WO2017219504A1 - High-power led lamp - Google Patents

High-power led lamp Download PDF

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Publication number
WO2017219504A1
WO2017219504A1 PCT/CN2016/098286 CN2016098286W WO2017219504A1 WO 2017219504 A1 WO2017219504 A1 WO 2017219504A1 CN 2016098286 W CN2016098286 W CN 2016098286W WO 2017219504 A1 WO2017219504 A1 WO 2017219504A1
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WO
WIPO (PCT)
Prior art keywords
heat dissipation
led lamp
power led
base pipe
light source
Prior art date
Application number
PCT/CN2016/098286
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French (fr)
Chinese (zh)
Inventor
黄晋
王海卫
Original Assignee
亚浦耳照明股份有限公司
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Publication of WO2017219504A1 publication Critical patent/WO2017219504A1/en

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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • F21K9/23Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/60Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V5/00Refractors for light sources
    • F21V5/08Refractors for light sources producing an asymmetric light distribution

Definitions

  • the invention belongs to the technical field of illumination, and in particular to a high power LED lamp.
  • Semiconductor lighting has many advantages such as high brightness, low energy consumption, long life, and environmental protection. It is being widely used in various fields of lighting. However, since the light-emitting principle and light-emitting characteristics of the light-emitting diode are greatly different from those of the conventional light source, the design of the light-emitting diode has more and stricter requirements.
  • LED lamps emit higher heat during illumination, especially when high-power LED lamps emit more heat, and excessive heat accumulation shortens the life of LED lamps. Therefore, existing high power LED lamps are provided with heat sinks. However, most of the heat sinks are passively dissipated, and active heat dissipation is not possible, so the heat dissipation effect is not good.
  • the present invention provides a high-power LED lamp with high utilization rate of light source, good heat dissipation effect and long service life.
  • a high-power LED lamp includes: a lamp cap, a power supply cavity, a power source, a heat dissipation base pipe, at least one heat dissipation fin, at least one light source substrate, a protection diffusion cover, Active air convector and heat sink cover;
  • the lamp cap is fixed on the power supply cavity
  • the power source is fixed in the power supply cavity, and the power supply cavity is connected to the heat dissipation base pipe;
  • the light source substrate is fixed on the heat dissipation base pipe, and the protection diffusion cover is disposed on an outer side of the light source base;
  • the heat dissipation fin is disposed on the heat dissipation base pipe
  • the active or passive air convector is fixed on the heat dissipation end cover and is fixed to the heat dissipation base pipe together with the heat dissipation end cover.
  • the surface of the protective diffusion cover is a matte surface, a frosted surface, a glossy surface or a transparent surface.
  • the heat dissipation fins are formed integrally or separately from the heat dissipation base pipe.
  • the active or passive air convector is mechanically or electronically driven.
  • the upper and lower ends of the protection diffusion cover are directly communicated with the outside.
  • the heat dissipation base pipe is made of ceramic, metal, and/or plastic.
  • the protective diffusion cover is made of glass, ceramic, and/or plastic.
  • the heat dissipation fins are made of ceramic, metal and/or plastic.
  • the heat dissipation end cover is made of ceramic, metal and/or plastic.
  • the power supply cavity is made of ceramic, metal, and/or plastic.
  • the light source substrate is formed by at least one LED chip fixed on the substrate on which the line is formed or at least one LED chip and does not need a substrate.
  • the high-power LED lamp provided by the invention replaces the traditional sealed lampshade or lamp casing with a protective diffusion cover, so that the characteristics of the LED light source are exerted to a greater extent.
  • both ends of the protection diffusion cover are directly connected to the outside, convection with the outside air enhances the heat dissipation performance of the LED lamp, and solves the problem that the LED light and heat are contradictory to each other.
  • the high-power LED lamp adopts modular design, and the light source base body, heat dissipation fin, heat dissipation base pipe, power supply, active air convector, lamp base and other structural parts can be combined and replaced according to actual conditions, which reduces the use cost and prolongs the use.
  • the service life has reached the goal of protecting the environment.
  • the high-power LED lamp provided by the present invention is provided with an active or passive air convector, that is, an active heat sink or a passive heat sink.
  • an active or passive air convector that is, an active heat sink or a passive heat sink.
  • the power and illumination of the high-power LED lamp provided by the invention can be made very large, even exceeding the light effect of the conventional sodium lamp or metal halide lamp, and become a high-power LED lamp with superior performance.
  • FIG. 1 is a schematic structural view of a specific embodiment of a high power LED lamp according to the present invention.
  • FIG. 2 is a schematic view showing a specific gas flow direction when a high-power LED lamp is used according to the present invention
  • FIG. 3 is a schematic overall structural view of a specific embodiment of a high power LED lamp according to the present invention.
  • the base 1 is fixed to the power supply cavity 2 .
  • the power supply cavity 2 is made of ceramic, metal and/or plastic.
  • the power source 3 is fixed in the power supply cavity 2 without an external power supply.
  • the integrated structure of light source and power supply makes installation and use easier.
  • the power supply cavity 2 is connected to the heat dissipation base pipe 4.
  • the heat sink base tube 4 is the core component of the high power LED lamp, which may be circular, square, diamond or other geometric shape.
  • the heat dissipation base pipe 4 is made of ceramic, metal and/or plastic; in addition, other high heat conduction and high heat dissipation materials can also be used as the preparation material of the heat dissipation base pipe 4.
  • the light source base 6 is fixed to the heat dissipation base pipe 4, and the protective diffusion cover 7 is disposed outside the light source base 6.
  • the protective diffusion cover 7 is non-closed, that is, it can protect the light source substrate 6 and can dissipate heat.
  • the protective diffusion cover 7 is made of glass, ceramic and/or plastic.
  • the surface of the protective diffusion cover 7 is a matte surface, a frosted surface, a glossy surface or a transparent surface.
  • the heat dissipation fins 5 are disposed on the heat dissipation base pipe 4 .
  • the thickness, length, and shape of the heat dissipation fins 5 can be adjusted as needed, and need not be specifically limited.
  • the light source base 6 can be fixed to the heat dissipation fins 5 in addition to the heat dissipation base pipe 4, and the heat dissipation effect is better.
  • the heat dissipation fins 5 are made of ceramic, metal and/or plastic; in addition, other high thermal conductivity and high heat dissipation materials can also be used as the preparation material of the heat dissipation fins 5.
  • the heat dissipation fins 5 are preferably formed integrally with the heat dissipation base pipe 4.
  • the integrally formed heat dissipation fins 5 and the heat dissipation base pipe 4 have better matching, which not only reduces the production cost, but also improves the production and heat dissipation efficiency.
  • the active or passive air convector 8 is fixed to the heat dissipation end cover 9 and is fixed to the heat dissipation base pipe 4 together with the heat dissipation end cover 9.
  • the active air convector is, for example, a fan
  • the passive air convector is, for example, a radiator.
  • the active or passive air convector 8 is driven mechanically or electronically.
  • the active or passive air convector 8 can quickly discharge the heat generated by the high-power LED lamp during operation, reduce the heat inside the lamp body, and maintain the light source substrate 6 and the power source 3 at the rated use temperature, thereby prolonging the service life of the lamp body.
  • the heat dissipation end cover 9 is made of ceramic, metal and/or plastic.
  • the light source substrate is formed by at least one LED chip fixed on a substrate on which the line is formed or at least one LED chip and does not need a substrate.
  • a lamp cap 1 constituting the high-power LED lamp, a power supply cavity 2, a power source 3, a heat dissipation base pipe 4, at least one heat dissipation fin 5, at least one light source substrate 6, a protective diffusion cover 7, an active or passive air convector 8 and
  • the heat dissipation end cover 9 can be arbitrarily combined and replaced according to the use condition. This modular design reduces the cost of use, extends the life of the lamp, and protects the environment.
  • the flow direction of the airflow is specifically identified in FIG.
  • the light source substrate 6 emits heat to the heat dissipation base pipe 4, and the heat dissipation base pipe 4 conducts a part of the heat to it by conduction. Internally, a portion is conducted to the heat sink fins 5.
  • the active or passive air convector 8 draws cold air under the lamp body into the interior of the heat dissipation base pipe 4, and the cold air carries away the heat generated by the power source 3 and the light source substrate 6 through the inside of the heat dissipation base pipe 4.
  • the rising cold air cannot rise after encountering the upper power supply cavity 2, and the airflow flows along the cooling fins 5 and the passage between the protection diffusion cover 7 and the light source base 6 to the lower portion, and the heat dissipation fins 5 and the light source are added.
  • the air flow velocity on the surface of the base body 6 lowers the surface temperature, thereby achieving the purpose of bare rapid heat dissipation.
  • the high-power LED lamp provided by the invention has good heat dissipation performance, high light source utilization rate, long service life, simple structure and easy replacement, and low cost; most importantly, the high-power LED lamp provided by the invention can remove the sodium lamp and the mercury lamp without In the case of the original front-mounted electrical appliance of the metal halide lamp, the original bulb is directly replaced.

Abstract

A high-power LED lamp, comprising: a lamp base (1), a power cavity (2), a power source (3), a heat radiation base tube (4), at least one heat radiation fin (5), at least one light source base (6), a protective diffusing cover (7), an active or passive air convector (8), and a heat radiation end cover (9); the lamp base (1) being fixed onto the power cavity (2); the power source (3) being fixed into the power cavity (2); the power cavity (2) being connected to the heat radiation base tube(4); the light source base (6) being fixed onto the heat radiation base tube (4); the protective diffusing cover (7) being provided on the outer side of the light source base (6); the heat radiation fin (5) being provided on the heat radiation base tube (4); the active or passive air convector (8) being fixed onto the heat radiation end cover (9) and then being fixed together with the heat radiation end cover (9), onto the heat radiation base tube (4).

Description

一种大功率LED灯A high power LED lamp 技术领域Technical field
本发明属于照明技术领域,具体地说,涉及一种大功率LED灯。The invention belongs to the technical field of illumination, and in particular to a high power LED lamp.
背景技术Background technique
半导体照明具有高亮度、低能耗、寿命长、绿色环保等诸多优点,正越来越广泛的被应用于照明的各个领域。但由于发光二极管的发光原理和出光特性与传统光源有很大的差异,其灯具设计有更多、更严格的要求。Semiconductor lighting has many advantages such as high brightness, low energy consumption, long life, and environmental protection. It is being widely used in various fields of lighting. However, since the light-emitting principle and light-emitting characteristics of the light-emitting diode are greatly different from those of the conventional light source, the design of the light-emitting diode has more and stricter requirements.
LED灯在照明时散发的热量较高,尤其是大功率的LED灯发光时发散的热量就更高,而过高的热量聚集会缩短LED灯的寿命。因此,现有的大功率LED灯都设置有散热装置。但是大多散热装置均是被动散热,无法进行主动散热,因此散热效果并不好。LED lamps emit higher heat during illumination, especially when high-power LED lamps emit more heat, and excessive heat accumulation shortens the life of LED lamps. Therefore, existing high power LED lamps are provided with heat sinks. However, most of the heat sinks are passively dissipated, and active heat dissipation is not possible, so the heat dissipation effect is not good.
此外,采用密闭的灯罩或者灯壳对光源进行有效保护是常用的技术,这样既不利于光源特性的发挥,又不利于热量的散发。In addition, the use of a sealed lampshade or lamp housing to effectively protect the light source is a common technique, which is not conducive to the performance of the light source, and is not conducive to heat dissipation.
因此需要一种既能够最大限度发挥光源特性,又能够有效解决散热问题的大功率LED灯。Therefore, there is a need for a high-power LED lamp that can maximize the characteristics of the light source and effectively solve the heat dissipation problem.
发明内容Summary of the invention
为了解决现有技术中大功率LED灯的缺陷,本发明提供了一种光源利用率高、散热效果好、使用寿命长的大功率LED灯。In order to solve the defects of the high-power LED lamp in the prior art, the present invention provides a high-power LED lamp with high utilization rate of light source, good heat dissipation effect and long service life.
根据本发明的一个方面,提供一种大功率LED灯,所述大功率LED灯包括:灯头、电源腔体、电源、散热基管、至少一个散热鳍片、至少一个光源基体、保护扩散罩、主动式空气对流器和散热端盖;According to an aspect of the present invention, a high-power LED lamp includes: a lamp cap, a power supply cavity, a power source, a heat dissipation base pipe, at least one heat dissipation fin, at least one light source substrate, a protection diffusion cover, Active air convector and heat sink cover;
所述灯头固定于所述电源腔体上; The lamp cap is fixed on the power supply cavity;
所述电源固定于电源腔体内,所述电源腔体与所述散热基管相连接;The power source is fixed in the power supply cavity, and the power supply cavity is connected to the heat dissipation base pipe;
所述光源基体固定于所述散热基管上,所述保护扩散罩设置于所述光源基体的外侧;The light source substrate is fixed on the heat dissipation base pipe, and the protection diffusion cover is disposed on an outer side of the light source base;
所述散热鳍片设置于所述散热基管上;The heat dissipation fin is disposed on the heat dissipation base pipe;
所述主动式或被动式空气对流器固定于所述散热端盖上,并与所述散热端盖一起固定于所述散热基管上。The active or passive air convector is fixed on the heat dissipation end cover and is fixed to the heat dissipation base pipe together with the heat dissipation end cover.
根据本发明的一个具体实施方式,所述保护扩散罩的表面为雾面、磨砂面、光面或透明面。According to an embodiment of the invention, the surface of the protective diffusion cover is a matte surface, a frosted surface, a glossy surface or a transparent surface.
根据本发明的另一个具体实施方式,所述散热鳍片与所述散热基管一体化形成或分体化形成。According to another embodiment of the present invention, the heat dissipation fins are formed integrally or separately from the heat dissipation base pipe.
根据本发明的又一个具体实施方式,所述主动式或被动式空气对流器采用机械式或电子式驱动。According to yet another embodiment of the invention, the active or passive air convector is mechanically or electronically driven.
根据本发明的又一个具体实施方式,保护扩散罩的上下两端直接与外界联通。According to still another embodiment of the present invention, the upper and lower ends of the protection diffusion cover are directly communicated with the outside.
根据本发明的又一个具体实施方式,所述散热基管采用陶瓷、金属和/或塑料制备而成。According to still another embodiment of the present invention, the heat dissipation base pipe is made of ceramic, metal, and/or plastic.
根据本发明的又一个具体实施方式,所述保护扩散罩采用玻璃、陶瓷和/或塑料制备而成。According to still another embodiment of the present invention, the protective diffusion cover is made of glass, ceramic, and/or plastic.
根据本发明的又一个具体实施方式,所述散热鳍片采用陶瓷、金属和/或塑料制备而成。According to still another embodiment of the present invention, the heat dissipation fins are made of ceramic, metal and/or plastic.
根据本发明的又一个具体实施方式,所述散热端盖采用陶瓷、金属和/或塑料制备而成。According to still another embodiment of the present invention, the heat dissipation end cover is made of ceramic, metal and/or plastic.
根据本发明的又一个具体实施方式,所述电源腔体采用陶瓷、金属和/或塑料制备而成。According to still another embodiment of the present invention, the power supply cavity is made of ceramic, metal, and/or plastic.
根据本发明的又一个具体实施方式,所述光源基体是至少由一颗LED芯片固定在制作有线路的基板上构成或至少由一颗LED芯片且不需要基板构成。 According to still another embodiment of the present invention, the light source substrate is formed by at least one LED chip fixed on the substrate on which the line is formed or at least one LED chip and does not need a substrate.
本发明提供的大功率LED灯采用保护扩散罩代替了传统的密闭的灯罩或灯壳,使LED光源的特性得到了更大程度的发挥。此外,由于保护扩散罩的两端直接与外界连通,与外界空气形成对流,增强了LED灯的散热性能,解决了LED光与热互为矛盾的难题。The high-power LED lamp provided by the invention replaces the traditional sealed lampshade or lamp casing with a protective diffusion cover, so that the characteristics of the LED light source are exerted to a greater extent. In addition, since both ends of the protection diffusion cover are directly connected to the outside, convection with the outside air enhances the heat dissipation performance of the LED lamp, and solves the problem that the LED light and heat are contradictory to each other.
该大功率LED灯采用模块化设计,光源基体、散热鳍片、散热基管、电源、主动式空气对流器、灯头等结构件均可根据实际情况任意组合及替换,降低了使用成本、延长了使用寿命,达到了保护环境的目的。The high-power LED lamp adopts modular design, and the light source base body, heat dissipation fin, heat dissipation base pipe, power supply, active air convector, lamp base and other structural parts can be combined and replaced according to actual conditions, which reduces the use cost and prolongs the use. The service life has reached the goal of protecting the environment.
更为关键的是,在本发明提供的大功率LED灯内部设置有主动式或被动式空气对流器,即主动散热装置或被动散热装置。这样可以迅速被排出该大功率LED灯在工作时产生的热量,降低电源和光源基体的热量,保持光源基体和电源的额定使用温度,延长使用寿命。More critically, the high-power LED lamp provided by the present invention is provided with an active or passive air convector, that is, an active heat sink or a passive heat sink. In this way, the heat generated by the high-power LED lamp during operation can be quickly discharged, the heat of the power source and the light source substrate can be reduced, the rated use temperature of the light source substrate and the power source can be maintained, and the service life can be prolonged.
通过上述特殊的结构设计,本发明提供的大功率LED灯的功率和照度可以做到很大,甚至超过传统钠灯或金卤灯的光效,成为性能优越的大功率LED灯。Through the above special structural design, the power and illumination of the high-power LED lamp provided by the invention can be made very large, even exceeding the light effect of the conventional sodium lamp or metal halide lamp, and become a high-power LED lamp with superior performance.
附图说明DRAWINGS
通过阅读参照以下附图所作的对非限制性实施例所作的详细描述,本发明的其它特征、目的和优点将会变得更明显:Other features, objects, and advantages of the present invention will become more apparent from the Detailed Description of Description
图1所示为根据本发明所述的一种大功率LED灯的一个具体实施方式的结构示意图;1 is a schematic structural view of a specific embodiment of a high power LED lamp according to the present invention;
图2所示为根据本发明所述的一种大功率LED灯使用时具体气体流向的示意图;2 is a schematic view showing a specific gas flow direction when a high-power LED lamp is used according to the present invention;
图3所示为根据本发明所述的一种大功率LED灯的一个具体实施方式的整体结构示意图。FIG. 3 is a schematic overall structural view of a specific embodiment of a high power LED lamp according to the present invention.
附图中相同或相似的附图标记代表相同或相似的部件。 The same or similar reference numerals in the drawings denote the same or similar components.
具体实施方式detailed description
下文的公开提供了许多不同的实施例或例子用来实现本发明的不同结构。为了简化本发明的公开,下文中对特定例子的部件和设置进行描述。此外,本发明可以在不同例子中重复参考数字和/或字母。这种重复是为了简化和清楚的目的,其本身不指示所讨论各种实施例和/或设置之间的关系。应当注意,在附图中所图示的部件不一定按比例绘制。本发明省略了对公知组件和处理技术及工艺的描述以避免不必要地限制本发明。The following disclosure provides many different embodiments or examples for implementing different structures of the present invention. In order to simplify the disclosure of the present invention, the components and arrangements of the specific examples are described below. Furthermore, the present invention may repeat reference numerals and/or letters in different examples. This repetition is for the purpose of simplicity and clarity, and is not in the nature of the description of the various embodiments and/or arrangements discussed. It is noted that the components illustrated in the drawings are not necessarily drawn to scale. The description of the known components and processing techniques and processes is omitted to avoid unnecessarily limiting the present invention.
参见图1~图3,本发明提供的大功率LED灯包括:灯头1、电源腔体2、电源3、散热基管4、至少一个散热鳍片5、至少一个光源基体6、保护扩散罩7、主动式或被动式空气对流器8和散热端盖9。Referring to FIG. 1 to FIG. 3, the high-power LED lamp provided by the present invention comprises: a lamp cap 1, a power supply cavity 2, a power source 3, a heat dissipation base pipe 4, at least one heat dissipation fin 5, at least one light source substrate 6, and a protection diffusion cover 7. Active or passive air convector 8 and heat sink end cap 9.
所述灯头1固定于所述电源腔体2上。优选的,所述电源腔体2采用陶瓷、金属和/或塑料制备而成。The base 1 is fixed to the power supply cavity 2 . Preferably, the power supply cavity 2 is made of ceramic, metal and/or plastic.
所述电源3固定于电源腔体2内,无需外置电源。光源及电源一体化结构,安装及使用更加简便。所述电源腔体2与所述散热基管4相连接。散热基管4是该大功率LED灯的核心部件,其可以是圆形、方形、菱形或其他几何形状。优选的,所述散热基管4采用陶瓷、金属和/或塑料制备而成;除此之外,其他高导热、高散热材料也可以作为散热基管4的制备材料。The power source 3 is fixed in the power supply cavity 2 without an external power supply. The integrated structure of light source and power supply makes installation and use easier. The power supply cavity 2 is connected to the heat dissipation base pipe 4. The heat sink base tube 4 is the core component of the high power LED lamp, which may be circular, square, diamond or other geometric shape. Preferably, the heat dissipation base pipe 4 is made of ceramic, metal and/or plastic; in addition, other high heat conduction and high heat dissipation materials can also be used as the preparation material of the heat dissipation base pipe 4.
所述光源基体6固定于所述散热基管4上,所述保护扩散罩7设置于所述光源基体6的外侧。保护扩散罩7不同于传统的灯罩或灯壳,是非密闭的,即可以保护光源基体6,又可以散热。优选的,所述保护扩散罩7采用玻璃、陶瓷和/或塑料制备而成。为了达到不同的发光效果,优选的,所述保护扩散罩7的表面为雾面、磨砂面、光面或透明面。为了在对光源基体6进行保护的前提下,加强散热效果,优选的,保护扩散罩7的上下两端直接 与外界联通。The light source base 6 is fixed to the heat dissipation base pipe 4, and the protective diffusion cover 7 is disposed outside the light source base 6. Unlike the conventional lampshade or lamp housing, the protective diffusion cover 7 is non-closed, that is, it can protect the light source substrate 6 and can dissipate heat. Preferably, the protective diffusion cover 7 is made of glass, ceramic and/or plastic. In order to achieve different illuminating effects, it is preferable that the surface of the protective diffusion cover 7 is a matte surface, a frosted surface, a glossy surface or a transparent surface. In order to enhance the heat dissipation effect under the premise of protecting the light source base 6, it is preferable to directly protect the upper and lower ends of the diffusion cover 7 directly Connect with the outside world.
所述散热鳍片5设置于所述散热基管4上。散热鳍片5的厚度、长度以及形状可以根据需要进行调整,并不需要具体限定。光源基体6除了固定于散热基管4上,还可以固定于散热鳍片5上,这样的散热效果更好。优选的,所述散热鳍片5采用陶瓷、金属和/或塑料制备而成;除此之外,其他高导热、高散热材料也可以作为散热鳍片5的制备材料。为了进一步简化生产工艺,优选的所述散热鳍片5与所述散热基管4一体化形成。一体化形成的散热鳍片5和散热基管4匹配性更好,不但降低了生产成本,还提高了生产以及散热效率。The heat dissipation fins 5 are disposed on the heat dissipation base pipe 4 . The thickness, length, and shape of the heat dissipation fins 5 can be adjusted as needed, and need not be specifically limited. The light source base 6 can be fixed to the heat dissipation fins 5 in addition to the heat dissipation base pipe 4, and the heat dissipation effect is better. Preferably, the heat dissipation fins 5 are made of ceramic, metal and/or plastic; in addition, other high thermal conductivity and high heat dissipation materials can also be used as the preparation material of the heat dissipation fins 5. In order to further simplify the production process, the heat dissipation fins 5 are preferably formed integrally with the heat dissipation base pipe 4. The integrally formed heat dissipation fins 5 and the heat dissipation base pipe 4 have better matching, which not only reduces the production cost, but also improves the production and heat dissipation efficiency.
所述主动式或被动式空气对流器8固定于所述散热端盖9上,并与所述散热端盖9一起固定于所述散热基管4上。其中,主动式空气对流器例如为风扇、被动式空气对流器例如为散热器。优选的,所述主动式或被动式空气对流器8采用机械式或电子式驱动。主动式或被动式空气对流器8能够迅速排出大功率LED灯在工作时产生的热量,降低灯体内部的热量,将光源基体6和电源3均保持在额定使用温度,延长灯体的使用寿命。优选的,所述散热端盖9采用陶瓷、金属和/或塑料制备而成。所述光源基体是至少由一颗LED芯片固定在制作有线路的基板上构成或至少由一颗LED芯片且不需要基板构成。The active or passive air convector 8 is fixed to the heat dissipation end cover 9 and is fixed to the heat dissipation base pipe 4 together with the heat dissipation end cover 9. The active air convector is, for example, a fan, and the passive air convector is, for example, a radiator. Preferably, the active or passive air convector 8 is driven mechanically or electronically. The active or passive air convector 8 can quickly discharge the heat generated by the high-power LED lamp during operation, reduce the heat inside the lamp body, and maintain the light source substrate 6 and the power source 3 at the rated use temperature, thereby prolonging the service life of the lamp body. Preferably, the heat dissipation end cover 9 is made of ceramic, metal and/or plastic. The light source substrate is formed by at least one LED chip fixed on a substrate on which the line is formed or at least one LED chip and does not need a substrate.
组成该大功率LED灯的灯头1、电源腔体2、电源3、散热基管4、至少一个散热鳍片5、至少一个光源基体6、保护扩散罩7、主动式或被动式空气对流器8和散热端盖9可根据使用情况任意组合及替换。这种模块化设计既降低了使用成本,又延长了灯的使用寿命,还达到了保护环境的目的。a lamp cap 1 constituting the high-power LED lamp, a power supply cavity 2, a power source 3, a heat dissipation base pipe 4, at least one heat dissipation fin 5, at least one light source substrate 6, a protective diffusion cover 7, an active or passive air convector 8 and The heat dissipation end cover 9 can be arbitrarily combined and replaced according to the use condition. This modular design reduces the cost of use, extends the life of the lamp, and protects the environment.
为了进一步说明本发明提供的大功率LED灯的散热性能,图2中具体标识了气流的流动方向。光源基体6发出热量传导到散热基管4上,散热基管4通过传导的方式将热量一部分传导到其 内部,一部分传导到散热鳍片5上。主动式或被动式空气对流器8将灯体下方冷空气吸入散热基管4内部,冷空气通过散热基管4内部将电源3以及光源基体6上产生的热量带走。上升的冷空气在遇到上方电源腔体2后无法上升,气流就会沿着散热鳍片5以及保护扩散罩7与光源基体6之间的通道往下部流动,增加了散热鳍片5及光源基体6表面的空气流动速度,降低了表面温度,从而达到裸露式快速散热的目的。To further illustrate the heat dissipation performance of the high power LED lamp provided by the present invention, the flow direction of the airflow is specifically identified in FIG. The light source substrate 6 emits heat to the heat dissipation base pipe 4, and the heat dissipation base pipe 4 conducts a part of the heat to it by conduction. Internally, a portion is conducted to the heat sink fins 5. The active or passive air convector 8 draws cold air under the lamp body into the interior of the heat dissipation base pipe 4, and the cold air carries away the heat generated by the power source 3 and the light source substrate 6 through the inside of the heat dissipation base pipe 4. The rising cold air cannot rise after encountering the upper power supply cavity 2, and the airflow flows along the cooling fins 5 and the passage between the protection diffusion cover 7 and the light source base 6 to the lower portion, and the heat dissipation fins 5 and the light source are added. The air flow velocity on the surface of the base body 6 lowers the surface temperature, thereby achieving the purpose of bare rapid heat dissipation.
本发明提供的大功率LED灯散热性能好、光源利用率高、寿命长、结构简单易更换、成本低;最重要的是,本发明提供的大功率LED灯可以在不拆除钠灯、汞灯、金卤灯原有前置电器的情况下直接更换原有灯泡使用。The high-power LED lamp provided by the invention has good heat dissipation performance, high light source utilization rate, long service life, simple structure and easy replacement, and low cost; most importantly, the high-power LED lamp provided by the invention can remove the sodium lamp and the mercury lamp without In the case of the original front-mounted electrical appliance of the metal halide lamp, the original bulb is directly replaced.
虽然关于示例实施例及其优点已经详细说明,应当理解在不脱离本发明的精神和所附权利要求限定的保护范围的情况下,可以对这些实施例进行各种变化、替换和修改。对于其他例子,本领域的普通技术人员应当容易理解在保持本发明保护范围内的同时,工艺步骤的次序可以变化。While the invention has been described with respect to the preferred embodiments and the embodiments of the present invention, it is understood that various changes, substitutions and modifications may be made to the embodiments without departing from the spirit and scope of the invention. For other examples, those of ordinary skill in the art will readily appreciate that the order of process steps may vary while remaining within the scope of the invention.
此外,本发明的应用范围不局限于说明书中描述的特定实施例的工艺、机构、制造、物质组成、手段、方法及步骤。从本发明的公开内容,作为本领域的普通技术人员将容易地理解,对于目前已存在或者以后即将开发出的工艺、机构、制造、物质组成、手段、方法或步骤,其中它们执行与本发明描述的对应实施例大体相同的功能或者获得大体相同的结果,依照本发明可以对它们进行应用。因此,本发明所附权利要求旨在将这些工艺、机构、制造、物质组成、手段、方法或步骤包含在其保护范围内。 Further, the scope of application of the present invention is not limited to the process, mechanism, manufacture, composition of matter, means, methods and steps of the specific embodiments described in the specification. From the disclosure of the present invention, it will be readily understood by those skilled in the art that the processes, mechanisms, manufactures, compositions, means, methods, or steps that are presently present or will be developed in the The corresponding embodiments described have substantially the same function or substantially the same results, which can be applied in accordance with the invention. Therefore, the appended claims are intended to cover such modifications, such structures, structures,

Claims (12)

  1. 一种大功率LED灯,其特征在于,所述大功率LED灯包括:灯头、电源腔体、电源、散热基管、至少一个散热鳍片、至少一个光源基体、保护扩散罩、主动式或被动式空气对流器和散热端盖;A high-power LED lamp, comprising: a lamp head, a power supply cavity, a power source, a heat dissipation base pipe, at least one heat dissipation fin, at least one light source substrate, a protection diffusion cover, an active or a passive type Air convector and heat sink cover;
    所述灯头固定于所述电源腔体上;The lamp cap is fixed on the power supply cavity;
    所述电源固定于电源腔体内,所述电源腔体与所述散热基管相连接;The power source is fixed in the power supply cavity, and the power supply cavity is connected to the heat dissipation base pipe;
    所述光源基体固定于所述散热基管上或固定于所述散热鳍片上,所述保护扩散罩设置于所述光源基体的外侧;The light source substrate is fixed on the heat dissipation base pipe or fixed on the heat dissipation fin, and the protection diffusion cover is disposed on an outer side of the light source base;
    所述散热鳍片设置于所述散热基管上;The heat dissipation fin is disposed on the heat dissipation base pipe;
    所述主动式或被动式空气对流器固定于所述散热端盖上,并与所述散热端盖一起固定于所述散热基管上。The active or passive air convector is fixed on the heat dissipation end cover and is fixed to the heat dissipation base pipe together with the heat dissipation end cover.
  2. 根据权利要求1所述的大功率LED灯,其特征在于,所述保护扩散罩的表面为雾面、磨砂面、光面或透明面。The high power LED lamp according to claim 1, wherein the surface of the protective diffusion cover is a matte surface, a frosted surface, a glossy surface or a transparent surface.
  3. 根据权利要求1所述的大功率LED灯,其特征在于,所述散热鳍片与所述散热基管一体化形成或分体化形成。The high-power LED lamp according to claim 1, wherein the heat dissipation fins are formed integrally or separately from the heat dissipation base pipe.
  4. 根据权利要求1所述的大功率LED灯,其特征在于,所述主动式或被动式空气对流器采用机械式或电子式驱动。The high power LED lamp of claim 1 wherein said active or passive air convector is mechanically or electronically driven.
  5. 根据权利要求1所述的大功率LED灯,其特征在于,保护扩散罩的上下两端直接与外界联通。The high-power LED lamp according to claim 1, wherein the upper and lower ends of the protection diffusion cover are directly connected to the outside.
  6. 根据权利要求5所述的大功率LED灯,其特征在于,所 述主动式或被动式空气对流器将所述大功率LED灯下方冷空气吸入所述散热基管内部,所述冷空气通过所述散热基管内部将所述电源以及所述光源基体产生的热量带走;上升的冷空气在遇到上方的所述电源腔体后沿着所述散热鳍片以及所述保护扩散罩与所述光源基体之间的通道向下部流动。A high power LED lamp according to claim 5, characterized in that An active or passive air convector draws cold air under the high power LED lamp into the interior of the heat dissipation base pipe, and the cold air passes through the heat dissipation base pipe to heat the power source and the light source substrate The rising cold air flows downward along the heat dissipation fin and the passage between the protective diffusion cover and the light source substrate after encountering the upper power supply cavity.
  7. 根据权利要求1所述的大功率LED灯,其特征在于,所述散热基管采用陶瓷、金属和/或塑料制备而成。The high power LED lamp according to claim 1, wherein the heat dissipation base pipe is made of ceramic, metal and/or plastic.
  8. 根据权利要求1所述的大功率LED灯,其特征在于,所述保护扩散罩采用玻璃、陶瓷和/或塑料制备而成。The high power LED lamp of claim 1 wherein said protective diffusion cover is fabricated from glass, ceramic and/or plastic.
  9. 根据权利要求1所述的大功率LED灯,其特征在于,所述散热鳍片采用陶瓷、金属和/或塑料制备而成。The high power LED lamp according to claim 1, wherein the heat dissipation fins are made of ceramic, metal and/or plastic.
  10. 根据权利要求1所述的大功率LED灯,其特征在于,所述散热端盖采用陶瓷、金属和/或塑料制备而成。The high power LED lamp according to claim 1, wherein the heat dissipation end cover is made of ceramic, metal and/or plastic.
  11. 根据权利要求1所述的大功率LED灯,其特征在于,所述电源腔体采用陶瓷、金属和/或塑料制备而成。The high power LED lamp of claim 1 wherein said power supply cavity is fabricated from ceramic, metal and/or plastic.
  12. 根据权利要求1所述的大功率LED灯,其特征在于,所述光源基体是至少由一颗LED芯片固定在制作有线路的基板上构成或至少由一颗LED芯片且不需要基板构成。 The high power LED lamp according to claim 1, wherein the light source substrate is formed by at least one LED chip fixed on a substrate on which the wiring is formed or at least one LED chip and does not require a substrate.
PCT/CN2016/098286 2016-06-24 2016-09-07 High-power led lamp WO2017219504A1 (en)

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