1335404 I 099年07月22日修正替換頁 六、發明說明： 二極體燈具，尤係具有散熱模組之 [0001] 【發明所屬之技術領威】 本發明涉及一種發光 發光二極體燈具β [先前技術]1335404 I Revised replacement page on July 22, 099. Description of the invention: Diode lamp, especially with heat dissipation module [0001] [Technology of the invention] The invention relates to a light-emitting diode lamp β [Prior technology]
[0002] 隨著科學技術進步，從一般鎢絲燈發展到現在之冷陰極 螢光燈管（Cold Cathode Fluorescent Lamp’ CCFL )及發光二極體（Light Emitting Diode, LED) ’ ^ 皆是朝向體積縮小及扁平化之方向發展° [0003] 而目前CCFL因為體積幾乎是不能再縮小，而且CCFL升壓 到600伏特電壓時會發生干擾，另外aGFl/g造成汞污染等 ,χ * - · A ^ 〆·；, 問題，使得部分國家也將予以禁用而有環保、亮 度高、省電、壽命長等諸多特點，所以led將漸漸取代 CCFL。然而，現今高亮度LED所產生之局部熱量較大，若 要取代CCFL作為照明產品，則必須要有合適之散熱設計 ;否則會造成LED發光效率降夢及壽命縮短等問題，所以 • 現今LED封裝結構多利用金屬承載基板（Metai Core[0002] With the advancement of science and technology, from the development of general tungsten filament lamps to the current Cold Cathode Fluorescent Lamps (CCFL) and Light Emitting Diodes (LEDs) ^ ^ are toward the volume The direction of reduction and flattening [0003] At present, CCFL can hardly shrink because of the volume, and when CCFL is boosted to 600 volts, interference will occur, and aGFl/g will cause mercury pollution, etc., χ * - · A ^ 〆·;, problems, so that some countries will also be banned and have many characteristics such as environmental protection, high brightness, power saving, long life, etc., so led will gradually replace CCFL. However, today's high-brightness LEDs generate a large amount of local heat. If you want to replace CCFL as a lighting product, you must have a proper heat dissipation design. Otherwise, LED lighting efficiency will be reduced, and life expectancy will be shortened. So • Today's LED package Multi-purpose metal carrier substrate (Metai Core)
Print Circuit Board，MCPCB)作為散熱媒介，但 LED仍無法以高密集度方式設置，原因在 法有效突破，因此有關L随熱是目前業界巫需克服之難 題。 【發明内容】 議]-種發光二極體燈具，包括—燈罩、—位於燈罩内之發 光二極題組’以及—散減組，該發I極體模組包 括複數發光二極體。其中，該散熱模組包括一第一散熱 096128541 表單編號A0101 笫3頁/共15頁 0993263220-0 1335404 099年07月22日修正替換頁 器、一第二散熱器、一位於該第一散熱器和該第二散熱 器之間之熱傳導元件。該等發光二極體分佈在該熱傳導 元件上；該燈罩位於該第一散熱器和第二散熱器之間並 將熱傳導元件及發光二極體模組罩設其内。 [0005] 與習知技術相比，本發明發光二極體燈具之散熱模組包 括兩個散熱器而使其具有較i大之散熱面積，故可快速地 將發光二極體產生之熱量散發，從而可確保發光二極體 工作于正常溫度範圍内，提昇燈具照明效果。 【實施方式】 [0006] 如圖1及圖2所示，本發明之發光二極體燈具包括一發光 二極體模組100、一用以支撐並冷卻該發光二極體模組 100之散熱模組200，以及設置於散熱模組200中部之一 燈罩300和反光罩400。該發光二極體模組100包括複數 發光二極體110及複數電路板120，該等發光二極體110 安裝於相應之電路板120上並與電路板120電性連接。 [0007] 請一併參閱圖4，該散熱模組20 0包括一第一散熱器210、 一第二散熱器230、一位於該第一散熱器210和第二散熱 器230之間之熱傳導元件250，以及複數熱管270，該等 熱管270將熱傳導元件250與第一散熱器210及第二散熱 器230連接。該燈罩300和反光罩400設置於第一散熱器 210與第二散熱器230之間，並將發光二極體模組100和 熱傳導元件250罩設其内。 [0008] 燈罩300為内凹之碗狀結構，通常是由透明之塑膠、玻璃 或其他材料製成。燈罩300包括一内凹之上表面（圖中未 標），其中部具有一通孔310。該通孔310可供第一散熱 096128541 表單編號 A0101 第 4 頁/共 15 頁 0993263220-0 1335404 器210之上部穿過， 099年07月22日 從而使燈罩300組裝於第一散熱器 210上並令燈罩300之上表面朝向反光罩4〇〇。 [0009]Print Circuit Board (MCPCB) is used as a heat-dissipating medium, but LEDs cannot be set in a high-density manner. The reason is that the method is effective, so the related heat of L is a difficult problem that the industry needs to overcome. SUMMARY OF THE INVENTION A light-emitting diode lamp includes a lampshade, a light-emitting diode set in the lampshade, and a dimming group, and the hair-emitting diode module includes a plurality of light-emitting diodes. Wherein, the heat dissipation module includes a first heat dissipation 096128541 Form No. A0101 笫 3 pages / 15 pages 0993263220-0 1335404 01997 July 22 revision replacement page device, a second heat sink, and a first heat sink And a heat conducting element between the second heat sink. The light-emitting diodes are distributed on the heat-conducting element; the lamp cover is located between the first heat sink and the second heat sink and covers the heat-conducting element and the light-emitting diode module. Compared with the prior art, the heat dissipation module of the light-emitting diode lamp of the present invention includes two heat sinks to have a larger heat dissipation area, so that the heat generated by the light-emitting diode can be quickly dissipated. Therefore, it can ensure that the light-emitting diode works in a normal temperature range and enhance the lighting effect of the lamp. [Embodiment] As shown in FIG. 1 and FIG. 2, the LED device of the present invention includes a light emitting diode module 100, and a heat dissipation device for supporting and cooling the LED module 100. The module 200 and the lampshade 300 and the reflector 400 are disposed in the middle of the heat dissipation module 200. The LED module 100 includes a plurality of LEDs 110 and a plurality of circuit boards 120. The LEDs 110 are mounted on the corresponding circuit board 120 and electrically connected to the circuit board 120. Referring to FIG. 4 , the heat dissipation module 20 0 includes a first heat sink 210 , a second heat sink 230 , and a heat conducting component between the first heat sink 210 and the second heat sink 230 . 250, and a plurality of heat pipes 270 that connect the heat conduction elements 250 with the first heat sink 210 and the second heat sink 230. The lamp cover 300 and the reflector 400 are disposed between the first heat sink 210 and the second heat sink 230, and the light emitting diode module 100 and the heat conducting element 250 are covered therein. The lampshade 300 is a concave bowl-like structure, usually made of transparent plastic, glass or other material. The lamp cover 300 includes a concave upper surface (not shown) having a through hole 310 therein. The through hole 310 is configured to pass through the upper portion of the first heat sink 096128541 Form No. A0101, and the upper portion of the device 210, and the light cover 300 is assembled on the first heat sink 210. The upper surface of the lamp cover 300 is directed toward the reflector 4 . [0009]
[0010][0010]
096128541 反光罩400為内凹之碗狀結構，其包括一内凹之下表面（ 圖中未示），其中部也具有一通孔41〇。該通孔41〇可供 第一散熱器230之下部穿過’從而使反光罩4〇〇組裝於第 二散熱器230並令反光罩4〇〇之下表面朝向燈罩3〇〇之上 表面。該反光罩400與燈罩3〇〇共同圍成一燈室用以容納 發光二極體模組100及熱傳導元件250，可防止灰塵、昆 蟲等進入燈具内而影響發光二極體模組100之使用壽命。 另外’根據實際使用狀況，可以將反光罩4〇〇省略而令一 燈罩直接設於第一散熱器210妒第二敗熱器230之間以收 容熱傳導元件250和發光二極體模組ι〇〇β , 請一併參閱圖3，該等發光二極體11〇及相應電路板12〇分 佈在熱傳導元件250之外側周面，使該等發光二極體11〇 呈立體狀分佈而形成一立體光源，可增強燈具照明效果 ，....：：. . 。在使用時’發光二極體110在電路板12〇控制下產生光 線’起到照明效果；與此同時，發光二極體110產生之熱 量首先被熱傳導元件250吸收；然後通過熱管270内工作 介質之相變化將熱量分別傳遞給位於散熱模組2〇〇兩端部 之第—散熱器210和第二散熱器230進而散發到外部環境 中去。由於散熱模組200包括兩個散熱器而使其具有較大 散熱面積，故可快速地將發光二極體11〇產生之熱量散發 ;此外，發光二極體模組100位於散熱模組200之中部， 而第一散熱器210和第二散熱器230位於散熱模組200之 兩端部，通過熱管270把發光二極體110產生之熱量均勻 表單編St A0101 第 5 頁/共 15 頁 0993263220-0 1335404 傳導至帛散熱器210和第二散熱器230，可將熱量分 攤到兩個散熱器上以加快熱量散發；另外，可以利用發 光二極體模組loo周固之^間來增大第一散熱器21〇與第 -散熱器23G之散熱面積，進—步提昇散熱模組2〇〇整體 之散熱性能°以下針對散熱模組m之各部件之具體結構 作進一步說明’以更好地了解散熱模組2GG之工作過程。 [0011] 熱傳導元件250設置於第一散熱器21〇和第二散熱器23〇 之間，且熱傳導元件250之相對兩端分別固定在第一散熱 器210和第二散熱器230上。該熱傳導元件25〇是一個中 空六棱柱結構，其具有六個外側面252及一個圓柱狀之内 表面254。在熱傳導元件25_έι每一個外^^252上，三 個發光二極體110沿著熱傳拿元件2 5分之#線:方向排列成 條直線。六個溝槽256對稱地分佈在熱傳導元件250之 内表面254 ’並沿著熱傳導元件250之軸線方向延伸。其 中’每一個溝槽256與一外側面252對應，並位於該對應 外側面252上三個發光二極體110之正下方用以收容、固 定熱管270之一部分。 [〇〇12] 該等熱管270之一部分固定在熱傳導元件25〇上，而其另 一部分則分別固定到第一散熱器210和第二散熱器23〇上 。依照熱管270與第一散熱器210和第二散熱器23〇之間 之連接關係，可將該等熱官2 7 0劃分為兩組，即第一組為 與第一散熱器210連接之三支熱管272 ;第二組為與第二 散熱器230連接之三支熱管274 »如圖4中所示，第一組中 每一熱管272之上半部’即蒸發段，固定於熱傳導元件 250上相應之溝槽256内；每一熱管272之下半部，即冷 096128541 表單編號Α0101· 第6頁/共15頁 0993263220-0 1335404 • 099年07月22日核正替換頁 凝段，固定於第一散熱器210内。第二組中每一熱管274 之下半部，即蒸發段，固定於熱傳導元件250上相應之溝 槽256内；每一熱管274之上半部，即冷凝段，固定於第 二散熱器230内。換言之，熱傳導元件2 50吸收之熱量之 一部分，可通過第一組熱管272向下傳導至第一散熱器 210 ;熱傳導元件250吸收之熱量之其餘部分，可通過第 二組熱管274向上傳導至第二散熱器230。而且，第一組 熱管272與第二組熱管274在熱傳導元件250内間隔交替 排列，有利於將發光二極體110產生之熱量均勻、快速地 傳遞給第一散熱器210和第二散熱器230。 [0013] 第一散熱器210包括一圓筒肤之基座2.1.2·，'.以及自該基座 Λ' ..〔赛:.） 被么 21 2外侧周面向外放射狀延#之複JL散’熱片/214。相鄰散 'Λ..'''.吧'_: 熱片214之間分別形成一通道以供氣流流過。該基座212 頂端向上凸伸出有一環形連接部2122，該連接部2122與 熱傳導元件250之底端連接。該基座212之底端與一燈頭 (圖中未示）連接，該燈頭為可從市場上獲得之標準件 • 。三個凹槽216對稱地形成於基座212之内壁面，並沿基 座212之軸線方向延伸，該等凹槽216與熱傳導元件250 内之溝槽256對應設置以容納第一組熱管272之下半部。 [0014] 第二散熱器230是第一散熱器210之倒置結構，其也包括 一圓筒狀之基座232、複數散熱片234及三個凹槽236用 以收容第二組熱管274之冷凝段。該基座232底端向下凸 伸出有一環形連接部2322，該連接部2322與熱傳導元件 250之頂端連接。第一散熱器210、第二散熱器230、熱 傳導元件250及熱管270可通過焊接等方法連接成一體， 096128541 表單編號A0101 第7頁/共15頁 0993263220-0 1335404 [0015] [0016] [0017] [0018] [0019] [0020] [0021] [0022] [0023] [0024] [0025] 並令燈罩300和反光罩400夾設於第一散熱器210和第二 散熱器230之間罩設發光二極體模組1〇〇，如此即可組成 上述燈具。由於第二散熱器230之基座232為中空結構’ 一蓋板或擋片可蓋在第二散熱器230之上部，以防止灰塵 、昆蟲等進入燈具内而影響發光二極體模組1〇〇之使用壽 命。 综上所述，本發明符合發明專利要件，爰依法提出專利 申凊^惟，以上所述者僅為本發明之較佳實施例，舉凡 熟悉本案技藝之人士，在爰依本發明精神所作之等效修 痛 飾或變化，皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 : 圖1是本發明發光二極體燈具之立_體丨圓、 圖2是圖1中發光二極體燈具之分解圖。 圖3是圖2中散熱模組與發光二極體模組之組合圖。 圖4是圖3中散熱模組與發光二極體模组之剖視圖。 ...... 【主要元件符號說明】 ^ 發光二極體模組：100 電路板：120 第一散熱器：210 散熱片：214 連接部：2122 基座：232 096128541 表單編號A0101 第8頁/共15頁 0993263220-0 Γ335404 099年07月22日核正替换頁 [0026] 凹槽：236 [0027] 熱傳導元件：250 [0028] 内表面：254 [0029] 熱管：270、272、274096128541 The reflector 400 is a concave bowl-like structure including a concave lower surface (not shown), and a middle portion thereof also has a through hole 41. The through hole 41 is permeable to the lower portion of the first heat sink 230 so that the reflector 4 is assembled to the second heat sink 230 and the lower surface of the reflector 4 is directed toward the upper surface of the globe 3. The reflector 400 and the lampshade 3 are enclosed by a lamp chamber for accommodating the LED module 100 and the heat conducting component 250 to prevent dust, insects, etc. from entering the lamp and affecting the use of the LED module 100. life. In addition, according to the actual use condition, the reflector 4 can be omitted and a lamp cover can be directly disposed between the first heat sink 210 and the second heat exchanger 230 to accommodate the heat conducting component 250 and the light emitting diode module. 〇β, please refer to FIG. 3 together, the light-emitting diodes 11〇 and the corresponding circuit board 12〇 are distributed on the outer peripheral surface of the heat conducting element 250, so that the light-emitting diodes 11〇 are distributed in a three-dimensional manner to form a Stereo light source can enhance the lighting effect of the lamp, ....::. . In use, the 'light-emitting diode 110 generates light under the control of the circuit board 12 '' to illuminate the effect; at the same time, the heat generated by the light-emitting diode 110 is first absorbed by the heat-conducting element 250; then the working medium is passed through the heat pipe 270 The phase change transfers the heat to the first heat sink 210 and the second heat sink 230 located at both ends of the heat dissipation module 2, and then is radiated to the external environment. Since the heat dissipation module 200 includes two heat sinks to have a large heat dissipation area, the heat generated by the LEDs 11 can be quickly dissipated. In addition, the LED module 100 is located in the heat dissipation module 200. In the middle portion, the first heat sink 210 and the second heat sink 230 are located at both ends of the heat dissipation module 200, and the heat generated by the light-emitting diode 110 is uniformly formed by the heat pipe 270. The form is St A0101, page 5 of 15 0993263220- 0 1335404 Conducted to the heat sink 210 and the second heat sink 230, the heat can be distributed to the two heat sinks to accelerate the heat dissipation; in addition, the light emitting diode module can be used to increase the number The heat dissipation area of a heat sink 21〇 and the first heat sink 23G, and further improve the heat dissipation performance of the heat dissipation module 2〇〇. The following is a further description of the specific structure of each component of the heat dissipation module m. Understand the working process of the thermal module 2GG. [0011] The heat conduction element 250 is disposed between the first heat sink 21〇 and the second heat sink 23〇, and opposite ends of the heat conduction element 250 are respectively fixed on the first heat sink 210 and the second heat sink 230. The heat conducting element 25A is a hollow hexagonal prism structure having six outer sides 252 and a cylindrical inner surface 254. On each of the heat conducting elements 25_έ, the three light emitting diodes 110 are arranged in a straight line along the #线: direction of the heat transfer element. Six trenches 256 are symmetrically distributed over the inner surface 254' of the thermally conductive element 250 and extend along the axis of the thermally conductive element 250. Each of the trenches 256 corresponds to an outer side surface 252 and is located directly below the three light emitting diodes 110 on the corresponding outer side surface 252 for receiving and fixing a portion of the heat pipe 270. [〇〇12] One of the heat pipes 270 is partially fixed to the heat conducting member 25A, and the other portion is fixed to the first heat sink 210 and the second heat sink 23b, respectively. According to the connection relationship between the heat pipe 270 and the first heat sink 210 and the second heat sink 23, the heat registers 210 can be divided into two groups, that is, the first group is connected to the first heat sink 210. The heat pipe 272; the second group is three heat pipes 274 connected to the second heat sink 230. As shown in FIG. 4, the upper half of each heat pipe 272 in the first group, that is, the evaporation section, is fixed to the heat conduction element 250. In the corresponding groove 256; the lower half of each heat pipe 272, that is, cold 096128541 Form No. 1010101· Page 6 / Total 15 Page 0993263220-0 1335404 • July 22, 099 nuclear replacement page condensing section, fixed In the first heat sink 210. The lower half of each heat pipe 274 in the second group, that is, the evaporation section, is fixed in the corresponding groove 256 of the heat conducting element 250; the upper half of each heat pipe 274, that is, the condensation section, is fixed to the second heat sink 230. Inside. In other words, a portion of the heat absorbed by the heat conducting element 205 can be conducted downwardly through the first set of heat pipes 272 to the first heat sink 210; the remainder of the heat absorbed by the heat conducting element 250 can be conducted upward through the second set of heat pipes 274 Two radiators 230. Moreover, the first group of heat pipes 272 and the second group of heat pipes 274 are alternately arranged in the heat conducting element 250, which is beneficial to uniformly and quickly transfer the heat generated by the light emitting diodes 110 to the first heat sink 210 and the second heat sink 230. . [0013] The first heat sink 210 includes a base of the cylindrical skin 2.1.2·, '. and from the base Λ '. (赛:.) by the outer side of the outer circumference of the 21 2 radial extension JL scattered 'hot film / 214. Adjacent to the 'Λ..'''..'_: A channel is formed between the hot sheets 214 for airflow. An annular connecting portion 2122 is protruded from the top end of the base 212, and the connecting portion 2122 is connected to the bottom end of the heat conducting member 250. The bottom end of the base 212 is coupled to a base (not shown) which is a commercially available standard. Three recesses 216 are symmetrically formed on the inner wall surface of the base 212 and extend along the axis of the base 212. The recesses 216 are disposed corresponding to the grooves 256 in the heat conducting element 250 to accommodate the first set of heat pipes 272. The lower half. [0014] The second heat sink 230 is an inverted structure of the first heat sink 210, and also includes a cylindrical base 232, a plurality of fins 234 and three recesses 236 for accommodating the condensation section of the second group of heat pipes 274. . An annular connecting portion 2322 is protruded downwardly from the bottom end of the base 232. The connecting portion 2322 is connected to the top end of the heat conducting element 250. The first heat sink 210, the second heat sink 230, the heat conduction element 250, and the heat pipe 270 may be integrally connected by soldering or the like, 096128541 Form No. A0101 Page 7 / Total 15 Page 0993263220-0 1335404 [0015] [0016] [0017 [0020] [0024] [0024] [0025] [0025] [0025] and the lampshade 300 and the reflector 400 are sandwiched between the first heat sink 210 and the second heat sink 230 A light-emitting diode module 1 is provided, so that the above-mentioned lamps can be formed. Since the base 232 of the second heat sink 230 is a hollow structure, a cover or a cover can be placed on the upper portion of the second heat sink 230 to prevent dust, insects, etc. from entering the lamp and affecting the LED module. The service life of the cockroach. In summary, the present invention complies with the requirements of the invention patents, and the patent application is filed according to law. The above description is only a preferred embodiment of the present invention, and those skilled in the art of the present invention are in accordance with the spirit of the present invention. Equivalent repairs or changes shall be covered by the following patents. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an exploded view of a light-emitting diode lamp of the present invention, and FIG. 2 is an exploded view of the light-emitting diode lamp of FIG. 3 is a combination diagram of the heat dissipation module and the light emitting diode module of FIG. 4 is a cross-sectional view of the heat dissipation module and the light emitting diode module of FIG. ...... [Key component symbol description] ^ LED module: 100 PCB: 120 First heat sink: 210 Heat sink: 214 Connection: 2122 Base: 232 096128541 Form No. A0101 Page 8 / Total 15 pages 0993263220-0 Γ335404 July 22, 2008, nuclear replacement page [0026] Groove: 236 [0027] Heat conduction element: 250 [0028] Inner surface: 254 [0029] Heat pipe: 270, 272, 274
[0030] 燈罩：300 [0031] 反光罩：400 [0032] 發光二極體：110 [0033] 散熱模組：200 [0034] 基座：212 [0035] 凹槽：216 [0036] 第二散熱器：230 [0037] 散熱片：234 [0038] 連接部：2322 [0039] 外侧面：252 [0040] 溝槽：256 [0041] 通孔：310 [0042] 通孔：410 096128541 表單编號A0101 第9頁/共15頁 0993263220-0[0030] Lampshade: 300 [0031] Reflector: 400 [0032] Light-emitting diode: 110 [0033] Thermal module: 200 [0034] Base: 212 [0035] Groove: 216 [0036] Second heat dissipation Heat sink: 230 [0037] Heat sink: 234 [0038] Connection: 2322 [0039] Outer side: 252 [0040] Trench: 256 [0041] Through hole: 310 [0042] Through hole: 410 096128541 Form number A0101 Page 9 of 15 0993263220-0