KR20100003328A - Heat-dissipation device for a light-emitting diode lamp - Google Patents

Abstract

The radiator for a light emitting diode lamp basically includes a plurality of cooling fins and a heat pipe. Since both the cooling fins and the heat pipe are fixed on the outer surface of the base plate of the lamp, the radiator has the best heat dissipation effect. In addition, since the heat pipe is a sealed hollow pipe filled with a liquid that serves as a heat absorbing and shearing medium, the heat energy generated from the light emitting diode of the lamp is quickly absorbed by the liquid in the heat pipe, thereby transferring the heat energy out of the lamp. Emitting and further conducting thermal energy to each cooling fin to achieve the purpose of a quick heat dissipation effect, thereby lowering the light attenuation rate of the light emitting diode and consequently significantly extending the life of the light emitting diode.

Description

Heat radiator for light emitting diode lamps {HEAT-DISSIPATION DEVICE FOR A LIGHT-EMITTING DIODE LAMP}

The present invention relates to a radiator for a lamp, and more particularly to a radiator for a light emitting diode lamp comprising a heat pipe filled with a liquid.

Almost all conventional LED (Light Emitting Diode) lamps radiate heat in such a way that the thermal energy generated by the lamp is radiated into the lamp's housing and then transferred to the surrounding atmosphere. However, because of the low radiation efficiency, the thermal energy generated from the light emitting diodes cannot be released immediately, causing heat accumulation. Therefore, the wiring or lamp element is easily damaged or burned, and the light weakening of the light emitting diode is accelerated, which greatly shortens the life of the light emitting diode.

In order to improve heat dissipation of LED lamps, a heat dissipation structure having multiple heat pipes, as shown in Fig. 1, disclosed in Taiwan Patent No. 300866, has been developed in the market. In this heat dissipation structure, a plurality of heat pipes 10 and cooling fins 11 are provided on the lamp 1, and thermal energy generated from the light emitting diodes 12 is transferred to the respective heat pipes 10 and cooling fins 11. The heat is transmitted to the outside of the lamp 1 through). The heat dissipation effect of using each heat pipe 10 and cooling fins 11 to absorb and transfer the thermal energy of the lamp 1 is not as ideal as expected, and because the heat absorption and transfer is too slow, the lamp 1 It cannot be cooled quickly. As a result, a lot of heat is accumulated in the lamp 1, resulting in shortening the life of the LED lamp 12.

The present invention seeks to obviate and / or mitigate the above mentioned disadvantages.

The main object of the present invention is to quickly absorb and conduct heat in order to quickly release heat energy to the outside of the lamp, preventing heat energy from accumulating in the lamp, lowering the light attenuation rate and greatly extending the life of the light emitting diode. To provide a radiator for a light emitting diode lamp that can help.

Thus, the radiator for a light emitting diode lamp according to the present invention includes a plurality of cooling fins and a heat pipe.

The cooling fins are fixed on the outer surface of the base plate of the lamp, and the base plate is provided with a plurality of light emitting diodes on the inner surface of the lamp. The heat pipe is a sealed hollow pipe filled with liquid, which is fixed on the outer surface of the base plate of the lamp and connected to each cooling fin.

In the radiator for a light emitting diode lamp according to the present invention, the heat pipe may be U-shaped or long to widen the application range.

According to the present invention, it is possible to quickly absorb and conduct heat to quickly release heat energy to the outside of the lamp, preventing heat energy from accumulating in the lamp, lowering the light attenuation rate and greatly extending the life of the light emitting diode. A radiator for a light emitting diode lamp can be provided.

The invention will become more apparent from the following description when taken in conjunction with the accompanying drawings, in which preferred embodiments according to the invention are shown for purposes of illustration only.

2 and 3, the radiator for a light emitting diode lamp according to a preferred embodiment of the present invention basically includes a plurality of cooling fins (2) and heat pipes (3).

Both cooling fins 2 are fixed on the outer surface of the base plate 41 of the lamp 4. The base plate 41 is provided with a plurality of light emitting diodes 42 on the inner surface of the lamp 4. A transparent cover 43 is provided to seal the lamp 4.

The heat pipe 3 is a hollow metal pipe (for example U-shaped in this embodiment) filled with liquid 31. The heat pipe 3 is fixed on the outer surface of the base plate 41 of the lamp 4 and the heat pipe 3 and each cooling fin 2 are closely coupled together to increase the heat conduction efficiency. Is connected to each cooling fin (2).

Between the heat pipe 3 and each of the cooling fins 2, the heat pipe 3 and the base plate 41 and between each of the cooling fins 2 and the base plate 41, the ease of sufficient heat conduction therebetween. Heat transfer paste is further coated. In addition, as shown in FIG. 4, the heat pipe 5 is a long hollow metal pipe filled with liquid 51, which does not affect the connection of each cooling fin 2 and the base plate 41. Note that it may be.

As shown in Fig. 5, the heat pipe 6 of the present invention is in such a way that the area of contact between the heat pipe 6 and the base plate 41 is enlarged to help accelerate the absorption and transfer of thermal energy. Is partially embedded in the base plate 4.

In addition, as shown in FIG. 6, two identical heat pipes 3 and respective cooling fins 2 are fixed together on the outer surface of the base plate 41 of the lamp 4 and of the lamp 4. It has the same performance as the above embodiment to absorb thermal energy and then release it out of the lamp 4. As shown in Fig. 7, both heat pipes 3 are partially embedded in the base plate 41 to enlarge the contact area between each heat pipe 3 and the base plate 41, Helps to accelerate the absorption and delivery of energy.

As shown in Fig. 8, in order to cooperate with an existing LED lamp, the base plate 7 may be formed by the superposition of the circuit board 71 and the metal plate 72. The circuit board 71 is provided for the connection of the light emitting diodes 42 and then fixed on the metal plate 72 of the lamp 4. In addition, the metal plate 72 of the lamp 4 is used to transfer the thermal energy of the lamp 4.

The heat dissipation principle of the radiator for LED lamps according to the present invention is made in Figs. The heat energy generated from the light emitting diodes 42 of the lamp 4 can only be transferred to the base plate 41 in direct contact with the light emitting diodes 42. At this time, since the base plate 41 is connected to a heat pipe 3, 5 or 6 filled with liquid 31, 51, 61, which serves as a heat absorbing and transferring medium, the heat energy is transferred to the heat pipe ( 3, 5 or 6, i.e. with the rapid heat absorption and conduction capability of the liquids 31, 51, 61 of each heat pipe 3, 5, 6, the light emitting diode of the lamp 4 ( The heat generated by 42 can be released outside the lamp 4 and quickly transferred to each cooling fin 2 to achieve the purpose of rapid heat dissipation.

In summary, the heat dissipation according to the present invention can quickly absorb and conduct heat and quickly release heat energy to the outside of the lamp, so that no heat energy is accumulated in the lamp, which reduces the light attenuation rate of the light emitting diode and consequently emits light. Extend the life of the diode.

While various embodiments in accordance with the present invention have been shown and described, it will be apparent to those skilled in the art that there may be additional embodiments within the scope of the present invention.

1 is a longitudinal sectional view of a heat sink for a conventional LED lamp.

Figure 2 is a longitudinal cross-sectional view of a radiator for a light emitting diode lamp according to the present invention.

3 is a perspective view of a radiator for a light emitting diode lamp according to the present invention;

4 is a longitudinal sectional view showing the long heat pipe according to the present invention;

Fig. 5 is a longitudinal sectional view showing that the heat pipe is embedded in the base plate according to the present invention.

Figure 6 is a longitudinal sectional view showing that two heat pipes and cooling fins are fixed on the outer surface of the base plate, in accordance with the present invention.

Figure 7 is a longitudinal sectional view showing two heat pipes and cooling fins embedded in a base plate, in accordance with the present invention;

Fig. 8 is a longitudinal sectional view showing that the base plate according to the present invention is formed by the superposition of a circuit board and a metal plate.

<Explanation of symbols on main parts of the drawings>

2: cooling fins 3, 5, 6: heat pipe

4: lamp 7, 41: base plate

31, 51, 61: liquid 42: light emitting diode

43: transparent cover 71: circuit board

72: metal plate

Claims (7)

Radiator for light emitting diode lamp, A plurality of cooling fins 2 fixed on the outer surface of the base plate of the lamp 4, A sealed hollow pipe filled with liquid 31, 51, 61, which is fixed on the outer surface of the base plates 7, 41 of the lamp 4 and connected to the respective cooling fins 2. Heat pipes (3, 5, 6), The base plate (7, 41) is provided with a plurality of light emitting diodes (42) on the inner surface of the lamp (4). The heat sink of claim 1, wherein the heat pipes (3, 5, 6) are long. The radiator of claim 1, wherein the heat pipes (3, 5, 6) are U-shaped. The heat sink of claim 1, further comprising one or more heat pipes (3, 5, 6). The radiator according to claim 1, wherein the base plate (7, 41) is formed by overlapping a circuit board (71) and a metal plate (72). The heat sink of claim 1, wherein the heat pipes (3, 5, 6) are connected on the outer surface of the base plate (7, 41). The heat sink of claim 1, wherein the heat pipes (3, 5, 6) are partially embedded in the base plate (7, 41).

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