CN210089471U - Efficient micro heat exchanger - Google Patents
Efficient micro heat exchanger Download PDFInfo
- Publication number
- CN210089471U CN210089471U CN201920628667.4U CN201920628667U CN210089471U CN 210089471 U CN210089471 U CN 210089471U CN 201920628667 U CN201920628667 U CN 201920628667U CN 210089471 U CN210089471 U CN 210089471U
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- metal
- metal shell
- heat exchanger
- micro heat
- cooling liquid
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Abstract
The utility model discloses a high-efficiency micro heat exchanger, which comprises a hollow metal shell (4) with an opening at the top; a plurality of heat exchange fins (3) which are vertically distributed are uniformly distributed on the inner side surface of the bottom of the metal shell (4); at least three metal baffles (1) which are longitudinally distributed are vertically arranged on the inner side surface of the bottom of the metal shell (4); any two adjacent metal baffles (1) are respectively connected with the inner side surfaces of the front end and the rear end of the metal shell (4) and are not positioned on the same side; the top of the metal shell (4) is provided with a metal upper cover (5); cooling liquid is injected into the metal shell (4); the center of the metal upper cover (5) is provided with a groove (8) with an upward opening; the groove (8) is used for embedding and placing electronic elements needing heat dissipation. The utility model discloses a micro heat exchanger, its form that adopts array distribution heat transfer fin can improve the heat exchange efficiency to electronic component effectively to extension electronic component's life.
Description
Technical Field
The utility model relates to a heat exchanger technical field especially relates to an efficient micro heat exchanger.
Background
At present, with continuous advancement and development of science and technology, the technology in the field of chips is more mature, the integration level of circuits is higher, the packaging quantity in unit volume is increased continuously, and the heat accumulation phenomenon is serious. Meanwhile, the operation amount is increased exponentially, the operation speed is also increased dramatically, and the heat quantity of each chip is also increased greatly, which provides greater challenges for the heat dissipation technology of microelectronic devices.
The service efficiency and the service life of the microelectronic element are particularly closely related to the temperature of the microelectronic element, and the failure of the electronic equipment is mostly caused by the fact that the temperature of the electronic element exceeds an acceptable range. Resulting in reduced efficiency of use, shortened service life, increased maintenance costs, and increased time costs. If the heat is not removed well, the daily work efficiency will be seriously affected, and even the development of the microelectronic industry will be hindered. Therefore, the problem of heat dissipation in the microelectronic industry is urgently solved.
SUMMERY OF THE UTILITY MODEL
In view of this, the present invention provides a high-efficiency micro heat exchanger, which is suitable for the problems of the prior art. The heat exchange efficiency of the electronic element can be effectively improved, so that the service life of the electronic element is prolonged, the popularization and the application are facilitated, and the heat exchange device has great production practice significance.
Therefore, the utility model provides an efficient micro heat exchanger, which comprises a hollow metal shell with an opening at the top;
a plurality of heat exchange fins which are vertically distributed are uniformly distributed on the inner side surface of the bottom of the metal shell;
at least three metal baffles which are longitudinally distributed are also vertically arranged on the inner side surface of the bottom of the metal shell;
any two adjacent metal baffles are respectively connected with the inner side surfaces of the front end and the rear end of the metal shell and are not positioned on the same side;
the top of the metal shell is provided with a metal upper cover;
cooling liquid is injected into the metal shell;
the center of the metal upper cover is provided with a groove with an upward opening;
the groove is used for embedding and placing electronic elements needing heat dissipation.
Wherein, the groove has a reserved gap after the electronic element is placed;
and heat-conducting silicone grease is coated in the reserved gap.
Wherein, the longitudinal length of the metal baffle is shorter than the longitudinal length of the inner cavity of the metal shell.
The bottom of the heat exchange fin and the inner side surface of the bottom of the metal shell are welded together or are integrally formed with the metal shell;
the bottom of the metal baffle is welded with the inner side surface of the bottom of the metal shell or integrally formed with the metal shell;
the metal upper cover is welded with the top of the peripheral edge of the metal shell.
The left end and the right end of the front surface of the metal shell are respectively provided with a cooling liquid inlet interface and a cooling liquid outlet interface;
and the cooling liquid inlet interface and the cooling liquid outlet interface are communicated with the inner space of the metal shell.
The cooling liquid inlet interface and the cooling liquid outlet interface are respectively communicated with a liquid outlet and a liquid inlet of an external cooling pump through hollow connecting pipelines;
the connecting pipeline is pre-filled with cooling liquid.
Wherein, the cooling liquid inlet interface and the cooling liquid outlet interface are pagoda interfaces.
The cooling liquid inlet interface and the cooling liquid outlet interface are connected with the front surface of the metal shell in a threaded connection or welding mode.
The heat exchange fins are distributed on the inner side surface of the bottom of the metal shell in a rectangular array;
the cross section of the heat exchange fin is rectangular, circular or triangular.
By above the utility model provides a technical scheme is visible, compares with prior art, the utility model provides an efficient micro heat exchanger, its form that adopts array distribution heat transfer fin can improve the heat exchange efficiency to electronic component effectively to extension electronic component's life is favorable to popularizing and applying, has the meaning of great production practice.
Furthermore, it is right the utility model provides a miniature heat exchanger of efficient, it can pass through the coolant liquid, takes the heat out, further guarantees the radiating effect to electronic component.
Drawings
Fig. 1 is an exploded schematic view of a three-dimensional structure of an efficient micro heat exchanger provided by the present invention;
fig. 2 is a schematic top view of the high-efficiency micro heat exchanger provided by the present invention;
fig. 3 is a schematic diagram of a high-efficiency micro heat exchanger after a transverse cross-sectional view according to the present invention;
in the figure: 1 is a metal baffle, 2 is a bolt hole, 3 is a heat exchange fin, 4 is a metal shell, and 5 is a metal upper cover;
6 is a cooling liquid inlet interface, 7 is a cooling liquid outlet interface, and 8 is a groove
Detailed Description
In order to make the technical field of the present invention better understand, the present invention is further described in detail with reference to the accompanying drawings and embodiments.
Referring to fig. 1 to 3, the present invention provides a high efficiency micro heat exchanger, which includes a hollow metal shell 4 with an open top;
a plurality of heat exchange fins 3 which are vertically distributed are uniformly distributed on the inner side surface of the bottom of the metal shell 4;
at least three longitudinally distributed metal baffles 1 are vertically arranged on the inner side surface of the bottom of the metal shell 4;
any two adjacent metal baffles 1 are respectively connected with the inner side surfaces of the front end and the rear end of the metal shell 4 and are not positioned on the same side;
the top of the metal shell 4 is provided with a metal upper cover 5;
cooling liquid is injected into the metal shell 4;
the center of the metal upper cover 5 is provided with a groove 8 with an upward opening;
the groove 8 is used for embedding and placing electronic elements (for example, a chip of a computer host, a chip of a large-scale data room and a semiconductor refrigeration piece, for example, a Central Processing Unit (CPU) chip) which need heat dissipation.
Note that the bottom surface of the electronic component is in contact with the top surface of the recess 8.
The utility model discloses in, on specifically realizing, recess 8 can design according to the radiating electronic component size of actual need, makes in embedding recess 8 that electronic component can be just good, and recess 8's size slightly is greater than electronic radiating element's size.
It should be noted that the specific size of the micro heat exchanger of the present invention can be adjusted appropriately according to the size of the electronic component requiring heat dissipation.
In particular, the groove 8 has a reserved gap after the electronic element is placed;
in this clearance of reserving, scribble heat conduction silicone grease or other heat conduction materials, heat conduction silicone grease or other heat conduction materials not only can heat conduction, still have the fixed function of bonding, consequently, can strengthen electronic component with the utility model discloses a heat transfer between the micro heat exchanger (specifically be metal casing 4 and metal upper cover 5).
The utility model discloses in, in the concrete realization, the longitudinal length of metal baffle 1, the weak point is in the longitudinal length of 4 inner chambers of metal casing.
In the utility model, the bottom of the heat exchange fin 3 is welded with the inner side surface of the bottom of the metal shell 4, or is integrally formed with the metal shell 4;
in particular, the bottom of the metal baffle plate 1 and the inner side surface of the bottom of the metal shell 4 are welded together, or are integrally formed with the metal shell 4;
in the concrete implementation, the metal upper cover 5 is welded with the top of the peripheral edge of the metal shell 4.
In the utility model, the right and left ends of the front surface of the metal shell 4 are respectively provided with a cooling liquid inlet interface 6 and a cooling liquid outlet interface 7;
and a cooling liquid inlet port 6 and a cooling liquid outlet port 7 which are communicated with the inner space of the metal shell 4.
In particular, the cooling liquid inlet interface 6 and the cooling liquid outlet interface 7 are respectively communicated with a liquid outlet and a liquid inlet of an external cooling pump (such as a water pump) through hollow connecting pipelines;
the connecting pipeline is pre-filled with cooling liquid.
It should be noted that the cooling liquid may be water, an ethanol solution or other liquid with low viscosity, high specific heat capacity and good thermal conductivity, so that the heat exchange efficiency between the cooling liquid and the electronic component requiring heat dissipation can be enhanced, and the energy for driving the cooling liquid to flow is also reduced.
In the concrete implementation, the connecting pipeline is also connected with a radiator in series so as to conveniently carry out heat dissipation treatment on the cooling liquid in the connecting pipeline. The mounting technology of the heat sink is the prior art and is not described herein.
It should be noted that, in the present invention, the external cooling pump (for example, a water pump) is used to provide circulating power for the cooling liquid in the metal shell 4 and the connecting pipeline, so as to ensure that the cooling liquid can flow in the metal shell 4 and the connecting pipeline, and to control the flow speed of the cooling liquid.
In particular, the cooling liquid inlet interface 6 and the cooling liquid outlet interface 7 are pagoda interfaces.
In the concrete implementation, the connection mode between the cooling liquid inlet interface 6 and the cooling liquid outlet interface 7 and the front surface of the metal shell 4 is threaded connection or welding. Therefore, the cooling liquid inlet interface 6 and the cooling liquid outlet interface 7 can be better connected with an external pipeline and are not easy to disconnect.
The utility model discloses in, on specifically realizing, a plurality of heat transfer fins 3 are the bottom medial surface that rectangular array distributes and sets up at metal casing 4.
To the utility model discloses, it is required to explain that the space inside metal casing 4 is divided into a plurality of regions by metal baffle 1 to two adjacent regions communicate each other. The concrete embodiment is as follows: the inner area (i.e., the inner space) of the metal shell 4 located around each metal baffle plate 1 has a U-shape.
Therefore, the liquid inflow port and the outflow port of the coolant are not on the same side of the region inside the metal shell 4 near each metal baffle 1. And in two adjacent areas, the flow channel of the fluid is U-shaped. The flow path of the flow channel can be changed according to the size of the micro radiator. The multi-flow channel is adopted, so that the time of the cooling liquid in the micro radiator can be prolonged, the heat transmitted to the micro heat exchanger by the electronic element can be better taken away by the cooling liquid, and the heat exchange efficiency between the micro heat exchanger and the electronic element is improved.
In the present invention, in the concrete implementation, the metal casing 4 is a rectangular parallelepiped.
The utility model discloses in, specifically realize, metal casing 4 and metal upper cover 5 adopt the metal material who has good heat conductivility, bearing capacity, heat-resisting ability and anticorrosive ability to make, for example can be copper or aluminium system.
It should be noted that the metal housing 4 may adopt different external dimensions according to the shape and size of the electronic component that actually needs to dissipate heat.
In the concrete implementation, the heat exchange fins 3 are made of the same material as the shell 4, and the heat exchange fins 3 are vertically arranged on the inner side surface of the bottom of the metal shell 4 (namely, the largest plane of the micro heat exchanger).
The upper and lower ends of the heat exchange fins 3 are connected with the largest plane of the micro heat exchanger (specifically including the bottom surface of the metal upper cover 5 and the inner side surface of the bottom of the metal shell 4).
In particular, the cross section of the heat exchange fins 3 is rectangular, circular or triangular.
In the concrete realization, the top of the heat exchange fin 3 is contacted with the bottom surface of the metal upper cover 5.
The utility model discloses in, on specifically realizing, the welding has the bolt hole 2 that is used for fixed micro heat exchanger in the middle part of the bottom left and right sides of metal casing 4.
According to the technical scheme provided by the utility model, it can overcome prior art's is not enough, provides a heat exchanger technical scheme efficient, that the heat is recoverable, the size is suitable, adaptability is good for the microelectronics trade, has solved the inefficiency problem of current heat exchanger.
In order to understand the technical solution of the present invention more clearly, the following description is about the working process of the present invention.
First, the coolant enters the interior of the metal housing 4 in the micro heat exchanger through the coolant inlet port 6.
Next, the cooling liquid takes away heat generated by the electronic components in the metal housing 4, specifically: the heat of the electronic element is transferred to the micro heat exchanger through the heat conduction material (such as heat conduction silicone grease) between the electronic element and the micro heat exchanger due to high power and long-time operation.
Finally, the coolant carries the heat generated by the electronic components, and flows out from the coolant outlet.
Therefore, compared with the prior art, the utility model provides an efficient micro heat exchanger, it has following beneficial effect:
1. the method of the built-in heat exchange fins is adopted for heat exchange, the dust removal efficiency is high, the heat exchanger is small in size, and the defects of low efficiency and large size of the traditional heat exchanger are overcome.
2. The sealed liquid heat exchange is adopted, so that the heat exchange efficiency is enhanced, the cooling liquid can be utilized to take heat out of the electronic equipment, and the heat exchange effect on the electronic element is ensured.
3. The metal upper cover with the groove is adopted, so that the electronic element can be well wrapped, the heat exchanger is in closer contact with micro heat exchange, and most of heat is taken out by the cooling liquid. The heat release in the narrow space of electronic equipment is reduced, reduces the temperature of whole electronic equipment inner chamber. The electronic equipment is operated under the optimal state.
To sum up, compare with prior art, the utility model provides a pair of efficient micro heat exchanger, its form that adopts array distribution heat transfer fin can improve the heat exchange efficiency to electronic component effectively to extension electronic component's life is favorable to popularizing and applying, has the significance of great production practice.
Furthermore, it is right the utility model provides a miniature heat exchanger of efficient, it can pass through the coolant liquid, takes the heat out, further guarantees the radiating effect to electronic component.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.
Claims (9)
1. A high efficiency micro heat exchanger, characterized by comprising an open-topped, hollow metal housing (4);
a plurality of heat exchange fins (3) which are vertically distributed are uniformly distributed on the inner side surface of the bottom of the metal shell (4);
at least three metal baffles (1) which are longitudinally distributed are vertically arranged on the inner side surface of the bottom of the metal shell (4);
any two adjacent metal baffles (1) are respectively connected with the inner side surfaces of the front end and the rear end of the metal shell (4) and are not positioned on the same side;
the top of the metal shell (4) is provided with a metal upper cover (5);
cooling liquid is injected into the metal shell (4);
the center of the metal upper cover (5) is provided with a groove (8) with an upward opening;
the groove (8) is used for embedding and placing electronic elements needing heat dissipation.
2. The high efficiency micro heat exchanger as claimed in claim 1, wherein the groove (8) has a predetermined clearance after placing the electronic components;
and heat-conducting silicone grease is coated in the reserved gap.
3. The high efficiency micro heat exchanger as claimed in claim 1, wherein the longitudinal length of the metal baffle (1) is shorter than the longitudinal length of the inner cavity of the metal housing (4).
4. The high-efficiency micro heat exchanger as claimed in claim 1, wherein the bottom of the heat exchange fin (3) is welded with the inner side surface of the bottom of the metal shell (4) or is integrally formed with the metal shell (4);
the bottom of the metal baffle (1) and the inner side surface of the bottom of the metal shell (4) are welded together or integrally formed with the metal shell (4);
the metal upper cover (5) is welded with the top of the peripheral edge of the metal shell (4).
5. The high efficiency micro heat exchanger as claimed in claim 1, wherein the metal casing (4) has a coolant inlet port (6) and a coolant outlet port (7) at the right and left ends of the front surface thereof, respectively;
and the cooling liquid inlet interface (6) and the cooling liquid outlet interface (7) are communicated with the inner space of the metal shell (4).
6. The high efficiency micro heat exchanger as claimed in claim 5, wherein the cooling fluid inlet port (6) and the cooling fluid outlet port (7) are respectively connected to a fluid outlet and a fluid inlet of an external cooling pump through hollow connecting pipes;
the connecting pipeline is pre-filled with cooling liquid.
7. The high efficiency micro heat exchanger as claimed in claim 5, wherein the coolant inlet port (6) and the coolant outlet port (7) are both pagoda ports.
8. The high efficiency micro heat exchanger according to any of claims 5 to 7, wherein the coolant inlet port (6) and the coolant outlet port (7) are connected to the front side of the metal housing (4) by means of a screw connection or a welding connection.
9. The high efficiency micro heat exchanger according to any of claims 1 to 7, wherein a plurality of heat exchange fins (3) are distributed in a rectangular array on the inner side of the bottom of the metal shell (4);
the cross section of the heat exchange fin (3) is rectangular, circular or triangular.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920628667.4U CN210089471U (en) | 2019-05-05 | 2019-05-05 | Efficient micro heat exchanger |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920628667.4U CN210089471U (en) | 2019-05-05 | 2019-05-05 | Efficient micro heat exchanger |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210089471U true CN210089471U (en) | 2020-02-18 |
Family
ID=69477198
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920628667.4U Expired - Fee Related CN210089471U (en) | 2019-05-05 | 2019-05-05 | Efficient micro heat exchanger |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210089471U (en) |
-
2019
- 2019-05-05 CN CN201920628667.4U patent/CN210089471U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200218 Termination date: 20210505 |
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| CF01 | Termination of patent right due to non-payment of annual fee |