200940888 九、發明說明： 【發明所屬之技術領域】 本發明涉及一種發光二極體照明裝置。 【先前技術】 目前，發光二極體（Light Emitting Diode，LED)已被廣 泛應用到很多領域，尤其是廣泛應用於路燈。在此，一種 新型的發光二極體可以參見Daniel A. Steigerwald等人於文 獻 IEEE Journal on Selected Topics in Quantum 〇 Electronics，Vol.8，No.2，March/April 2002 中之 Illumination With Solid State Lighting Technology —文。 由於發光二極體於發光時，其自身之溫度會逐漸升 高，當溫度達到一定程度時，其工作電壓、發光波長以及 光輸出強度等都會受到較大之影響。而於照明裝置之持續 工作過程中，如果發光二極體所產生之熱量無法及時散 去，將導致發光二極體等元件損毁使得照明裝置無法正常 運行。為了避免這一狀況之發生，需給發光二極體提供一 ^散熱元件’例如散熱風扇、熱管等等，由於散熱風扇之散 熱效率較低，故常採用熱管作為散熱元件，然而，於先前 之利用熱管作為散熱元件之照明裝置中，一般熱管與發光 二極體所處平面平行設置’即該熱管之受熱端及冷凝端於 同一個平面且該平面與該發光二極體所處平面平行，以致 使該熱管之散熱效率不高。 【發明内容】 下面將以實施例說明一種具較高散熱效率之發光二極 6 200940888 體照明裝置。 一種發光二極體照明裝置，其包括：-個燈罩、—個 發光模組及-個散熱模組。該燈罩包括一個散熱殼體及一 個出光部；該發光模組設置於該散熱殼體内且與該出光部 相對，該發光模組包括複數發光二極體，該複數發光二極 體發出之光經由該出光部射出；以及該散熱模組設置:該 散熱殼體内且位於該發光模組之遠離該出光部之一侧，气 ❹散熱模組包括複數個熱管，該複數個熱管之蒸發端與該= 數個發光二極體熱連接，其冷凝端與該散熱殼體熱連接。 相對於先前技術’該發光二極體照明裝置中複數個熱 管之蒸發端與複數個發光二極體熱連接，能快速將該複數 個發光二極體產生之熱量傳送至熱管，並且該複數個熱管 之冷凝端與該散熱殼體熱連接，能夠及時將上述熱量傳送 到空氣中，因此該發光二極體照明裝置能有效之提高散熱 效率，並且該發光二極體照明裝置中之散熱模組位於該發 ❾光一極體之遠離出光部之一側，不會阻擋或吸收該發光二 極體發出之光，可避免該散熱模組造成光損耗。 【實施方式】 下面將結合附圖對本發明實施方式作進一步之詳細說 明。 。 請參見圖1，本發明實施方式提供之一種具較高散熱效 率之發光二極體照明裝置100，其包括：一個燈罩1〇、一 個發光模組20及一個散熱模組30。 該燈罩10包括一個散熱殼體11' 一個出光部13及一 7 200940888 個設置於該出光部13之擴散板12。該出光部13可為一開 口，如圖1所示，也可由一透明材料製成。 該發光模組20設置於該散熱殼體11内且與該出光部 13相對，其包括一個反射罩22及複數個設置於該反射罩 22之内表面之發光二極體21。該複數個發光二極體21以 陣列式，例如矩陣式或線性陣列式等方式排布。 該散熱模組30設置於該散熱殼體11内且位於該發光 模組20之遠離該出光部13之一側。該散熱模組30包括第 ® —導熱板32、第二導熱板33及複數個熱管31。該第一導 熱板32位於該複數個發光二極體21之遠離該出光部13之 一侧且與其熱連接，該第二導熱板33固定於該散熱殼體11 上。該複數個熱管31之蒸發端311固定於該第一導熱板32 之遠離該複數發光二極體21之一側，該複數個熱管31之 冷凝端312經由該第二導熱板33與該散熱殼體11熱連接。 該複數個熱管31相互平行且間隔設置，且與該複數個發光 0二極體21——對應，該複數個熱管31之長度方向與該複 數個發光二極體21所處之平面之法向量方向Μ平行。 該反射罩22將該發光二極體21發出之且入射至其上 之光反射到該擴散板12,由該擴散板12將該光均勻化並將 其從該出光部13射出。該反射罩22之設置可降低光損耗 而提高光利用效率。 該複數發光二極體21於一般情況下，電光轉換效率約 為40%，其餘約60%之電能轉換成熱能。該複數個發光二 極體21工作時產生之熱量經由該反射罩22傳給第一導熱 200940888 板32,從而避免了大量之熱量聚集於該反射罩22内造成溫 度過高而影響該複數個發光二極體21之正常工作。該第一 導熱板32可為一具有良好導熱性能之銅板等金屬板，其將 吸收之熱量快速之傳送給與該第一導熱板32熱連接之該複 數個熱管31之蒸發端311。 請參見圖2’該複數個熱管31之工作流體於蒸發端311 吸收熱量發生相變化而變成氣態，氣態之工作流體到達冷 ❾凝端312釋放所吸收之熱量並轉變成液態，再經由毛細結 構層313流回蒸發端311。該冷凝端312與該第二導熱板 =3熱連接’該第二導熱板32為一具有良好導熱性能之銅板 荨金屬板，其與該散熱殼體U熱連接，該散熱殼體U與 空氣自然對流，從而將該發光二極體照明裝置1〇〇於工作 過耘中產生且由該冷凝端312傳送來之熱量傳送到外界， 達到散熱目的。 综上所述，本發明確已符合發明專利之要件，遂依法 ❾提出專利申請。但以上所述僅為本發明之較佳實施方式， 不能以此限制本案之申請專利範圍。舉凡熟悉本案技藝之 人士依本發明之精神所作之等效修飾或變化，皆應涵蓋於 以下申請專利範圍内。 【圖式簡單說明】 圖1係本發明實施例提供之發光二極體照明裝置之截 面示意圖； 圖2係圖1中所示熱管之工作原理示意圖。 【主要元件符號說明】 9 200940888 發光二極體照明裝置 100 燈罩 10 發光模組 20 散熱模組 30 散熱殼體 11 出光部 13 擴散板 12 反射罩 22 發光二極體 21 導熱板 32 第二導熱板 33 熱管 31 蒸發端 311 冷凝端 312 毛細結構層 313 ❹200940888 IX. Description of the Invention: [Technical Field of the Invention] The present invention relates to a light-emitting diode lighting device. [Prior Art] At present, Light Emitting Diode (LED) has been widely used in many fields, especially in street lamps. Here, a novel light-emitting diode can be found in Daniel A. Steigerwald et al., IEEE Journal on Selected Topics in Quantum 〇 Electronics, Vol. 8, No. 2, March/April 2002. Illumination With Solid State Lighting Technology - text. Since the temperature of the light-emitting diode is gradually increased when the light-emitting diode is illuminated, the working voltage, the wavelength of the light, and the intensity of the light output are greatly affected when the temperature reaches a certain level. In the continuous operation of the illuminating device, if the heat generated by the illuminating diode cannot be dissipated in time, the components such as the illuminating diode may be damaged, so that the illuminating device cannot operate normally. In order to avoid this situation, it is necessary to provide a heat-dissipating component such as a heat-dissipating fan, a heat pipe, etc. to the light-emitting diode. Since the heat-dissipating fan has a low heat-dissipating efficiency, a heat pipe is often used as the heat-dissipating component, however, the heat pipe is used in the prior art. In the illuminating device as the heat dissipating component, generally, the heat pipe is disposed in parallel with the plane in which the light emitting diode is disposed, that is, the heat receiving end and the condensing end of the heat pipe are in the same plane and the plane is parallel to the plane of the light emitting diode, so as to cause The heat dissipation efficiency of the heat pipe is not high. SUMMARY OF THE INVENTION A light-emitting diode 6 200940888 body lighting device with high heat dissipation efficiency will be described below by way of example. A light-emitting diode lighting device comprises: a lampshade, a light-emitting module and a heat-dissipating module. The light cover includes a heat dissipation housing and a light exiting portion. The light emitting module is disposed in the heat dissipation housing and opposite to the light emitting portion. The light emitting module includes a plurality of light emitting diodes, and the light emitted by the plurality of light emitting diodes And the heat dissipation module is disposed in the heat dissipation housing and located on a side of the light emitting module away from the light exiting portion, the air heat dissipation module includes a plurality of heat pipes, and the evaporation ends of the plurality of heat pipes It is thermally connected to the plurality of light-emitting diodes, and the condensation end thereof is thermally connected to the heat dissipation housing. Compared with the prior art, the evaporation end of the plurality of heat pipes in the light-emitting diode lighting device is thermally connected to the plurality of light-emitting diodes, and the heat generated by the plurality of light-emitting diodes can be quickly transmitted to the heat pipe, and the plurality of heat-emitting diodes are quickly transferred to the heat pipe. The condensing end of the heat pipe is thermally connected to the heat dissipating casing, and the heat can be transferred to the air in time, so that the illuminating diode lighting device can effectively improve the heat dissipating efficiency, and the heat dissipating module in the illuminating diode illuminating device The light emitting diode is located on one side of the light-emitting portion of the hair-emitting body, and does not block or absorb the light emitted by the light-emitting diode, thereby avoiding light loss caused by the heat-dissipating module. [Embodiment] Hereinafter, embodiments of the present invention will be further described in detail with reference to the accompanying drawings. . Referring to FIG. 1 , an embodiment of the present invention provides a light-emitting diode lighting device 100 with high heat dissipation efficiency, comprising: a lamp cover 1 , a light-emitting module 20 and a heat dissipation module 30 . The lampshade 10 includes a heat dissipating casing 11', a light exiting portion 13 and a diffusing plate 12 disposed on the light exiting portion 13. The light exit portion 13 can be an opening, as shown in Fig. 1, or can be made of a transparent material. The light-emitting module 20 is disposed in the heat-dissipating housing 11 and opposite to the light-emitting portion 13, and includes a reflector 22 and a plurality of LEDs 21 disposed on the inner surface of the reflector 22. The plurality of light emitting diodes 21 are arranged in an array type such as a matrix or a linear array. The heat dissipation module 30 is disposed in the heat dissipation housing 11 and located on a side of the light emitting module 20 away from the light exit portion 13 . The heat dissipation module 30 includes a first heat conduction plate 32, a second heat conduction plate 33, and a plurality of heat pipes 31. The first heat conducting plate 32 is located on a side of the plurality of light emitting diodes 21 remote from the light exiting portion 13 and is thermally connected thereto. The second heat conducting plate 33 is fixed to the heat dissipating casing 11. The evaporation end 311 of the plurality of heat pipes 31 is fixed to one side of the first heat conducting plate 32 away from the plurality of light emitting diodes 21, and the condensation end 312 of the plurality of heat pipes 31 passes through the second heat conducting plate 33 and the heat radiating shell Body 11 is thermally connected. The plurality of heat pipes 31 are parallel to each other and spaced apart from each other, and corresponding to the plurality of light-emitting diodes 21, the length direction of the plurality of heat pipes 31 and the normal vector of the plane in which the plurality of light-emitting diodes 21 are located The directions are parallel. The reflector 22 reflects the light emitted from the light-emitting diode 21 and incident thereon to the diffusing plate 12, and the diffusing plate 12 equalizes the light and emits the light from the light-emitting portion 13. The arrangement of the reflector 22 reduces optical loss and improves light utilization efficiency. In the general case, the complex light-emitting diode 21 has an electro-optic conversion efficiency of about 40%, and the remaining about 60% of the electrical energy is converted into heat energy. The heat generated by the operation of the plurality of LEDs 21 is transmitted to the first heat conduction 200940888 board 32 via the reflector 22, thereby preventing a large amount of heat from being concentrated in the reflector 22, causing the temperature to be too high to affect the plurality of illuminations. The diode 21 works normally. The first heat conducting plate 32 can be a metal plate such as a copper plate having good thermal conductivity, and the absorbed heat is quickly transmitted to the evaporation end 311 of the plurality of heat pipes 31 thermally connected to the first heat conducting plate 32. Referring to FIG. 2, the working fluid of the plurality of heat pipes 31 changes into a gaseous state by absorbing heat in the evaporation end 311, and the gaseous working fluid reaches the cold condensing end 312 to release the absorbed heat and is converted into a liquid state, and then passes through the capillary structure. Layer 313 flows back to evaporation end 311. The condensing end 312 is thermally connected to the second heat conducting plate=3. The second heat conducting plate 32 is a copper plate metal plate having good thermal conductivity, and is thermally connected to the heat dissipating case U. Natural convection, so that the light generated by the illuminating diode illuminating device 1 and generated by the condensing end 312 is transmitted to the outside to achieve the purpose of heat dissipation. In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and the scope of the patent application of the present invention cannot be limited thereto. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic cross-sectional view of a light-emitting diode lighting device according to an embodiment of the present invention; FIG. 2 is a schematic view showing the operation principle of the heat pipe shown in FIG. [Main component symbol description] 9 200940888 Light-emitting diode lighting device 100 Lampshade 10 Light-emitting module 20 Heat-dissipating module 30 Heat-dissipating housing 11 Light-emitting part 13 Diffuser 12 Reflector 22 Light-emitting diode 21 Heat-conducting plate 32 Second heat-conducting plate 33 heat pipe 31 evaporation end 311 condensation end 312 capillary structure layer 313 ❹