CN104676545B - Heat sink, heat abstractor and LED bay light cooling system - Google Patents
Heat sink, heat abstractor and LED bay light cooling system Download PDFInfo
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- CN104676545B CN104676545B CN201510093466.5A CN201510093466A CN104676545B CN 104676545 B CN104676545 B CN 104676545B CN 201510093466 A CN201510093466 A CN 201510093466A CN 104676545 B CN104676545 B CN 104676545B
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- heat
- heat sink
- liquid
- heat abstractor
- radiator
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
- F21W2131/00—Use or application of lighting devices or systems not provided for in codes F21W2102/00-F21W2121/00
- F21W2131/40—Lighting for industrial, commercial, recreational or military use
- F21W2131/402—Lighting for industrial, commercial, recreational or military use for working places
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2101/00—Point-like light sources
Abstract
The present invention relates to a kind of heat sink, the heat sent for absorbing heater, the heater is close, is close to or is embedded in the one side of the heat sink, the another side of the heat sink is provided with multiple microprotrusions, form dimpling group, capillary slot road is provided between microprotrusion, and forms capillary slot group；The dimpling group and capillary slot group are immersed in liquid refrigerant, and capillary slot group forms capillary force, and the liquid refrigerant on capillary slot road side is drawn into micro-channel, and the thin liquid film region of phase-change heat-exchange is formed in micro-channel；The heat sink is additionally provided with reservoir, and the reservoir is arranged on the periphery, edge or outer rim that have microprotrusion face of the heat sink.It is avoided that because of external environment fluctuation or other reasonses, when causing the heat sink to tilt, and loses the condition of micro- liquid film evaporation condition, the problem of endothermic effect declines.The present invention relates to a kind of heat abstractor and LED bay light cooling system.
Description
Technical field
The invention belongs to technical field of heat dissipation, specially a kind of heat sink, heat abstractor and LED bay light radiating system
System.
Background technology
LED (light-emitting diode, Light-Emitting Diode) is considered as the new light sources of 21 century most worthy, it
There is short low-work voltage, reaction time, energy-efficient, working stability, long lifespan, pollution-free, high brightness, in city
The fields such as landscape, lighting of home, automobile tail light, LED backlight plate are just widely used, LED illumination substitution traditional lighting and
To be trend of the times as the major way of mankind's illumination.
The manufacture of great power LED at present is reachable towards high-performance, integrated and miniaturization, the power density of its chip
Hundreds of W/cm2.The electro-optical efficiency of great power LED is about 20%, and about 80% electric energy is converted to heat and distributed, therefore its
Heat flow density at chip is high.And LED junction temperature rise can cause luminous efficiency decline, the lost of life, luminescent spectrum to produce
Drift, serious can also burn chip, so radiating is that one of key problems-solving is needed in high-power LED illumination.
The existing various LEDs in market make cooler frequently with Natural Heat Convection, fan forced heat radiation or heat pipe method.
Wherein, hot pipe technique is George Ge Luofo of U.S. Los Alamos (Los Alamos) National Laboratory in 1963
One kind of (George Grover) invention is referred to as the heat transfer element of " heat pipe ", and it takes full advantage of heat-conduction principle and is situated between with refrigeration
The quick thermal transport property of matter, the heat of thermal objects is delivered to outside thermal source rapidly through heat pipe, its capacity of heat transmission, which exceedes, appoints
Oneself knows the capacity of heat transmission of metal for what.
Present heat pipe is widely used in radiator manufacturing, such as the high-power LED phase-change radiating that in the market is emerging
The stem of device just uses gravity assisted heat pipe technology, reference can be made to published Chinese patent, as number of patent application is
200810217336.8 entitled " a kind of vacuum liquid heat radiating device for LED lamp ", number of patent application are
201010216542.4 entitled " being used for the gravity type flat heat pipe radiator for cooling down LED ", number of patent application is
201010256523.4, entitled " a kind of heat-pipe radiator and make the high-power LED lamp of radiating element with it ", patent
Application No. 201010543821.1, entitled " a kind of improved high-efficient single direction heat transfer heat pipe for microelectronics radiating "
It is 201210006408.0 with number of patent application, entitled " the modified gravity force heat pipe radiator for being used for great power LED "
Deng patent document disclosure.
Traditional gravity heat pipe is mainly made up of shell, end cap and working medium three parts.The Temperature of Working of evaporation in gravity assisted heat pipe
It is higher, density is relatively low, there is the trend moved to gravity opposite direction.And the vapour volume in condensation process diminishes, density uprises,
With the trend moved to gravity direction.Therefore, gas rises to condensation segment and is condensed into liquid, and the heat-conducting medium of liquid is by gravity
Effect is back to evaporator section, completes thermal cycle, and heat is dispersed into external environment condition by fin.
Because traditional gravity heat pipe is also limited to the cooling capacity of LED chip, it is difficult to realize from high-power LED wick table
Face takes heat and externally radiated in time, its temperature is reduced in ideal range.Therefore occur again a kind of using liquid working substance core
The heat dissipating method of the high intensity micro-scale composite phase-change enhanced heat exchange of state boiling, it is referring specifically to number of patent application
201010152539.0, entitled " a kind of cavity-type light-emitting diode lamp ", during its work, the liquid in the fine conduit of open type
Body working medium, is flowed in the presence of capillary gradients along microflute, while extension meniscus surface area thin liquid film is formed in microflute
Evaporation and the high intensity micro-scale composite phase-change enhanced heat exchange process of intrinsic meniscus surface area thickness liquid film nucleate boiling, make liquid
Working medium becomes the caloric value that steam takes away LED chip.But there is the fluctuation or other originals due to external environment in this heat dissipating method
Cause, cause the inclination of heat control system, the problem of causing the forfeiture of micro- liquid film evaporation condition, this can trigger interior junction temperature superelevation, sternly
Quick dead lamp is resulted even in during weight.
The content of the invention
The technical problem to be solved in the present invention is：A kind of heat sink is provided, it is avoided that the suction using micro- liquid film evaporation
Thermal, because of external environment fluctuation or other reasonses, heat sink is caused to tilt, what caused micro- liquid film evaporation condition was lost asks
Topic.
While above-mentioned heat sink is provided, the present invention also provides a kind of heat abstractor including the heat sink.Also
A kind of LED bay light cooling system including the heat abstractor is provided.
In order to solve the above-mentioned technical problem, a kind of heat sink of present invention offer, the heat sent for absorbing heater,
Wherein, the heater is close, is close to or is embedded in the one side of the heat sink, and the another side of the heat sink is provided with
Multiple microprotrusions, dimpling group is formed, is provided with capillary slot road between microprotrusion, and form capillary slot group；The dimpling group
It is immersed in capillary slot group in liquid refrigerant, capillary slot group forms capillary force, by the liquid refrigerant on capillary slot road side
It is drawn into micro-channel, and the thin liquid film region of phase-change heat-exchange is formed in micro-channel；The heat sink is additionally provided with liquid storage
Groove, the reservoir are arranged on the periphery, edge or outer rim that have microprotrusion face of the heat sink.
Optionally, the reservoir is provided with multiple, and is symmetrically distributed in the edge or outer rim of the heat sink.
Optionally, the reservoir is the ring-type communicated, is arranged on the periphery of the heat sink.
Optionally, the heat sink also includes liquid-sucking core, and the liquid-sucking core is arranged in the microprotrusion.
Optionally, the liquid-sucking core is made of porous materials.
Optionally, the liquid-sucking core is formed by metal dust, metallic fiber or ceramic powders sintering.
Optionally, the liquid-sucking core is individually disposed in the single microprotrusion.
Optionally, the liquid-sucking core is arranged in the multiple microprotrusion with being at least partly interconnected.
Optionally, the liquid-sucking core of the interconnection is in network structure.
Optionally, the liquid-sucking core overall structure, it is arranged in all microprotrusions.
Optionally, the liquid-sucking core periphery offers one or more through hole.
Optionally, the liquid-sucking core is arranged on the top of the microprotrusion.
Optionally, the liquid-sucking core is arranged on the outer wall of the microprotrusion.
Optionally, the liquid-sucking core is arranged on the top and outer wall of the microprotrusion.
Optionally, the microprotrusion is shaped as zigzag, triangle, trapezoidal, arc and one kind in cylinder or two
The combination of the kind above.
Optionally, the micro-channel is shaped as zigzag, triangle, trapezoidal, arc and one kind in cylinder or two
The combination of the kind above.
Optionally, the liquid refrigerant is one or both of water, acetone, methanol, ethanol, liquid freon and liquefied ammonia
Composition above.
Optionally, the dimpling group and capillary slot group are partially immersed in liquid refrigerant in itself.
The heat abstractor of offer, including radiator and any of the above-described kind of heat sink, the radiator fill with the heat absorption
Closed cavity is formed between putting, the liquid refrigerant is arranged in the closed cavity.
Optionally, described heat abstractor also includes end cap, and the radiator is in the form of a column, and the end cap is arranged on described dissipate
At the top of hot body, the heat sink is arranged on the radiator bottom, shape between the end cap, radiator and the heat sink
Into closed cavity.
Optionally, the radiator and the heat sink are formed in one structure.
Optionally, the radiator is in the form of a column, and the heat sink is arranged on the radiator bottom, in the radiator
To be provided with longitudinal section be funnel-form fin on top, the spout of funnel of the funnel-form fin is towards the middle part of heat sink.
Optionally, the radiator is to include the sun fancy structure that skeleton and fin are formed.
Optionally, the skeleton and fin are hollow structure, the skeleton, fin hollow structure and the radiator and
The closed cavity formed between heat sink is connected.
Optionally, the radiator is hollow column structure, and the heat abstractor also includes radiating core, the radiating core
It is built in the hollow space of the radiator.
Optionally, the cross section of the fin be triangle, quadrangle, polygon, crescent, sickleshaped and it is arch-shaped in
One or more kinds of combinations.
Optionally, the longitudinal section of the fin is rectangle, S-shaped or spiral shape.
The LED bay light cooling system of offer, the heat sent for absorbing and shifting LED luminescence chips, wherein on also
Any described heat abstractor is stated, the LED luminescence chips are close, are close to or are embedded in the one side of the heat sink.
Heat sink of the present invention, the heat sent for absorbing heater, the heater is close, is close to or embedding
Enter the one side in the heat sink, the another side of the heat sink is provided with multiple microprotrusions, forms dimpling group, microprotrusion
Between be provided with capillary slot road, and form capillary slot group；The dimpling group and capillary slot group are immersed in liquid refrigerant,
Capillary slot group forms capillary force, and the liquid refrigerant on capillary slot road side is drawn into micro-channel, and the shape in micro-channel
Into the thin liquid film region of phase-change heat-exchange；The heat sink is additionally provided with reservoir, and the reservoir is arranged on the heat absorption dress
That puts has the periphery, edge or outer rim in microprotrusion face.Under normal circumstances, the liquid refrigerant in capillary slot road, in capillary pressure
Flowed in the presence of power gradient along microflute, while the evaporation of extension meniscus surface area thin liquid film and intrinsic meniscus are formed in microflute
The high intensity micro-scale composite phase-change enhanced heat exchange process of region thickness liquid film nucleate boiling, makes liquid refrigerant become steam and takes away
The caloric value of radiator.And when because of external environment fluctuation or other reasonses, when causing the heat sink to tilt, due to liquid refrigerant
Mobility, it is possible that work Mass lost in the capillary slot road in higher position, or working medium amount can not infiltrate it is micro-
In groove, the forfeiture of micro- liquid film evaporation condition may be caused.At this moment, the periphery, the edge that have microprotrusion face of heat sink are arranged on
Or liquid refrigerant is stored with the reservoir of outer rim, working medium supplement can be carried out to neighbouring capillary slot road in time, avoid it
Lose the condition of micro- liquid film evaporation condition, the caused portion temperature drastically raises, endothermic effect decline the problem of.
In further technical scheme, liquid-sucking core can also be set in the microprotrusion, the liquid-sucking core can be by
Porous material is made, work Mass lost or during without working medium in the capillary slot around the microprotrusion, the liquid stored in liquid-sucking core
Working medium can carry out working medium supplement to the capillary slot road, and it can also be avoided to lose the condition of micro- liquid film evaporation condition, caused
The portion temperature drastically raise, endothermic effect decline the problem of.
Heat abstractor provided by the invention is due to including above-mentioned heat sink, it may have corresponding technique effect.Entering
In the technical scheme of one step, the radiator and heat sink can use integrated formed structure, and such sealing effectiveness is more preferable, keeps away
Non-leaking.
In further technical scheme, the radiator can be to be in the form of a column, and the heat sink is arranged on described dissipate
Hot body bottom, it is funnel-form fin that the top in the radiator, which can be provided with longitudinal section, the funnel-form fin
Spout of funnel is towards the middle part of heat sink.During work, the heat of heater raises the heat sink temperature of radiator bottom, when
When reaching the phase transition temperature of working medium, the part of working medium can produce phase transformation, i.e., working medium switchs to steam state by liquid, steam state working medium by
Moved upwards after the limitation of column radiator inwall, reach the top rear steering of radiator, radiated by radiator more, steam state work
Matter condenses into liquid refrigerant to the cold, and liquid refrigerant is under gravity that funnel-form fin moves downward along longitudinal section, is passed through
Spout of funnel flows to the middle part of heat sink, and the general temperature in the middle part of heat sink is all relatively higher elsewhere, therefore this dissipates
Thermal has stronger radiating effect.
In further technical scheme, the radiator can be to include the sun fancy knot that skeleton and fin are formed
Structure, wherein the skeleton and fin are hollow structure, the skeleton, hollow structure and the radiator and the heat sink of fin
Between the closed cavity that is formed be connected.During work, steam state working medium can not only flow to ground cavity in radiator, and can flow to
Skeleton, fin hollow structure in.So when making an equal amount of heat abstractor, the radiator can obtain bigger dissipate
Hot area, so as to have more preferable radiating effect.
LED bay light cooling system provided by the invention is due to including above-mentioned heat abstractor, it may have corresponding technology
Effect.
Brief description of the drawings
Fig. 1 is the stereogram for representing the heat sink involved by present embodiment；
Fig. 2 is the sectional view of heat sink shown in Fig. 1；
Fig. 3 is partial enlarged drawing at A shown in Fig. 1；
Fig. 4 is the stereogram for representing the liquid-sucking core involved by present embodiment；
Fig. 5 is the configuration diagram for representing another liquid-sucking core involved by present embodiment；
Fig. 6 is the sectional view for representing the heat abstractor involved by present embodiment；
Fig. 7-Figure 10 is the sectional view for representing other several heat abstractors involved by present embodiment；
Figure 11 is the configuration diagram for representing the radiator involved by present embodiment；
Figure 12 is the top view of radiator shown in Figure 11.
In figure：
The thin liquid film region of 1 heat sink, 2 microprotrusion, 3 capillary slot road 31
31a meniscus 31b extends the intrinsic meniscus surface areas of meniscus thin liquid film region 31c
The fin of 4 reservoir, 5 radiator, 51 skeleton 52
The funnel-form fin of 6 liquid-sucking core, 7 through hole, 8 end cap 9
The heater of 91 fin fin 10
Embodiment
The present invention will be described in detail below in conjunction with the accompanying drawings, and the description of this part is only exemplary and explanatory, should not
There is any restriction effect to protection scope of the present invention.In addition, description of the those skilled in the art according to this document, can be right
Feature in this document in embodiment and in different embodiments carries out respective combination.
<Heat sink>
Refer to Fig. 1 and Fig. 2.Fig. 1 is the stereogram for representing the heat sink involved by present embodiment, and Fig. 2 is Fig. 1 institutes
Show the sectional view of heat sink.In the present embodiment, the one side of heat sink 1 can be provided with multiple microprotrusions 2, multiple dimplings
Play 2 and form dimpling group, capillary slot road 3 is formed between microprotrusion 2, multiple capillary slot roads 3 form capillary slot group；Dimpling group
It is immersed in capillary slot group in liquid refrigerant, capillary slot group forms capillary force, by the liquid refrigerant on the side of capillary slot road 3
It is drawn into micro-channel, and the thin liquid film region 31 of phase-change heat-exchange is formed in micro-channel.During work, heat sink utilizes thin liquid
Micro- liquid film evaporation augmentation of heat transfer mechanism of diaphragm area 31, using Working fluid phase changing potential with heat caused by heater, carries
The steam state working medium of potential radiates on radiator 5 is condensed into liquid refrigerant, is come back to by gravity reflux in micro-channel.This reality
Apply in example, heat sink 1 can use the material of high thermal conductivity to be made, such as copper, aluminium metal material, multiple microprotrusions 2
A face of heat sink 1 can be distributed in uniform intervals, the another side of heat sink 1 is close to heater.Certainly as needed,
One side that can also be by heater close to heat sink 1, or heater 10 is embedded in the one side of heat sink 1 (as schemed
Shown in 10), as long as being easy to carry out heat transfer between heater and heat sink.Refer to Fig. 3, the thin liquid film region 31
Micro- liquid film evaporation augmentation of heat transfer mechanism concrete principle be：The liquid working substance on conduit side is drawn into by capillary force in micro-channel
Micro-channel, simultaneously because the effect of surface tension of liquid, liquid working substance does not flood micro-channel, but is formed in micro-channel curved
Moon shape liquid level 31a so that the very thin thickness of liquid film in conduit, heat transfer resistance very little, while in meniscus 31a and conduit side
The small extension meniscus thin liquid film region 31b to micron dimension of thickness of liquid film is formed near wall contact point, when heating body heat content
When in incoming micro-channel, liquid working substance is flowed in the presence of capillary gradients along microflute, while extension is formed in microflute
Meniscus surface area thin liquid film evaporates and the high intensity micro-scale composite phase-change of intrinsic meniscus surface area 31c thickness liquid film nucleate boiling
Enhanced heat exchange process, liquid working substance is become steam and take away the heat of heater.Experiment shows, this micro-scale compound phase
Become the extraordinary phenomenon for the heat and mass that enhanced heat exchange process belongs under micro- space scale, it takes full advantage of the interface of micro-scale
Effect and dimensional effect take hot heat flow density to may be up to 100W/m the extraordinary strengthening mechanism that flows and exchange heat, its theoretical maximum2,
It is more taller than the highest heating heat flow density of current electronic device go out two orders of magnitude, be a kind of high performance cooling radiating side
Formula.
Fig. 1 and Fig. 2 are referred to again, and in the present embodiment, heat sink 1 is also provided with reservoir 4, the reservoir 4
It is arranged on the periphery for having microprotrusion face of heat sink.Reservoir 4 can be annular, and be centered around heat sink 1 has microprotrusion
The periphery in face.Certainly, reservoir 4 can also be arranged on to the edge or outer rim that have microprotrusion face of heat sink 1 as needed,
For example there are the edge in microprotrusion face or outer rim that 4~100 reservoirs 4 are symmetrically set in heat sink 1.The reservoir 4
Concrete structure can be square groove, arc groove or triangular groove.Because steam state working medium radiates condensation on radiator 5
Into liquid refrigerant, then come back to by gravity reflux in micro-channel, and micro-channel is to lean on capillary force by the liquid on conduit side
Body working medium is drawn into micro-channel, and liquid working substance can not flood micro-channel, and the amount of this liquid refrigerant for requiring to add is being closed
In the range of reason.If the liquid refrigerant amount filled is excessive, this micro- liquid film evaporation effect is just not present, and the work of heat sink is former
Comprehend and become pool boiling.And when liquid refrigerant amount in the reasonable scope when, if because heat sink 1 tilts or by extraneous wind
Shake pendulum, just occur that heat sink work Mass lost occurs with the direct contact portion of heater, or working medium amount can not infiltrate
To micro-channel, it may result in the portion temperature and drastically raise so that endothermic effect declines, or even burn-off phenomenon occurs.Now, store up
The working medium in reservoir 4 be present can add in neighbouring micro-channel in time, prevent micro-channel working medium amount from drying up, and cause part
Micro- liquid film evaporation condition in thin liquid film region 31 is lost.
Fig. 4 and Fig. 5 are referred to, in the present embodiment, heat sink 1 is also provided with liquid-sucking core 6, the liquid-sucking core 6
It is arranged in the microprotrusion 2.So, waved when heat sink 1 is tilted or blown by external wind, heat sink and heating occur
There is work Mass lost in the direct contact portion of body, or when working medium amount can not infiltrate micro-channel, the work being stored in liquid-sucking core 6
Matter can also add in the micro-channel around the microprotrusion 2 under it in time, prevent micro-channel working medium amount from drying up, and cause part
Micro- liquid film evaporation condition in thin liquid film region 31 is lost.Preferably, the liquid-sucking core 6 is made of porous materials, such as can be by
Metal dust, metallic fiber or ceramic powders sintering form.It is of course also possible to there are other porous materials to be made.It can so fill
Divide and absorb, store a certain amount of liquid working substance wherein.Specifically, the liquid-sucking core 6 can by the way of individually separated, if
Put in the single microprotrusion 2.For example the liquid-sucking core 6 can be set in all microprotrusions 2, can also be only in part
Set in microprotrusion 2.Certainly, the liquid-sucking core 6 can also use part to be connected with each other ground mode and be arranged on the multiple dimpling
Rise 2 on, as liquid-sucking core 6 be arranged to be connected with each other be in network structure.Preferably, the liquid-sucking core 6 is according to the layout of microprotrusion 2
Shape, it is arranged to a monoblock, is placed on the microprotrusion 2 (as shown in Figure 4).So it is easy to manufacture and install, reliability
It is higher.Further, the periphery of liquid-sucking core 6 of the monoblock offers one or more through hole 7.Such as in liquid-sucking core 6
Periphery symmetrically offer 2~20 through holes 7 (as shown in Figure 5).So, when the steam state working medium in thin liquid film region 31 is moved upwards
By liquid-sucking core 6 resistance when, can be moved upwards by the through hole 7 on the periphery of liquid-sucking core 6, certainly, liquid refrigerant moves downward
When, thin liquid film region 31 can also be flowed downwardly into by through hole 7.Preferably, the liquid-sucking core 6 can be arranged on the microprotrusion
On 2 top or/and the liquid-sucking core 6 is arranged on the outer wall of the microprotrusion 2.As long as it is easily installed and places.
In the present embodiment, the shape of the microprotrusion 2 could be arranged to zigzag, triangle, trapezoidal, arc and cylinder
Combination more than one or both of shape.It is of course also possible to by the micro-channel be shaped to zigzag, triangle,
Combination more than one or both of trapezoidal, arc and cylinder.For example the microprotrusion 2 is shaped to cylinder,
So relative equivalent be relatively large in diameter, difficulty of processing it is smaller.
In the present embodiment, the working medium that it is liquid under normal temperature and pressure that the liquid refrigerant, which can be, such as water, acetone, methanol
And ethanol；It under normal temperature and pressure is gaseous working medium that can also be, such as freon R11, R22, R-134a, liquefied ammonia etc., it is of course possible to
It is the composition of foregoing two or more liquid refrigerant.As long as it is appreciated that using with environment and heat sink material phase
Hold：With temperature control ability, you can with relatively low operating temperature (such as 50 DEG C or so evaporation) larger heat flow density can be realized
What the liquid refrigerant of heat absorption can serve as the system fills working medium.In addition, the dimpling group and capillary slot group in itself can be with
It is partially immersed in liquid refrigerant.In order to form thin liquid film region 31, micro- liquid film evaporation condition is constructed.Therefore, to adding
Liquid refrigerant filling weight need meet a relatively reasonable scope.
<Heat abstractor>
Refer to shown in Fig. 6 to Figure 10, the heat abstractor, including radiator 5 and above-mentioned heat sink 1, the radiating
Closed cavity is formed between body 5 and the heat sink 1, the liquid refrigerant is arranged in the closed cavity.So, heat absorption dress
Put 1 it is heated after, cavity built with the liquid working substance with the latent heat of vaporization become steam by micro- liquid film evaporation, carry potential
Steam state working medium radiated on radiator 5 and be condensed into liquid refrigerant, the micro-channel of heat sink 1 is come back to by gravity reflux
It is interior, form the circulation once radiated.Due to above-mentioned heat sink 1, can also produce corresponding technique effect, herein no longer
Repeat.
In the present embodiment, the heat abstractor can also include end cap 8, and the radiator 5 could be arranged to column, institute
State end cap 8 and be arranged on the top of radiator 5, the heat sink 1 is arranged on the bottom of radiator 5, the end cap 8, dissipated
Closed cavity is formed between hot body 5 and the heat sink 1, is so more convenient for manufacturing and installs.Preferably, the radiator
5 can use integrated formed structure with the heat sink 1, directly overall to manufacture together.So, its better tightness.More enter
One step, it is funnel-form fin 9 that the top in the radiator 5, which is provided with longitudinal section, the funnel of the funnel-form fin 9
Mouth is towards the middle part of heat sink 1.So, steam state working medium radiates on radiator 5 be condensed into liquid refrigerant after, dissipated through funnel-form
The spout of funnel of backing 9 flows directly into the middle part of heat sink 1, and the middle part of heat sink 1 is general all closer to heater, temperature
It is relatively higher, the evaporation of liquid refrigerant also faster, the thus more conducively flowing and circulation of working medium.Improved of course for further
Radiating effect, some fin fins 91 can also be set on the funnel-form fin 9.
Figure 11 and Figure 12 are referred to, in the present embodiment, the radiator 5, which can use, includes skeleton 51 and the structure of fin 52
Into sun fancy structure.Preferably described skeleton 51 and fin 52 can use hollow structure, the skeleton 51, fin 52
Hollow structure be connected with the closed cavity formed between the radiator 5 and heat sink 1.So steam state working medium not only may be used
To flow to the hollow space of heat sink 1, in the skeleton 51 that can also be flowed into, the hollow structure of fin 52, to improve radiating
Face, therefore distributing for steam state working medium heat is more beneficial for, improve radiating efficiency.Preferably, the cross section of the fin 52 can
Be arranged to triangle, quadrangle, polygon, crescent, sickleshaped and it is one or both of arch-shaped more than combination.Together
When, the longitudinal section of the fin 52 is rectangle, S-shaped or spiral shape.To increase area of dissipation, radiating efficiency is improved.
In the present embodiment, the radiator 5 can be hollow column structure, in the hollow space of the radiator 5
Radiating core is also provided with, further improves radiating effect.
<LED bay light cooling system>
On the basis of above-mentioned heat abstractor is provided, the embodiment of the present invention additionally provides a kind of LED bay light cooling system.
The LED bay light cooling system is used to absorbing and shifting the heat that LED luminescence chips are sent, and can include any of the above-described kind of radiating
Device, the LED luminescence chips are close, are close to or are embedded in the one side of the heat sink 1.Due to being filled with above-mentioned radiating
Put, can also produce corresponding technique effect, will not be repeated here.
Certainly, in order to realize that carrying out liquid refrigerant to the LED bay light cooling system fills, system actually may be used also
To fill mouth with what liquid refrigerant quantitatively filled comprising vacuumizing, and after the completion of liquid refrigerant is carried out to system and is filled, then it is right
System is sealed, it is ensured that system sealing and is not leaked.The technical side for filling and vacuumizing due to carrying out liquid working substance to system
Case, it is on the books in the prior art, as number of patent application is：CN201110253364.7, CN201310231790.X etc. are open
Patent document, also repeat no more herein.
Described above is only the preferred embodiment of the present invention, it is noted that for the ordinary skill people of the art
For member, under the premise without departing from the principles of the invention, some improvements and modifications can also be made, these improvements and modifications also should
It is considered as protection scope of the present invention.
Claims (26)
1. a kind of heat abstractor, including radiator, it is characterised in that also include being used for the heat absorption for absorbing the heat that heater is sent
Device, the heater is close, is close to or is embedded in the one side of the heat sink, and the another side of the heat sink is provided with
Multiple microprotrusions, dimpling group is formed, is provided with capillary slot road between microprotrusion, and form capillary slot group；The dimpling group
It is immersed in capillary slot group in liquid refrigerant, and the thin liquid film region of phase-change heat-exchange is formed in capillary slot road；The suction
Thermal is additionally provided with reservoir, and the reservoir is arranged on the periphery, the edge or outer that have microprotrusion face of the heat sink
Edge；Closed cavity is formed between the radiator and the heat sink, the liquid refrigerant is arranged in the closed cavity；Institute
To state heat sink and be arranged on the radiator bottom, it is funnel-form fin that the top in the radiator, which is provided with longitudinal section,
The spout of funnel of the funnel-form fin is towards the middle part of heat sink.
2. heat abstractor according to claim 1, it is characterised in that the reservoir is provided with multiple and symmetrical
In the edge of the heat sink or outer rim.
3. heat abstractor according to claim 2, it is characterised in that the reservoir is the ring-type communicated, is arranged on institute
State the periphery of heat sink.
4. heat abstractor according to claim 1, it is characterised in that the heat sink also includes liquid-sucking core, the suction
Wick-containing is arranged in the microprotrusion.
5. heat abstractor according to claim 4, it is characterised in that the liquid-sucking core is made of porous materials.
6. heat abstractor according to claim 5, it is characterised in that the liquid-sucking core by metal dust, metallic fiber or
Ceramic powders sintering forms.
7. heat abstractor according to claim 4, it is characterised in that the liquid-sucking core is individually disposed on single described
In microprotrusion.
8. heat abstractor according to claim 4, it is characterised in that the liquid-sucking core is set with being at least partly interconnected
In the multiple microprotrusion.
9. heat abstractor according to claim 8, it is characterised in that the liquid-sucking core of the interconnection is in network structure.
10. heat abstractor according to claim 4, it is characterised in that the liquid-sucking core overall structure, be arranged on all institutes
State in microprotrusion.
11. heat abstractor according to claim 10, it is characterised in that the liquid-sucking core periphery offers one or two
Through hole above.
12. heat abstractor according to claim 4, it is characterised in that the liquid-sucking core is arranged on the top of the microprotrusion
In portion.
13. heat abstractor according to claim 4, it is characterised in that the liquid-sucking core is arranged on the outer of the microprotrusion
On wall.
14. heat abstractor according to claim 4, it is characterised in that the liquid-sucking core is arranged on the top of the microprotrusion
In portion and outer wall.
15. heat abstractor according to claim 1, it is characterised in that the microprotrusion is shaped as zigzag, triangle
Combination more than one or both of shape, trapezoidal, arc and cylinder.
16. heat abstractor according to claim 1, it is characterised in that the micro-channel is shaped as zigzag, triangle
Combination more than one or both of shape, trapezoidal, arc and cylinder.
17. heat abstractor according to claim 1, it is characterised in that the liquid refrigerant is water, acetone, methanol, second
Composition more than one or both of alcohol, liquid freon and liquefied ammonia.
18. heat abstractor according to claim 1, it is characterised in that the dimpling group and capillary slot group part in itself
It is immersed in liquid refrigerant.
19. heat abstractor according to claim 1, it is characterised in that be also in the form of a column including end cap, the radiator, institute
End cap is stated to be arranged at the top of the radiator, the heat sink is arranged on the radiator bottom, the end cap, radiator and
Closed cavity is formed between the heat sink.
20. heat abstractor according to claim 19, it is characterised in that the radiator is integrated with the heat sink
Molding structure.
21. heat abstractor according to claim 1, it is characterised in that the radiator is to include skeleton and fin composition
Sun fancy structure.
22. heat abstractor according to claim 21, it is characterised in that the skeleton and fin are hollow structure, described
Skeleton, the hollow structure of fin are connected with the closed cavity formed between the radiator and heat sink.
23. heat abstractor according to claim 21, it is characterised in that the radiator is hollow column structure, institute
Stating heat abstractor also includes radiating core, and the radiating core is built in the hollow space of the radiator.
24. heat abstractor according to claim 21, it is characterised in that the cross section of the fin is polygon, crescent moon
Shape, sickleshaped and it is one or both of arch-shaped more than combination.
25. heat abstractor according to claim 21, it is characterised in that the longitudinal section of the fin is rectangle, S-shaped or spiral shell
Revolve shape.
26. a kind of LED bay light cooling system, the heat sent for absorbing and shifting LED luminescence chips, it is characterised in that
Also include the heat abstractor any one of claim 1 to 25, the LED luminescence chips are close, be close to or are embedded in institute
State the one side of heat sink.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510093466.5A CN104676545B (en) | 2015-03-03 | 2015-03-03 | Heat sink, heat abstractor and LED bay light cooling system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510093466.5A CN104676545B (en) | 2015-03-03 | 2015-03-03 | Heat sink, heat abstractor and LED bay light cooling system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104676545A CN104676545A (en) | 2015-06-03 |
| CN104676545B true CN104676545B (en) | 2018-01-12 |
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| CN201510093466.5A Active CN104676545B (en) | 2015-03-03 | 2015-03-03 | Heat sink, heat abstractor and LED bay light cooling system |
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Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105221941A (en) * | 2015-10-28 | 2016-01-06 | 福建中科芯源光电科技有限公司 | Tool strengthening multi-layer leads the LED bay light of heat-sinking capability |
| FR3043448B1 (en) * | 2015-11-05 | 2019-10-04 | Valeo Vision | COOL-COOLED LIGHT MODULE WITH TEXTURED SURFACE |
| CN106641761B (en) * | 2017-01-17 | 2023-11-24 | 北京印刷学院 | Direct-cooling type LED light source based on heat pipe principle |
| CN107101142A (en) * | 2017-04-28 | 2017-08-29 | 广州虎辉照明科技公司 | A kind of LED High-Pole Lamps |
| CN109882810B (en) * | 2017-12-06 | 2024-03-19 | 中国科学院工程热物理研究所 | Radiator device of full-angle LED projection lamp |
| CN108332174B (en) * | 2018-02-07 | 2019-12-24 | 武汉大学 | Heat dissipation system and method applied to light emitting surface of high-power LED lighting equipment |
| CN109307252B (en) * | 2018-09-10 | 2021-03-19 | 长春希达电子技术有限公司 | Phase change liquid and heat transmission module containing same |
| CN110351981B (en) * | 2019-06-25 | 2021-03-26 | 南京理工大学 | High heat flux density spray cooling device and system |
| CN110381700B (en) * | 2019-06-25 | 2020-12-04 | 南京理工大学 | Spraying chamber and steam chamber integral type phase transition cooling device and system |
| CN110381701B (en) * | 2019-06-25 | 2020-12-04 | 南京理工大学 | Spray cooling device with combined steam cavity and composite microstructure |
| CN114153092B (en) * | 2021-12-09 | 2024-02-09 | 武汉华星光电技术有限公司 | Backlight module and display device |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7784972B2 (en) * | 2006-12-22 | 2010-08-31 | Nuventix, Inc. | Thermal management system for LED array |
| CN101667561B (en) * | 2009-09-04 | 2012-05-23 | 厦门大学 | Silicon-based vapor-liquid phase separating heat radiation chip and preparation method thereof |
| CN201636634U (en) * | 2010-04-21 | 2010-11-17 | 中国科学院工程热物理研究所 | Cavity-type light-emitting diode lamp |
| CN204513305U (en) * | 2015-03-03 | 2015-07-29 | 湖南中科热控技术有限公司 | Heat sink, heat abstractor and LED bay light cooling system |
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Effective date of registration: 20220225 Address after: 226000 Room 101, building 18, Tian'an Digital City, No. 199, Shennan Road, Yongxing street, Chongchuan District, Nantong City, Jiangsu Province Patentee after: Huadenggao energy saving technology (Jiangsu) Co.,Ltd. Address before: 226000 east side of the third floor of Building 5, No.9, Xindong Road, Nantong Development Zone, Jiangsu Province Patentee before: NANTONG ZHONGKE THERMAL CONTROL TECHNOLOGY Co.,Ltd. |