CN106641761B - Direct-cooling type LED light source based on heat pipe principle - Google Patents
Direct-cooling type LED light source based on heat pipe principle Download PDFInfo
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- CN106641761B CN106641761B CN201710030673.5A CN201710030673A CN106641761B CN 106641761 B CN106641761 B CN 106641761B CN 201710030673 A CN201710030673 A CN 201710030673A CN 106641761 B CN106641761 B CN 106641761B
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- 238000001816 cooling Methods 0.000 title claims abstract description 36
- 239000007788 liquid Substances 0.000 claims abstract description 156
- 230000017525 heat dissipation Effects 0.000 claims abstract description 23
- 230000008016 vaporization Effects 0.000 claims abstract description 3
- 238000010521 absorption reaction Methods 0.000 claims abstract 9
- 239000011521 glass Substances 0.000 claims description 17
- 238000007789 sealing Methods 0.000 claims description 8
- 239000012780 transparent material Substances 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 6
- 239000006260 foam Substances 0.000 claims description 5
- 239000011324 bead Substances 0.000 claims description 4
- 239000000919 ceramic Substances 0.000 claims description 4
- 239000011494 foam glass Substances 0.000 claims description 3
- 239000002861 polymer material Substances 0.000 claims description 3
- 239000010409 thin film Substances 0.000 claims description 3
- 239000011147 inorganic material Substances 0.000 claims description 2
- 239000011368 organic material Substances 0.000 claims description 2
- 239000011152 fibreglass Substances 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 11
- 238000005286 illumination Methods 0.000 abstract description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000003365 glass fiber Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- 238000002309 gasification Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 229920002545 silicone oil Polymers 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 241001465382 Physalis alkekengi Species 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/51—Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Led Device Packages (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The application belongs to the field of LED illumination, and particularly provides a direct-cooling type LED light source based on a heat pipe principle. The application aims to solve the problem of poor heat conduction and heat dissipation effects of the traditional LED chip. For this purpose, the direct-cooling type LED light source based on the heat pipe principle comprises a shell, an LED chip and a strip capillary structure liquid absorption core, wherein the LED chip and the strip capillary structure liquid absorption core are arranged in the shell, the shell comprises a light emitting part and a liquid storage part, the main body of the strip capillary structure liquid absorption core is arranged in the light emitting part, the LED chip is arranged near the main body of the strip capillary structure liquid absorption core or embedded in a groove or a hole on the strip capillary structure liquid absorption core, and the liquid storage part stores liquid insulating working media. The strip capillary structure liquid absorption core can absorb the liquid insulating working medium, so that the LED chip arranged near the strip capillary structure liquid absorption core can directly cool the LED chip by vaporizing the liquid insulating working medium absorbed by the strip capillary structure liquid absorption core, and the service life and the luminous efficiency of the LED light source are greatly improved.
Description
Technical Field
The application belongs to the field of LED illumination, and particularly provides a direct-cooling type LED light source based on a heat pipe principle, which is particularly used for a high-power LED chip.
Background
Since the LED became the fourth generation light source, the LED industry has rapidly developed and gradually occupied the entire lighting field, and along with the continuous popularization of applications, users have also put higher demands on their performance. Experimental study proves that the junction temperature of the LED has direct influence on the light attenuation and the service life of the LED, and the junction temperature of the LED is higher, the lower the light efficiency is, the larger the light attenuation is, and the service life is shorter. According to Arrhenius rule, the junction temperature of the LED is reduced by 2 times in a certain temperature range, so that more and more technicians are focusing on the heat conduction and heat dissipation of the LED chip in order to improve the performance of the LED. At present, almost all LED lamps adopt an aluminum-based circuit board, and in order to achieve good electric and heat conduction effects, a circuit layer (i.e. copper foil) of the aluminum-based circuit board usually has a certain thickness and width, and an insulating layer is arranged below the circuit layer. When the circuit board works, the LED chip generates a large amount of heat, and the heat needs to be transferred to the radiator through the insulating layer, and the heat conduction of the LED chip is necessarily lower because the insulating property and the heat conduction of the material are generally inversely proportional to each other in the prior art, and the insulating layer has good insulating property.
In order to further improve the performance of the LED, the problems of heat conduction and heat dissipation of the LED chip have become a problem to be solved on the development road of the LED. Because the LED light source does not have the radiation heat dissipation function, the heat transfer that the LED chip produced is received the heat conduction capacity restriction of insulating layer in the aluminium base board to the radiator in-process, and the LED lamps and lanterns can only be through increasing the mode that the radiator derived heat to accelerate the heat dissipation, have many kinds of radiators on the market at present, but comprehensive heat dissipation performance is not ideal. For example, an aluminum alloy radiator mainly achieves the effect of rapid heat dissipation through heat conduction of the radiating fins, but the radiating fins cannot be manufactured to be thin enough in the prior art, so that the radiating area cannot be maximized, and the radiating effect is poor.
In order to solve the above problems, the present inventors propose a high-power LED light source based on the heat pipe principle in chinese patent application CN105633259 a. The high-power LED light source comprises a light-emitting part, a liquid storage part for storing liquid insulating working media and a heat dissipation part. The luminous part is used for sucking the liquid insulating working medium through the capillary suction principle, so that the liquid insulating working medium is filled around the LED chip, and the LED chip is directly cooled. However, the applicant found that the capillary phenomenon of the light emitting part of the structure is not obvious enough to influence the vapor-liquid circulation, and the effect of the LED light source in practical application is still not particularly ideal. Accordingly, there is still a need in the art for a new direct-cooled LED light source that addresses the above-described problems.
Disclosure of Invention
In order to solve the above problems in the prior art, that is, in order to solve the problem that the heat conduction and heat dissipation effects of the existing LED chip are poor, the present application provides a direct-cooling LED light source based on the heat pipe principle, which includes a housing and at least one LED chip disposed in the housing, the housing includes a light emitting portion and a liquid storage portion, the LED chip is disposed in the light emitting portion, and the liquid storage portion stores a liquid insulating working medium.
In the above preferred technical solution of the direct-cooling LED light source, one end of the strip-shaped capillary structure wick is disposed in the liquid insulating working medium, and the other end and the main body of the strip-shaped capillary structure wick are disposed in the light emitting portion.
In the preferred technical scheme of the direct-cooling type LED light source, at least one groove or hole is formed in the body of the strip-shaped capillary wick, and the LED chip is arranged in the groove or hole.
In the preferred technical scheme of the direct-cooling LED light source, at least one side of the strip capillary wick is provided with a plurality of protrusions, and each LED chip is arranged between two adjacent protrusions.
In the above-described preferred embodiment of the direct-cooling LED light source, each of the LED chips is disposed at a position between two adjacent protrusions such that the LED chip is closer to the protrusion on the liquid storage portion side.
In the above preferred technical solution of the direct-cooling LED light source, at least a part of the light emitting portion is made of a transparent material, and the transparent material is transparent glass or transparent ceramic or fluorescent glass or fluorescent film glass or is made of a transparent material but insoluble in a liquid insulating working medium, such as an inorganic material, an organic material, and a polymer material.
In the preferred technical scheme of the direct-cooling type LED light source, the strip-shaped capillary structure liquid absorbing core is made of glass beads or a foam body with a capillary structure formed by sintering glass fibers at high temperature; or foam with capillary structure made of other transparent inorganic, organic, high polymer materials which are insoluble in liquid insulating working medium.
In the preferred embodiment of the direct-cooling LED light source, an internal circuit is further provided in the light emitting portion, the LED chip is connected to the internal circuit, and the internal circuit is connected to a pin provided on the housing so as to be connected to an external power source.
In the above-mentioned preferred technical solution of the direct-cooling LED light source, the direct-cooling LED light source further includes a cold end of the heat pipe of the heat dissipation portion, and the heat dissipation portion contacts with the liquid storage portion, so as to quickly reduce the temperature of the liquid insulating working medium in the liquid storage portion.
In the above preferred technical solution of the direct-cooling LED light source, the connection mode of the light emitting portion and the liquid storage portion and the connection mode of the liquid storage portion and the heat dissipation portion are integrated sealing connection or separable connection.
As can be appreciated by those skilled in the art, in the technical solution of the present application, the direct-cooling LED light source includes a housing, and an LED chip and a strip capillary wick disposed in the housing, where the housing includes a light emitting portion and a liquid storage portion, the liquid storage portion stores a liquid insulating working medium therein, the body of the strip capillary wick is disposed in the light emitting portion, and at least one cavity is separated in the light emitting portion, and the LED chip is disposed near the body of the strip capillary wick or is embedded in a groove or hole on the strip capillary wick. Because the strip capillary structure liquid absorbing core separates a plurality of cavities in the light emitting part, when the LED chip arranged on or near the strip capillary structure liquid absorbing core generates heat, the liquid insulating material absorbed in the strip capillary structure liquid absorbing core can be vaporized to the greatest extent and discharged into the cavities, condensed into liquid at the cold end, and the cooled liquid is absorbed by the liquid absorbing core to realize the vapor-liquid circulation of the heat pipe, thereby greatly improving the cooling effect of the LED light source and prolonging the service life of the LED light source
Drawings
Fig. 1 is a cross-sectional view of a first embodiment of a direct-cooled LED light source according to the present application based on the heat pipe principle.
Fig. 2 is a cross-sectional view of a second embodiment of the direct-cooled LED light source based on the heat pipe principle of the present application.
Detailed Description
Preferred embodiments of the present application are described below with reference to the accompanying drawings. It should be understood by those skilled in the art that these embodiments are merely for explaining the technical principles of the present application, and are not intended to limit the scope of the present application. Those skilled in the art can adapt it as desired to suit a particular application. For example, although the direct-cooled LED light source is described in the specification in connection with cooling LED chips, it is apparent that the present application can also be applied to cooling other light sources, and such changes in application objects do not deviate from the basic principle of the present application and thus fall within the scope of the present application.
It should be noted that, in the description of the present application, terms such as "upper", "lower", "left", "right", "inner", "outer", "near", and the like indicate directions or positional relationships based on the directions or positional relationships shown in the drawings, which are merely for convenience of description, and do not indicate or imply that the apparatus or elements must have a specific orientation, be constructed and operated in a specific orientation, and thus are not to be construed as limiting the present application. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
Furthermore, it should be noted that, in the description of the present application, unless explicitly specified and limited otherwise, the terms "disposed," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present application can be understood by those skilled in the art according to the specific circumstances.
As shown in fig. 1, which is a cross-sectional view of a first embodiment of the direct-cooling LED light source based on the heat pipe principle of the present application, the first embodiment of the direct-cooling LED light source of the present application includes a housing 1 and at least one LED chip 2 provided in the housing 1, the housing 1 including a light emitting portion 8 and a liquid storage portion 9. It should be noted that, the connection manner of the light emitting portion 8 and the liquid storage portion 9 may be an integrated sealing connection or a separable connection, and the connection portion of the light emitting portion 8 and the liquid storage portion 9 is set so that the housing 1 has good sealing property. The LED chip 2 is arranged in the light-emitting part 8, and the liquid insulating working medium 5 is stored in the liquid storage part 9. In addition, four strip-shaped capillary structure liquid absorbing cores 4 are further arranged in the shell 1, five cavities 7 are separated by the four strip-shaped capillary structure liquid absorbing cores 4 in the light-emitting part 8, the upper ends and the main bodies of the strip-shaped capillary structure liquid absorbing cores 4 are arranged in the light-emitting part 8, the lower ends of the strip-shaped capillary structure liquid absorbing cores are arranged in the liquid insulating working medium 5 of the liquid storage part 9, and the liquid insulating working medium 5 stored in the liquid storage part 9 can be absorbed. As will be appreciated by those skilled in the art, at least a portion of the light emitting portion 8 is made of a transparent material, preferably transparent glass or transparent ceramic or fluorescent glass or fluorescent thin film glass, so that light emitted from the LED chip 2 provided in the light emitting portion 8 can be irradiated to the outside of the light emitting portion 8. In addition, it should be noted that the number and positions of the strip-shaped capillary structure liquid absorbing cores 4 disposed in the housing 1 are not constant, and a designer can set the number and distribution of the strip-shaped capillary structure liquid absorbing cores 4 by himself in combination with specific situations, so long as the strip-shaped capillary structure liquid absorbing cores 4 can absorb the liquid insulating working medium 5, and the main body of the strip-shaped capillary structure liquid absorbing cores 4 can separate at least one cavity 7 in the light emitting portion 8.
With continued reference to fig. 1, when the LED light source is turned on, the heat generated by the LED chip 2 disposed in the light emitting portion 8 can vaporize the liquid insulating working medium 5 in the wick 4 with a nearby strip-shaped capillary structure and generate steam, and due to the cavity 7, the steam of the liquid insulating working medium 5 can flow back down the cavity 7 into the liquid storage portion 9, then be liquefied when the cooling portion encounters cold, the air pressure is reduced, and then be absorbed into the light emitting portion 8 again by the wick 4 with a strip-shaped capillary structure, thereby realizing vapor-liquid circulation. Specifically, in the first embodiment, each of the strip-shaped capillary wick 4 is provided with a plurality of grooves 11, the LED chip 2 is embedded in the groove 11, the four side surfaces of the groove 11 and the four side surfaces of the LED chip 2 may be provided with an interference fit, the LED chip 2 is fixed in the groove 11 in the mounted state, and the inner surface and the four side surfaces of the LED chip 2 are surrounded by the surfaces of the groove 11. When the LED light source is turned on, the temperature of the LED chip 2 is gradually increased, and a large amount of heat is generated, at this time, the heat generated by the LED chip 2 is continuously absorbed by the liquid insulating working medium 5 surrounding the LED chip 2, and the liquid insulating working medium 5 surrounding the LED chip 2 is continuously vaporized into a gas state because of absorbing the heat, meanwhile, more heat generated by the LED chip 2 can be taken away, and the steam of the liquid insulating working medium 5 moves to the surface of the liquid insulating working medium 5 stored in the liquid storage part 9 along the cavity 7, then is liquefied when encountering cold, and can be absorbed again by the strip capillary structure liquid absorbing core 4, so that the steam-liquid circulation is formed, the flow rate of the liquid insulating working medium 5 is greatly improved, and the temperature of the LED chip 2 is reduced to the greatest extent. As will be appreciated by those skilled in the art, the strip capillary wick 4 is arranged such that at least one recess 11 can be provided in the strip capillary wick 4, and the LED chip 2 can be mounted in the recess 11. Furthermore, it is preferable that the wick 4 of a capillary structure in the form of a strip is made of glass beads, glass fibers, foam glass, or a foam having a capillary structure made of an inorganic, organic, polymer or the like material that is transparent but insoluble in a liquid insulating working medium, for example, a foam made of a PC material. Finally, it should be noted that the grooves 11 provided in the wick 4 with a strip-shaped capillary structure may be through holes, and the grooves or holes 11 may be in clearance fit with the LED chip 2, so long as most of the surface of the LED chip 2 is surrounded by the grooves or holes 11.
With continued reference to fig. 1, the direct-cooling LED light source further includes a heat dissipation portion 6, where the heat dissipation portion 6 contacts with the liquid storage portion 9 to quickly reduce the temperature of the liquid insulating working medium 5 in the liquid storage portion 9, and it should be noted that the connection mode of the heat dissipation portion 6 and the liquid storage portion 9 may be integrated sealing connection or separable connection. And, the heat radiating portion 6 is structured so that the temperature of the liquid insulating working medium 5 in the liquid storage portion 9 can be rapidly reduced. As an example, the heat sink 6 may be provided as an air-cooled or liquid-cooled heat exchanger surrounding the reservoir 9. In addition, an internal circuit (not shown in the drawing) to which the LED chip 2 is connected is also provided in the light emitting section 8, and the internal circuit is connected with the pins 10 so as to be connected to an external power source. It will be appreciated by those skilled in the art that the arrangement of the internal circuit is specifically set according to the needs of the designer, and that the location of the pins 10 is not constant, and that the structure of the pins 10 is such that the internal circuit can be connected to an external power source through the pins 10.
With continued reference to fig. 1, in the specific operation of the direct-cooling LED light source, the temperature of the LED chip 2 disposed in the light emitting portion 8 gradually increases, and at the same time, the liquid insulating working medium 5 around the LED chip 2 continuously absorbs the heat generated by the LED chip 2 and is vaporized, accordingly, since the heat generated by the LED chip 2 is absorbed by the liquid insulating working medium 5, the temperature of the LED chip 2 is reduced, and the temperature is controlled near the boiling point of the liquid working medium. The heat generated by the LED chip 2 can vaporize the surrounding liquid insulating working medium 5 and generate steam, the steam of the liquid insulating working medium 5 moves to the surface of the liquid insulating working medium 5 stored in the liquid storage part 9 along the cavity 7, and then is liquefied when encountering cold, and is absorbed again by the strip capillary wick 4, so that circulation is formed, the flow rate of the liquid insulating working medium 5 is greatly improved, and the temperature of the LED chip 2 is reduced to the greatest extent. In addition, the heat dissipation part 6 makes the temperature of the liquid insulating working medium 5 in the liquid storage part 9 quickly decrease, the vapor of the liquid insulating working medium 5 in the light emitting part 8 dissipates heat by releasing heat into the liquid insulating working medium 5 stored in the liquid storage part 9, and meanwhile, the vapor of the liquid insulating working medium 5 is subjected to liquefaction reaction and reenters the liquid storage part 9, at this time, the temperature of the LED chip 2 is reduced through the liquid insulating working medium 5 near the continuous gasification groove 11, the cooling cycle process is accelerated, and the LED chip 2 has a good cooling effect.
Further, it is also possible to provide a plurality of protrusions on at least one side of the strip-shaped capillary structure wick 4, and then to provide the LED chip 2 between adjacent two of the protrusions. Specifically, as shown in fig. 2, which is a sectional view of a second embodiment of the direct-cooling LED light source based on the heat pipe principle of the present application, the second embodiment of the direct-cooling LED light source of the present application includes a housing 1 and at least one LED chip 2 provided in the housing 1, the housing 1 including a light emitting portion 8 and a liquid storage portion 9. As will be appreciated by those skilled in the art, the connection manner of the light emitting portion 8 and the liquid storage portion 9 may be an integrated sealing connection or a separable connection, and the connection portion of the light emitting portion 8 and the liquid storage portion 9 is configured so that the housing 1 has good sealing property. The LED chip 2 is disposed in the light emitting portion 8, the liquid storage portion 9 stores therein the liquid insulating working medium 5, in addition, the housing 1 is further provided therein with three strip capillary structure liquid absorbing cores 4, the three strip capillary structure liquid absorbing cores 4 divide four cavities 7 in the light emitting portion 8, the upper end and the main body of the strip capillary structure liquid absorbing cores 4 are disposed in the light emitting portion 8, the lower end thereof is disposed in the liquid insulating working medium 5, and the liquid insulating working medium 5 in the liquid storage portion 9 can be absorbed. It is also understood by those skilled in the art that at least a part of the light emitting part 8 is made of a transparent material, preferably transparent glass or transparent ceramic or fluorescent glass or fluorescent thin film glass, so that light emitted from the LED chip 2 provided in the light emitting part 8 can be irradiated to the outside of the light emitting part 8. It should be further noted that the number and positions of the strip-shaped capillary structure liquid absorbing cores 4 disposed in the housing 1 are not constant, and a designer may set the number and distribution of the strip-shaped capillary structure liquid absorbing cores 4 by himself in combination with specific situations, so long as the strip-shaped capillary structure liquid absorbing cores 4 are ensured to absorb the liquid insulating working medium 5, and the main body of the strip-shaped capillary structure liquid absorbing cores 4 can separate at least one cavity 7 in the light emitting portion 8.
With continued reference to fig. 2, the heat generated by led chip 2 is capable of vaporizing the liquid insulating working medium 5 in the nearby wick 4 in a strip-like capillary structure and generating vapor, which can flow back down the cavity 7 separated by wick 4 into reservoir 9 and thus be cooled to a liquid. The strip capillary wick 4 is provided with a plurality of protrusions 3 on both sides, the LED chip 2 is disposed between two adjacent protrusions 3, and the protrusions 3 closer to the lower side are arranged so that the vapor near the LED chip 2 generates a "coanda effect", that is, the vapor near the LED chip 2 will adhere to the wall of the protrusions 3 closer to the lower side, so that a negative pressure is generated near the protrusions 3 closer to the upper side, thereby sucking out the liquid insulating working medium 5 absorbed by the strip capillary wick 4 more quickly, and further greatly improving the flow circulation rate of the liquid insulating working medium 5. As will be appreciated by those skilled in the art, the structure of the strip-shaped capillary structure wick 4 is such that at least one side of the strip-shaped capillary structure wick 4 is provided with a plurality of protrusions 3, and the structure of the protrusions 3 is such that one LED chip 2 can be provided between two adjacent protrusions 3. Furthermore, it is preferable that the wick 4 of a capillary structure in the form of a strip is made of glass beads, glass fibers, foam glass, or transparent, but liquid insulating working substance-insoluble inorganic, organic, polymer, or the like material, such as PC material.
With continued reference to fig. 2, the direct-cooling LED light source further includes a heat dissipation portion 6, where the heat dissipation portion 6 contacts with the liquid storage portion 9, so as to quickly reduce the temperature of the liquid insulating working medium 5 in the liquid storage portion 9. It should be noted that, the connection manner of the heat dissipation portion 6 and the liquid storage portion 9 may be an integrated sealing connection or a separable connection, and the structure of the heat dissipation portion 6 is set so that the temperature of the liquid insulating working medium 5 in the liquid storage portion 9 can be rapidly reduced. As an example, the heat sink 6 may be provided as an air-cooled or liquid-cooled heat exchanger surrounding the reservoir 9. In addition, an internal circuit (not shown in the drawing) to which the LED chip 2 is connected is also provided in the light emitting section 8, and the internal circuit is connected to the pin 10 so as to be connected to an external power source. It will be appreciated by those skilled in the art that the arrangement of the internal circuit is specifically set according to the needs of the designer, and that the location of the pins 10 is not constant, and that the structure of the pins 10 is such that the internal circuit can be connected to an external power source through the pins 10.
With continued reference to fig. 2, in the specific operation of the direct-cooling LED light source, the temperature of the LED chip 2 disposed in the light emitting portion 8 gradually increases, and at the same time, the liquid insulating working medium 5 around the LED chip 2 continuously absorbs the heat generated by the LED chip 2 and is vaporized, and accordingly, the temperature of the LED chip 2 is reduced because the heat generated by the LED chip 2 is absorbed by the liquid insulating working medium 5. Because the heat generated by the LED chip 2 can vaporize the surrounding liquid insulating working medium 5 and generate steam, in addition, the LED chip 2 is disposed between two adjacent protrusions 3 and closer to the lower protrusion 3, so that the steam near the LED chip 2 is continuously attached to the wall of the lower protrusion 3, so that negative pressure is generated near the upper protrusion 3, thereby sucking the liquid insulating working medium 5 absorbed by the strip capillary wick 4 more quickly, and further greatly improving the flow circulation rate of the liquid insulating working medium 5. In addition, the heat dissipation part 6 makes the temperature of the liquid insulating working medium 5 in the liquid storage part 9 quickly decrease, the steam in the light emitting part 8 releases heat into the liquid insulating working medium 5 to realize heat dissipation, and the liquefaction reaction is simultaneously recovered by the liquid storage part 9, at the moment, the LED chip 2 is cooled through the liquid insulating working medium 5 nearby the continuous gasification, the cooling process is accelerated, and the LED chip 2 has a good cooling effect.
Finally, the selection of the liquid insulating working medium needs to comprehensively consider multiple factors such as conductivity, boiling point, light transmittance, flowing property, heat transfer coefficient, and affinity reaction with glass, and the like, and the low-viscosity silicone oil is preferably selected as the liquid insulating working medium used by the application, especially the dimethyl silicone oil, and can also be selected from ethanol and diethyl ether. It is further understood by those skilled in the art that the filling amount of the liquid insulating working medium should comprehensively consider two factors of the thermal resistance of the liquid storage part and the heat transfer capability of the liquid insulating working medium, so that the cooling effect of the LED chip reaches the optimal state.
Thus far, the technical solution of the present application has been described in connection with the accompanying drawings, but it is easily understood by those skilled in the art that the scope of protection of the present application is not limited to these specific embodiments. Equivalent modifications and substitutions for related technical features may be made by those skilled in the art without departing from the principles of the present application, and such modifications and substitutions will fall within the scope of the present application.
Claims (8)
1. The direct cooling type LED light source based on the heat pipe principle comprises a shell and at least one LED chip arranged in the shell, wherein the shell comprises a light-emitting part and a liquid storage part, the LED chip is arranged in the light-emitting part, liquid insulating working medium is stored in the liquid storage part,
the LED chip is characterized in that at least one strip capillary structure liquid suction core is arranged in the shell, the strip capillary structure liquid suction core is divided into at least one cavity in the light-emitting part, and the strip capillary structure liquid suction core can absorb liquid insulating working medium in the liquid storage part, so that the LED chip arranged in the light-emitting part can be cooled by vaporizing the liquid insulating working medium absorbed by the strip capillary structure liquid suction core;
one end of the strip capillary structure liquid suction core is arranged in the liquid insulating working medium, and the other end and the main body of the strip capillary structure liquid suction core are arranged in the light-emitting part;
at least one side of the strip capillary structure liquid absorption core is provided with a plurality of protrusions, and each LED chip is arranged between two adjacent protrusions;
each of the LED chips is disposed at a position between two adjacent protrusions such that the LED chip is closer to the protrusion on the liquid storage portion side;
the vapor in the vicinity of the LED chip is continuously attached to the wall of the protrusion closer to the lower side, so that negative pressure is generated in the vicinity of the protrusion on the upper side.
2. The direct-cooled LED light source of claim 1, wherein at least a portion of the light emitting portion is made of a transparent material, the transparent material being transparent glass or transparent ceramic or fluorescent glass or fluorescent thin film glass.
3. The direct-cooled LED light source of claim 1, wherein at least a portion of the light emitting portion is made of a transparent material made of an inorganic, organic, or polymeric material that is transparent but insoluble in a liquid insulating working medium.
4. The direct-cooled LED light source of claim 2, wherein the strip capillary wick is made of glass beads, fiberglass or foam glass.
5. The direct-cooled LED light source of claim 2, wherein the strip capillary wick is a foam with capillary structure made of inorganic, organic, and polymer materials that are transparent but insoluble in liquid insulating working medium.
6. The direct-cooled LED light source of claim 4, wherein an internal circuit is further provided in the light emitting portion, the LED chip being connected to the internal circuit, the internal circuit being connected to pins provided on the housing for connection to an external power source.
7. The direct-cooled LED light source of claim 6, further comprising a heat sink in contact with the reservoir for rapidly reducing the temperature of the liquid insulating medium in the reservoir.
8. The direct-cooling LED light source according to claim 7, wherein the light emitting portion and the liquid storage portion and the heat dissipation portion are connected in an integrated sealing connection or a separable connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710030673.5A CN106641761B (en) | 2017-01-17 | 2017-01-17 | Direct-cooling type LED light source based on heat pipe principle |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710030673.5A CN106641761B (en) | 2017-01-17 | 2017-01-17 | Direct-cooling type LED light source based on heat pipe principle |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106641761A CN106641761A (en) | 2017-05-10 |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN2610491Y (en) * | 2003-02-26 | 2004-04-07 | 台达电子工业股份有限公司 | Circulation cooling device |
| CN104676545A (en) * | 2015-03-03 | 2015-06-03 | 湖南中科热控技术有限公司 | Heat absorbing device, heat radiating device and LED (light-emitting diode) mining lamp radiating system |
| CN105633259A (en) * | 2016-02-03 | 2016-06-01 | 张国生 | Heat pipe principle based high-power LED light source |
| CN205424865U (en) * | 2016-02-02 | 2016-08-03 | 广州华钻电子科技有限公司 | High -power LED phase change heat sink |
| CN205482497U (en) * | 2016-03-28 | 2016-08-17 | 深圳市智通电子有限公司 | Phase -change radiator |
| CN206572230U (en) * | 2017-01-17 | 2017-10-20 | 张国生 | Direct-cooling type LED/light source based on heat pipe principle |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI442527B (en) * | 2010-02-11 | 2014-06-21 | 寶福通光能有限公司 | Hardened modular semiconductor device |
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Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2610491Y (en) * | 2003-02-26 | 2004-04-07 | 台达电子工业股份有限公司 | Circulation cooling device |
| CN104676545A (en) * | 2015-03-03 | 2015-06-03 | 湖南中科热控技术有限公司 | Heat absorbing device, heat radiating device and LED (light-emitting diode) mining lamp radiating system |
| CN205424865U (en) * | 2016-02-02 | 2016-08-03 | 广州华钻电子科技有限公司 | High -power LED phase change heat sink |
| CN105633259A (en) * | 2016-02-03 | 2016-06-01 | 张国生 | Heat pipe principle based high-power LED light source |
| CN205482497U (en) * | 2016-03-28 | 2016-08-17 | 深圳市智通电子有限公司 | Phase -change radiator |
| CN206572230U (en) * | 2017-01-17 | 2017-10-20 | 张国生 | Direct-cooling type LED/light source based on heat pipe principle |
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