1315179 -九、發明說明： .【發明所屬之技術領域】 ‘ 本發明涉及一種散熱模組，特別係指一種冷卻發光二 極體之發光二極體散熱模組。 【先前技術】 發光二極體（Light Emitting Diode,簡稱LED)因其具 有高亮度、體積小、重量輕、不易破損、低耗電量和壽命 •長等優點被廣泛應用於各式顯示產品中，其發光原理如 下：施加一電壓於二極體上，驅使二極體裏之電子與空穴 結合，並進一步產生光。 市％上現有之燈具，如白織燈、金鹵燈、節能燈等， 大多採用自身散熱之方式散發熱量，一般不需要配備專門 之政熱器。而當前流行之半導體發光二極體燈，由於其體 積小，功耗集中，就必須於殼體之内部或外部連接散熱器， _否則就不能保證發光二極體於工作時産生之熱量被充分散 發出去，從而影響其使用壽命。 ^因而，需要提供一種能快速吸收發光二極體產生之熱 _ I並將其有效散發之發光二極體散熱模組，以保證發光二 極體於正常溫度下工作。 【發明内容】 有鑒於此，有必要提供一種對發光二極體有效散熱之 發光二極體散熱模組。 本發明發光一極體散熱模組包括發光二極體、與該發 1315179 光二極體貼設之吸熱塊、遠離該發光二極體設置之散熱部 及連接該吸熱塊與散熱部之熱管，該熱管吸收發光二極體 產生之熱量並傳至該散熱部進行散熱。 * 與習知技術相比，本發明中該吸熱塊與該發光二極體 直接接觸吸收其熱量，經該熱管傳至該散熱部散熱，迅速 冷卻發光二極體，保證其於較低溫度下工作。 【實施方式】 φ 請參閱圖1與圖2,本發明發光二極體散熱模組之第一 實施例包括一發光二極體100、貼設發光二極體100之一吸 熱塊200、一散熱部400及連接吸熱塊200與散熱部400之一 熱管300。熱管300包括一吸熱段302及由吸熱段302—端延 伸而出之放熱段304。吸熱段302收容於吸熱塊200之頂部並 以焊接等方式固定其中，放熱段304穿過散熱部400並與其 熱性接觸。散熱部400包括相互間隔、平行排列之複數散熱 鰭片406，且每一散熱鰭片406垂直於熱管300之放熱段 鲁304。吸熱塊200設有一吸熱面202，熱管300吸熱段302之上 表面被壓扁形成一扁平面3020，吸熱面202與扁平面3020位 於同一水平面，二者同時貼設于發光二極體100之底部以吸 收其熱量。 該吸熱塊200與熱管300之吸熱段302直接貼設發光二 極體100以吸收其熱量，並快速傳導至熱管300之放熱段 304，經與其緊密接觸之散熱鰭片406進行散熱，以快速冷 卻發光二極體100。 1315179 圖3為本發明發光二極體散熱模組之第二實施例中熱 管310與吸熱塊210之組合圖，吸熱塊200頂部具有一吸熱面 • 212，而熱管300之吸熱段312則收容於吸熱塊210之底部， •熱管310之吸熱段312未與發光二極體100直接接觸。僅吸熱 塊210頂部之吸熱面212直接吸收發光二極體100之熱量，同 時傳向熱管310之吸熱段312。 圖4為本發明發光二極體散熱模組之第三實施例，其與 第一實施例之區別於：吸熱塊220之吸熱面222之兩侧及底 部分別向外延伸複數散熱片224，以增強散熱，散熱片224 可與吸熱塊220—體成型或通過焊接之方式結合於吸熱塊 220 上。 圖5為本發明發光二極體散熱模組之第四實施例，其與 第二實施例之區別於：吸熱塊230之吸熱面232之頂部兩側 及底部分別向外延伸複數散熱片234，以增強散熱，散熱片 234可與吸熱塊230—體成型或通過焊接之方式結合於吸熱 φ塊23〇上。 圖6為本發明發光二極體散熱模組之第五實施例，其與 第一實施例之區別於：與第一實施例中結構一致之四根熱 管340穿過散熱部440，且每一根熱管340對應一個發光二極 體100以吸收其熱量，即本實施能同時對四個發光二極體 100進行散熱。 圖7為本發明發光二極體散熱模組之第六實施例，其與 第一實施例之區別於：熱管350呈U形，其吸熱段352收容於 8 1315179 吸熱塊250之頂部，熱管350還設有另一放熱段354，該放熱 段354由吸熱段352另一端延伸而出並穿過散熱部450。 ' 圖8為本發明發光二極體散熱模組之第七實施例，其與 •第六實施例之區別於：熱管360之吸熱段362同時貼設於兩 個間隔開之發光二極體100以吸收其熱量。 圖9為本發明發光二極體散熱模組之第八實施例，其與 第七實施例之區別於：熱管370之放熱段374分別穿設於兩 I個散熱部470内。 圖10為本發明發光二極體散熱模組之第九實施例，其 包括四個發光二極體100、吸熱塊280、U形熱管380及散熱 部480。每一熱管380包括一吸熱段382、放熱段384及連接 吸熱段382與放熱段384之連接段386。每一熱管380之吸熱 段382與發光二極體100、吸熱塊280之結合方式如第一實施 例所述。散熱部480包括一基座482及由基座482底部向外延 伸之複數散熱鰭片484，基座482之上表面橫穿設有一對平 _行溝槽486，熱管380之放熱段384焊接固定於溝槽486内。 圖11為本發明發光二極體散熱模組之第十實施例，其 與第九實施例之區別於：四個板體590貼設於散熱部490之 * 基座492上，將熱管390之放熱段394夾緊固定於基座492之 上表面與板體590之間，板體590爲傳熱或散熱性較佳之金 屬材料。 综上所述，本發明發光二極體散熱模組通過吸熱塊與 發光二極體直接接觸吸收其熱量，再充分利用熱管之快速 9 1315179 至散熱部之各散熱 體，保證其於較低 熱傳導性將發光二極體之熱量快速傳遞 鰭片進行散熱，以便快速冷卻發光二極 溫度下工作。 綜上所述，本發明符合發明專利要件，爰依法提出專 利申請。m該者僅為本發明之較佳實施例，舉凡熟 悉本案技藝之人士’在爰依本發明精神所作之等效修飾或 變化，皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 圖1係本發明發光二極體散熱模組第一實施例之立體 組合圖。 "" 圖2係圖1中熱管與吸熱塊之立體組合圖。 圖3係本發明發光二極體散熱模組第二實施例中熱管 與吸熱塊之立體組合圖。 ^ 圖4係本發明發光二極體散熱模組第三實施例之立體 組合圖。 圖5係本發明發光二極體散熱模組第四實施例之立體 組合圖。 圖6係本發明發光一極體散熱模組第五實施例之立體 組合圖。 圖7係本發明發光二極體散熱模組第六實施例之立體 組合圖。 圖8係本發明發光二極體散熱模組第七實施例之立體 組合圖。 1315179 圖9係本發明發光二極體散熱模組第八實施例之立體 組合圖。 * 圖10係本發明發光二極體散熱模組第九實施例之立體 •組合圖。 圖11係本發明發光二極體散熱模組第十實施例之立體 組合圖。 肇【主要元件符號說明】 200、210、 發光二極體 100 吸熱塊 220 > 230 > 250 、 280 300 、 310 、 熱管 340 、 350 、 360 、 370 、 380 、 390 吸熱段 302 、 312 、 352、362、382 放熱段 304 、 354 、 374、384、394 散熱部 400 、 440 、 450 > 470 、 480 ' 490 散熱鰭片 406 、 484 散熱片 224 、 234 基座 482、492 溝槽 486 連接段 386 板體 590 111315179 - IX, invention description: . [Technical field of invention] ‘ The present invention relates to a heat dissipation module, in particular to a light-emitting diode cooling module for cooling a light-emitting diode. [Prior Art] Light Emitting Diode (LED) is widely used in various display products due to its high brightness, small size, light weight, non-breakage, low power consumption and long life. The principle of illumination is as follows: a voltage is applied to the diode to drive electrons and holes in the diode to combine and further generate light. The existing lamps on the city, such as white woven lamps, metal halide lamps, energy-saving lamps, etc., mostly use their own heat dissipation to dissipate heat, generally do not need to be equipped with a special political heater. The current popular semiconductor light-emitting diode lamp, because of its small size and concentrated power consumption, must be connected to the heat sink inside or outside the housing, otherwise it is impossible to ensure that the heat generated by the light-emitting diode during operation is sufficient. Dissipated to affect its service life. Therefore, it is necessary to provide a light-emitting diode heat-dissipating module capable of quickly absorbing the heat generated by the light-emitting diode and effectively dissipating it to ensure that the light-emitting diode operates at a normal temperature. SUMMARY OF THE INVENTION In view of the above, it is necessary to provide a light emitting diode heat dissipation module that effectively dissipates heat from a light emitting diode. The light-emitting diode thermal module of the present invention comprises a light-emitting diode, a heat-absorbing block attached to the light-emitting diode 1315179, a heat-dissipating portion disposed away from the light-emitting diode, and a heat pipe connecting the heat-absorbing block and the heat-dissipating portion, the heat pipe The heat generated by the light-emitting diode is absorbed and transmitted to the heat radiating portion for heat dissipation. Compared with the prior art, in the present invention, the heat absorbing block directly contacts the light emitting diode to absorb the heat, and the heat pipe is transmitted to the heat dissipating portion to dissipate heat, thereby rapidly cooling the light emitting diode to ensure that it is at a lower temperature. jobs. [Embodiment] φ Referring to FIG. 1 and FIG. 2, a first embodiment of a light-emitting diode heat dissipation module of the present invention includes a light-emitting diode 100, a heat-absorbing block 200 attached to the light-emitting diode 100, and a heat dissipation system. The portion 400 and the heat pipe 300 connecting the heat absorption block 200 and the heat dissipation portion 400. The heat pipe 300 includes a heat absorbing section 302 and a heat releasing section 304 extending from the end of the heat absorbing section 302. The heat absorbing section 302 is received at the top of the heat absorbing block 200 and fixed therein by soldering or the like, and the heat releasing section 304 passes through the heat radiating portion 400 and is in thermal contact therewith. The heat dissipating portion 400 includes a plurality of heat dissipating fins 406 spaced apart from each other and arranged in parallel, and each of the heat dissipating fins 406 is perpendicular to the heat releasing portion 304 of the heat pipe 300. The heat absorbing block 200 is provided with a heat absorbing surface 202. The upper surface of the heat absorbing section 302 is flattened to form a flat surface 3020. The heat absorbing surface 202 and the flat surface 3020 are at the same level, and are attached to the bottom of the light emitting diode 100 at the same time. To absorb its heat. The heat absorbing block 200 and the heat absorbing section 302 of the heat pipe 300 are directly attached to the light emitting diode 100 to absorb the heat thereof, and are quickly conducted to the heat releasing section 304 of the heat pipe 300, and are radiated by the heat radiating fins 406 in close contact with each other for rapid cooling. Light-emitting diode 100. 1315179 FIG. 3 is a combination diagram of a heat pipe 310 and a heat absorbing block 210 in a second embodiment of the light emitting diode heat dissipating module of the present invention. The heat absorbing block 200 has a heat absorbing surface 212 at the top, and the heat absorbing portion 312 of the heat pipe 300 is received in the heat absorbing block 312. At the bottom of the heat absorbing block 210, the heat absorbing section 312 of the heat pipe 310 is not in direct contact with the light emitting diode 100. Only the heat absorbing surface 212 at the top of the heat absorbing block 210 directly absorbs the heat of the light emitting diode 100, and is also transmitted to the heat absorbing section 312 of the heat pipe 310. 4 is a third embodiment of the light-emitting diode heat-dissipating module of the present invention, which is different from the first embodiment in that: the two sides and the bottom of the heat-absorbing surface 222 of the heat-absorbing block 220 respectively extend outwardly from the plurality of heat-dissipating fins 224 to To enhance heat dissipation, the heat sink 224 may be integrally formed with the heat absorbing block 220 or bonded to the heat absorbing block 220 by welding. FIG. 5 is a fourth embodiment of the light-emitting diode heat-dissipating module of the present invention, which is different from the second embodiment in that: a plurality of heat sinks 234 are respectively extended outwardly on the top and bottom sides of the heat-absorbing surface 232 of the heat-absorbing block 230, To enhance heat dissipation, the heat sink 234 may be integrally formed with the heat absorbing block 230 or bonded to the heat absorbing φ block 23A by welding. FIG. 6 is a fifth embodiment of the light-emitting diode heat dissipation module of the present invention, which is different from the first embodiment in that four heat pipes 340 conforming to the structure in the first embodiment pass through the heat dissipation portion 440, and each The root heat pipe 340 corresponds to one light emitting diode 100 to absorb heat thereof, that is, the present embodiment can simultaneously dissipate heat from the four light emitting diodes 100. 7 is a sixth embodiment of the light-emitting diode heat dissipation module of the present invention, which is different from the first embodiment in that the heat pipe 350 is U-shaped, and the heat absorption section 352 is received at the top of the 8 1315179 heat absorption block 250, and the heat pipe 350 There is also another heat release section 354 which extends from the other end of the heat absorption section 352 and passes through the heat dissipation portion 450. 8 is a seventh embodiment of the light-emitting diode heat-dissipating module of the present invention, which is different from the sixth embodiment in that: the heat-absorbing section 362 of the heat pipe 360 is simultaneously attached to the two spaced-apart light-emitting diodes 100. To absorb its heat. FIG. 9 is an eighth embodiment of the light-emitting diode heat-dissipating module of the present invention, which is different from the seventh embodiment in that the heat-dissipating sections 374 of the heat pipes 370 are respectively disposed in the two heat-dissipating portions 470. 10 is a ninth embodiment of a light-emitting diode heat dissipation module according to the present invention, which includes four light-emitting diodes 100, a heat-absorbing block 280, a U-shaped heat pipe 380, and a heat dissipation portion 480. Each heat pipe 380 includes a heat absorption section 382, a heat release section 384, and a connection section 386 connecting the heat absorption section 382 and the heat release section 384. The heat absorbing section 382 of each heat pipe 380 is combined with the light emitting diode 100 and the heat absorbing block 280 as described in the first embodiment. The heat dissipating portion 480 includes a pedestal 482 and a plurality of heat dissipating fins 484 extending outward from the bottom of the pedestal 482. The upper surface of the pedestal 482 is provided with a pair of flat-row grooves 486, and the heat releasing portion 384 of the heat pipe 380 is welded and fixed. Within the trench 486. 11 is a tenth embodiment of a light-emitting diode heat dissipation module according to the present invention, which is different from the ninth embodiment in that four plate bodies 590 are attached to the base 492 of the heat dissipation portion 490, and the heat pipe 390 is The heat release section 394 is clamped and fixed between the upper surface of the base 492 and the plate body 590. The plate body 590 is a metal material with better heat transfer or heat dissipation. In summary, the light-emitting diode heat-dissipating module of the present invention directly absorbs the heat by the heat-absorbing block and the light-emitting diode, and then fully utilizes the heat radiating body of the heat pipe 9 1315179 to the heat dissipating body of the heat radiating portion to ensure the lower heat conduction. The heat of the light-emitting diode is quickly transferred to the fins for heat dissipation, so as to quickly cool the light-emitting diode temperature. In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. The present invention is only a preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be covered by the following claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective assembled view of a first embodiment of a light emitting diode heat dissipating module of the present invention. "" Figure 2 is a three-dimensional combination of the heat pipe and the heat absorbing block in Figure 1. 3 is a perspective assembled view of a heat pipe and a heat absorbing block in a second embodiment of the light emitting diode heat dissipating module of the present invention. Figure 4 is a perspective assembled view of a third embodiment of the light-emitting diode heat dissipation module of the present invention. Fig. 5 is a perspective assembled view of a fourth embodiment of the light-emitting diode heat dissipating module of the present invention. Fig. 6 is a perspective assembled view of a fifth embodiment of the light-emitting diode thermal module of the present invention. Figure 7 is a perspective assembled view of a sixth embodiment of the light-emitting diode heat dissipation module of the present invention. Fig. 8 is a perspective assembled view of a seventh embodiment of the light emitting diode heat dissipating module of the present invention. 1315179 FIG. 9 is a perspective assembled view of an eighth embodiment of the light-emitting diode heat dissipation module of the present invention. * Figure 10 is a perspective view of a ninth embodiment of the light-emitting diode heat dissipation module of the present invention. Figure 11 is a perspective assembled view of a tenth embodiment of the light-emitting diode heat dissipation module of the present invention.肇[Main component symbol description] 200, 210, light-emitting diode 100 heat-absorbing block 220 > 230 > 250 , 280 300 , 310 , heat pipe 340 , 350 , 360 , 370 , 380 , 390 heat absorption section 302 , 312 , 352 , 362, 382 heat release sections 304, 354, 374, 384, 394 heat sinks 400, 440, 450 > 470, 480 '490 heat sink fins 406, 484 heat sinks 224, 234 pedestals 482, 492 trench 486 connecting sections 386 board 590 11