CN105333759A - Etching temperature uniformization board - Google Patents
Etching temperature uniformization board Download PDFInfo
- Publication number
- CN105333759A CN105333759A CN201410383377.XA CN201410383377A CN105333759A CN 105333759 A CN105333759 A CN 105333759A CN 201410383377 A CN201410383377 A CN 201410383377A CN 105333759 A CN105333759 A CN 105333759A
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- plate
- temperature
- uniforming
- etched area
- plate body
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Abstract
The invention provides a temperature uniformization board for electronic products. An etching temperature uniformization board comprises two board bodies which are combined. The inner side faces of the board bodies are each provided with an etching region in an etching manner. Each etching region is recessed and multiple channels are densely formed in each etching region. Working fluid is contained in the channels. When any position of the etching temperature uniformization board is heated, the working fluid of the heated position will evaporate and become gas, and the working fluid in the position not heated directly is still liquid, so that different steam pressures are generated at the two positions, and the working fluid can flow in the channels of the etching regions; and heat is transmitted through gas-liquid conversion and flowing of the working fluid, the speed of heat transmission of the working fluid is far higher than that of heat conduction of a material, and thus the heat conducting speed is increased.
Description
Technical field
The present invention relates to a kind of heat-transfer device of electronic product, the temperature-uniforming plate of espespecially a kind of computer, communication products.
Background technology
In the electronic product of prior art, the heat come out in order to avoid the various element such as processor or backlight module is concentrated and is caused temperature too high, feels under the weather, therefore often arrange temperature-uniforming plate by hot Transmit evenly when causing user to touch; And the temperature-uniforming plate of prior art is a sheet metal, temperature-uniforming plate is close to side part contact thermal source, and make the heat trnasfer of thermal source on whole temperature-uniforming plate by the high thermal conduction characteristic of metal material, and be delivered to whole electronic installation by temperature-uniforming plate again, produce uncomfortable during the heat of thermal source is evenly transmitted and avoids user to touch.
But along with the development of science and technology, in existing electronic product, the heat that its element such as processor or backlight module comes out gets more and more, but the temperature-uniforming plate of prior art is by means of only the heat-transfer rate of own material heat conduction, be not enough to deal with the elements such as novel processor or backlight module, therefore the temperature-uniforming plate of prior art needs to be improved.
Summary of the invention
Because the shortcoming of aforesaid prior art and deficiency, the invention provides a kind of etching temperature-uniforming plate, it effectively can promote the speed of heat conduction.
For reaching above-mentioned goal of the invention, the technology used in the present invention means are a kind of etching of design temperature-uniforming plate, and wherein comprise two plate bodys be combined with each other, each plate body includes a medial surface and a lateral surface; The medial surface of each plate body is provided with an etched area with etching mode, and etched area is recessed and be covered with multiple passage, the interlaced setting of these passages, and forms capillary structure, is provided with working fluid in these passages.
The invention has the advantages that, by the medial surface at two plate bodys, multiple staggered passage is set respectively, and be provided with working fluid in these passages, therefore when arbitrary place of the present invention is heated, the working fluid at the place of being heated just can flash to gaseous state, and the working fluid at the place that is not directly heated is still for liquid, therefore two places produce different steam pressures, cause gaseous working fluid (high temperature place) for mobile toward gaseous working fluid (low temperature place), and in the process of gaseous working fluid movement in the passage of etched area, heat can be distributed to plate body everywhere simultaneously, to the last be cooled to liquid state, at this moment these passages can produce capillary pressure effect, make the working fluid of liquefy flow back to the place of being heated and again receive heat and evaporation, the present invention carrys out transferring heat by the liquid gas shift of working fluid and flowing, and working fluid moves fast next far beyond material self heat conduction of the speed of heat, and then reaches the object of lifting heat-transfer rate.
Accompanying drawing explanation
Fig. 1 is stereo appearance figure of the present invention.
Fig. 2 is element exploded view of the present invention.
Fig. 3 is the top view of a wherein plate body of the present invention.
Fig. 4 is the enlarged diagram at the wherein junction surface of a plate body of the present invention.
Fig. 5 is side cutaway view of the present invention.
Fig. 6 is the top view of a wherein plate body of another embodiment of the present invention.
Fig. 7 is the side cutaway view of another embodiment of the present invention.
Fig. 8 is the side cutaway view of one more embodiment of the present invention.
10 plate body 11 medial surfaces
12 lateral surface 13 accommodation spaces
14 solder annular groove 20 etched area
21 passage 22 junction surfaces
221 inner groove 222 outer grooves
223 cross recess 30 fasteners
40 solders
10A plate body 20A etched area
10B plate body 11B medial surface
13B accommodation space 22B junction surface
30B fastener
10C plate body 11C medial surface
21C passage 22C junction surface
Detailed description of the invention
With the following drawings and preferred embodiments of the present invention, the technological means that the present invention takes for reaching predetermined goal of the invention is set forth further.
Refer to shown in Fig. 1 to Fig. 3, etching temperature-uniforming plate of the present invention includes two plate bodys 10 be combined with each other, and in the present embodiment, plate body 10 is about slightly square, but not as limit, also can be other shapes; Each plate body 10 includes medial surface 11 and a lateral surface 12, the medial surface 11 of each plate body 10 is provided with an etched area 20 with etching mode, in the present embodiment, the shape of etched area 20 is identical with the shape of plate body 10, and the border of etched area 20 adjoins the periphery of plate body 10, therefore etched area 20 occupies most of area of plate body 10, but not as limit; Refer to shown in Fig. 6, the shape of etched area 20A also visual various demand and completely different from the shape of plate body 10A.
Refer to shown in Fig. 3 and Fig. 4, the etched area 20 of plate body 10 is recessed and be covered with multiple passage 21, the interlaced setting of these passages 21, and form capillary structure, in the present embodiment, these 21 one-tenth, passage proper alignment are arranged, and mutual vertical interlaced (as shown in Figure 3), and parallel with the corresponding side of plate body 10, but not as limit, these passages also can the figure such as interlaced diamondwise, or even these passages can be irregular alignment.
Be provided with working fluid in these passages 21 of etched area 20, in the present embodiment, working fluid can be water or refrigerant, but also not to be limited both this.
Refer to shown in Fig. 4 and Fig. 5, in the present embodiment, multiple junction surface 22 is provided with further in etched area 20, each junction surface 22 is provided with mutually sheathed inner groove 221 and an outer groove 222, in the present embodiment, inner groove 221 and outer groove 222 are all square groove, but not as limit, also can be circular groove etc.; Be provided with a cross recess 223 in inner groove 221, four ends of cross recess 223 are connected with inner groove 221; Each junction surface 22 of two plate bodys 10 is all installed with a fastener 30, fastener 30 is a cylinder, and be welded on inner groove 221 and cross recess 223, inner groove 221 and cross recess 223 can hold the solder of fastener 30, and then the combination of strengthening junction surface 22 and fastener 30, and outer groove 222 can avoid the solder of fastener 30 accidentally to flow out junction surface 22 and passage 21.
In the present embodiment, the etched area 20 of each plate body 10 is formed in the mode of exposure imaging, but also not as limit, also can be formed by other etching mode.
Refer to shown in Fig. 2 and Fig. 5, shape, the size and location of the etched area 20 of two plate bodys 10 are corresponding, namely two plate bodys 10 in conjunction with time, the justified margin of two etched area 20, and also align mutually in passage 21 in etched area 20 and junction surface 22, two plate bodys 10 in conjunction with time, fastener 30 on the corresponding junction surface 22 of two plate bodys 10 mutually against, and therefore make between the medial surface 11 of two plate bodys 10, to be formed with an accommodation space 13 (as shown in Figure 5), the passage 21 of the etched area 20 of two plate bodys 10 is connected by accommodation space 13.
The medial surface 11 of each plate body 10 adjoins peripheral region, and along periphery ring around being arranged with a solder annular groove 14, solder annular groove 14 is between the periphery and etched area 20 of plate body 10; Two plate bodys 10 in conjunction with time, be first coated with one circle solder 40 in the solder annular groove 14 of the wherein plate body 10 kept flat, then another plate body 10 is compressed on coating solder 40 plate body 10 on, and the solder annular groove 14 of the plate body 10 of top also simultaneously hold solder 40; Then heat at least one plate body 10 corresponding solder 40 part until solder 40 melts, finally when solder 40 cooled and solidified, two plate bodys 10 just firmly combine fixing by solder 40; And hold solder 40 by arranging solder annular groove 14, move everywhere after melting so that solder 40 can be avoided and infilter etched area 20 or overflow outside the edge of two plate bodys 10; In addition, after solder 40 cooled and solidified becomes a round, working fluid more can be effectively avoided to flow out outside two plate bodys 10.
In other embodiments, a wherein plate body also only can be had to have solder annular groove, the object infiltering etched area after avoiding solder fusing or overflow outside two plate bodys can be reached so equally.
In other embodiments, two plate bodys also can otherwise combine, and the such as direct edge ring boxing in two plate bodys connects circle etc., so equally can firmly in conjunction with two plate bodys and avoid working fluid to flow out.
Refer to shown in Fig. 3 and Fig. 5, when the present invention uses, when arbitrary place of the present invention is heated, the working fluid at the place of being heated is because evaporating by heat into gaseous state, and the working fluid at the place that is not directly heated is still for liquid, therefore two places produce different steam pressures, and and then cause the gaseous working fluid at high temperature place for moving toward the low temperature place of gaseous working fluid, and in the process of gaseous working fluid movement in the passage 21 of etched area 20, heat can be distributed to plate body 10 everywhere simultaneously, to the last be cooled to liquid state, at this moment the capillary structure that these passages 21 are formed can produce capillary pressure effect, the working fluid of liquefy is flow back into be heated to sentence and again receive heat and evaporation.
The present invention carrys out transferring heat by the liquid gas shift of working fluid and flowing, and and then effectively promotes heat-transfer rate.
In other embodiments, fastener can not be also cylinder, and is the solder solidified, and namely directly makes solder form projection on junction surface, so also can reach the object making to form accommodation space between the medial surface of two plate bodys.
Refer to shown in Fig. 7, in other embodiments, also only can have on the junction surface 22B of a wherein plate body 10B and be installed with fastener 30B, these fasteners 30B is then directly resisted against the corresponding junction surface 22B of another plate body 10B, can make the accommodation space 13B being formed with a relative narrower between the medial surface 11B of two plate body 10B thus.
Refer to shown in Fig. 8, in other embodiments, plate body 10C also can not be provided with junction surface 22C and fastener, and the medial surface 11C of two plate body 10C directly fits, and the passage 21C of the etched area of two plate body 10C is directly connected.
In other embodiments, also can include the filler that can produce capillary structure further, it is filled in the accommodation space between two plate bodys, and then the heat conduction of working fluid can be made more quick.
In other embodiments, the passage of the channel region of each plate body also to etch formation, and can not change into under type.
One, formed with metal sand body sintering, the hole of the sintered rear formation of metal sand body is passage, and can produce capillary pressure effect equally.
They are two years old, be provided with the webbed multiple wire harness of braiding in channel region, these wire harness are incorporated on plate body with sintering or other modes, and each wire harness itself just has multiple hole, these holes just can be used as the passage of channel region, and have the effect producing capillary pressure effect equally.
They are three years old, multiple wire harness bar is provided with in channel region, these wire harness bars are incorporated on plate body with sintering or other modes, these wire harness bar parallel interval spread configurations, each wire harness bar is that multiple wire harness is entwined, multiple holes that space between wire harness and each wire harness are formed, all can be used as the passage of channel region, and have the effect producing capillary pressure effect equally.
The above is only preferred embodiment of the present invention, not any pro forma restriction is done to the present invention, although the present invention discloses as above with preferred embodiment, but and be not used to limit the present invention, technical staff in any art, not departing from the scope of technical solution of the present invention, make a little change when the technology contents of above-mentioned announcement can be utilized or be modified to the Equivalent embodiments of equivalent variations, in every case be the content not departing from technical solution of the present invention, according to any simple modification that technical spirit of the present invention is done above embodiment, equivalent variations and modification, all still belong in the scope of technical solution of the present invention.
Claims (10)
1. etch a temperature-uniforming plate, it is characterized in that, this etching temperature-uniforming plate comprises two plate bodys be combined with each other, and each plate body includes a medial surface and a lateral surface; The medial surface of each plate body is provided with an etched area with etching mode, and etched area is recessed and be covered with multiple passage, the interlaced setting of described passage, and forms capillary structure, is provided with working fluid in described passage.
2. etch temperature-uniforming plate as claimed in claim 1, it is characterized in that, the medial surface of two plate bodys fits, and the passage of the etched area of two plate bodys is directly connected.
3. etch temperature-uniforming plate as claimed in claim 1, it is characterized in that, be formed with an accommodation space between the medial surface of two plate bodys, the passage of the etched area of two plate bodys is connected by accommodation space.
4. etch temperature-uniforming plate as claimed in claim 3, it is characterized in that, this etching temperature-uniforming plate includes capillary structure filler further, and it is filled in the accommodation space between two plate bodys.
5. etch temperature-uniforming plate as claimed in claim 3, it is characterized in that,
Multiple junction surface is provided with in the etched area of each plate body;
This etching temperature-uniforming plate includes multiple fastener further, and described fastener is fixedly arranged on the junction surface of a wherein plate body, and is resisted against the junction surface of another plate body.
6. etch temperature-uniforming plate as claimed in claim 3, it is characterized in that,
Multiple junction surface is provided with in the etched area of each plate body;
This etching temperature-uniforming plate includes multiple fastener further, and described fastener is fixedly arranged on the junction surface of two plate bodys respectively, the fastener on two plate bodys mutually against.
7. the etching temperature-uniforming plate as described in claim 5 or 6, is characterized in that, each fastener is a cylinder, and is welded and fixed with corresponding junction surface.
8. the etching temperature-uniforming plate according to any one of claim 1 to 6, is characterized in that, shape, the size and location of the etched area of two plate bodys are corresponding.
9. the etching temperature-uniforming plate according to any one of claim 1 to 6, is characterized in that, the medial surface of each plate body adjoins peripheral region, and along periphery ring around being arranged with a solder annular groove, solder annular groove is between the periphery and etched area of plate body; Be provided with solder in the solder annular groove of two plate bodys, and two plate bodys are fixed with the mutual welding of solder of fusing.
10. the etching temperature-uniforming plate according to any one of claim 1 to 6, is characterized in that, the etched area of each plate body is formed in the mode of exposure imaging.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410383377.XA CN105333759A (en) | 2014-08-06 | 2014-08-06 | Etching temperature uniformization board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410383377.XA CN105333759A (en) | 2014-08-06 | 2014-08-06 | Etching temperature uniformization board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105333759A true CN105333759A (en) | 2016-02-17 |
Family
ID=55284421
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410383377.XA Pending CN105333759A (en) | 2014-08-06 | 2014-08-06 | Etching temperature uniformization board |
Country Status (1)
| Country | Link |
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| CN (1) | CN105333759A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI645152B (en) * | 2017-11-24 | 2018-12-21 | 泰碩電子股份有限公司 | Manufacturing method of temperature-free plate without degassing tube |
| CN110139539A (en) * | 2019-05-27 | 2019-08-16 | 天津大学 | It is a kind of for microwave from the self assembly microchannel structural design and implementation method of package platforms |
| CN110602920A (en) * | 2018-06-30 | 2019-12-20 | 中航光电科技股份有限公司 | Cold plate and method for producing a cold plate |
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| CN2774091Y (en) * | 2005-01-06 | 2006-04-19 | 珍通科技股份有限公司 | Supporter structure of soaking plate |
| US20100139893A1 (en) * | 2008-12-10 | 2010-06-10 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat spreader with vapor chamber |
| CN102175088A (en) * | 2011-03-16 | 2011-09-07 | 大连理工大学 | Silica-based unequal-width microchannel flat heat pipe and manufacture method thereof |
| CN102623421A (en) * | 2011-01-26 | 2012-08-01 | 奇鋐科技股份有限公司 | Micro temperature-uniforming plate structure |
| US20120241133A1 (en) * | 2011-03-22 | 2012-09-27 | Foxconn Technology Co., Ltd. | Vapor chamber and method for manufacturing the same |
| CN202871787U (en) * | 2012-09-07 | 2013-04-10 | 浙江中博光电科技有限公司 | Structure with chip directly packaged on uniform temperature plate |
| CN202885617U (en) * | 2012-08-21 | 2013-04-17 | 邱威廉 | Temperature evenness plate provided with sealing structure |
| CN202974002U (en) * | 2012-11-28 | 2013-06-05 | 双鸿科技股份有限公司 | Ultra-thin uniform-temperature plate |
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Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2774091Y (en) * | 2005-01-06 | 2006-04-19 | 珍通科技股份有限公司 | Supporter structure of soaking plate |
| US20100139893A1 (en) * | 2008-12-10 | 2010-06-10 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat spreader with vapor chamber |
| CN102623421A (en) * | 2011-01-26 | 2012-08-01 | 奇鋐科技股份有限公司 | Micro temperature-uniforming plate structure |
| CN102175088A (en) * | 2011-03-16 | 2011-09-07 | 大连理工大学 | Silica-based unequal-width microchannel flat heat pipe and manufacture method thereof |
| US20120241133A1 (en) * | 2011-03-22 | 2012-09-27 | Foxconn Technology Co., Ltd. | Vapor chamber and method for manufacturing the same |
| CN202885617U (en) * | 2012-08-21 | 2013-04-17 | 邱威廉 | Temperature evenness plate provided with sealing structure |
| CN202871787U (en) * | 2012-09-07 | 2013-04-10 | 浙江中博光电科技有限公司 | Structure with chip directly packaged on uniform temperature plate |
| CN202974002U (en) * | 2012-11-28 | 2013-06-05 | 双鸿科技股份有限公司 | Ultra-thin uniform-temperature plate |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI645152B (en) * | 2017-11-24 | 2018-12-21 | 泰碩電子股份有限公司 | Manufacturing method of temperature-free plate without degassing tube |
| CN110602920A (en) * | 2018-06-30 | 2019-12-20 | 中航光电科技股份有限公司 | Cold plate and method for producing a cold plate |
| CN110139539A (en) * | 2019-05-27 | 2019-08-16 | 天津大学 | It is a kind of for microwave from the self assembly microchannel structural design and implementation method of package platforms |
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Application publication date: 20160217 |
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