WO2010066089A1 - Heat dissipation component for led, led, and led lamp - Google Patents

Heat dissipation component for led, led, and led lamp Download PDF

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Publication number
WO2010066089A1
WO2010066089A1 PCT/CN2009/000113 CN2009000113W WO2010066089A1 WO 2010066089 A1 WO2010066089 A1 WO 2010066089A1 CN 2009000113 W CN2009000113 W CN 2009000113W WO 2010066089 A1 WO2010066089 A1 WO 2010066089A1
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WO
WIPO (PCT)
Prior art keywords
heat sink
bracket
emitting diode
heat
led
Prior art date
Application number
PCT/CN2009/000113
Other languages
French (fr)
Chinese (zh)
Inventor
楼满娥
郭邦俊
Original Assignee
Lou Mane
Guo Bangjun
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to CN200810182614 priority Critical
Priority to CN200810182614.0 priority
Application filed by Lou Mane, Guo Bangjun filed Critical Lou Mane
Publication of WO2010066089A1 publication Critical patent/WO2010066089A1/en

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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • F21K9/23Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/75Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with fins or blades having different shapes, thicknesses or spacing
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S362/00Illumination
    • Y10S362/80Light emitting diode

Abstract

A LED lamp comprises a heat dissipation component and a light emitting diode (1). The heat dissipation component comprises a heat sink (3), a support (2) and a housing (6). The support (2) is a ultra-high heat conductivity tube; the top surface of said support (2) is flat. A heat sink (3) is fixed on the top of the support (2), and a group of underlying heat sinks (3') is arranged around the support (2). There are gaps arranged (4) between the various heat sinks (3,3'). A hole equal to the outer diameter of the support (2) is arranged amidst the heat sinks (3,3'). A mesh housing (6) made of insulating material or metal encloses the support (2).

Description

 Heat dissipating component for LED and LED and LED lamp

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high-power light-emitting diode assembly (LED) and a lighting fixture, and more particularly to a heat-dissipating component for a light-emitting diode and a light-emitting diode and a light-emitting diode lamp.

Background technique

 Light-emitting chip in a light-emitting diode (LED) A semiconductor device that is sensitive to 3⁄4, heat reduces its electro-optic conversion efficiency, and shortens the working life of the LED. Therefore, the LED has a heat sink during operation. Therefore, how to effectively dissipate a large amount of heat generated by the light-emitting diode and operate the light-emitting diode at a lower temperature has become the key for manufacturing the light-emitting diode and the light-emitting diode lamp. To this end, the patent application number: 02826127. 5; The name of the invention: "Light-emitting diodes and their LED lamps", discloses a light-emitting diode and a light-emitting diode lamp having a new heat-dissipating base, the light-emitting diode comprising: at least one mounted on a light-emitting diode chip on a base having a high thermal conductivity, the light-emitting diode chip being electrically connected to the electric circuit through a circuit board, and having a light-transmitting medium above the photodiode chip, the upper surface of the base is a light reflecting surface or a periphery of the base A light reflecting surface is mounted, the circuit board is mounted above the base, and at least one screw or screw hole is disposed at a lower portion of the base, and the base is directly mechanically connected to the heat sink through the screw or the screw hole. Due to the direct tight thermal connection between the heat sink and the base, the thermal resistance between the chip and the heat sink is almost equal to zero, so that the heat generated by the chip is effectively dissipated. In addition, the metal base and the heat sink are connected by metal screws, and the thermal connection is very reliable. Long-term work will not change. Therefore, the heat dissipation structure can be used to manufacture a light-emitting diode with high success rate, high efficiency, and long life. However, since the heat sink is still a solid metal block and the outer portion is processed into a fin shape, the heat sink structure is cumbersome and consumes a large amount of metal material, so the cost is high and the heat radiation effect is not satisfactory.

At present, in addition to the LED made by Taiwan Liquid Solid State Lighting Co., Ltd. is solved by liquid filling method. In addition to the method of LED heat dissipation (this method has applied for Chinese patent, publication number CN101109502A), most of the LED lamps are made of die-cast aluminum or extruded aluminum. The material is used as a radiator and doubles as a casing. They are bulky, heavy, and have poor heat dissipation, resulting in severe LED lighting degradation and short life. Summary of the invention

 The object of the present invention is to overcome the heat conduction of the heat sink of the existing light emitting diode - 3⁄4, the thermal performance is poor,

The LED temperature is easily increased, resulting in a rapid decrease in the luminous efficiency of the LED, or even burnt due to overheating; in order to reduce the weight of the device, save metal materials and reduce costs, and further improve the heat conduction and heat dissipation effect of the LED heat sink; A heat dissipating assembly for a light emitting diode composed of a heat sink and a bracket.

 The second object of the present invention is to provide a combined high-power light-emitting diode and a light-emitting diode lamp fabricated by using a heat dissipating component composed of a heat sink and a bracket. The object of the present invention is as follows: The heat dissipating member for a light emitting diode provided by the present invention (as shown in FIGS. 6a-6c) includes a heat sink, and is characterized in that it further comprises a bracket constructed of a high thermal conductive material. The bracket is a rod or a tube made of a highly thermally conductive material, and the high thermal conductivity material may be a hot superconductor or a metal such as copper or aluminum, and the fin has a through hole at the center thereof. The through hole size is the same as the outer diameter of the superheat conductivity tube; the heat sink is disposed on the top of the bracket, and the lower heat sink is disposed around the bracket, and the lower heat sink is a space is left between the lower heat sink and a porous or mesh outer casing made of insulating material or metal and wrapped around the bracket to be integrated with the bracket; the inner diameter of the superconducting heat pipe and the light emitting diode to be mounted The screw on the bottom of the heat sink base is matched. In the above technical solution, the bracket is made up of two or more high thermal conductive materials to form a hollow skeleton, and a set of lower heat sinks is fixed in the inner cavity of the rack, and the set of lower heat sinks is between The top of the skeleton is flat; the heat sink is fixed on the top of the skeleton, or may be matched with the screw of the bottom surface of the heat dissipation base of the light emitting diode to be mounted at the fixing of the skeleton and the heat sink. Through hole; a porous or mesh outer casing made of insulating material or metal is wrapped around the bracket and integrated with the bracket.

 In the above technical solution, the bracket is constructed by a hot superconductor, a hollow or solid metal material, or a composite material with high thermal conductivity or high thermal conductivity, and the shape of the bracket is circular, square or other. The top is a flat polyhedral frame; the metal material is copper or aluminum.

In the above technical solution, the heat sink fin TF heat sink has high thermal conductivity and high dispersion. Made of thermal carbon nanotubes or other nano-carbon materials, it can also be made of copper, aluminum or other composite materials. This material must have good thermal and thermal properties on the plane; the shape of the lower heat sink The shape of the heat sink or the lower heat sink is in the shape of O. imn! Between ~10mm, 5a-Fig. 5d lists several common patterns, the size of which depends on the power of the heat sink. - In the above technical solution, the method further includes disposing at least two reinforcing ribs on the heat sink or the lower heat sink made of the nano carbon material, wherein the reinforcing ribs are also made of a nano carbon material, and the reinforcing ribs may be parallel or The cross is placed on the bottom surface of the heat sink or the lower heat sink.

 In the above technical solution, the heat sink, the lower heat sink and the bracket may be connected to each other perpendicularly, as shown in FIG. 6a, or the lower heat sink and the bracket are connected in parallel with each other, as shown in FIG. 6b. As shown, or at an angled connection, as shown in Figure 6c, this angle is as long as it meets the direction of hot air flow in use (ie, the lower fin is inclined by 20° to 70° with respect to the 5: shelf column). Conducive to the flow of air to remove heat. .

 In the above technical solution, for safety and ease of use, the porous or mesh outer casing may be made of an insulating material or a metal material, see FIG. 2a, FIG. 2b, for example, the insulating material may be plastic, metal. ^ 料 material can be copper, iron, the surface can be properly treated, such as insect plating, and has a certain strength; the hole in the mesh material is enough to ensure the circulation of air, to achieve heat dissipation. The support, the heat sink and the outer casing constitute a laminated heat sink, which has the purpose of efficient heat dissipation, light weight and less material.

A combined light emitting diode (shown in FIG. 1) fabricated by using the discrete component provided by the present invention comprises at least one light emitting diode electrically connected by a: 1 line to a driving power source, characterized in that it further comprises a The heat dissipating component of the light emitting diode; the bracket is a rod or tube made of a material having high thermal conductivity; the high thermal conductivity material may be a hot superconductor or a metal such as tantalum or aluminum, or other materials. The heat sink is disposed on the top of the bracket, and the heat sink is disposed around the bracket, and a space is left between the lower heat sink and the lower heat sink, and is made of insulating material or metal. a porous or meshed outer casing wrapped in a bracket

^ (As shown in Figure 1) The heat dissipating component; the base of the LED is closely attached to the [the upper surface of the hot plate, or the screw of the LED base penetrates the through hole of the heat sink into the bracket 2, The light emitting diode is electrically connected to the driving power source of the light emitting diode through a wire. V

In the above technical solution, the bracket is composed of two heat-conducting materials with a high heat guide material. The truss, the back frame, the shell portion is f, the top of the skeleton is fixed to the heat sink, and a through hole is formed at the fixing portion of the skeleton and the heat sink to match the main rod of the bottom surface of the heat dissipation base of the light emitting diode to be mounted. And fixing a set of lower fins in the inner cavity of the skeleton, leaving a gap between the lower fin and the lower fin; wrapping a porous or mesh shell made of insulating material or metal on the bracket Bu, integrated with the bracket. The LED lamp manufactured by using the light-emitting diode provided by the invention comprises at least one combined LED component manufactured by using the invention, and the above-mentioned LED assembly is mounted with a basin-shaped reflector directly attached to the heat sink (sticky) On the knot or mechanically fixed, around the LED, use it to adjust the luminous flux distribution of the LED exiting light. Also included in the above technical solution is a light transmissive housing that is mounted on the outer ring of the reflector above the LED and bonded to the outer casing of the heat dissipating component. The material of the light-transmissive bulb may be transparent plastic or glass or transparent silica gel. The above technical solution further includes a driving circuit corresponding to the circuit chamber and the LED, the circuit chamber is made of an insulating material, the driving circuit is placed therein, and the output end of the driving circuit is electrically connected via the wire and the LED, and the input end of the driving circuit passes The electrical connector is connected to an external power source to form an LED lamp to which the present invention is applied.

 In the above technical solution, the light emitting diode is a white LED, or may be a variety of 'monochromatic visible light LEDs, or a group of LEDs of various wavelengths. · They may be DC driven or AC driven. of. The advantages of the invention are:

 1. Due to the heat sink of the present invention, a laminated structure of a heat sink and a bracket is used, and the heat sink and the bracket may be connected to each other perpendicularly (shown in FIG. 6a) and parallel to each other (shown in FIG. 6c). Or at an oblique angle (shown in Figure 6b), this angle is consistent with the rise of the hot airflow during use, which is beneficial to the air flow to take away heat; and the bracket is hollowed out, the hot air flow is easy to circulate and take away heat, Therefore, the heat dissipation effect is very good. .

 2. Because the heat sink used in the present invention is made of carbon nanotubes or other nano carbon materials having high thermal conductivity and high dispersion rate, it can also be made of copper sheets, aluminum sheets or other composite materials, and the LEDs are tight. The sticker is fixed on the heat sink; in addition, there is a proper gap between the lower heat sink and the lower heat sink to allow the air to flow freely (see la) (so shown in Figure la);

- The execution of the cattle in the first county 诵 inch 茧 ^ ^ ^ ^ 卞骱 散 散 散 散 散 散 散 散 散 散 散 散 ^ ^ ^ ^ ^ ^ ^ ^ After a short distance, it will encounter another heat sink to dissipate a part of the heat, so that after a few cycles of heat, it will quickly dissipate into the surrounding space; therefore, the heat dissipation effect of the LED chip or LED light-emitting diode is good. Thereby increasing the luminous efficiency and prolonging the service life of the LED or LED lamp.

 3. The heat sink structure composed of the heat sink and the bracket combination of the invention greatly reduces the amount of the whole material and reduces the cost; more importantly, the weight is greatly reduced, the heat dissipation effect is better, and the LED luminous efficiency is improved.

 4. The present invention also employs a structure in which a strong rib is added to the heat sink, and the heat sink made of the carbon nanotube is inferior in strength to add a strong rib inside or outside when the heat sink is formed.

 5. For safety and ease of use, the entire radiator is surrounded by a porous or mesh material. The material can be insulated or metal and has a certain strength. The holes in the mesh material are sufficient to ensure The circulation of air to achieve heat dissipation.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1B is a schematic view showing the installation of the heat dissipating component and the light emitting diode of the present invention. FIG. 2b is another schematic diagram of the heat dissipating component and the illuminating z: pole tube of the present invention. FIG. 2a is a mesh casing of the present invention. FIG. 2b is a schematic structural view of a porous outer casing material according to the present invention. FIG. 3a is a connection diagram of an LED with a screw structure and a bracket. FIG. 3b is a connection diagram of a conventional power type 1^) and a top heat dissipation plate. Figure 4 is a connection between the LED and the top heat sink. Figure 4 is an LED bulb with a shape and incandescent bulb approaching. Figure 5a is a schematic view of a circular heat sink. Figure 5b is a schematic diagram of a lower heat sink. Figure 5c is a schematic diagram of a lower diffuser. Figure 5d is a schematic view of a lower heat sink. Figure 6a is a schematic view of the lower heat sink and the bracket in the vertical direction. Figure 6b is a lower heat sink mounted on the bracket in an angled manner. Figure 6c is a schematic view of the lower heat sink and the bracket in parallel. Figure 7a is a schematic diagram of a single LED as a light source. Fig. 7b is a schematic diagram showing the structure of a street lamp in which a plurality of LEDs are light sources as follows:

1. Light-emitting diode 2. Bracket 3. Heat sink

 4. Clearance 5. LED electrode lead

 6. Shell 7. Bubble shell 8. High heat dissipation module

 9. Insulated circuit room 10. Electrical connector 11. Lens on the LED

 12. How the heat sink is mounted on the bracket 13. Washer'

 14. LED fixing method 15. Reflector

BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.

Embodiment 1 Firstly, the outer casing 6 of the heat dissipating component for a light emitting diode of the present invention is fabricated. The outer casing 6 is made of an insulating material or a metal material, and has a small hole in the wall of the drum. Referring to FIG. 2b Or use a strip of insulating material 3⁄4 ^ is a metal material woven into a barrel shape, the hole in the mesh material is enough to ensure the circulation of air, to achieve heat dissipation (refer to Figure 2a). The insulating material may be plastic, the metal material may be copper or iron, and the surface thereof may be suitably treated, such as electroplating, and has a certain strength. Referring to FIG. 5a, a heat sink 3 in the heat dissipating component of the invention is fabricated, and the hot sheet 3 and the lower The heat sink 3' is made of a carbon nanotube or a nano-carbon material, and the thickness of the heat sink 3 is between 0.1 mm and 10 legs. Sheet 3 is circular. The shape of the lower fin 3' is adapted to the bracket 2, such as Figures 5a, 5b, 5c, 5d. Using a high thermal conductivity material, for example, a column made of a superconducting heat pipe is used as a main body, and then a heat sink 3 is fixed on the top of the column to form a bracket 2, referring to "2" shown in Fig. 6a, Fig. 6b, Fig. 6c. .

 Referring to FIG. 6a, FIG. 6b, and FIG. 6c, the heat dissipating component for the light emitting diode of the present invention is fabricated, and a heat sink 3 is fixed on the top of the bracket 2 in the embodiment, and the center of the heat sink 3 is opened and superconducting. a through hole having the same outer diameter of the heat pipe; around the bracket, and installing a three-layer lower heat sink 3' perpendicular to the bracket 2, the three lower heat sinks 3' are parallel to each other (refer to FIG. 6a), and between the lower heat sinks 3' The gap is 丄~lOirai, allowing the air to flow freely; then the outer casing 6 is placed over the entire bracket to form the heat dissipating component for the light emitting diode of the present invention. When the LED is working, the heat is first dissipated through the heat sink on the top layer. At the same time, the heat is transmitted down the bracket. After a short distance, the heat sink 3' is dissipated and a part of the heat is dissipated. The heat of circulation is quickly released into the surrounding space. The bracket, the heat sink and the outer casing constitute a laminated heat sink, which serves the purpose of efficient heat dissipation and light weight and less material.

 Or use 3 or 5 superconducting tubes to form a circular bracket 2, which is flat at the top of the bracket 2, and fix a copper fin 3 with holes on the bracket 2, so that the bracket is around the bracket 2

2 Install 5 pieces of lower 3⁄4 hot piece 3' in parallel with the lower heat sink 3' (refer to Figure 6c). The gap 4 between the 5 lower heat sinks 3' is 5mm, 10, etc., so that the air can be fully circulated freely. . It is also possible to tilt the five lower fins 3' relative to the column of the bracket (see Fig. 6b) around the bracket 2, for example, at an angle of 20°, 70° or 70°. The cylindrical outer casing 6 woven into a plastic is wrapped around the bracket 2, which is integrated with the bracket; or a porous cylindrical casing 6 made of metal (ie, a hollow outer casing, as shown in Fig. 2a, Fig. 2b) Shown) The package is integrated with the outside of the bracket.

 In another embodiment, the bracket 2 can also be constructed by using a high thermal conductivity material such as copper or aluminum to form a polyhedral frame. The top of the bracket is made of a flat top, and the top is provided with a heat sink 3, which is made of nano carbon material or Made of bracts. The light-emitting diodes are mounted on the heat sink 3 on the top of the bracket 2, and a plurality of LED arrays are arranged on the heat sink 3 (as shown in Fig. 3c), and the bottom surface of the LEDs must be closely attached to the heat sink 3. Alternatively, a hole can be opened in the fixing portion of the heat sink 3 and the top of the bracket 2, and the round hole is inserted into the screw of the base of the light-emitting diode 1.

The heat sink 3 used in the other implementation tree is made of nano carbon material, and the heat sink is At least two reinforcing ribs are disposed on the same, and the reinforcing ribs are made of the same nano carbon material, and the two reinforcing ribs are arranged in parallel or intersecting on the bottom surface of the heat sink.

Embodiment 2 - Referring to Figure 1 a, a combined light-emitting diode of the present invention is fabricated using any of the heat-dissipating components provided in Embodiment 1, including at least one conventional light-emitting diode 1, for example, the patent application number is 02826127. Invention name: "Light-emitting diodes and their LED lights" (Figure 3a). The base of the light-emitting diode 1 is closely attached to the upper surface of the heat sink 3 of the heat-dissipating component fabricated in the first embodiment, and the screw of the base of the light-emitting diode 1 is screwed into the super-heat-conducting tube through the through hole of the heat sink 3 (the bracket 2). The outer casing 6 is sleeved outside the bracket 2. (as shown in FIG. 1a). The light-emitting diode 1 is electrically connected to the driving power source of the light-emitting diode through a wire.

 In another embodiment, the structure of FIG. 3b can be used, including at least one conventional light-emitting diode 1. The base of the light-emitting diode 1 is closely attached to the upper surface of the heat sink 3 of the heat dissipation assembly fabricated in Embodiment 1, in the LED A lens 11 is mounted on the upper side, and the LED fixing method 14 is mechanically fixed.

In another embodiment, three or five light emitting diodes 1 are included (as shown in FIG. 7b), or they may be assembled in combination, and an LED of the integrated package may be used, and the light emitting diode 1 is closely attached to the heat dissipating component of the heat dissipating component fabricated in Embodiment 1. On the upper surface of the sheet 3 (as shown in FIG. 1b), the LED 1 is electrically connected to the driving power source through the LED electrode lead; the heat sink of the embodiment has a cylindrical copper rod as a column of the bracket 2, and a top is fixed on the top of the bracket 2 a heat sink 3 made of carbon nanomaterial, and a lower heat sink made of a set of carbon nanomaterials at equal intervals in the bracket, and a gap 4 between the set of lower heat sinks 3', the heat sink or the lower The thickness of the heat sink is 0.2 mm; the LED is fixed on the heat sink 3 on the top layer of the copper column (the column of the bracket 2) (Fig. 1b), and the plastic cylinder with the hollow mesh (or small hole) is used as the outer casing 6, The bracket 2 to which the heat sink is fixed is integrally formed as a whole, and constitutes the performance heat dissipation module 8. Since the bracket and the outer casing are hollow, the air can be fully freely circulated; thus, the heat generated by the LED during operation is firstly dissipated through the heat sink of the first layer, and the heat is transmitted down the bracket, and after a short distance, When the hot piece is encountered, a part of the heat is dissipated, so that after a few cycles of heat, it is quickly released into the surrounding space. In other embodiments: the bracket 2 can also be made of a highly thermally conductive material such as carbon nanotubes or copper. Luminous dipole Whether it is mounted on the bracket or on the top of the heat sink, the bottom of the base must be placed close to the heat sink.

 In other embodiments, the lower fin 3' is mounted on the bracket 2, and when the bracket 2 is a super heat pipe, a metal pipe or a metal bar, the lower fin 3' is disposed in parallel with the bracket. Even with a certain angle setting (ie, the heat sink is opposite to the spear ^: frame tilt l3⁄40 ° ~ 70 °); 'and, the lower 3⁄4 hot plate 3 ' is fixed at the gap 4 on the bracket 2, can be provided at the gap 4 Adjust the fin spacing of the pad 13 or the screw for fixing. If the lower heat sink 3' is installed vertically on the circumference of the bracket 2 (a super heat pipe, metal pipe or metal bar can be used as the column), the groove can be grooved around the column, and the lower heat sink 3 'vertical Insert into the slot, as shown in Figure 7c. In the figure, 14 is an LED fixing method, which can make a screw hole on the bracket and fix it with a screw on the LED.

Example 3

 Referring to Fig. 4, a bulb having a combined LED bulb, that is, a bulb used in a crucible, is produced. Most of the lamps have a small power of 3, 5, 7, and 10W. Figure 4 (a) is an LED bulb with a shape and an incandescent bulb approaching. The bulb can have a variety of shapes.

 The combined light-emitting diode bulb of the embodiment, using any of the 3 - 7W light-emitting diodes 1 produced in the second embodiment, the rest of the structure is the same as the existing light-emitting diode bulb, that is, a bulb 7 is also included, which may be Transparent, or matte or opalescent, or a secondary optical system or a transparent protective cover, the bulb 7 is mounted on the top end of the holder 2 of the combined light emitting diode of the second embodiment. The light-emitting diode 1 is surrounded by a reflector 15 (see FIG. 4), and a driving circuit for adjusting the light distribution to match the LED is installed in the insulating circuit chamber 9. The lower end of the insulating circuit chamber 9 is mounted with a common electrical connection with the conventional lamp. The electrical connector 10 is typically of the E27 or E14 type and is also compatible with conventional luminaires.

A heat sink 3 made of a nano carbon material is fixed on the bracket, and a set of lower fins 3' are respectively fixed in the bracket 2 perpendicularly to the pillar of the bracket, and 8 mm between the lower fins 3' interval. Reinforcing ribs are provided on the heat sink or the lower heat sheet made of 3⁄4 nanometer carbon material, for example, 2, 3, 4, 5 or more, ribs made of nano carbon material, arranged in parallel on the heat sink or the lower heat sink On the bottom surface; or at the bottom of the heat sink or the lower heat sink On the surface, it is in the shape of "X", . , "*", and "十".

 A casing made of a mesh (or small hole) plastic cylinder 6 is formed by integrating the outer periphery of the casing to which the heat sink is fixed, and constitutes a laminated heat dissipation module 8. The drive circuit matched with the LED is mounted in the insulated circuit chamber 9 and electrically connected to the electrical connector 10 common to the conventional lamp under the insulated circuit chamber 9, and the electrical connector 10 is of the conventional E27 or E14 type. The bulb 7 of this embodiment mounted on the front end of the LED can have various shapes. Example 4

 The LED street light source module of the present invention is formed by using the heat dissipating component produced in the first embodiment in combination with a conventional power LED light source, or the LED street light source module is formed by using any of the combined light emitting diodes produced in the second embodiment. , as shown in Figure 7a and Figure 7b; the rest of the structure is the same as the existing LED light source.

The LED light source used in this type of luminaire is relatively large, often tens of watts. Now the LED street light is made of a whole large piece of die-cast aluminum or stretched as an LED heat sink, and a 120W LED street light is used for heat dissipation. The device often weighs 8-10 kg. The heat dissipation effect is not ideal, and such a heavy lamp head brings a lot of burden to the overall design and manufacture of the street lamp; using the heat dissipating component of the invention to manufacture the LED light source can greatly reduce the weight of the lamp. In the present embodiment, two examples are exemplified, one is to use one LED of the second embodiment as a light source, the bracket 2 is a copper rod, and the top end of the bracket 2 is made into a screw hole, and the size of the screw hole is The LED screw is screwed, and the screw of the LED base is screwed into the screw hole. As shown in Fig. 7a, the heat sink 3 is closely attached to the lower surface of the LED base. 5毫米的铝合金片。 The heat sink 3 is made of a thickness of 0. 5mm nano-carbon sheet, can also be made with a thickness of 0. 1~lram. According to the temperature distribution on the bracket 2. The area of the heat sink 3' is gradually reduced, so that the entire heat dissipating component has a pagoda shape. The electrodes of the LED are led out of the module by wires, and if there are multiple LEDs as shown in Fig. 7b, they are combined and then led out to the driving power source in the street lamp. There is a gap between the two heat sinks. The outer ring 6 is a function of ventilation and waterproofing. Fig. 7b is a schematic view showing the structure of a laminated heat sink according to the present invention by using several LEDs as a light source; wherein the lower heat sink 3' is installed in the shape of a pagoda according to Fig. 7a, which can reduce some costs.

 There are a variety of other embodiments and modifications of the present invention, and various corresponding changes and modifications can be made in accordance with the present invention without departing from the spirit and scope of the invention. Changes and modifications are intended to be included within the scope of the appended claims.

Claims

right
A heat dissipating component for a light emitting diode, comprising a heat sink, characterized by further comprising a bracket constructed of a highly thermally conductive material, the bracket being a superconducting heat pipe, a metal pipe or a metal bar Providing the heat sink on the top of the bracket, and forming a set of lower heat sinks around the bracket; wherein the heat sink has a through hole at the center thereof, the through hole size and the superconducting The outer diameter of the heat pipe, the metal pipe or the metal bar is the same; the inner diameter of the superheat conductivity pipe or the metal pipe is matched with the screw of the bottom surface of the heat dissipation base of the light emitting diode to be mounted; one made of insulating material or metal A porous or meshed outer casing encases the outer portion of the stent and is integral with the stent.
The heat dissipating component for a light emitting diode according to claim 1, wherein the bracket is made of two or more high thermal conductive materials to form a hollow skeleton, and the top of the skeleton is flat, and the skeleton top fixing station a heat sink, and a set of lower heat sinks are fixed in the inner cavity of the skeleton, and a space is left between the lower heat sink and the lower heat sink; or a light emitting diode to be mounted is fixed at the fixing of the skeleton and the heat sink A screw-fitted through hole on the bottom surface of the heat dissipation base; a porous or mesh-shaped outer casing made of an insulating material or metal is wrapped around the bracket and integrated with the bracket.
 The heat dissipating component for a light emitting diode according to claim 2, wherein the lower heat sink and the bracket are connected to each other by using the lower heat sink and the bracket perpendicular to each other, and the bottom or lower heat sink Tilt fixed relative to the bracket. ,
The heat dissipating component for a light emitting diode according to claim 1 or 2, wherein the bracket has a circular, square or polyhedral frame, and the top of the bracket is flat; For copper or aluminum.
 ,
The heat dissipating component for a light emitting diode according to claim 1 or 2, wherein the heat sink or the lower heat sink is made of carbon nanotubes or other nano carbon materials having high thermal conductivity and high heat dissipation performance. Or a copper sheet, an aluminum sheet or other composite material; the shape of the lower heat sink is suitable for being mounted in the inner cavity of the bracket; the heat sink or the lower heat dissipation The thickness of the sheet is between 0. lmm^lOmm.
 The heat dissipating component for a light-emitting diode according to claim 5, further comprising at least two reinforcing ribs disposed on the heat sink or the lower heat sink made of the nano carbon material, the reinforcing rib Made of the same nano-carbon material, the ribs are placed parallel or across the bottom surface of the heat sink or the lower heat sink.
7. The heat dissipating assembly for a light emitting diode according to claim 1 or 2, wherein The corpse is also used for 宂^"King Ding Li 枓 乂, corpse; r: 3⁄4tw 偶 科 定 钢 3⁄4 衣 back 3⁄4 · .
8. A light emitting diode fabricated by using the heat dissipating component of claim 1, comprising at least one light emitting diode electrically connected to a driving power source through a wire, characterized by further comprising a heat dissipating component for the light emitting diode; The heat dissipating component comprises a bracket constructed of a highly thermally conductive material, and the heat sink is disposed on the top of the bracket, and a set of lower fins is disposed around the bracket; wherein the heat sink is centered a through hole having a through hole having the same outer diameter as the superconducting tube, the metal tube or the metal rod; the inner diameter of the superheat conductivity tube or the metal tube and the bottom surface of the heat dissipation base of the light emitting diode to be mounted The screw is matched; a porous or mesh shell made of insulating material or metal is wrapped around the bracket and integrated with the bracket; the heat sink base of the LED is closely attached to the heat sink mounted on the top of the bracket On-chip, or the screw of the heat-dissipating base of the light-emitting diode is inserted into the hole of the heat sink at the top of the bracket.
 The light emitting diode according to claim 8, wherein the bracket is made up of two or more high thermal conductive materials, and the top of the skeleton is flat, and the top of the skeleton fixes the heat sink. And fixing a set of lower heat sinks in the inner cavity of the skeleton, leaving a space between the lower heat sink and the lower heat sink; or opening a bottom surface of the heat dissipation base of the light emitting diode to be mounted at the fixing portion of the skeleton and the heat sink A through hole that is matched by a screw; a porous or mesh outer casing made of an insulating material or metal is wrapped around the bracket and integrated with the bracket.
 10. A light-emitting diode lamp manufactured by using the light-emitting diode of claim 8, comprising: at least one of the light-emitting diodes, wherein a lead-out line of the light-emitting diode is electrically connected to a driving circuit corresponding to the LED; The driving circuit is installed in the insulating circuit chamber, and is electrically connected to the external power source through the electrical connector 10, and a light-transmitting bulb and a reflector are disposed on the light-emitting diode. .
 The LED lamp of claim 10, wherein the LED chip mounted on the top of the diffuser is a white LED, or a monochromatic visible LED, or a combination of LEDs of various wavelengths. And it is DC driven or AC driven.
12. The LED lamp of claim 10, wherein said electrical connector is a two-legged, multi-legged base or a spiral base. ^
PCT/CN2009/000113 2008-12-09 2009-01-23 Heat dissipation component for led, led, and led lamp WO2010066089A1 (en)

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CN200810182614.0 2008-12-09

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2009901004568U CN202049991U (en) 2008-12-09 2009-01-23 Radiation assembly used for light-emitting diode (LED), as well as LED and LED lamp

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WO2010066089A1 true WO2010066089A1 (en) 2010-06-17

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Cited By (2)

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CN102252300A (en) * 2011-07-05 2011-11-23 广州光为照明科技有限公司 Novel heat dissipation light emitting diode (LED) street lamp module radiator
EP3354982A4 (en) * 2015-09-17 2018-10-31 Yixing Zhang Device exchanging heat using thermally conductive material wire braid

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CN104332553A (en) * 2014-10-23 2015-02-04 福建永德吉灯业股份有限公司 One-way luminous LED (Light Emitting Diode) light-emitting element COB (Chip on Board) packaging structure and application thereof

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CN2401931Y (en) * 1999-10-29 2000-10-18 魏文珍 Improved radiator
CN1359045A (en) * 2000-12-19 2002-07-17 庄嘉琛 Heat sink of CPU
CN1608326A (en) * 2001-12-29 2005-04-20 杭州富阳新颖电子有限公司 LED and LED lamp thereof

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Publication number Priority date Publication date Assignee Title
CN2401931Y (en) * 1999-10-29 2000-10-18 魏文珍 Improved radiator
CN1359045A (en) * 2000-12-19 2002-07-17 庄嘉琛 Heat sink of CPU
CN1608326A (en) * 2001-12-29 2005-04-20 杭州富阳新颖电子有限公司 LED and LED lamp thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102252300A (en) * 2011-07-05 2011-11-23 广州光为照明科技有限公司 Novel heat dissipation light emitting diode (LED) street lamp module radiator
EP3354982A4 (en) * 2015-09-17 2018-10-31 Yixing Zhang Device exchanging heat using thermally conductive material wire braid

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