CN102175088A - Silica-based unequal-width microchannel flat heat pipe and manufacture method thereof - Google Patents
Silica-based unequal-width microchannel flat heat pipe and manufacture method thereof Download PDFInfo
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- CN102175088A CN102175088A CN201110062316XA CN201110062316A CN102175088A CN 102175088 A CN102175088 A CN 102175088A CN 201110062316X A CN201110062316X A CN 201110062316XA CN 201110062316 A CN201110062316 A CN 201110062316A CN 102175088 A CN102175088 A CN 102175088A
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title claims abstract description 56
- 239000000377 silicon dioxide Substances 0.000 title claims abstract description 28
- 238000000034 method Methods 0.000 title claims abstract description 23
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 47
- 239000011521 glass Substances 0.000 claims abstract description 18
- 229910052710 silicon Inorganic materials 0.000 claims description 30
- 239000010703 silicon Substances 0.000 claims description 30
- 239000000758 substrate Substances 0.000 claims description 13
- 238000001259 photo etching Methods 0.000 claims description 8
- 238000002360 preparation method Methods 0.000 claims description 8
- 238000005260 corrosion Methods 0.000 claims description 6
- 230000007797 corrosion Effects 0.000 claims description 6
- 230000003647 oxidation Effects 0.000 claims description 5
- 238000007254 oxidation reaction Methods 0.000 claims description 5
- 235000012239 silicon dioxide Nutrition 0.000 claims description 5
- 239000000126 substance Substances 0.000 claims description 5
- 230000003628 erosive effect Effects 0.000 claims description 3
- 238000003631 wet chemical etching Methods 0.000 claims description 3
- 239000007788 liquid Substances 0.000 abstract description 34
- 238000012546 transfer Methods 0.000 abstract description 18
- 238000005516 engineering process Methods 0.000 abstract description 6
- 238000011049 filling Methods 0.000 abstract description 2
- 238000004806 packaging method and process Methods 0.000 abstract 1
- 230000005855 radiation Effects 0.000 abstract 1
- 230000003068 static effect Effects 0.000 abstract 1
- 239000003507 refrigerant Substances 0.000 description 11
- 238000011160 research Methods 0.000 description 9
- 230000005499 meniscus Effects 0.000 description 8
- 230000009467 reduction Effects 0.000 description 8
- 239000012530 fluid Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 238000010992 reflux Methods 0.000 description 5
- 230000008859 change Effects 0.000 description 4
- 238000013461 design Methods 0.000 description 4
- 238000011161 development Methods 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 238000009833 condensation Methods 0.000 description 3
- 230000005494 condensation Effects 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 230000004907 flux Effects 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000005213 imbibition Methods 0.000 description 2
- 230000009466 transformation Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000001174 ascending effect Effects 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000005459 micromachining Methods 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
- 239000011257 shell material Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
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- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a silica-based unequal-width microchannel flat heat pipe and a manufacture method thereof. By using a principle that liquid flows in a microchannel without a mechanical force under the action of surface tension and an MEMS (Micro Electro Mechanical System) technology, unequal-width rectangular or V-shaped microchannels with same cluster structures and continuously-changing widths are respectively etched on two rectangular silicon chips, rectangular glass sheets completely same with the silicon chips in sizes are etched to form hollow glass rings as steam cavities of flat heat pipes, and the glass rings and the upper and the lower silicon chips are packaged together to form the silica-based unequal-width microchannel flat heat pipe by adopting a static packaging method. Under the condition of smaller liquid filling rate, working liquid is accelerated to flow from a wide end to a narrow end through capillary pressure difference generated by liquid surface tension at two ends of an unequal-width microchannel, thus heat transfer efficiency is improved, capillary limit of the heat pipe is greatly improved, and heat transfer capacity of the heat pipe is increased; and the silica-based unequal-width microchannel flat heat pipe can be used in a heat-radiating system of a high heat-flow density chip for solving the heat radiation problem of a high-performance chip.
Description
Technical field
The invention belongs to the micro-channel flat plate heat pipe research field, particularly a kind ofly can utilize not wide micro-channel replace wide micro-channel, in order to the silica-based not wide micro-channel flat plate heat pipe and the preparation method of the heat-transfer capability that improves the capillary limit and flat-plate heat pipe.
Background technology
Micro-channel flat plate heat pipe is the result of the continuous miniaturization development of conventional heat pipe, in order to solve the problem that the electronic chip heat flow density increases day by day, receives much attention in scientific research and application.Micro-channel flat plate heat pipe is a kind of novel heat transfer element that conducts heat based on capillarity and Transformation Principle, and it is compared with traditional cooling system heat transfer type, have volume little, operate steadily, advantage such as efficient height, no mechanical power part.
Since the nineties in last century, the researcher has carried out a large amount of research to the heat transfer property of micro-channel flat plate heat pipe.Nineteen forty-four, R.S. Gaugler proposes gravity-type heat pipe, its basic functional principle is: heat pipe evaporator section is subjected to extraneous heating, heat is delivered to the vapour-liquid interface by thermotube wall and liquid refrigerant, make the evaporation of the liquid refrigerant on the vapour-liquid interface in the evaporator section, produce pressure reduction in the vapor chamber thereby make, steam flows to condensation segment by evaporator section under the effect of pressure reduction, and condenses on the vapour-liquid interface in condensation segment and discharge heat.Heat is passed to heat abstractor by liquid refrigerant and tube wall, and the liquid after condensing is back to evaporator section under the effect of gravity.So circulation is more than, realizes that heat is by the continuous transmission of heat pipe one end to an other end.Because the liquid refrigerant in the heat pipe is by phase transformation, gas flow transmission heat, thereby its coefficient of conductivity height, samming is effective.1963, the G.M. Grover of U.S. Los Alamos National Laboratory has invented the heat transfer element of this being called " heat pipe ", it has made full use of the Rapid Thermal hereditary property of heat-conduction principle and refrigeration filling, be delivered to rapidly outside the thermal source by the heat of heat pipe with thermal objects, its capacity of heat transmission surpasses known any metal.
Nineteen sixty-five, Cotter has proposed a whole set of heat pipe theory after opposite heat tube carries out a large amount of research, also become the basis of modern heat pipe theory.Along with the continuous development of heat pipe theory, heat pipe structure research is also changed to the capillary type by gravity-type gradually.Because it is machine-processed to adopt the capillarity of imbibition core to reflux as liquid, has broken away from the restriction of gravity, imbibition core heat pipe begins to be applied at aviation field.
Along with the integrated and microminiaturized development of electronic device, Cotter had proposed comparatively complete micro heat pipe theory in 1984, for theoretical foundation has been established in the research and the application of micro heat pipe.Change from large-scale heat pipe to micro heat pipe is not only the variation of appearance and size, the more important thing is the change of its structure.The planform of micro heat pipe and operation principle are similar to conventional heat pipe, and different is the capillary wick that the common existence of conventional inside heat pipe provides capillary force to reflux for working medium specially; Micro heat pipe then mainly relies on the capillarity in conduit wedge angle district to finish the backflow of working medium.Provide the capillary wick of capillary force because micro heat pipe has saved, reduced the size of system greatly, also reduced energy consumption and reagent dosage simultaneously for working medium refluxes.
After proposing the notion of micro heat pipe in the 5th international heat pipe meeting in 1984, the theory analysis and the experimental study of micro heat pipe have obtained significant progress from Cotter, and very big variation has also taken place corresponding micro heat pipe structure.Develop into from single micro heat pipe and to leave the fine raceway groove of cluster at solid substrate and form micro heat pipe array, improved the Heat Transfer of Heat Pipe on Heat Pipe ability greatly.After this, the microflute flat-plate heat pipe structure that vapor chamber interconnects has appearred again, reduced the interface friction force that reverse flow produced of the interior steam of heat pipe to liquid effectively, the maximal heat transfer amount of heat pipe is significantly improved, this micro-channel flat plate heat pipe becomes research focus in recent years.Along with the development of silicon micromachining technology, increasing micro heat pipe is matrix material with the silicon chip, makes raceway groove by various corrosion technologies or plasma etching technology.
1999, R. people such as Hopkins distributes to heat output, the axial temperature of copper-level board heat pipe under the different operating temperature of three kinds of axial channels and thermal resistance has been carried out theory and experimental study, finds that the capillary limit is limiting the heat transfer property of minitype flat plate hot pipe in the ordinary course of things.2008, people such as Jian Qu, Huiying Wu introduced micro-channel flat plate heat pipe to function surface, and this measure has changed the contact angle of liquid refrigerant and channel sidewalls, makes capillary pressure with the stepped distribution of contact angle.The introducing of function surface has increased the capillary pressure reduction of interior hot junction of conduit and cold junction, has improved the capillary limit, and the heat-transfer capability of flat-plate heat pipe is further strengthened.
In conducting heat research, dull and stereotyped micro heat pipe finds, the capillary limit is one of principal element of restriction adopting heat pipes for heat transfer performance, and influence the characteristic of cross sectional shape, liquid refrigerant of the factor of capillary force and micro-channel and directly related with compatibility of shell material etc., and the axial arrangement of micro-channel also influences the size of capillary force.The present invention proposes at improving the capillary force problem just.
Summary of the invention
The purpose of this invention is to provide a kind of silica-based not wide micro-channel flat plate heat pipe and preparation method,, improve the capillary limit of dull and stereotyped micro heat pipe, to strengthen the heat-transfer capability of dull and stereotyped micro heat pipe by improving the structure of micro-channel.Utilize the design of the not wide micro-channel flat plate heat pipe that the present invention proposes, be expected to improve the high heat flux heat dissipation problem that high-power microelectronic chip faces.
The technical scheme that adopts: a kind of silica-based not wide micro-channel flat plate heat pipe is provided, and the micro-channel in the described silica-based not wide micro-channel flat plate heat pipe is that a clustering architecture is identical, width continually varying micro-channel structure.
Wherein, described micro-channel is rectangle micro-channel or V-arrangement micro-channel.
Wherein, described silica-based not wide micro-channel flat plate heat pipe comprises: two have that a clustering architecture is identical, the silicon chip of width continually varying micro-channel structure, two described silicon chips are sealed by the method for electrostatic sealing-in, are combined into not wide micro-channel flat plate heat pipe.
Wherein, between described two silicon chips, be packaged with the glass ring substrate, form vapor chamber by photoetching and chemical corrosion method in the middle of the described glass ring substrate.
Wherein, described silicon chip surface forms the layer of silicon dioxide film by oxidation.
The present invention provides a kind of preparation method of silica-based not wide micro-channel flat plate heat pipe in addition, may further comprise the steps: the first step: adopt the method for photoetching and wet chemical etching technique, two silicon chip erosions are become to have a clustering architecture is identical, the silicon chip of width continually varying micro-channel structure; Second step: utilize the method for electrostatic sealing-in that two silicon chips are sealed, be combined into not wide micro-channel flat plate heat pipe.
Wherein, second step also comprised: utilize photoetching and chemical corrosion method, produce the glass ring substrate that the size centre identical with silicon chip has vapor chamber, the method of utilizing electrostatic sealing-in is sealed glass ring substrate and two silicon chips up and down, is combined into the not step of wide micro-channel flat plate heat pipe.
Wherein, also comprised before the first step: the rectangle silicon chip that two chip sizes are identical carries out oxidation, forms the step of layer of silicon dioxide film on the silicon chip surface.
Effect of the present invention and benefit are: owing to adopted not wide micro-channel structure, the meniscus curvature radius that makes the interior liquid refrigerant of conduit form under the effect of tension force no longer is a fixing value, take place vertically to change continuously and present, the meniscus curvature radius of sipes road end is greater than the meniscus curvature radius of narrow conduit end.Because the capillary pressure reduction of the hot junction-cold junction of micro-channel heat pipe is directly related with the meniscus radius of liquid refrigerant at the interface, the meniscus radius graded is big more, and capillary pressure reduction is just big more, and capillary pressure reduction is to cause the major impetus that liquid refluxes in the micro-channel.Therefore, the design of the not wide micro-channel flat plate heat pipe that the present invention proposes, further increased the meniscus radius graded vertically of liquid refrigerant on the structure, make and produce bigger barometric gradient in the liquid, thereby more helping liquid than conventional wide conduit refluxes, improve the capillary limit of flat-plate heat pipe, strengthened the heat-transfer capability of micro-hotplate.
Description of drawings
Fig. 1 is the not wide micro-channel structural representation of embodiment of the invention rectangle.
Fig. 2 is the not wide micro-channel structural representation of embodiment of the invention V-arrangement.
Fig. 3 is that the embodiment of the invention etches the not silicon chip cross-sectional view of wide micro-channel of rectangle.
Fig. 4 is that the embodiment of the invention etches the not silicon chip cross-sectional view of wide micro-channel of V-arrangement.
Fig. 5 is the silicon chip schematic diagram that the embodiment of the invention erodes away micro-channel.
Fig. 6 is an embodiment of the invention glass ring substrate structure schematic diagram.
Fig. 7 is an embodiment of the invention micro-hotplate electrostatic sealing-in structural representation.
Accompanying drawing sign: 1---sipes end Breadth Maximum; 2---sipes end liquid meniscus radius;
The narrow groove end of 3---minimum widith; The narrow groove end of 4---liquid meniscus radius;
5---liquid-soaked angle; The bottom subtended angle of 6---V shape groove;
7---carves the silicon chip surface that is decorated with the micro-channel structure; The narrow groove end of 8---micro-channel;
The 9---silicon chip; The sipes end of 10---micro-channel;
The 11---liquid refrigerant; The 12---micro-channel;
The 13---vapor chamber; 14---glass ring substrate.
The specific embodiment
The present invention is described in detail below in conjunction with drawings and Examples.
Silica-based not wide micro-channel flat plate micro heat pipe of the present invention, utilize liquid under capillary effect, in micro-channel, to produce the principle of no mechanical dynamic flow, on two silicon chips, etch not wide rectangle of a clustering architecture same widths continually varying or V-arrangement micro-channel (as shown in Figure 1 and Figure 2) respectively, under less liquid filled ratio situation, working fluid produces capillary pressure reduction by liquid level tension force and realizes leniently holding flowing of narrow end at the conduit two ends.It is characterized in that: the micro-channel structure that in flat-plate heat pipe, adopts width gradual change, make the working fluid internal pressure along the axial distributions in gradient of heat pipe, thereby it is poor to strengthen the fluid pressure inside, promotes fluid leniently to hold flowing of narrow end, realizes that fluid is by the backflow of heat pipe cold junction to the hot junction.The quant's sign that do not wait of micro-channel makes flat-plate heat pipe to work under less liquid filled ratio, its cold junction liquid level can be lower than the conduit top, steam is directly contacted with silicon chip, reduced the thermal resistance of steam and silicon chip heat exchange, improved the condensation limit and the heat transfer efficiency of flat-plate heat pipe.
The preparation method: at first, the rectangle silicon chip that two chip sizes are identical carries out oxidation, forms the layer of silicon dioxide film at silicon chip surface; Then, adopt the method for photoetching and wet chemical etching technique, silicon chip erosion is become the silicon chip to not wide micro-channel structure shown in Figure 5 as Fig. 3; After this, utilize photoetching and chemical corrosion method once more, produce the size glass ring substrate identical, as shown in Figure 6 with silicon chip; At last, the method for utilizing electrostatic sealing-in is sealed (as shown in Figure 7) with glass ring substrate and two silicon chips up and down, is combined into not wide micro-channel flat plate heat pipe.
Using method: the flat-plate heat pipe of the present invention's design in use, at first that sealing-in is good micro-hotplate vacuumizes, according to the depth-to-width ratio of micro heat pipe micro-channel and the memory space in the body thereof, inject an amount of liquid refrigerant then, micro-hotplate is sealed to use then.According to the axial dissymmetry of wide micro-channel not, narrow groove end is as the hot junction, and the sipes end is as cold junction.
Brief summary: the invention belongs to the flat-plate heat pipe research field, be applicable to the heat transfer of chip-scale high heat flux cooling system.The present invention utilizes liquid to produce the principle of no mechanical dynamic flow under capillary effect in micro-channel, adopt the MEMS technology, on two rectangle silicon chips, etch not wide rectangle of a clustering architecture same widths continually varying or V-arrangement micro-channel respectively, size and the identical rectangular glass sheet of silicon chip are etched into the vapor chamber of the glass ring of hollow as flat-plate heat pipe, the method of utilizing electrostatic sealing-in is sealed glass ring and two silicon chips up and down, produces silica-based not wide micro-channel flat plate heat pipe.Characteristics of the present invention are: the ascending continuous variation that passes through of the rectangle of etching or V-arrangement micro-channel on silicon chip, its width, two kinds of channel structure as shown in Figure 1.This kind structure is under less liquid filled ratio situation, and the capillary pressure reduction that working fluid produces at not wide conduit two ends by liquid level tension force, accelerating fluid are leniently held flowing of narrow end, thereby improves heat transfer efficiency.The not wide micro-channel flat plate micro heat pipe that this invents designed making can improve the capillary limit of heat pipe by a relatively large margin, thereby improve the Heat Transfer of Heat Pipe on Heat Pipe ability, is expected to be applied to the cooling system of high heat flux chip, to solve the heat dissipation problem of high performance chips.
Above content be in conjunction with optimal technical scheme to further describing that the present invention did, can not assert that the concrete enforcement of invention only limits to these explanations.Concerning the general technical staff of the technical field of the invention, under the prerequisite that does not break away from design of the present invention, can also make simple deduction and replacement, all should be considered as protection scope of the present invention.
Claims (8)
1. a silica-based not wide micro-channel flat plate heat pipe is characterized in that, the micro-channel (12) in the described silica-based not wide micro-channel flat plate heat pipe is that a clustering architecture is identical, width continually varying micro-channel structure.
2. silica-based not wide micro-channel flat plate heat pipe according to claim 1 is characterized in that described micro-channel (12) is rectangle micro-channel or V-arrangement micro-channel.
3. silica-based not wide micro-channel flat plate heat pipe according to claim 1 and 2, it is characterized in that, described silica-based not wide micro-channel flat plate heat pipe comprises: two have that a clustering architecture is identical, the silicon chip (9) of width continually varying micro-channel structure, two described silicon chips (9) are sealed by the method for electrostatic sealing-in, are combined into not wide micro-channel flat plate heat pipe.
4. silica-based not wide micro-channel flat plate heat pipe according to claim 3, it is characterized in that, between described two silicon chips (9), be packaged with glass ring substrate (14), form vapor chamber (13) by photoetching and chemical corrosion method in the middle of the described glass ring substrate (14).
5. silica-based not wide micro-channel flat plate heat pipe according to claim 3 is characterized in that,
Described silicon chip (9) surface forms the layer of silicon dioxide film by oxidation.
6. the preparation method of a silica-based not wide micro-channel flat plate heat pipe may further comprise the steps:
The first step: adopt the method for photoetching and wet chemical etching technique, two silicon chip erosions are become to have a clustering architecture is identical, the silicon chip (9) of width continually varying micro-channel structure;
Second step: utilize the method for electrostatic sealing-in that two silicon chips (9) are sealed, be combined into not wide micro-channel flat plate heat pipe.
7. the preparation method of silica-based not wide micro-channel flat plate heat pipe according to claim 6, it is characterized in that, second step also comprised: utilize photoetching and chemical corrosion method, produce the glass ring substrate (14) that the size centre identical with silicon chip (9) has vapor chamber (13), the method of utilizing electrostatic sealing-in is sealed glass ring substrate (14) and two silicon chips (9) up and down, is combined into the not step of wide micro-channel flat plate heat pipe.
8. the preparation method of silica-based not wide micro-channel flat plate heat pipe according to claim 6, it is characterized in that, also comprised before the first step: the rectangle silicon chip (9) that two chip sizes are identical carries out oxidation, forms the step of layer of silicon dioxide film on silicon chip (9) surface.
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| CN105333759A (en) * | 2014-08-06 | 2016-02-17 | 双鸿科技股份有限公司 | Etching temperature uniformization board |
| CN106024736A (en) * | 2016-07-18 | 2016-10-12 | 上海交通大学 | Integrated micro heat pipe radiator based on MEMS technology |
| CN106318371A (en) * | 2016-10-31 | 2017-01-11 | 华南理工大学 | Quantum dot synthesis microchannel with compound capillary one-way auxiliary driving structure |
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Cited By (23)
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