microcontroller (16) output end is electrically connected by conducting wire and the input terminal of water pump (8).

2. a kind of graphite jig cooling structure according to claim 1, it is characterised in that: between the heat release hole (1) is in equal Away from distribution.

3. a kind of graphite jig cooling structure according to claim 1, it is characterised in that: the cold air occur room (3) with Upper mold constitutes weldedization structure between (6).

4. a kind of graphite jig cooling structure according to claim 1, it is characterised in that: the bracket (12) and lower die (7) disassembly mounting structure is constituted between.

5. a kind of graphite jig cooling structure according to claim 1, it is characterised in that: the inside of the waterway (13) It is evenly arranged with water cooling tube (14), the water inlet pipe (9) passes through side wall and the extension of waterway (13) far from the side of water pump (8) It is connect to the inside of waterway (13) with one end of water cooling tube (14), the other end of the outlet pipe (10) and water cooling tube (14) connects It connects, the water cooling tube (14) is in serpentine.

6. a kind of graphite jig cooling structure according to claim 1, it is characterised in that: the spiral rubber column (20) is in Helical form.