200907235 九、發明說明： 【發明所屬之技術領域】 本發明涉及一種發光二極體燈具，尤係具有散熱模組 之發光二極體燈具。 【先前技術】 隨著科學技術進步，從一般鎢絲燈發展到現在之冷陰 極煢光燈管（Cold Cathode Fluorescent Lamp, CCFL)及發 光二極體（Light Emitting Diode，LED )，皆是朝向體積縮 小及爲平化之方向發展。 而目前CCFL因為體積幾乎是不能再縮小，而且CCFL 升壓到600伏特電壓時會發生干擾，另外CCFL會造成汞 污染等問題，使得部分國家也將予以禁用。而LED具有環 保、亮度高、省電、壽命長等諸多特點，所以LED將漸漸 取代CCFL。然而，現今高亮度LED所產生之局部熱量較 大，若要取代CCFL作為照明產品，則必須要有合適之散 熱設計；否則會造成LED發光效率降低及壽命縮短等問 題，所以現今LED封裝結構多利用金屬承載基板（Metal Core Print Circuit Board，MCPCB)作為散熱媒介，但 LED 仍無法以高密集度方式設置，原因在於散熱能力仍無法有 效突破，因此有關LED散熱是目前業界亟需克服之難題。 【發明内容】 一種發光二極體燈具，包括一燈罩、一位於燈罩内之 發光二極體模組，以及一散熱模組，該發光二極體模組包 200907235 括複數發光二極體。其中，該散熱模組包括一第一散熱器、 一第二散熱器、一位於該第一散熱器和該第二散熱器之間 之熱傳導元件。該等發光二極體分佈在該熱傳導元件上； 該燈罩位於該第一散熱器和第二散熱器之間並將熱傳導元 件及發光二極體模組罩設其内。 與習知技術相比，本發明發光二極體燈具之散熱模組 包括兩個散熱器而使其具有較大之散熱面積，故可快速地 將發光二極體產生之熱量散發，從而可確保發光二極體工 作于正常溫度範圍内，提昇燈具照明效果。 【實施方式】 如圖1及圖2所示’本發明之發光二極體燈具包括一 發光一極體模組100、一用以支稽並冷卻該發光二極體模組 1〇〇之散熱模組200，以及設置於散熱模組2〇〇中部之一燈 罩300和反光罩400。該發光二極體模組1〇〇包括複數發光 二極體110及複數電路板12〇，該等發光二極體ι1〇安裝於 相應之電路板120上並與電路板12〇電性連接。 凊一併參閱圖4 ’該散熱模組200包括一第一散熱器 210、一第二散熱器23〇、一位於該第一散熱器21〇和第二 散熱益230之間之熱傳導元件250，以及複數熱管270，該 等熱官270將熱傳導元件25〇與第一散熱器21〇及第二散 熱器230連接。該燈罩300和反光罩400設置於第一散熱 器210與第二散熱器230之間，並將發光二極體模組100 和熱傳導元件250罩設其内。 燈罩300為内凹之碗狀結構，通常是由透明之塑膠、 7 200907235 玻璃或其他材料製成。燈罩300包括-内凹之上表面.(圖 中未才不）’其中部具有—通孔310。該通孔別可供第一散 熱器210之上部穿過，#而使燈罩3⑽組裝於第—散熱器 210上亚令燈罩300之上表面朝向反光罩4⑽。 反光罩400為内凹之碗狀結構，其包括一内凹之下表 (圖中未示），其中部也具有一通孔。該通孔4工〇 可，第二散熱器23G之下部穿過，從而使反光罩_組裝 於第二散熱器230並令反光罩4〇〇之下表面朝向燈罩· ^上表面。該反光罩400與燈罩300共同圍成一燈室用以 谷納發光二極體模組1〇〇及熱傳導元件b〇,可防止灰塵、 =蟲等進入燈具内而影響發光二極體模組1〇〇之使用壽 ^另外，根據實際使用狀況，可以將反光罩400省略而 令罩直接設於第-散熱器210和第二散熱器230之間 以收=熱傳導兀件25〇和發光二極體模組^⑽。 月併參閱圖3，該等發光二極體i丨〇及相應電路板 120分佈在熱傳導元件謂之外側周面，使該等發光二極體 〇呈立體狀分佈而形成一立體光源，可增強燈具照明效 果在使用時，發光二極體11〇在電路板12〇控制下產生 一 Λ起到如、明效果；與此同時，發光二極體i 1(3產生之 …、里首先被熱傳導元件250吸收；然後通過熱管27〇内工 作w貝之相變化將熱量分別傳遞給位於散熱模組200兩端 Ρ之第散熱器210和第二散熱器230進而散發到外部環 i兄中去。由於散熱模組2〇()包括兩個散熱器而使其具有較 8 200907235 大散熱面積，故可快速地將發光二極體11〇產生之熱量散 發，·此外，發光二極體模組100位於散熱模組2〇〇之中部， 而第一散熱器210和第二散熱器23〇位於散熱模組之 兩端部，通過熱管270把發光二極體110產生之熱量均勻 地傳導至第一散熱器21〇和第二散熱器23〇，可將熱量分攤 到兩個散熱器上以加快熱量散發；另外’可以利用發光二 極體模組1〇〇周圍之空間來增大第一散熱器21〇與第二散 熱器230之散熱面積，進一步提昇散熱模組2〇〇整體之散 熱性能。以下針對散熱模組細之各部件之具體結構作進 一步說明，以更好地了解散熱模組2〇〇之工作過程。 熱傳導το件250設置於第—散熱器21〇和第二散熱器 230之間，且熱傳導元件25〇之相對兩端分別固定在第^散 熱器2U)和第二散熱器230上。該熱傳導元件25〇是—個 中空六棱柱結構，其具有六個外側面252及—個圓柱狀之 内表面254。在熱傳導元件25〇之每一個外側面252上，三 個發光二 一條直線 極體11G沿著熱傳導元件25G之轴線方向排列成 。六個溝槽256對稱地分佈在熱傳導元件25〇之 内表面254,並沿著熱傳導元件25〇之軸線方向延伸。其 中，每-個溝槽256與-外側自252制，並位於該對應 外側面252上三個發光二極體11〇之正下方用以收容、固 定熱管270之一部分。 該等熱管 270之一部分固定在熱傳導元件25〇上 而 9 200907235 其另一部分則分別固定到第一散熱器210和第二散熱器 2 3 〇上。依K?、熱管2 7 0與弟一散熱器210和第二散熱2 3 〇 之間之連接關係’可將該等熱管270劃分為兩組，即第一 組為與第一散熱器210連接之三支熱管272;第二組為與第 一散熱益230連接之三支熱管274。如圖4中所示，第一组 中每一熱管272之上半部，即蒸發段，固定於熱傳導元件 250上相應之溝槽256内；每一熱管272之下半部，即冷凝 I又，固疋於第一散熱器210内。第二組中每一熱管274之 下半部，即蒸發段，固定於熱傳導元件25〇上相應之溝槽 256内，每一熱管274之上半部，即冷凝段，固定於第二散 熱器230内。換言之，熱傳導元件25〇吸收之熱量之—部 分，可通過第一組熱管272向下傳導至第一散熱器21〇 :熱 傳導元件250吸收之熱量之其餘部分’可通過第二組熱管 274向上傳導至第二散熱器23〇。而且，第一組熱管π?與 (第二組熱管274在熱傳導元件25〇内間隔交替排列，有利 於將七光—極體11〇產生之熱量均勻、快速地傳遞給第— 政熱益210和第二散熱器230。 第一散熱器210包括—圓筒狀之基座212，以及自該基 座212外側周面向外放射狀延伸之複數散熱片。相鄰散 熱片214之間分別形成—通道以供氣流流過。該基座扣 頁令而向上凸伸出有一環形連接部，該連接部2m與熱 傳導元件250之底端連接。該基座212之底端與一燈頭(、圖 200907235 t未不）連接，該燈頭為可從市場上獲得之標準件。三個 .凹槽216對稱地形成於基座212之内壁面，並沿基座212 ' 曰216與熱傳導元件25〇内之溝 槽25^對應設置以容納第—組熱管奶之下半部。 第二散熱器230是第—散熱器21〇之倒置結構，其也 匕括圓冋狀之基座232、複數散熱片2M及三個凹槽 用以收容第二組熱管274之冷凝段。該基座232底端向下 凸伸出有-環形連接部说2,該連接部Μ22與熱傳導元件 250之頂端連接。第-散熱器21〇、第二散熱器230、埶傳 導凡件250及熱管270可通過焊接等方法連接成一體，並 令燈罩3〇0和反光罩400夹設於第一散熱器210和第二散 :器230之間罩設發光二極體模組·，如此即可組成上述 垃具。由於第二散熱器23〇之基座232為中空結構，—蓋 板或擋片可蓋在第二散熱器23〇之上部，以防止灰塵、2 蟲等進入燈具内而影響發光二極體模組之使用壽命。 =上料，本發明符合發明專利要件，爰依法提出專 」凊。惟，以上所述者僅為本發明之較佳實施例，舉凡 …:本案技藝之人士，在爰依本發明精神所作之等效修飾 或變化，皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 圖1是本發明發光二極體燈具之立體圖。 圖2是圖1令發光二極體燈具之分解圖。 11 200907235 圖3是圖2中散熱模組與發光二極體模組之組合圖。 圖4是圖3中散熱模組與發光二極體模組之剖視圖。 【主要元件符號說明】 發光二極體模組 100 發光二極體 110 電路板 120 散熱模組 200 第一散熱器 210 基座 212 散熱片 214 凹槽 216 連接部 2122 第二散熱器 230 基座 232 散熱片 234 凹槽 236 連接部 2322 熱傳導元件 250 外側面 252 内表面 254 溝槽 256 熱管 270 > 272 、 274 燈罩 300 通孔 310 反光罩 400 通孔 410 12200907235 IX. Description of the Invention: [Technical Field] The present invention relates to a light-emitting diode lamp, in particular to a light-emitting diode lamp having a heat-dissipating module. [Prior Art] With the advancement of science and technology, from the development of general tungsten filament lamps to the current Cold Cathode Fluorescent Lamps (CCFLs) and Light Emitting Diodes (LEDs), all are oriented toward volume. Reduce and develop in the direction of flattening. At present, the CCFL can hardly shrink because of the volume, and the CCFL will increase to 600 volts, and the CCFL will cause mercury pollution, which will be banned in some countries. LEDs have many features such as environmental protection, high brightness, power saving, and long life, so LEDs will gradually replace CCFL. However, today's high-brightness LEDs generate a large amount of local heat. If you want to replace CCFL as a lighting product, you must have a proper heat dissipation design. Otherwise, LED lighting efficiency will decrease and life will be shortened. Therefore, many LED package structures are available today. The Metal Core Print Circuit Board (MCPCB) is used as the heat dissipation medium, but the LED cannot be set in a high-density manner. The reason is that the heat dissipation capability cannot be effectively broken. Therefore, the LED heat dissipation is an urgent problem to be overcome in the industry. SUMMARY OF THE INVENTION A light-emitting diode lamp includes a lamp cover, a light-emitting diode module located in the lamp cover, and a heat-dissipating module. The light-emitting diode module package 200907235 includes a plurality of light-emitting diodes. The heat dissipation module includes a first heat sink, a second heat sink, and a heat conducting component between the first heat sink and the second heat sink. The light emitting diodes are distributed on the heat conducting component; the lampshade is disposed between the first heat sink and the second heat sink and covers the heat conducting component and the light emitting diode module. Compared with the prior art, the heat dissipation module of the light-emitting diode lamp of the present invention includes two heat sinks to have a large heat dissipation area, so that the heat generated by the light-emitting diode can be quickly dissipated, thereby ensuring The light-emitting diode works in the normal temperature range to enhance the lighting effect of the lamp. [Embodiment] As shown in FIG. 1 and FIG. 2, the LED lamp of the present invention includes a light-emitting diode module 100, and a heat dissipation module for cooling and cooling the LED module. The module 200 and the lampshade 300 and the reflector 400 are disposed in the middle of the heat dissipation module 2〇〇. The LED module 1 includes a plurality of LEDs 110 and a plurality of circuit boards 12A. The LEDs are mounted on the corresponding circuit board 120 and electrically connected to the circuit board 12. Referring to FIG. 4, the heat dissipation module 200 includes a first heat sink 210, a second heat sink 23, and a heat conducting component 250 between the first heat sink 21 and the second heat sink 230. And a plurality of heat pipes 270 that connect the heat conduction elements 25A to the first heat sink 21A and the second heat sink 230. The lamp cover 300 and the reflector 400 are disposed between the first heat sink 210 and the second heat sink 230, and the light emitting diode module 100 and the heat conduction element 250 are disposed therein. The lampshade 300 is a concave bowl-like structure, usually made of transparent plastic, 7 200907235 glass or other material. The lamp cover 300 includes a concave upper surface (not shown in the drawings), and a central portion thereof has a through hole 310. The through hole is allowed to pass through the upper portion of the first heat sink 210, and the lamp cover 3 (10) is assembled on the first heat sink 210. The upper surface of the lampshade 300 faces the reflector 4 (10). The reflector 400 is a concave bowl-like structure including a concave lower surface (not shown), and the middle portion also has a through hole. The through hole 4 is operative, and the lower portion of the second heat sink 23G passes through, so that the reflector _ is assembled to the second heat sink 230 and the lower surface of the reflector 4 朝向 faces the upper surface of the lamp cover. The reflector 400 and the lamp cover 300 together form a lamp chamber for the nano-light-emitting diode module 1 and the heat-conducting element b 〇 to prevent dust, worms, etc. from entering the lamp and affecting the LED module. In addition, according to the actual use situation, the reflector 400 can be omitted and the cover can be directly disposed between the first heat sink 210 and the second heat sink 230 to receive the heat conduction element 25 and the light emitting light. Polar body module ^ (10). Referring to FIG. 3, the light-emitting diodes and corresponding circuit boards 120 are distributed on the outer peripheral surface of the heat conducting element, so that the light-emitting diodes are distributed in a three-dimensional manner to form a three-dimensional light source, which can be enhanced. When the lighting effect of the luminaire is in use, the illuminating diode 11 产生 is produced under the control of the circuit board 12 Λ to achieve a clear effect; at the same time, the illuminating diode i 1 (3 is generated, the first is thermally conducted The component 250 is absorbed; then, the heat is transferred to the first heat sink 210 and the second heat sink 230 located at the two ends of the heat dissipation module 200 through the phase change of the heat pipe 27, and then distributed to the outer ring. Since the heat dissipation module 2〇() includes two heat sinks to have a larger heat dissipation area than the 8200907235, the heat generated by the light-emitting diode 11〇 can be quickly dissipated. In addition, the light-emitting diode module 100 is further provided. The first heat sink 210 and the second heat sink 23 are located at the two ends of the heat dissipation module, and the heat generated by the light-emitting diode 110 is uniformly transmitted to the first through the heat pipe 270. Radiator 21〇 and second radiator 2 3〇, the heat can be distributed to the two heat sinks to accelerate the heat dissipation; in addition, the space around the light-emitting diode module 1〇〇 can be used to increase the first heat sink 21〇 and the second heat sink 230 The heat dissipation area further enhances the overall heat dissipation performance of the heat dissipation module. The following is a further description of the specific structure of the components of the heat dissipation module to better understand the working process of the heat dissipation module. 250 is disposed between the first heat sink 21〇 and the second heat sink 230, and opposite ends of the heat conducting element 25〇 are respectively fixed on the second heat sink 2U) and the second heat sink 230. The heat conducting element 25 is a hollow hexagonal prism structure having six outer sides 252 and a cylindrical inner surface 254. On each of the outer side faces 252 of the heat conducting member 25, three light emitting diode bodies 11G are arranged along the axial direction of the heat conducting element 25G. Six trenches 256 are symmetrically distributed over the inner surface 254 of the thermally conductive element 25 and extend along the axis of the thermal conduction element 25''. Each of the grooves 256 and - is made of 252 and is located directly below the three light-emitting diodes 11 on the corresponding outer side surface 252 for receiving and fixing a portion of the heat pipe 270. One of the heat pipes 270 is partially fixed to the heat conducting member 25A and 9 200907235 and the other portion is fixed to the first heat sink 210 and the second heat sink 2 3 , respectively. According to the connection relationship between the K?, the heat pipe 210 and the heat sink 210 and the second heat sink 2 3 ', the heat pipes 270 can be divided into two groups, that is, the first group is connected to the first heat sink 210. The three heat pipes 272; the second group is three heat pipes 274 connected to the first heat sink 230. As shown in FIG. 4, the upper half of each heat pipe 272 in the first group, that is, the evaporation section, is fixed in the corresponding groove 256 of the heat conducting element 250; the lower half of each heat pipe 272, that is, the condensation I , being fixed in the first heat sink 210. The lower half of each heat pipe 274 in the second group, that is, the evaporation section, is fixed in the corresponding groove 256 of the heat conducting element 25, and the upper half of each heat pipe 274, that is, the condensation section, is fixed to the second heat sink. Within 230. In other words, the portion of the heat absorbed by the heat conducting element 25 can be conducted downwardly through the first set of heat pipes 272 to the first heat sink 21: the remainder of the heat absorbed by the heat conducting element 250 can be conducted upward through the second set of heat pipes 274 To the second heat sink 23〇. Moreover, the first group of heat pipes π? and (the second group of heat pipes 274 are alternately arranged in the heat conducting element 25〇, which facilitates the uniform and rapid transfer of heat generated by the seven-light body 11 给 to the first heat-consumption 210 And the second heat sink 230. The first heat sink 210 includes a cylindrical base 212, and a plurality of fins extending radially outward from the outer circumferential surface of the base 212. The adjacent heat sinks 214 are respectively formed between - The passage is for the airflow to flow through. The base buckle has an annular connecting portion protruding upwardly, and the connecting portion 2m is connected to the bottom end of the heat conducting element 250. The bottom end of the base 212 is connected with a base (Fig. 200907235 t not connected), the lamp cap is a standard piece available from the market. Three grooves 216 are symmetrically formed on the inner wall surface of the base 212 and along the base 212 ' 曰 216 and the heat conducting element 25 The groove 25^ is correspondingly arranged to accommodate the lower half of the first set of heat pipe milk. The second heat sink 230 is an inverted structure of the first heat sink 21〇, which also includes a rounded base 232 and a plurality of heat sinks 2M And three grooves for receiving the condensation section of the second group of heat pipes 274. The bottom end of the seat 232 protrudes downwardly from the annular connecting portion 2, and the connecting portion 22 is connected to the top end of the heat conducting element 250. The first heat sink 21, the second heat sink 230, the conductive member 250 and the heat pipe 270 The light shield 3〇0 and the reflector 400 are sandwiched between the first heat sink 210 and the second diffuser 230, and the light emitting diode module is disposed between the first heat sink 210 and the second diffuser 230. Since the base 232 of the second heat sink 23 is hollow, the cover or the cover can cover the upper part of the second heat sink 23〇 to prevent dust, 2 insects, etc. from entering the lamp and affecting the light. The service life of the diode module is the same as the invention. Equivalent modifications or variations made in accordance with the spirit of the present invention are intended to be included in the following claims. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a perspective view of a light-emitting diode lamp of the present invention. An exploded view of a light-emitting diode lamp. 11 200907235 Figure 3 Figure 4 is a cross-sectional view of the heat dissipation module and the light emitting diode module of Figure 3. [Main component symbol description] LED module 100 Light Emitting Diode 110 Circuit Board 120 Heat Dissipation Module 200 First Heat Sink 210 Base 212 Heat Sink 214 Groove 216 Connection 2122 Second Heat Sink 230 Base 232 Heat Sink 234 Groove 236 Connection Port 2322 Heat Conduction Element 250 Side 252 Inner surface 254 Groove 256 Heat pipe 270 > 272, 274 Lampshade 300 Through hole 310 Reflector 400 Through hole 410 12