200912187 九、發明說明： 【發明所屬之技術領域】 本發明涉及一種發光二極體燈呈， j. ., 一 荷別涉及一種呈有 散熱結構之發光二極體燈具。 男 【先前技術】 ▲發光二極體作為一種高效之發光源，具 1¾、省電、壽命長等諸多牲P 、 ’韦 冗度 ,、”，，已！被廣泛運用於各種領域， 如用作路燈等照明設備。但是 貝坺 大量熱量’該熱量如不及時散m使=作時會產生 過熱現象，進而導致其發光效率下降。X、-極體產生 電子=:，散：問題之傳統解決方案通常係在發熱 文衣一散熱益，該散熱器包括與電子元件緊密 板、設於底板上之複數散細。該散熱器一 外散熱’效率較低，易造成熱量積聚， 又先-極體燈具之發光效率。^加強散熱器周圍空氣 :戶白強：其散熱效果，可在散熱器上增加-風扇，但是 罝之耗易產生熱里與深音’並且增加了發光二極體燈 ~之耗電夏，也使成本增加。 【發明内容】 體燈ί鑒於此，有必要提供一種具有散熱結構之發光二極 且/、，其散熱結構能引導氣流對發光二極體模組進行良 好散熱。 種 具有散熱結構之發光二極體燈具，包括一發光 200912187 f體模組、一用以贴設並冷卻該發光二極體模組之散熱 器，該散熱器包括與發光二極體模組接觸之柱狀之主體， 該主體之外表面具有複數散熱片，散熱片之外側緣相互連 接，從而在主體週邊散熱片之間形成複數沿主體轴線方向 延伸之氣流通道。 與習知技術相比，本發明發光二極體燈具之散熱器形 成複數氣流通道，加強了空氣在散熱部上下對流，其藉由 散熱器結構上之設計即可實現發光二極體燈具良好之散熱 效果，確保了發光二極體模組高效、穩定地工作。 【實施方式】 ^囷12所示’本發明發光二極體燈具由一發光二極體 杈、、且200及一用於貼設該發光二極體模組之散熱器 組成。該散熱1 1〇〇大致呈半球狀，其外徑沿軸線方向自 I端部向上端部逐漸變小。該散熱器100包括-主體10、 稷數自主體10外表面向外延伸之散熱片2〇及包圍散熱片 2〇外徑較大之半部分即下半部分之殼體3〇。 凊一併參考圖3至圖6，主體1〇具有—吸熱部12、一 自吸熱部12-端延伸之傳熱部15及—連接部18。該連接 部18自傳熱部15相對吸熱部口之另一端延伸出，並超出 散熱片2〇頂部。吸熱部12、傳熱部15及連接部18為同軸 之圓柱狀體。其中傳熱部15之半徑比吸熱部12之半徑小， 連接部18之半徑比傳熱部15之半徑小，因此整 自呈階梯狀。 15 200912187 吸熱部12内設有一開放之空腔，該空腔與傳熱部 分別置於吸熱部12相反兩側。該空腔内底面均勻設置四螺 孔120，以結合螺釘（圖未示）將發光二極體模組固定 在吸熱部12内上。連接部18内設一開放圓柱形空腔，該 空腔部分陷入傳熱部15。該空腔内壁朝内均勻形成沿主體 轴線延伸之三連接肋181’每—連接肋181頂部均設有—安 裝孔180以藉由複數連接件（圖未示）連接一燈頭（圖未 示），該燈頭為一標準件，可從市場上購買。該傳熱部15 内設有複數穿孔40,以連通吸熱部12及連接部切之空腔。 散熱片20自吸熱部12及傳熱部15之外表面沿主體1〇 之轴線方向向外呈放射狀延伸。該等散熱片2〇靠近傳熱部 15之-端面與傳熱部15之端面平齊，其靠近吸熱部u之 端面與吸熱部之端面平齊。該等散熱片加外邊緣沿主 體軸線方向自吸熱部向傳熱部逐漸#近軸線，因而使整個 :熱器具有「外凸如半球體狀之外表面，其中散熱片均 勻間隔形成沿主體軸線方向延伸之狹槽。 、殼體3〇為環形片狀，其垂直連接散熱片20外端緣靠 ，吸熱部12之部分，並將整個散熱器⑽半部分圍起來。 二中該殼體3G靠近吸熱部12之端緣與散熱片2卜端緣平 :广3〇之另—端緣靠近散熱片20外端緣延軸線方向 之中部。因此，殼體30、散熱片2〇以及吸熱部12之外表 面共同圍成複數氣流通道，唁篝 延伸。每—氣流通道且相沿主體轴線方向 -、有„又與政熱态1〇〇靠近吸熱 之知之入風口 80，以及由殼體30、散熱片20與吸熱部 200912187 / 12之外表面圍成之處於散熱器100沿主體部10軸線中部之 ' 一出風口 50。 發光二極體模組200收容於散熱器100吸熱部12之空 腔内，包括一内設於空腔底面之電路板220及固定在該電 路板220上之複數發光二極體210。該電路板220上設置有 電路（圖未示），以與對應之發光二極體210電性連接。 該電路板220上之電路藉由穿置傳熱部15穿孔40之電線 .(圖未示）與一電源電性連接。 工作時，發光二極體燈具之吸熱部12朝下，連接部18 朝上，如圖1所示。發光二極體210產生之熱量迅速、均勻 地傳遍整個散熱器100。具體地說，發光二極體210產生之 熱量藉由吸熱部12傳遞至傳熱部15，再由吸熱部12和傳熱 部15同時將熱量傳遞至週邊之散熱片20中，最後散發至周 圍之空氣中。散熱片20周圍之空氣尤其係在殼體30、散熱 片20以及吸熱部12之外表面共同圍成之氣流通道中之空氣 ( 受熱，其密度變小，由浮力作用而上升，冷空氣從氣流通 道下面之入風口 80補入氣流通道，形成煙自效應，即空氣 之自下而上之自然流動，加強了散熱器100熱量之散發，提 高了散熱效率。其中由於殼體30僅圍住了散熱片20尺寸較 大之下半部分，使得氣流通道上面之出風口 50保持較大之 尺寸，不至於由於出風口太小而阻礙氣流通道中之空氣迅 速流通，減少了熱量在散熱器10周圍之積聚，實現燈具之 良好散熱，進而解決了高功率發光二極體燈具之散熱問題。 綜上所述，本發明符合發明專利要件，爰依法提出專 9 200912187 荦：r以上所述者僅為本發明之較佳實施例，舉凡 咬、二之人士，在爰依本發明精神所作之等效修飾 或釔化’白應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 圖1係本發明具有散熱結構之發光二極體燈具一較佳 果^例之立體圖。 圖2係圖！中具有散熱結構之發光二極體 Π-ΙΙ之剖視圖。 θ係、圖1中具有政熱結構之發光二極體燈具之倒置 圖〇 圖4係圖3中具有散熱 IV-IV之剖視圖。 圖5係圖1中具有散熱 圖。 結構之發光二極體燈具沿軸線 結構之發光二極體燈具之仰視200912187 IX. Description of the Invention: [Technical Field] The present invention relates to a light-emitting diode lamp, which relates to a light-emitting diode lamp having a heat dissipation structure. Male [Prior Art] ▲ Light-emitting diodes as an efficient source of light, with 13⁄4, power saving, long life and many other P, 'Wu redundancy,, have been widely used in various fields, such as Lighting equipment such as street lamps. But the large amount of heat in the shellfish's heat, if not dissolved in time, will cause overheating, which will lead to a decrease in luminous efficiency. X, - polar body produces electrons =:, dispersion: the traditional problem The solution is usually a heat-dissipating heat-dissipating device. The heat sink includes a plurality of thin plates that are tightly packed with the electronic components and disposed on the bottom plate. The heat-dissipating heat of the heat-sink is low, which is easy to cause heat accumulation, and first- The luminous efficiency of the polar body lamp. ^Strengthen the air around the radiator: Hu Baiqiang: The heat dissipation effect can be added to the radiator - the fan, but the consumption of heat is easy to generate hot and deep sounds and the luminous diode is added In view of the above, it is necessary to provide a light-emitting diode having a heat-dissipating structure and/or a heat-dissipating structure capable of guiding the airflow to the light-emitting diode module. A light-emitting diode lamp having a heat dissipation structure includes a light-emitting 200912187 f body module, and a heat sink for attaching and cooling the light-emitting diode module, the heat sink including the light-emitting diode The body of the body is in contact with the columnar body, and the outer surface of the body has a plurality of fins, and the outer edges of the fins are connected to each other to form a plurality of airflow passages extending along the main body axis direction between the fins around the main body. Compared with the known technology, the heat sink of the light-emitting diode lamp of the present invention forms a plurality of airflow passages, which enhances the convection of the air in the heat dissipation portion, and the heat dissipation effect of the light-emitting diode lamp can be realized by the design of the heat sink structure. The light-emitting diode module is ensured to work efficiently and stably. [Embodiment] The light-emitting diode lamp of the present invention is represented by a light-emitting diode, and 200 and one for attaching the light-emitting diode. The heat sink of the light emitting diode module is composed of a heat sink 1 1 〇〇 substantially hemispherical shape, and an outer diameter thereof gradually decreases from an I end portion to an upper end portion along the axial direction. The heat sink 100 includes a main body. The body 10 has a plurality of fins 2 向外 extending outward from the outer surface of the main body 10 and a casing 3 包围 surrounding the outer half of the heat sink 2 having a larger outer diameter, that is, the lower half of the housing. Referring to FIG. 3 to FIG. The main body 1 has a heat absorbing portion 12, a heat transfer portion 15 extending from the end of the heat absorbing portion 12, and a connecting portion 18. The connecting portion 18 extends from the heat transfer portion 15 to the other end of the heat absorbing portion and extends beyond the heat sink. 2 〇 top. The heat absorbing portion 12, the heat transfer portion 15 and the connecting portion 18 are coaxial cylindrical bodies, wherein the radius of the heat transfer portion 15 is smaller than the radius of the heat absorbing portion 12, and the radius of the connecting portion 18 is larger than the radius of the heat transfer portion 15. It is small, so it is self-stepped. 15 200912187 The heat absorbing part 12 is provided with an open cavity, and the cavity and the heat transfer part are respectively placed on opposite sides of the heat absorbing part 12. The inner surface of the cavity is uniformly provided with four screw holes 120. The light emitting diode module is fixed in the heat absorbing portion 12 by a screw (not shown). An open cylindrical cavity is formed in the connecting portion 18, and the cavity portion is caught in the heat transfer portion 15. The inner wall of the cavity is uniformly formed inwardly to form three connecting ribs 181' extending along the main body axis. Each of the connecting ribs 181 is provided with a mounting hole 180 for connecting a lamp cap by a plurality of connecting members (not shown) (not shown) ), the lamp head is a standard part and can be purchased from the market. The heat transfer portion 15 is provided with a plurality of through holes 40 for communicating with the heat absorbing portion 12 and the cavity cut by the connecting portion. The fins 20 extend radially outward from the outer surface of the heat absorbing portion 12 and the heat transfer portion 15 in the axial direction of the main body 1''. The end faces of the fins 2 near the heat transfer portion 15 are flush with the end faces of the heat transfer portion 15, and the end faces of the heat absorbing portions u are flush with the end faces of the heat absorbing portions. The fins and the outer edge are gradually closer to the heat transfer portion from the heat absorbing portion in the direction of the body axis, so that the entire heat exchanger has an outer convex surface such as a hemispherical shape, wherein the heat sinks are evenly spaced along the body axis. a slot extending in a direction. The housing 3 is an annular sheet shape which is perpendicularly connected to the outer end edge of the heat sink 20, a portion of the heat absorbing portion 12, and encloses the entire heat sink (10) half. The end edge of the heat absorbing portion 12 is flat with the edge of the fin 2: the other end edge is adjacent to the middle of the outer edge of the fin 20 in the axial direction. Therefore, the housing 30, the fin 2 and the heat absorbing portion The outer surfaces of the 12 are collectively encircled into a plurality of airflow passages, and the crucible extends. Each of the airflow passages and the phase along the main body axis direction has a wind inlet 80 adjacent to the heat absorption state, and is provided by the casing 30. The outer surface of the heat sink 20 and the heat absorption portion 200912187 / 12 is enclosed by an air outlet 50 of the heat sink 100 along the middle of the axis of the main body portion 10. The LED module 200 is received in the cavity of the heat sink 12 of the heat sink 100, and includes a circuit board 220 disposed on the bottom surface of the cavity and a plurality of LEDs 210 fixed on the circuit board 220. The circuit board 220 is provided with a circuit (not shown) for electrically connecting to the corresponding light-emitting diode 210. The circuit on the circuit board 220 is electrically connected to a power source by a wire (not shown) through which the heat transfer portion 15 is bored 40. In operation, the heat absorbing portion 12 of the illuminating diode lamp faces downward, and the connecting portion 18 faces upward as shown in FIG. The heat generated by the light-emitting diode 210 is transmitted throughout the heat sink 100 quickly and uniformly. Specifically, the heat generated by the light-emitting diode 210 is transmitted to the heat transfer portion 15 through the heat absorbing portion 12, and the heat is transferred from the heat absorbing portion 12 and the heat transfer portion 15 to the peripheral heat sink 20, and finally radiated to the periphery. In the air. The air around the heat sink 20 is especially the air in the air flow passage surrounded by the outer surface of the casing 30, the heat sink 20 and the heat absorbing portion 12 (heating, the density thereof becomes small, and rises by buoyancy, and the cold air flows from the airflow. The air inlet 80 below the channel is filled into the air flow passage to form a smoke self-effect, that is, the natural flow of the air from bottom to top, which enhances the heat dissipation of the heat sink 100 and improves the heat dissipation efficiency, wherein the housing 30 is only enclosed. The heat sink 20 has a larger size and a lower half portion, so that the air outlet 50 above the air flow passage is kept large in size, so that the air in the air passage is prevented from rapidly flowing due to the small air outlet, and the heat is reduced around the heat sink 10. Accumulation, to achieve good heat dissipation of the lamp, and thus solve the heat dissipation problem of the high-power light-emitting diode lamp. In summary, the invention meets the requirements of the invention patent, and the law is proposed according to the law 9 200912187 荦: r In the preferred embodiment of the present invention, the equivalent modification or degeneration of the person in the spirit of the present invention should be covered in the following application. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a preferred embodiment of a light-emitting diode lamp having a heat dissipation structure according to the present invention. FIG. 2 is a cross-sectional view of a light-emitting diode with a heat dissipation structure. Fig. 4 is a cross-sectional view of the light-emitting diode of Fig. 1 with heat dissipation IV-IV. Fig. 5 is a heat dissipation diagram of Fig. 1. Looking up the light-emitting diode lamp along the axis structure of the body lamp
6係圖1中寻有散熱結構之發光 二極體燈具之俯視 主要元件符號說明】 散熱器 1〇〇 吸熱部 12 傳熱部 15 安裝孔 18〇 散熱片 20 穿孔 40 主體 10 螺孔 120 連接部 18 連接肋 181 殼體 30 出風口 50 200912187 入風口 發光二極體 80 發光二極體模組 200 210 電路板 220 116 series diagram of the main components of the light-emitting diode lamp with heat dissipation structure in Fig. 1] Heat sink 1〇〇 Heat absorbing part 12 Heat transfer part 15 Mounting hole 18〇 Heat sink 20 Perforation 40 Main body 10 Screw hole 120 Connection part 18 connecting rib 181 housing 30 air outlet 50 200912187 air inlet light emitting diode 80 light emitting diode module 200 210 circuit board 220 11