CN108225072A - Heat pipe and its manufacturing method - Google Patents
Heat pipe and its manufacturing method Download PDFInfo
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- CN108225072A CN108225072A CN201711180902.8A CN201711180902A CN108225072A CN 108225072 A CN108225072 A CN 108225072A CN 201711180902 A CN201711180902 A CN 201711180902A CN 108225072 A CN108225072 A CN 108225072A
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- metal layer
- heat pipe
- recesses
- surface side
- pore
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
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- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A kind of heat pipe, including：1st metal layer, being formed makes to carry out mobile liquid level by the working fluid that steam liquefaction forms；And the 2nd metal layer, being formed makes to carry out mobile steam layer by the steam that working fluid gasification forms.1st metal layer includes：Multiple 1st recess portions low-lying from the 1st surface side and being configured separated from each other；The multiple second recesses low-lying from the 2nd surface side of the 1st surface opposite side；Partially communicating multiple 1st pores are carried out to the multiple 1st recess portion and the multiple second recesses respectively；And the side of the multiple second recesses to adjoining carries out partially communicating multiple 2nd pores.2nd metal layer is arranged on the 1st surface of the 1st metal layer.
Description
Technical field
The present invention relates to a kind of heat pipe (heat pipe) and its manufacturing methods.
Background technology
It is carried out as heat generating components such as the CPU (Central Processing Unit) to being installed on electronic equipment cold
But device, heat pipe are well known.Heat pipe is the dress being transmitted using the phase transformation (phase change) of working fluid to heat
It puts.
As an example, it is proposed that a kind of to be mutually arranged to the plate body that sinuous ditch is formd on single side with 90 degree of the angle of the crossing
Clathrate, and working fluid is enclosed into the heat pipe in sinuous channel (tunnel).The heat pipe is that steam pipe and liquid line do not have
There is separated structure (for example, referring to patent document 1).
Existing technical literature
Patent document
Patent document 1：Japanese Unexamined Patent Publication 2001-165582 bulletins
Invention content
However, in above-mentioned heat pipe, the work after the diffusion and condensation (condensation) of the steam from evaporation part
Same channel is all passed through in the return of fluid.For this purpose, although heating part pay near working fluid be evaporated and along ditch channel into
Row sprawling, but due in channel there are working fluid, so the sprawling of steam can be interfered.In addition, through cold after steam sprawling
When but condensing and having carried out liquefied working fluid return evaporation part, it can also be collided with the steam generation from evaporation part.This
Sample is not cycle operation due to evaporating and condensing, so thermal diffusivity is bad.
The present invention is to propose in view of the above problems, and subject is to provide the heat pipe that a kind of thermal diffusivity improves.
A kind of heat pipe is provided, including：1st metal layer, being formed makes to be moved by the working fluid that steam liquefaction forms
Liquid level；And the 2nd metal layer, being formed makes to carry out mobile steam layer by the steam that working fluid gasification forms.
1st metal layer includes：Multiple 1st recess portions low-lying from the 1st surface side and being configured separated from each other；From the 1st surface
The low-lying multiple second recesses of 2nd surface side of opposite side；The multiple 1st recess portion and the multiple second recesses are carried out respectively
Partially communicating multiple 1st pores；And the side of the multiple second recesses to adjoining carries out partially communicating multiple 2 carefully
Hole.2nd metal layer is arranged on the 1st surface of the 1st metal layer.
According to disclosed technology, it is possible to provide the heat pipe that a kind of thermal diffusivity improves.
Description of the drawings
Figure 1A, Figure 1B are the diagrammatic illustrations of the heat pipe of the 1st embodiment.
Fig. 2 is the function declaration figure (its 1) of each section of the heat pipe of the 1st embodiment.
Fig. 3 A, Fig. 3 B are the function declaration figures (its 2) of each section of the heat pipe of the 1st embodiment.
Fig. 4 A~Fig. 4 D are the diagrammatic illustrations of the manufacturing step of the heat pipe of the 1st embodiment.
Fig. 5 A, Fig. 5 B are the diagrammatic illustrations of the heat pipe of the variation 1 of the 1st embodiment.
Fig. 6 A, Fig. 6 B are the diagrammatic illustrations of the heat pipe of the variation 2 of the 1st embodiment.
Fig. 7 is the diagrammatic illustration of the heat pipe of the variation 3 of the 1st embodiment.
Fig. 8 is the diagrammatic illustration of the heat pipe of the variation 4 of the 1st embodiment.
Fig. 9 A, Fig. 9 B are the diagrammatic illustrations of the heat pipe of the 2nd embodiment.
Figure 10 A, Figure 10 B are the diagrammatic illustrations of the manufacturing step of the heat pipe of the 2nd embodiment.
Figure 11 A, Figure 11 B are the diagrammatic illustrations of the heat pipe of the variation 1 of the 2nd embodiment.
[symbol description]
1st, 1A, 1B, 1C, 1D heat pipe
11st, 12,13,14,25,25A metal layers
12x, 12y through hole
13x through holes
The upper surface of 14a metal layers 14
15 pillars
21 gas phase portions
22 liquid flow path portions
23 ventilating parts
The upper surface of 25a metal layers 25,25A
The lower surface of 25b metal layers 25,25A
25x opening portions
121st, there are bottom outlet (recess portion) in 121a, 121b, 121c, 121d, 122
123rd, 123a, 123b, 125 pores
251 flat parts
252 side of sidewall portion
253 pillars
Specific embodiment
The mode for being used to carry out an invention is illustrated referring to the drawings.It should be noted that in each attached drawing, exist pair
Identical composition part assigns the same symbol and omits the situation of repeated explanation.
1st embodiment
The structure of the heat pipe of 1st embodiment
First, the structure of the heat pipe of the 1st embodiment is illustrated.Fig. 1 is the illustration of the heat pipe of the 1st embodiment
Figure, Figure 1B is plan view, and Figure 1A is the sectional view along the line A-A of Figure 1B.
With reference to Fig. 1, heat pipe 1 is with the comprehensive type heat pipe of structure that 4 layers of metal layer 11~14 are laminated.Gold
Belong to layer 11~14 to be for example made of thermal conductivity preferably copper, and pass through the mutually directly engagement such as solidstate bonding.Metal layer 11~14
The thickness of each layer may be, for example, 50 μm~200 μm or so.It should be noted that the material of metal layer 11~14 is not limited to
Copper can also be formed by the higher material of the thermal conductivity such as stainless steel, Al alloys andMg alloys.With regard to heat pipe 1 flat shape (along metal layer 14
Upper surface 14a normal direction observation shape) for, here as an example is rectangular shape.
It should be noted that in Fig. 1, it, will be with gold using the stacking direction (thickness direction) of metal layer 11~14 as Z-direction
Belong to the parallel direction in one side of the upper surface 14a of layer 14 as X-direction, and will be in the upper surface 14a of metal layer 14 and X-direction
Orthogonal direction is as Y-direction (attached drawing thereafter is also the same).In addition, in present embodiment, for convenience's sake, by heat pipe 1
14 side of metal layer be known as upside or side, and by 11 side of metal layer be known as downside or opposite side.In addition, the metal by each position
The surface of 14 side of layer is known as upper surface or a surface, and the surface of 11 side of metal layer is known as lower surface or another surface.
In heat pipe 1, the 1st layer of (another outermost layer) metal layer 11 and the 4th layer of (outermost layer) metal layer 14 are no shapes
(solid-like) metal layer of the solid-like of pore-forming and ditch.
Metal layer 12 has been laminated on the upper surface of metal layer 11.It is each configured on 2nd layer of metal layer 12 multiple from metal
The substantial middle part of layer 13 sides (upper surface side of metal layer 12) to Z-direction it is low-lying have bottom outlet (also referred to as " recess portion ", similarly hereinafter)
121 and from the substantial middle part of 11 side of metal layer (lower face side of metal layer 12) to Z-direction it is low-lying have bottom outlet 122.Separately
Outside, it has been provided with bottom outlet 121 and has there is bottom outlet 122 to carry out partially communicating pore 123.
Metal layer 12 has by having bottom outlet 121, having a bottom outlet 122 and pore 123 is formed along the perforative through hole of Z-direction
12x。
It is multiple to there is bottom outlet 121 to be configured to matrix shape.It is multiple to have bottom outlet 121 for example with matching at predetermined intervals in X direction
The row put and the row being configured at predetermined intervals along Y-direction.However, row need not also arrange and also need not along the X direction
Along the Y direction.
In addition, row and column also need not be orthogonal, for example, relative to line tilt set row, and it is configured with and multiple has
The flat shape in the region of bottom outlet 121 is alternatively parallelogram shape on the whole.In addition, each row and having bottom outlet contained by each row
121 number can also differ, for example, the flat shape for being configured with multiple regions for having bottom outlet 121 can also be trapezoidal on the whole
Shape.In addition, multiple have bottom outlet 121 to can be configured as staggeredly shape.
There is bottom outlet 122 with each thering is bottom outlet 121 to be correspondingly configured one by one.It is corresponding to have bottom outlet 121
With there is bottom outlet 122 to repeat to be configured in plan view, partly connect between bottom surface, to form pore 123.That is, multiple have bottom outlet
122 have bottom outlet 121 to be configured accordingly as matrix shape with multiple, and what is repeated in plan view has bottom outlet 121 and have bottom outlet 122
Bottom surface between connect, and connected along Z-direction.However, for having bottom outlet 121 and having bottom outlet 122, as long as being configured as bottom surface
Between can be connected via pore 123, also need not by plan view completely repeat in a manner of be configured.
Each there is bottom outlet 121 to be separately from each other.That is, adjoin in the x-direction and the z-direction have bottom outlet 121 it
Between do not connect.However, for that adjoins in the x-direction and the z-direction has bottom outlet 122, via pore 125 in X side between side
It is partly connected to in Y-direction.There is bottom outlet 122 all to be carried out via pore 125 that is, being configured to all of matrix shape
Connection.
Have bottom outlet 121 the area of part being open in the upper surface side of metal layer 12 be less than have bottom outlet 122
The area for the part that the lower face side of metal layer 12 is open.There is bottom outlet 121 to be for example formed substantially semi-spherical shape, put down
Face shape is circle.In the case, there is the diameter phi of part being open in 13 side of metal layer of bottom outlet 1211It such as can
It is 25 μm or so.
There is bottom outlet 122 to be for example formed substantially semi-spherical shape, flat shape is circle.In the case, there is bottom outlet
The diameter phi of 122 part being open in the lower face side of metal layer 122More than have bottom outlet 121 in the upper of metal layer 12
The diameter phi for the part that surface side is open1, may be, for example, 50 μm or so.
Bottom outlet 121 with to have the position (position of pore 123) that bottom outlet 122 connects be than the thickness direction of metal layer 12
Center is also toward that side of the upper surface of metal layer 12, such as D1：D2 can be 3：7 or so.The diameter phi of pore 1233Less than there is bottom
The diameter phi in hole 1211With the diameter phi for having bottom outlet 1222, may be, for example, 15 μm or so.
However, the flat shape for having bottom outlet 121,122 is not limited to the arbitrary shapes such as circle or ellipse, polygon
Shape.Can also be inner wall from the upper surface of 123 lateral metal layer 12 of pore in addition, there is bottom outlet 121 to be also not necessarily limited to substantially semi-spherical shape
The arbitrary conical by its shape that side is enlarged.Equally, there is bottom outlet 122 to be also not necessarily limited to substantially semi-spherical shape, can also be inner wall from thin
The arbitrary conical by its shape that the lower face side of 123 lateral metal layer 12 of hole is enlarged.
With regard to the width W of the X-direction of pore 1251, Y-direction width W2And the height H of Z-direction1For, it is each less than
There is the diameter phi of bottom outlet 1222.The width W of the X-direction of pore 1251It may be, for example, 20 μm or so.The width of the Y-direction of pore 125
W2It may be, for example, 20 μm or so.The height H of the Z-direction of pore 1251It may be, for example, 10 μm or so.
Metal layer 13 is laminated on the upper surface of metal layer 12.3rd layer of metal layer 13 has and makes to be configured to rectangular
The through hole 13x that the through hole 12x of shape exposes, and it is formed frame-shaped.Metal layer 14 is formed with covering by metal layer 13
The mode of frame portion is layered on metal layer 13.
Fig. 2 is the function declaration figure (its 1) of each section of the heat pipe of the 1st embodiment, and it illustrates corresponding with Figure 1A
Section.
As shown in Fig. 2, in heat pipe 1, metal layer 11 and metal layer 14 are the layers for becoming outer wall.In addition, in heat pipe 1, by shape
Become vapor film as the metal layer 13 of frame-shaped.Specifically, metal layer 13 (vapor film) is in the through hole 13x of metal layer 13
The gas phase portion 21 that lower surface with the upper surface by metal layer 12 and metal layer 14 encloses.Gas phase portion 21 is to make working fluid
Steam Cv after C gasifications is moved to the region of low temperature side from high temperature side.
In addition, in heat pipe 1, metal layer 12 becomes liquid level.Specifically, metal layer 12 (liquid level) has liquid flow path
Portion 22 and ventilating part 23.Liquid flow path portion 22 has bottom outlet 122 to form in metal layer 12 by what is connected in X direction with Y-direction.Liquid
Body flow path portion 22 (bottom outlet 122) is the region that the working fluid C after low temperature side liquefies is made to be moved to high temperature side.
In addition, ventilating part 23 in metal layer 12 by each having 123 structure of bottom outlet 121 and pore with have that bottom outlet 122 connects
Into.Ventilating part 23 is to separate gas phase portion 21 and liquid flow path portion 22, and is moved to working fluid C caused by gas phase portion 21
The region in liquid flow path portion 22.
It is full of working fluid in liquid flow path portion 22 under state (state that heat pipe 1 does not connect with heat generating components) in the early stage
C.The type of working fluid C is not particularly limited, but in order to efficiently cool down heat generating components using evaporation latent heat, is preferably made
The higher and larger evaporation latent heat fluid with vapour pressure.As such fluid, such as ammonia, water, freon, alcohol can be enumerated
(ethyl alcohol) and acetone.
Fig. 3 is the function declaration figure (its 2) of each section of the heat pipe of the 1st embodiment, and Fig. 3 B are plan views, and Fig. 3 A are edges
The sectional view of the line B-B of Fig. 3 B.
As shown in figure 3, in heat pipe 1, when being observed along the normal direction of the upper surface 14a of metal layer 14, equably it is configured with
Through hole 12x (has bottom outlet 121,122 and pore 123).For this purpose, any position of the outer surface of metal layer 11 all configurable half
The heat generating components such as conductor device, the position for being configured with heat generating components are heating part.In Fig. 3, as an example, by metal layer 11
Bottom left section is as heating part H (evaporation part).
In Fig. 3, after the temperature rise of the metal layer 11,12 near heating part H, the liquid flow path portion 22 near heating part H
Interior working fluid C occurs gasification (evaporation) and generates steam Cv.The steam Cv generated is via ventilating part 23 to gas phase portion 21
It moves and spreads in entire gas phase portion 21.Position far from heating part H is condensation portion G, and in condensation portion G liquid occurs for steam Cv
Change.
Accordingly, heat caused by heating part H is moved to condensation portion G and radiates.After in condensation portion, G is liquefied
Working fluid C is inhaled into liquid flow path portion 22 by the capillary force of pore 123 by ventilating part 23.It has been inhaled into liquid flow path
The working fluid C in portion 22 passes through liquid flow path portion 22 to the position of working fluid C insufficient (shortage) by the capillary force of pore 125
Put, i.e., heating part H moved.Later, by the way that the cycle of evaporation and condensation is similarly repeated, it can inhibit heating part H's
Temperature rise.
The manufacturing method of the heat pipe of 1st embodiment
Then, the manufacturing method of the heat pipe of the 1st embodiment is illustrated.Fig. 4 is the system of the heat pipe of the 1st embodiment
Make the diagrammatic illustration of step, it illustrates with the corresponding sections of Figure 1A.
First, in the step shown in Fig. 4 A, prepare sheet metal (sheet) 120, the shape on the upper surface of sheet metal 120
Into photoresist (resist) layer 310 with opening portion 310x, and formed on the lower surface of sheet metal 120 with opening portion 320x
Photoresist layer 320.Opening portion 310x is so that upper with the sheet metal 120 having at 121 corresponding position of bottom outlet shown in Figure 1B
Surface expose mode and formed.In addition, opening portion 320x is so that with having at 122 corresponding position of bottom outlet shown in Figure 1B
Mode that the lower surface of sheet metal 120 is exposed and formed.
Sheet metal 120 is the last component as metal layer 12, such as can be formed by copper, stainless steel, Al alloys andMg alloys etc..
The thickness of sheet metal 120 may be, for example, 50 μm~200 μm or so.As photoresist layer 310,320, such as photosensitive dry film can be used
(dry film) photoresist etc..Opening portion 310x, 320x for example can be by being exposed photoresist layer 310,320 and developing and shape
Into.
Then, in the step shown in Fig. 4 B, to the sheet metal 120 that is exposed in the 310x of opening portion from sheet metal 120
Upper surface side carries out half-etching, and the sheet metal 120 to being exposed in the 320x of opening portion is carried out from the lower face side of sheet metal 120
Half-etching.Accordingly, bottom outlet 121 is formed in the upper surface side of sheet metal 120, and bottom outlet 122 is formed in lower face side.Separately
Outside, there is bottom outlet 121 and have and connected along Z-direction part to form pore 123, and formed by there is bottom outlet between the bottom surface of bottom outlet 122
121st, there is the through hole 12x that bottom outlet 122 and pore 123 are formed.In addition, just adjoin in X direction with Y-direction have bottom outlet 122 and
It says, is connected in X direction with Y-direction part between side, to form pore 125.The half-etching of sheet metal 120 for example can be used
Iron chloride (ferric chloride) solution.Later, photoresist layer 310,320 using stripper is removed, thus completed
(acquisition) through hole 12x is configured as the metal layer 12 of matrix shape.
Then, in the step shown in Fig. 4 C, the metal layer 13 of the frame-shaped with through hole 13x is formed.Metal layer 13 can
By preparing sheet metal and the unwanted part of the sheet metal being removed to be formed by etching.Alternatively, metal layer 13
Also can by prepare sheet metal and to the unwanted part of the sheet metal by pressure processing or Laser Processing removed and
It is formed.
Then, in the step shown in Fig. 4 D, prepare not forming the metal layer 11,14 of the solid-like of hole and ditch.Then,
Metal layer 11,12,13,14 is laminated successively, and passes through pressurization and heating progress solidstate bonding.Accordingly, the metal adjoined
It is directly engaged between layer, completing (being made) has the heat pipe 1 in gas phase portion 21, liquid flow path portion 22 and ventilating part 23.Later, make
With vacuum pump etc. to being exhausted in liquid flow path portion 22 after, not illustrated inlet injects work into liquid flow path portion 22 from figure
Make fluid C, then inlet is sealed.
Here, solidstate bonding refers to, do not make to dissolve between coalesced object object in the state of solid phase (solid) is kept into
Row heating makes its softening, then the method for being engaged its plastic deformation by pressurization.It should be noted that in order to pass through
For solidstate bonding to carrying out good engagement between the metal layer that adjoins, all material for preferably making metal layer 11~14 is all identical.
In this way, in heat pipe 1, the gas phase portion 21 for for being vaporized through and the liquid flow path portion 22 passed through for working fluid are just divided
It opens.For this purpose, the work after coming from the diffusion of the steam Cv of heating part H (evaporation part) side and being condensed in condensation portion G sides
The return of fluid C becomes different layers, will not collide between each other.As a result, evaporation and condensation cycle operation, thus
Thermal diffusivity can be improved.
In addition, in heat pipe 1, when being observed along the normal direction of the upper surface 14a of metal layer 14, through hole 12x (has bottom outlet
121st, 122 and pore 123) carried out uniform configuration.For this purpose, there is no the differentiation of heating part H (evaporation part) and condensation portion G,
It can be in heat generating components such as any position configuring semiconductor devices of the outer surface of metal layer 11 using as heating part H.In addition, hair
Hot portion H pays the steam Cv that are closely evaporated and is spread to comprehensive, temperature it is low partially change into condensation portion G so that steam generation is coagulated
Knot.Through this structure, can have along comprehensive all uniform heat diffusivity energy, and can realize there is no posture dependence
The heat pipe of (posture dependency).
In addition, in heat pipe 1, liquid flow path portion 22 and ventilating part 23 are formd in 1 metal layer.For this purpose, heat pipe 1 can be made
Thinning.
The variation 1 of 1st embodiment
The example of setting pillar is shown in the variation 1 of 1st embodiment.It should be noted that the 1st embodiment
There is a situation where that pair composition part identical with already described embodiment illustrates to omit in variation 1.
Fig. 5 is the diagrammatic illustration of the heat pipe of the variation 1 of the 1st embodiment, and Fig. 5 B are plan views, and Fig. 5 A are along Fig. 5 B
The sectional view of line A-A.
With reference to Fig. 5, for heat pipe 1A, pillar 15 is provided in the inside of metal layer 13 for being formed frame-shaped.Fig. 5's
In example, 4 pillars 15, but may also set up the pillar 15 of 1~3 or 5 or more despite the provision of.
In this way, by setting pillar 15 in the inside for the metal layer 13 for being formed frame-shaped, when manufacturing heat pipe 1A, can prevent
Metal layer 11,12,13,14 is stacked gradually in the step of Fig. 4 D and metal layer 14 is subject to crushing under pressure.In addition, heat pipe 1A
During work, also it can prevent metal layer 14 from deforming and gas phase portion 21 is caused to be subject to crushing.
The variation 2 of 1st embodiment
Show there is bottom outlet 122 to be set in the upper surface side of metal layer 12 relative to 1 in the variation 2 of 1st embodiment
Multiple examples for having bottom outlet are put.It should be noted that in the variation 2 of the 1st embodiment exist pair with already described embodiment party
The situation for illustrating to be omitted of the identical composition part of formula.
Fig. 6 is the diagrammatic illustration of the heat pipe of the variation 2 of the 1st embodiment, and Fig. 6 B are partial plan layouts, and Fig. 6 A are along Fig. 6 B
Line C-C partial cutaway view.
In heat pipe 1B shown in fig. 6, formd on the 2nd layer of metal layer 12 from the upper surface side of metal layer 12 to Z-direction
Substantial middle part it is low-lying have bottom outlet 121a, 121b and the substantial middle part from the lower face side of metal layer 12 to Z-direction
Low-lying has bottom outlet 122.In addition, it is provided with bottom outlet 121a, 121b and has there is bottom outlet 122 to carry out partially communicating pore
123a、123b。
Metal layer 12 has by having bottom outlet 121a, 121b, having a bottom outlet 122 and what pore 123a, 123b were formed passes through along Z-direction
The through hole 12y worn.
That is, in each through hole 12y, having bottom outlet 122 to be provided with relative to 1 has bottom outlet 121a, 121b.It is corresponding to have bottom
Hole 121a, 121b and have bottom outlet 122 in plan view repeat be configured.In addition, have bottom outlet 121a and have bottom outlet 122 bottom surface it
Between partly connect, to form pore 123a.It is partly connected between the bottom surface of bottom outlet 122 in addition, having bottom outlet 121b and having, to be formed
Pore 123b.
Having for adjoining in the X direction and has bottom outlet 121b to be separately from each other at bottom outlet 121a.In addition, adjoin in the Y direction
Have between bottom outlet 121a and having of adjoining in the Y direction is also separately from each other between bottom outlet 121b.
The area of part being open in the upper surface side of metal layer 12 for having bottom outlet 121a, 121b, which is less than, bottom outlet
The area of 122 part being open in the lower face side of metal layer 12.There are bottom outlet 121a, 121b to be for example formed substantially
Semi-spherical shape, flat shape are circle.There are bottom outlet 121a, 121b and position (pore 123a, 123b for thering is bottom outlet 122 to connect
Position) be the center than the thickness direction of metal layer 12 also toward that side of the upper surface of metal layer 12.
However, the flat shape for having bottom outlet 121a, 121b is not limited to circle or ellipse, polygon angular etc. appoints
Meaning shape.Can also be that inner wall is lateral from pore 123a, 123b in addition, thering is bottom outlet 121a, 121b to be also not necessarily limited to substantially semi-spherical shape
The arbitrary conical by its shape that the upper surface side of metal layer 12 is enlarged.
In this way, in each through hole 12y, there is bottom outlet 122 that can set 2 in the upper surface side of metal layer 12 relative to 1
There are bottom outlet 121a, 121b.In the case, since the size (size) of pore 123a, 123b can be made less than the 1st embodiment
The size of pore 123, so capillary force when working fluid C is sucked liquid flow path portion 22 from gas phase portion 21 can be increased.
It should be noted that there is bottom outlet 122 also can set 3 or more in the upper surface side of metal layer 12 relative to 1
There is bottom outlet.In addition, have bottom outlet 122 relative to 1 and multiple sizes for having bottom outlet set by the upper surface side in metal layer 12
It can also be different (for example, diameter is different).
The variation 3 of 1st embodiment
Show that change has the example of bottom outlet density in the variation 3 of 1st embodiment.It should be noted that the 1st implements
There is a situation where that pair composition part identical with already described embodiment illustrates to omit in the variation 3 of mode.
Fig. 7 is the diagrammatic illustration of the heat pipe of the variation 3 of the 1st embodiment, is and the corresponding plan views of Figure 1B.So
And in Fig. 7, illustrate only in metal layer 12 relative to have bottom outlet 122 and the upper surface side in metal layer 12 set by have bottom
The diagram of bottom outlet 122 and pore 123 is omitted in hole 121.
In heat pipe 1C shown in Fig. 7, it is configured with being configured with high-density region Hd and the low-density of bottom outlet 121 to high-density
The density regions Ld for having a bottom outlet 121 is alternately arranged in X direction with Y-direction.In high-density region Hd, such as relative to 1
Having bottom outlet 122 that can set multiple has bottom outlet 121.
As heat pipe 1C, the density for having bottom outlet 121 is not necessarily to uniformly, can have high-density region Hd and low-density
Region Ld.In the case, there can be the effect for the diffuser efficiency for improving the heat from heating part.It is improved in addition, can also have
Working fluid after the gasification efficiency of working fluid and liquefaction returns to the effect of the return efficiency of liquid level.
It should be noted that the different region of density is not limited to 2 kinds, it also can be with the different area of 3 kinds or more of density
Domain.
The variation 4 of 1st embodiment
Show that change has the example of bottom outlet size in the variation 4 of 1st embodiment.It should be noted that the 1st implements
There is a situation where that pair composition part identical with already described embodiment illustrates to omit in the variation 4 of mode.
Fig. 8 is the diagrammatic illustration of the heat pipe of the variation 4 of the 1st embodiment, is and the corresponding plan views of Figure 1B.So
And in Fig. 8, illustrate only in metal layer 12 relative to have bottom outlet 122 and set by 13 side of metal layer have bottom outlet 121c,
The diagram of bottom outlet 122 and pore 123 is omitted in 121d.
In heat pipe 1D shown in Fig. 8, in (the example that the area for the part that the upper surface side of metal layer 12 is open is larger
Such as, major diameter) there is bottom outlet 121c and smaller (for example, small in the area of part that is open of upper surface side of metal layer 12
Diameter) there is bottom outlet 121d to be alternately arranged in X direction with Y-direction.There are bottom outlet 121c, 121d for example with having in the same manner as bottom outlet 121
It can be formed substantially semi-spherical shape etc..
As heat pipe 1D, in the area for the opening portion for each having bottom outlet that the upper surface side of metal layer 12 is open
Be not necessarily to it is identical, can also have opening portion area it is larger have bottom outlet 121c and the area of opening portion is smaller has
Bottom outlet 121d.In the case, the working fluid after the gasification efficiency for improving working fluid and liquefaction can returns to liquid level
Return efficiency effect.
It should be noted that the area of each opening portion for having a bottom outlet being open in 13 side of metal layer is not limited to
2 kinds, can also be 3 kinds or more.
2nd embodiment
The example for making heat pipe more thinning is shown in 2nd embodiment.It should be noted that it is deposited in the 2nd embodiment
In the situation for illustrating to be omitted of pair composition part identical with already described embodiment.
The structure of the heat pipe of 2nd embodiment
First, the structure of the heat pipe of the 2nd embodiment is illustrated.Fig. 9 is the illustration of the heat pipe of the 2nd embodiment
Figure, Fig. 9 B are plan views, and Fig. 9 A are the sectional views along the line A-A of Fig. 9 B.
With reference to Fig. 9, heat pipe 2 is replaced into this point of 1 layer of metal layer 25 and heat pipe 1 in addition to metal layer 13,14 (with reference to Fig. 1)
Except difference, other are all identical with heat pipe 1.That is, heat pipe 2 is with the structure that 3 layers of metal layer 11,12,25 are laminated
Comprehensive type heat pipe.Metal layer 11,12,25 is formed such as by copper, stainless steel, Al alloys andMg alloys, and passes through solidstate bonding etc.
Direct engagement is carried out between each other.
Metal layer 25 has the flat part 251 of the rectangular shape with upper surface 25a and lower surface 25b and from flat part
The outer peripheral portion of 251 lower surface 25b is to the side of sidewall portion 252 of 12 lateral process of metal layer.For metal layer 25, flat part 251
It is formed as one with side of sidewall portion 252, and is made of concave shape.Side of sidewall portion 252 have make to be configured as running through for matrix shape
The opening portion 25x that hole 12x exposes, and the peripheral part office of the lower surface 25b in flat part 251 is formed frame-shaped.Metal layer
The lower surface of 25 side of sidewall portion 252 is directly engaged with the outer peripheral portion of the upper surface of metal layer 12.
The integral thickness T of metal layer 251It may be, for example, 50 μm~200 μm or so.The integral thickness T of metal layer 251It such as can
It is identical with the thickness of metal layer 11,12.The thickness T of the side of sidewall portion 252 of metal layer 252It may be, for example, thickness T1Half or so.
The side of sidewall portion 252 of metal layer 25 becomes vapor film, has in the opening portion 25x of side of sidewall portion 252 by metal layer 12
The gas phase portion 21 that the lower surface 25b of upper surface and metal layer 25 is enclosed (with reference to Fig. 2).Gas phase portion 21 is to make working fluid C gas
Steam Cv after change is moved to the region of low temperature side from high temperature side.
The manufacturing method of the heat pipe of 2nd embodiment
Then, the manufacturing method of the heat pipe of the 2nd embodiment is illustrated.Figure 10 is the heat pipe of the 2nd embodiment
The diagrammatic illustration of manufacturing step, it illustrates with the corresponding sections of Fig. 9 A.
First, the step of performing Fig. 4 A and Fig. 4 B of the 1st embodiment, to make metal layer 12.
Then, in the step shown in Figure 10 A, prepare sheet metal 250, formed on the entire upper surface of sheet metal 250
The photoresist layer 330 of solid-like, and the frame-shaped for the opening portion 340x for having rectangular shape is formed on the lower surface of sheet metal 250
Photoresist layer 340.Photoresist layer 340 is formed to cover the region of side of sidewall portion 252 to be formed.
Sheet metal 250 is the component for eventually becoming metal layer 25, for example, can be formed by copper, stainless steel, Al alloys andMg alloys etc..
The thickness of sheet metal 250 may be, for example, 50 μm~200 μm or so.As photoresist layer 330,340, such as photosensitive dry film can be used
Photoresist etc..Opening portion 340x can for example be formed by being exposed and developing to photoresist layer 340.
Then, in the step shown in Figure 10 B, to the sheet metal 250 that is exposed in the 340x of opening portion from sheet metal 250
Lower face side carries out half-etching, to form opening portion 25x with the end in center side, and is formed in peripheral side around opening portion 25x
Side of sidewall portion 252.Ferric chloride solution for example can be used in the half-etching of sheet metal 250.Later, by making to photoresist layer 330,340
It is removed with stripper, the peripheral part office that may be formed at the lower surface 25b of flat part 251 has around opening portion 25x's
The metal layer 25 of the side of sidewall portion 252 of frame-shaped.
It should be noted that in Figure 10 A, the photoresist layer of solid-like can be also formed on the entire lower surface of sheet metal 250
330, and the photoresist layer 340 of the frame-shaped for the opening portion 340x for having rectangular shape is formed on the upper surface of sheet metal 250.Herein
In the case of, in Figure 10 B, half is carried out from the upper surface side of sheet metal 250 to the sheet metal 250 exposed in the 340x of opening portion and is lost
It carves, to form opening portion 25x.
Then, preparation does not form the metal layer 11 of the solid-like of hole and ditch, in the same manner as the step of Fig. 4 D, successively to gold
Belong to layer 11,12,25 to be laminated, and pass through pressurization and heating progress solidstate bonding.Accordingly, it is directly connect between the metal layer adjoined
It closes, completes the heat pipe 2 that (being made) has gas phase portion 21, liquid flow path portion 22 and ventilating part 23.Later, using vacuum pump etc. to liquid
After being exhausted in body flow path portion 22, not illustrated inlet injects working fluid C into liquid flow path portion 22 from figure, then right
Inlet is sealed.It should be noted that in order to can be by solidstate bonding to carrying out good connect between the metal layer that adjoins
It closes, all material of metal layer 11,12,25 is preferably identical.
It in this way, can be by the way that the metal layer 13,14 in heat pipe 1 to be replaced into 1 layer of metal layer 25 using as heat pipe 2.Heat pipe 2
In, due to not being using bending machining or forming but bottom outlet and opening portion are formed with by half-etching, so easily
Carry out thinning.In heat pipe 2, as long as example, forming any layer in metal layer 11,12,25 with 50 μm of thickness, so that it may realize total
Thickness is 150 μm of thin type heat pipe.Other effects are identical described in the 1st embodiment.
The variation 1 of 2nd embodiment
The example of setting pillar is shown in the variation 1 of 2nd embodiment.It should be noted that the 2nd embodiment
There is a situation where that pair composition part identical with already described embodiment illustrates to omit in variation 1.
Figure 11 is the diagrammatic illustration of the heat pipe of the variation 1 of the 2nd embodiment, and Figure 11 B are plan views, and Figure 11 A are along Figure 11 B
Line A-A sectional view.
With reference to Figure 11, heat pipe 2A is different from heat pipe 2 (reference Fig. 9) in addition to metal layer 25 is replaced into this point of metal layer 25A
Except, other are all identical with heat pipe 2.That is, heat pipe 2A is with the structure that 3 layers of metal layer 11,12,25A are laminated
Comprehensive type heat pipe.Metal layer 11,12,25A are formed such as by copper, stainless steel, Al alloys andMg alloys, and pass through solidstate bonding etc.
Direct engagement is carried out between each other.
Metal layer 25A has the flat part 251 of the rectangular shape with upper surface 25a and lower surface 25b, from flat part
Side of sidewall portion 252 from the outer peripheral portion of 251 lower surface 25b to metal layer 12 lateral process and be arranged on the inside of side of sidewall portion 252
Pillar 253.Flat part 251, side of sidewall portion 252 and pillar 253 are formed as one.Side of sidewall portion 252 have make to be configured as rectangular
The opening portion 25x that the through hole 12x of shape exposes, and the peripheral part office of the lower surface 25b in flat part 251 is formed frame
Shape.The lower surface 25b for the flat part 251 that pillar 253 is exposed out of opening portion 25x is raised to the progress of 12 side of metal layer.Figure 11
Example in, there is provided 4 pillars 253, but may also set up the pillar 253 of 1~3 or 5 or more.The side wall of metal layer 25A
The lower surface in portion 252 is directly engaged with the outer peripheral portion of the upper surface of metal layer 12.In addition, each pillar 253 of metal layer 25A
Lower surface directly engaged with the precalculated position of the upper surface of metal layer 12.
When making metal layer 25A, for example, preparing sheet metal, the 1st of solid-like is formed on the entire upper surface of sheet metal
Photoresist layer, and in the outer peripheral portion (part for becoming side of sidewall portion 252) of the lower surface of sheet metal and the forming portion office of pillar 253
It is formed selectively the 2nd photoresist layer.Then, half is carried out to the part of the 2nd photoresist layer exposing from the lower face side of sheet metal to lose
It carves.Accordingly, form opening portion 25x with the end in center side, peripheral side formed around opening portion 25x side of sidewall portion 252, and
Pillar 253 is formed in the 25x of opening portion.Ferric chloride solution for example can be used in the half-etching of metal layer 25A.Later, by the 1st,
2nd photoresist layer is removed using stripper, is completed (being made) flat part 251, side of sidewall portion 252 and pillar 253 and is formed as one
Metal layer 25A.
In this way, pillar 253, manufacture heat are set by the inside of the side of sidewall portion 252 for being formed frame-shaped in metal layer 25A
During pipe 2A, metal layer when can prevent that metal layer 11,12,25A are laminated and are pressurizeed successively in the step similary with Fig. 4 D
25A is subject to crushing.In addition, when heat pipe 2A works, can also prevent metal layer 25A from deforming causes gas phase portion 21 to be subject to crushing.Other
Effect is identical described in the 1st embodiment and the 2nd embodiment.
Better embodiment is had been described in detail above, but is not limited to the above embodiment, as long as being said no more than right
The range that bright secretary carries can also carry out various deformations and displacement to the above embodiment.
For example, suitably the 1st embodiment and variation 1~4 can be combined and implemented.It in addition, can also be suitably
The variation 2~4 of the 2nd embodiment and variation 1 and the 1st embodiment is made to be combined and implement.、
Based on above-mentioned, a kind of heat pipe is provided, including：1st metal layer, formed make by the steam working fluid that forms of liquefaction into
The mobile liquid level of row；And the 2nd metal layer, being formed makes to carry out mobile steaming by the steam that working fluid gasification forms
Gas-bearing formation.1st metal layer includes：Multiple 1st recess portions low-lying from the 1st surface side and being configured separated from each other；From the described 1st
The low-lying multiple second recesses of 2nd surface side of surface opposite side；Respectively to the multiple 1st recess portion and the multiple second recesses
Carry out partially communicating multiple 1st pores；And the side of the multiple second recesses to adjoining carries out partially communicating multiple the
2 pores.2nd metal layer is arranged on the 1st surface of the 1st metal layer.
2nd metal layer is frame-shaped, and including along the perforative opening portion of thickness direction of the 2nd metal layer, described
Multiple 1st recess portions expose in the opening portion.
The heat pipe further includes：3rd metal layer is arranged on the 2nd metal layer；And the 4th metal layer, it is arranged on described
On the 2nd surface of 1st metal layer.The multiple 1st recess portion, the multiple second recesses and the multiple 1st pore shape
Into being configured as rectangular multiple through holes.
The heat pipe further includes：Multiple pillars are arranged in the opening portion, and positioned at the described of the 1st metal layer
Between 1st surface and the 3rd metal layer.
Each of the multiple 1st recess portion is in the part that the 1st surface side of the 1st metal layer is open
Area be less than the multiple second recesses each in the part that the 2nd surface side of the 1st metal layer is open
Area.
The multiple 1st recess portion has by from the 1st surface of lateral 1st metal layer of the multiple 1st pore
The conical by its shape that the widened inner wall in side is limited, the multiple second recesses have by from the multiple 1st pore lateral described the
The conical by its shape that the widened inner wall of the 2nd surface side of 1 metal layer is limited.
1st recess portion of 2 or more is connected with 1 in the multiple second recesses.
The 1st surface side that the multiple 1st recess portion is included in the 1st metal layer be open and area mutually not
The 1st same recess portion.
On the other hand, the heat pipe further includes：It is seen along the direction vertical with the 1st surface of the 1st metal layer
On the plan view observed, the 1st region that the multiple 1st recess portion is configured by the 1st density；And on the plan view,
The multiple 1st recess portion is by the 2nd region being configured less than the 2nd density of the 1st density.
2nd metal layer includes：Flat part；And it is arranged on the side of sidewall portion on the peripheral part of the flat part.It is described flat
Plate portion and the side of sidewall portion are integrally formed by single metal layer, and concave shape corresponding with the opening portion is consequently formed.
The heat pipe further includes：5th metal layer is arranged on the 2nd surface of the 1st metal layer.It is the multiple
1st recess portion, the multiple second recesses and the formation of the multiple 1st pore are configured as rectangular multiple through holes.
The heat pipe further includes：Multiple pillars are arranged in the opening portion of the side of sidewall portion, and positioned at the 1st metal
Between the 1st surface of layer and the flat part.
The flat part, the side of sidewall portion and the multiple pillar are integrally formed by single metal layer, the flat part and
The side of sidewall portion forms concave shape corresponding with the opening portion.
Each of the multiple 1st recess portion is in the part that the 1st surface side of the 1st metal layer is open
Area be less than the multiple second recesses each in the part that the 2nd surface side of the 1st metal layer is open
Area.
The multiple 1st recess portion has by from the 1st surface of lateral 1st metal layer of the multiple 1st pore
The conical by its shape that the widened inner wall in side is limited, the multiple second recesses have by from the multiple 1st pore lateral described the
The conical by its shape that the widened inner wall of the 2nd surface side of 1 metal layer is limited.
1st recess portion of 2 or more is connected with 1 in the multiple second recesses.
The 1st surface side that the multiple 1st recess portion is included in the 1st metal layer be open and area mutually not
The 1st same recess portion.
The heat pipe further includes：In the plane observed along the direction vertical with the 1st surface of the 1st metal layer
On figure, the 1st region that the multiple 1st recess portion is configured by the 1st density；And on the plan view, the multiple 1st
Recess portion is by the 2nd region being configured less than the 2nd density of the 1st density.
Additionally, it is provided a kind of manufacturing method of heat pipe, including：2nd metal layer forming step, being formed makes for forming by work
Make the 2nd metal layer that the steam that fluid gasification forms carries out mobile vapor film；1st metal layer forming step is formed for structure
Into the 1st metal layer for making to be carried out mobile liquid level by the working fluid that the steam liquefied forms；And engagement step,
The 2nd metal layer is engaged on one surface of the 1st metal layer.The 1st metal layer forming step has：To the 1st gold medal
Belong to piece and carry out half-etching from a surface side to form multiple 1st recess portions, the 1st sheet metal is carried out from another surface side
Half-etching forms to form multiple second recesses and carries out partially communicating 1st pore and by adjoining with the 1st recess portion
The step of 2 pore that the side of the second recesses carries out part connection and formed.The 2nd metal layer forming step has：
Form the step of through-thickness runs through the through hole of the 2nd sheet metal.
A kind of manufacturing method of heat pipe is also provided, including：2nd metal layer forming step, being formed makes for forming by working
The steam that fluid gasification forms carries out the 2nd metal layer of the side of sidewall portion of mobile vapor film；1st metal layer forming step is formed
Make the 1st metal layer that mobile liquid level is carried out by the working fluid that the steam liquefied forms for forming；And engagement
Step engages the 2nd metal layer on a surface of the 1st metal layer.The 1st metal layer forming step has：
Half-etching is carried out to form multiple 1st recess portions from surface side to the 1st sheet metal, to the 1st sheet metal from another table
Surface side carries out half-etching to form multiple second recesses, and is formed and carry out partially communicating 1st pore with the 1st recess portion and lead to
The step of 2 pore crossed the side progress part connection for the second recesses adjoined and formed.2nd metal layer is formed
Step has：Half-etching is carried out to form with the end open in center side from a surface or another surface side to the 2nd sheet metal
Oral area, and the step of form in peripheral side the side of sidewall portion for surrounding the opening portion.
The area in the part that one surface side is open of 1st recess portion exists less than the second recesses
The area of part that another described surface side is open.
From the 1st pore, laterally one surface side is enlarged the inner wall of 1st recess portion, the second recesses
Inner wall from the 1st pore, laterally another described surface side is enlarged.Multiple 1st recess portions and 1 it is the described 2nd recessed
Portion connects.
Claims (23)
1. a kind of heat pipe, including：
1st metal layer, being formed makes to carry out mobile liquid level by the working fluid that steam liquefaction forms；And
2nd metal layer, being formed makes to carry out mobile steam layer by the steam that working fluid gasification forms,
Wherein, the 1st metal layer includes
Multiple 1st recess portions low-lying from the 1st surface side and being configured separated from each other；
The multiple second recesses low-lying from the 2nd surface side of the 1st surface opposite side；
Partially communicating multiple 1st pores are carried out to the multiple 1st recess portion and the multiple second recesses respectively；And
Partially communicating multiple 2nd pores are carried out to the side of the multiple second recesses adjoined,
2nd metal layer is arranged on the 1st surface of the 1st metal layer.
2. heat pipe as described in claim 1, wherein：
2nd metal layer is frame-shaped, and including along the perforative opening portion of thickness direction of the 2nd metal layer, the multiple
1st recess portion exposes in the opening portion.
3. heat pipe as claimed in claim 2, further includes：
3rd metal layer is arranged on the 2nd metal layer；And
4th metal layer is arranged on the 2nd surface of the 1st metal layer,
Wherein, the multiple 1st recess portion, the multiple second recesses and the formation of the multiple 1st pore are configured as rectangular
Multiple through holes.
4. heat pipe as claimed in claim 2, further includes：
Multiple pillars are arranged in the opening portion, and positioned at the 1st surface of the 1st metal layer and the 3rd metal
Between layer.
5. heat pipe as described in claim 1, wherein：
Each area of part being open in the 1st surface side of the 1st metal layer of the multiple 1st recess portion
Less than the multiple second recesses each in the face of part that the 2nd surface side of the 1st metal layer is open
Product.
6. heat pipe as described in claim 1, wherein：
The multiple 1st recess portion has by expanding from the 1st surface side of lateral 1st metal layer of the multiple 1st pore
The conical by its shape that big inner wall is limited,
The multiple second recesses have by expanding from the 2nd surface side of lateral 1st metal layer of the multiple 1st pore
The conical by its shape that big inner wall is limited.
7. heat pipe as described in claim 1, wherein：
1st recess portion of 2 or more is connected with 1 in the multiple second recesses.
8. heat pipe as described in claim 1, wherein：
The 1st surface side that the multiple 1st recess portion is included in the 1st metal layer is open and area is mutually different
1st recess portion.
9. heat pipe as described in claim 1, further includes：
On the plan view observed along the direction vertical with the 1st surface of the 1st metal layer, the multiple 1st is recessed
The 1st region that portion is configured by the 1st density；And
On the plan view, the multiple 1st recess portion is by the 2nd area being configured less than the 2nd density of the 1st density
Domain.
10. heat pipe as described in claim 1, wherein：
2nd metal layer includes
Flat part；And
The side of sidewall portion being arranged on the peripheral part of the flat part,
Wherein, the flat part and the side of sidewall portion are integrally formed by single metal layer, are consequently formed corresponding with the opening portion
Concave shape.
11. heat pipe as claimed in claim 10, further includes：
5th metal layer is arranged on the 2nd surface of the 1st metal layer,
Wherein, the multiple 1st recess portion, the multiple second recesses and the formation of the multiple 1st pore are configured as rectangular
Multiple through holes.
12. heat pipe as claimed in claim 10, further includes：
Multiple pillars are arranged in the opening portion of the side of sidewall portion, and positioned at the 1st surface of the 1st metal layer and institute
It states between flat part.
13. heat pipe as claimed in claim 12, wherein：
The flat part, the side of sidewall portion and the multiple pillar are integrally formed by single metal layer, the flat part and described
Side of sidewall portion forms concave shape corresponding with the opening portion.
14. heat pipe as claimed in claim 10, wherein：
Each area of part being open in the 1st surface side of the 1st metal layer of the multiple 1st recess portion
Less than the multiple second recesses each in the face of part that the 2nd surface side of the 1st metal layer is open
Product.
15. heat pipe as claimed in claim 10, wherein：
The multiple 1st recess portion has by expanding from the 1st surface side of lateral 1st metal layer of the multiple 1st pore
The conical by its shape that big inner wall is limited,
The multiple second recesses have by expanding from the 2nd surface side of lateral 1st metal layer of the multiple 1st pore
The conical by its shape that big inner wall is limited.
16. heat pipe as claimed in claim 10, wherein：
1st recess portion of 2 or more is connected with 1 in the multiple second recesses.
17. heat pipe as claimed in claim 10, wherein：
The 1st surface side that the multiple 1st recess portion is included in the 1st metal layer is open and area is mutually different
1st recess portion.
18. heat pipe as claimed in claim 10, further includes：
On the plan view observed along the direction vertical with the 1st surface of the 1st metal layer, the multiple 1st is recessed
The 1st region that portion is configured by the 1st density；And
On the plan view, the multiple 1st recess portion is by the 2nd area being configured less than the 2nd density of the 1st density
Domain.
19. a kind of manufacturing method of heat pipe, including：
2nd metal layer forming step, formed makes to carry out mobile vapor film by the steam that working fluid gasification forms for forming
The 2nd metal layer；
1st metal layer forming step, formed makes to be moved by the working fluid that the steam liquefied forms for forming
Liquid level the 1st metal layer；And
Engagement step engages the 2nd metal layer on a surface of the 1st metal layer,
Wherein,
The 1st metal layer forming step has
Half-etching is carried out to form multiple 1st recess portions from surface side to the 1st sheet metal, to the 1st sheet metal from another
A surface side carries out half-etching to form multiple second recesses, and is formed and carry out partially communicating 1st pore with the 1st recess portion
The step of part connects 2 pore to be formed is carried out with by the side for the second recesses adjoined,
The 2nd metal layer forming step has
Form the step of through-thickness runs through the through hole of the 2nd sheet metal.
20. a kind of manufacturing method of heat pipe, including：
2nd metal layer forming step, formed makes to carry out mobile vapor film by the steam that working fluid gasification forms for forming
Side of sidewall portion the 2nd metal layer；
1st metal layer forming step, formed makes to be moved by the working fluid that the steam liquefied forms for forming
Liquid level the 1st metal layer；And
Engagement step engages the 2nd metal layer on a surface of the 1st metal layer,
Wherein,
The 1st metal layer forming step has
Half-etching is carried out to form multiple 1st recess portions from surface side to the 1st sheet metal, to the 1st sheet metal from another
A surface side carries out half-etching to form multiple second recesses, and is formed and carry out partially communicating 1st pore with the 1st recess portion
The step of part connects 2 pore to be formed is carried out with by the side for the second recesses adjoined,
The 2nd metal layer forming step has
Half-etching is carried out to form opening portion with the end in center side from a surface or another surface side to the 2nd sheet metal,
And the step of side of sidewall portion for surrounding the opening portion is formed in peripheral side.
21. the manufacturing method of the heat pipe as described in claim 19 or 20, wherein：
The area in the part that one surface side is open of 1st recess portion is less than the second recesses described
The area for the part that another surface side is open.
22. the manufacturing method of the heat pipe as described in claim 19 or 20, wherein：
From the 1st pore, laterally one surface side is enlarged the inner wall of 1st recess portion,
From the 1st pore, laterally another described surface side is enlarged the inner wall of the second recesses.
23. the manufacturing method of the heat pipe as described in claim 19 or 20, wherein：
Multiple 1st recess portions are connected with 1 second recesses.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016242730 | 2016-12-14 | ||
| JP2016-242730 | 2016-12-14 | ||
| JP2017112587A JP6799503B2 (en) | 2016-12-14 | 2017-06-07 | Heat pipe and its manufacturing method |
| JP2017-112587 | 2017-06-07 |
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| Publication Number | Publication Date |
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| CN108225072A true CN108225072A (en) | 2018-06-29 |
| CN108225072B CN108225072B (en) | 2020-10-30 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201711180902.8A Active CN108225072B (en) | 2016-12-14 | 2017-11-23 | Heat pipe and method for manufacturing the same |
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| JP (1) | JP6799503B2 (en) |
| CN (1) | CN108225072B (en) |
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| EP3611455A1 (en) * | 2018-08-13 | 2020-02-19 | Shinko Electric Industries Co., Ltd. | Loop-type heat pipe and method of manufacturing the same |
| CN111336850A (en) * | 2018-12-19 | 2020-06-26 | 新光电气工业株式会社 | Loop type heat pipe |
| WO2021208070A1 (en) * | 2020-04-17 | 2021-10-21 | 李克勤 | Laminated thin heat dissipation device and manufacturing method therefor |
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| JP7137783B2 (en) * | 2017-08-24 | 2022-09-15 | 大日本印刷株式会社 | Wick sheet for vapor chamber, vapor chamber and method for manufacturing vapor chamber |
| JP6400240B1 (en) * | 2018-02-05 | 2018-10-03 | 新光電気工業株式会社 | Loop heat pipe and manufacturing method thereof |
| JP6943786B2 (en) | 2018-02-05 | 2021-10-06 | 新光電気工業株式会社 | Loop type heat pipe and its manufacturing method |
| US20220120509A1 (en) * | 2019-03-11 | 2022-04-21 | Dai Nippon Printing Co., Ltd. | Vapor chamber, electronic device and sheet for vapor chamber |
| JP2021032539A (en) * | 2019-08-28 | 2021-03-01 | 京セラ株式会社 | Heat transport plate and manufacturing method for heat transport plate |
| KR102447793B1 (en) * | 2019-11-11 | 2022-09-27 | 주식회사 아모그린텍 | Sheet type heat pipe and manufacturing method thereof |
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| JP2018096669A (en) | 2018-06-21 |
| JP6799503B2 (en) | 2020-12-16 |
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