TWI393837B - Led illuminating apparatus - Google Patents
Led illuminating apparatus Download PDFInfo
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- TWI393837B TWI393837B TW97111340A TW97111340A TWI393837B TW I393837 B TWI393837 B TW I393837B TW 97111340 A TW97111340 A TW 97111340A TW 97111340 A TW97111340 A TW 97111340A TW I393837 B TWI393837 B TW I393837B
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Description
本發明涉及一種發光二極體照明裝置。 The invention relates to a light-emitting diode lighting device.
目前,發光二極體(Light Emitting Diode,LED)已被廣泛應用到很多領域,尤其是廣泛應用於路燈。在此,一種新型的發光二極體可以參見Daniel A.Steigerwald等人於文獻IEEE Journal on Selected Topics in Quantum Electronics,Vol.8,No.2,March/April 2002中之Illumination With Solid State Lighting Technology一文。 At present, Light Emitting Diode (LED) has been widely used in many fields, especially in street lamps. Here, a novel light-emitting diode can be found in Daniel A. Steigerwald et al., IEEE Journal on Selected Topics in Quantum Electronics, Vol. 8, No. 2, March/April 2002, Illumination With Solid State Lighting Technology. .
由於發光二極體於發光時,其自身之溫度會逐漸升高,當溫度達到一定程度時,其工作電壓、發光波長以及光輸出強度等都會受到較大之影響。而於照明裝置之持續工作過程中,如果發光二極體所產生之熱量無法及時散去,將導致發光二極體等元件損毀使得照明裝置無法正常運行。為了避免這一狀況之發生,需給發光二極體提供一散熱元件,例如散熱風扇、熱管等等,由於散熱風扇之散熱效率較低,故常採用熱管作為散熱元件,然而,於先前之利用熱管作為散熱元件之照明裝置中,一般熱管與發光二極體所處平面平行設置,即該熱管之受熱端及冷凝端於同一個平面且該平面與該發光二極體所處平面平行,以致使該熱管之散熱效率不高。 Since the temperature of the light-emitting diode is gradually increased when the light-emitting diode is illuminated, the working voltage, the wavelength of the light, and the intensity of the light output are greatly affected when the temperature reaches a certain level. In the continuous operation of the lighting device, if the heat generated by the light-emitting diode cannot be dissipated in time, the components such as the light-emitting diode may be damaged, so that the lighting device cannot operate normally. In order to avoid this situation, it is necessary to provide a heat dissipating component to the light emitting diode, such as a heat dissipating fan, a heat pipe, etc. Since the heat dissipating fan has low heat dissipation efficiency, a heat pipe is often used as the heat dissipating component, however, the heat pipe is used as a heat sink. In the illuminating device of the heat dissipating component, the heat pipe is generally disposed in parallel with the plane of the light emitting diode, that is, the heat receiving end and the condensing end of the heat pipe are in the same plane and the plane is parallel to the plane of the light emitting diode, so that the heat pipe The heat dissipation efficiency of the heat pipe is not high.
下面將以實施例說明一種具較高散熱效率之發光二極體照明裝置。 A light-emitting diode lighting device with high heat dissipation efficiency will be described below by way of example.
一種發光二極體照明裝置,其包括:一個燈罩、一個發光模組及一個散熱模組。該燈罩包括一個散熱殼體及一個出光部;該發光模組設置於該散熱殼體內且與該出光部相對,該發光模組包括複數發光二極體,該複數發光二極體發出之光經由該出光部射出;以及該散熱模組設置於該散熱殼體內且位於該發光模組之遠離該出光部之一側,該散熱模組包括複數個熱管,該複數個熱管之蒸發端與該複數個發光二極體熱連接,其冷凝端與該散熱殼體熱連接。 A light-emitting diode lighting device includes: a lamp cover, a light-emitting module and a heat-dissipating module. The light cover includes a heat dissipation housing and a light exiting portion. The light emitting module is disposed in the heat dissipation housing and opposite to the light emitting portion. The light emitting module includes a plurality of light emitting diodes, and the light emitted by the plurality of light emitting diodes is The heat emitting module is disposed in the heat dissipation housing and located on a side of the light emitting module away from the light emitting portion, the heat dissipation module includes a plurality of heat pipes, and the evaporation ends of the plurality of heat pipes and the plurality The light emitting diodes are thermally connected, and the condensation end thereof is thermally connected to the heat dissipation housing.
相對於先前技術,該發光二極體照明裝置中複數個熱管之蒸發端與複數個發光二極體熱連接,能快速將該複數個發光二極體產生之熱量傳送至熱管,並且該複數個熱管之冷凝端與該散熱殼體熱連接,能夠及時將上述熱量傳送到空氣中,因此該發光二極體照明裝置能有效之提高散熱效率,並且該發光二極體照明裝置中之散熱模組位於該發光二極體之遠離出光部之一側,不會阻擋或吸收該發光二極體發出之光,可避免該散熱模組造成光損耗。 Compared with the prior art, the evaporation end of the plurality of heat pipes in the light-emitting diode lighting device is thermally connected to the plurality of light-emitting diodes, and the heat generated by the plurality of light-emitting diodes can be quickly transmitted to the heat pipe, and the plurality of heat-emitting diodes are quickly transferred to the heat pipe. The condensing end of the heat pipe is thermally connected to the heat dissipating casing, and the heat can be transferred to the air in time, so that the illuminating diode lighting device can effectively improve the heat dissipating efficiency, and the heat dissipating module in the illuminating diode illuminating device The light-emitting diode is located on one side of the light-emitting diode, and does not block or absorb the light emitted by the light-emitting diode, thereby avoiding light loss caused by the heat-dissipating module.
下面將結合附圖對本發明實施方式作進一步之詳細說明。 The embodiments of the present invention will be further described in detail below with reference to the accompanying drawings.
請參見圖1,本發明實施方式提供之一種具較高散熱效率之發光二極體照明裝置100,其包括:一個燈罩10、一個 發光模組20及一個散熱模組30。 Referring to FIG. 1 , an embodiment of the present invention provides a light-emitting diode lighting device 100 with high heat dissipation efficiency, comprising: a lampshade 10 and a lamp cover 10 The light emitting module 20 and a heat dissipation module 30.
該燈罩10包括一個散熱殼體11、一個出光部13及一個設置於該出光部13之擴散板12。該出光部13可為一開口,如圖1所示,也可由一透明材料製成。 The lamp cover 10 includes a heat dissipation housing 11 , a light exit portion 13 , and a diffusion plate 12 disposed on the light exit portion 13 . The light exit portion 13 can be an opening, as shown in FIG. 1, or can be made of a transparent material.
該發光模組20設置於該散熱殼體11內且與該出光部13相對,其包括一個反射罩22及複數個設置於該反射罩22之內表面之發光二極體21。該複數個發光二極體21以陣列式,例如矩陣式或線性陣列式等方式排布。 The light-emitting module 20 is disposed in the heat-dissipating housing 11 and opposite to the light-emitting portion 13 . The light-emitting module 20 includes a reflector 22 and a plurality of LEDs 21 disposed on the inner surface of the reflector 22 . The plurality of light emitting diodes 21 are arranged in an array, for example, a matrix or a linear array.
該散熱模組30設置於該散熱殼體11內且位於該發光模組20之遠離該出光部13之一側。該散熱模組30包括第一導熱板32、第二導熱板33及複數個熱管31。該複數個發光二極體21之遠離該出光部13之一側且均與該第一導熱板32熱連接,該第二導熱板33固定於該散熱殼體11上。該複數個熱管31之蒸發端311固定於該第一導熱板32之遠離該複數發光二極體21之一側,該複數個熱管31之冷凝端312經由該第二導熱板33與該散熱殼體11熱連接。該複數個熱管31相互平行且間隔設置,且與該複數個發光二極體21一一對應,該複數個熱管31之長度方向與該複數個發光二極體21所處之平面之法向量方向M平行。 The heat dissipation module 30 is disposed in the heat dissipation housing 11 and located on a side of the light emitting module 20 away from the light exit portion 13 . The heat dissipation module 30 includes a first heat conduction plate 32, a second heat conduction plate 33, and a plurality of heat pipes 31. The plurality of light-emitting diodes 21 are remote from one side of the light-emitting portion 13 and are thermally connected to the first heat-conducting plate 32. The second heat-conducting plate 33 is fixed to the heat-dissipating casing 11. The evaporation end 311 of the plurality of heat pipes 31 is fixed to one side of the first heat conducting plate 32 away from the plurality of light emitting diodes 21, and the condensation end 312 of the plurality of heat pipes 31 passes through the second heat conducting plate 33 and the heat radiating shell Body 11 is thermally connected. The plurality of heat pipes 31 are parallel to each other and spaced apart from each other, and are in one-to-one correspondence with the plurality of light-emitting diodes 21, and the length direction of the plurality of heat pipes 31 and the normal vector direction of the plane in which the plurality of light-emitting diodes 21 are located M parallel.
該反射罩22將該發光二極體21發出之且入射至其上之光反射到該擴散板12,由該擴散板12將該光均勻化並將其從該出光部13射出。該反射罩22之設置可降低光損耗而提高光利用效率。 The reflector 22 reflects the light emitted from the light-emitting diode 21 and incident thereon to the diffusing plate 12, and the diffusing plate 12 equalizes the light and emits the light from the light-emitting portion 13. The arrangement of the reflector 22 reduces light loss and improves light utilization efficiency.
該複數發光二極體21於一般情況下,電光轉換效率約為 40%,其餘約60%之電能轉換成熱能。該複數個發光二極體21工作時產生之熱量經由該反射罩22傳給第一導熱板32,從而避免了大量之熱量聚集於該反射罩22內造成溫度過高而影響該複數個發光二極體21之正常工作。該第一導熱板32可為一具有良好導熱性能之銅板等金屬板,其將吸收之熱量快速之傳送給與該第一導熱板32熱連接之該複數個熱管31之蒸發端311。 In the general case, the complex light-emitting diode 21 has an electro-optical conversion efficiency of about 40%, the remaining 60% of the electrical energy is converted into heat. The heat generated by the operation of the plurality of LEDs 21 is transmitted to the first heat conducting plate 32 via the reflector 22, thereby preventing a large amount of heat from being accumulated in the reflector 22, causing the temperature to be too high to affect the plurality of LEDs. The polar body 21 works normally. The first heat conducting plate 32 can be a metal plate such as a copper plate having good thermal conductivity, and the absorbed heat is quickly transmitted to the evaporation end 311 of the plurality of heat pipes 31 thermally connected to the first heat conducting plate 32.
請參見圖2,該複數個熱管31之工作流體於蒸發端311吸收熱量發生相變化而變成氣態,氣態之工作流體到達冷凝端312釋放所吸收之熱量並轉變成液態,再經由毛細結構層313流回蒸發端311。該冷凝端312與該第二導熱板33熱連接,該第二導熱板32為一具有良好導熱性能之銅板等金屬板,其與該散熱殼體11熱連接,該散熱殼體11與空氣自然對流,從而將該發光二極體照明裝置100於工作過程中產生且由該冷凝端312傳送來之熱量傳送到外界,達到散熱目的。 Referring to FIG. 2, the working fluid of the plurality of heat pipes 31 changes into a gaseous state by absorbing heat in the evaporation end 311, and the gaseous working fluid reaches the condensing end 312 to release the absorbed heat and is converted into a liquid state, and then passes through the capillary structure layer 313. It flows back to the evaporation end 311. The condensing end 312 is thermally connected to the second heat conducting plate 33. The second heat conducting plate 32 is a metal plate such as a copper plate having good thermal conductivity, and is thermally connected to the heat dissipating casing 11, and the heat dissipating casing 11 and the air are naturally The convection is performed, so that the heat generated by the illuminating diode device 100 during operation and transmitted by the condensing end 312 is transmitted to the outside to achieve the purpose of heat dissipation.
綜上所述,本發明確已符合發明專利之要件,遂依法提出專利申請。但以上所述僅為本發明之較佳實施方式,不能以此限制本案之申請專利範圍。舉凡熟悉本案技藝之人士依本發明之精神所作之等效修飾或變化,皆應涵蓋於以下申請專利範圍內。 In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and the scope of the patent application of the present invention cannot be limited thereto. Equivalent modifications or variations made by those skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims.
100‧‧‧發光二極體照明裝置 100‧‧‧Lighting diode lighting device
10‧‧‧燈罩 10‧‧‧shade
20‧‧‧發光模組 20‧‧‧Lighting module
30‧‧‧散熱模組 30‧‧‧ Thermal Module
11‧‧‧散熱殼體 11‧‧‧ Thermal housing
13‧‧‧出光部 13‧‧‧Lighting Department
12‧‧‧擴散板 12‧‧‧Diffuser
22‧‧‧反射罩 22‧‧‧reflector
21‧‧‧發光二極體 21‧‧‧Lighting diode
32‧‧‧導熱板 32‧‧‧heat conducting plate
33‧‧‧第二導熱板 33‧‧‧Second heat conducting plate
31‧‧‧熱管 31‧‧‧ heat pipe
311‧‧‧蒸發端 311‧‧‧Evaporation end
312‧‧‧冷凝端 312‧‧‧ Condensed end
313‧‧‧毛細結構層 313‧‧‧Capillary structure
圖1係本發明實施例提供之發光二極體照明裝置之截面示意圖;圖2係圖1中所示熱管之工作原理示意圖。 1 is a schematic cross-sectional view of a light-emitting diode lighting device according to an embodiment of the present invention; and FIG. 2 is a schematic view showing the working principle of the heat pipe shown in FIG.
100‧‧‧發光二極體照明裝置 100‧‧‧Lighting diode lighting device
10‧‧‧燈罩 10‧‧‧shade
20‧‧‧發光模組 20‧‧‧Lighting module
30‧‧‧散熱模組 30‧‧‧ Thermal Module
11‧‧‧散熱殼體 11‧‧‧ Thermal housing
13‧‧‧出光部 13‧‧‧Lighting Department
12‧‧‧擴散板 12‧‧‧Diffuser
22‧‧‧反射罩 22‧‧‧reflector
21‧‧‧發光二極體 21‧‧‧Lighting diode
32‧‧‧第一導熱板 32‧‧‧First heat conducting plate
33‧‧‧第二導熱板 33‧‧‧Second heat conducting plate
31‧‧‧熱管 31‧‧‧ heat pipe
311‧‧‧蒸發端 311‧‧‧Evaporation end
312‧‧‧冷凝端 312‧‧‧ Condensed end
Claims (9)
Priority Applications (1)
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TW97111340A TWI393837B (en) | 2008-03-28 | 2008-03-28 | Led illuminating apparatus |
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TW97111340A TWI393837B (en) | 2008-03-28 | 2008-03-28 | Led illuminating apparatus |
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TW200940888A TW200940888A (en) | 2009-10-01 |
TWI393837B true TWI393837B (en) | 2013-04-21 |
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TW97111340A TWI393837B (en) | 2008-03-28 | 2008-03-28 | Led illuminating apparatus |
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Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101082414A (en) * | 2006-05-30 | 2007-12-05 | 新灯源科技有限公司 | Luminous diode lighting appararatus with high power and high heat sinking efficiency |
CN101093062A (en) * | 2006-06-20 | 2007-12-26 | 常州东村电子有限公司 | Highpower light emitting diode light fixture with heat being eliminated by superconductive heat pipe |
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2008
- 2008-03-28 TW TW97111340A patent/TWI393837B/en not_active IP Right Cessation
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101082414A (en) * | 2006-05-30 | 2007-12-05 | 新灯源科技有限公司 | Luminous diode lighting appararatus with high power and high heat sinking efficiency |
CN101093062A (en) * | 2006-06-20 | 2007-12-26 | 常州东村电子有限公司 | Highpower light emitting diode light fixture with heat being eliminated by superconductive heat pipe |
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