200940887 九、發明說明： . 【發明所屬之技術領域】 本發明涉及一種發光二極體照明裝置。 【先前技術】 目前，發光二極體（Light Emitting Diode,LED)已經被廣 泛應用到很多領域，尤其係廣泛應用於路燈。在此，一種 新型發光二極體可參見Daniel A. Steigerwald等人於文獻 IEEE Journal on Selected Topics in Quantum ❹ Electronics,Vol.8,No.2，March/April 2002 中之 Illumination With Solid State Lighting Technology —文。 由於路燈之工作時間一般較長，其產生之熱量亦較 多’當溫度達到一定程度時，將會導致低落之内部量子效 應並且明顯縮短其壽命。為了避免這一狀況之發生，一般 給發光一極體提供一個散熱元件，例如散熱風扇、熱管等 等。然而現有發光二極體照明裝置中，由於其各個元件之 ❹間之相對位置關係之設置及其材料之導熱性能都普遍不太 理想’於南功率操作下’發光二極體工作所產生之熱量無 法及時散去’從而影響整個照明裝置正常工作。 【發明内容】 下面將以實施例說明一種具較高散熱效率之發光二極 體照明裝置。 一種發光二極體照明裝置，其包括：一個固定座、一 個發光二極體光源以及一個散熱模組。該固定座具有固定 槽’該發光二極體光源設置於該固定座之固定槽中，該發 200940887 • · 光二極體光源包括一個‘板與設置於該基板上之複數個發 • 光二極體；該散熱模組位於該發光二極體光源之背離其出 - 光侧之一側，該散熱模組包括複數個熱管與一組散熱鰭 片，該複數個熱管之蒸發端與該基板熱連接，該複數個熱 管之冷凝端遠離該基板且與該組散熱鰭片熱連接。 相對於先刖技術’該發光二極體照明裝置中複數個熱 管之蒸發端與設置有複數個發光二極體之基板熱連接，能 ❹快速將該複數個發光二極體產生之熱量傳送至熱管並藉由 該組散熱鰭片傳送到空氣中。並且該發光二極體照明裝置 具有一個固定座’該固定座不僅能依據實際需要固定該發 光二極體照明裝置之各個元件並確定各元件之間之位置關 係及間距，能輔助該散熱模組進行散熱，因此該發光二極 體照明裝置能有效地提高散熱效率。 【實施方式】 請參見圖1與圖2,本發明實施方式提供之一種具較高 ❹散熱效率之發光二極體照明裝置1〇〇，其包括：一個固定座 11、一個發光二極體光源12以及一個散熱模組13。 "忒固定座11用以放置該發光二極體照明裝置1〇〇之發 ，二極體光源12與散熱模組13。該固定座11具有第一固 定槽U1、第二固定槽112與第三固定槽113,該三個固定 槽呈階梯狀排佈，且該第-固定# 111位於該第二固定槽 112及第二固定槽113之間。該固定座11可由鋁等金屬製 成，具有良好之導熱性能，且質量輕。 "亥發光二極體光源12設置於該固定座n之第一固定 200940887 槽111上，該發光二極體光源12包括一個基板121、複數 個發光二極體122與一個反射板123。該基板121具有一個 第一表面121a及一個與該第一表面121a相對之第二表面 121b。該複數個發光二極體122設置於該基板121之第一 表面121a上。該反射板123設置於該固定座11之第三固 定槽113上。該反射板123具有一個第一表面123a及一個 與該第一表面123a相對之第二表面1231>該第一表面123a 與該基板121之第一表面121a熱連接。該反射板123具有 ϋ ^複數個貫穿該第一表面123a與第二表面123b之圓台形通 孔124，每一個圓台形通孔124於該第一表面123a與第二 表面123b上分別形成兩個圓形之開口，且每個圓台形通孔 124於該第一表面123a上形成之開口半徑小在於該第二表 面123b上形成之開口之半徑。每一個圓台形通孔124内設 置有一個該發光二極體122，請一併參見圖3。 該散熱模組13包括一組散熱鰭片131、複數個熱管132 ❹與一個背板133，該背板133設置於該固定座11之第二固 定槽112上，該背板133具有一個第一表面133a及一個與 該第一表面133a相對之第二表面133b。該背板133之第一 表面133a與該基板121之第二表面121b熱連接，該背板 133之第二表面133b與該複數個熱管132之蒸發端132a熱 連接’該複數個熱管132之冷凝端132b遠離該背板133， 且嵌於該組散熱鰭片131内並與其熱連接，該複數個熱管 132相互平行且間隔設置。 每個發光二極體122發出之光線經該圓台形通孔ία 200940887 射出，其中部分出射至該圓台形通孔124之侧面124a之光 • 線於該侧面124a上發生反射並集中射出，有效地防止了光 . 線向四周偏散，使該發光二極體122之光線強度集中，亮 度高。 複數個發光二極體122於一般情況下，電光轉換效率 約為40%，其餘約60%之電能轉換成熱能。由於該基板121 為金屬芯印製電路板，具有良好之導熱性能，因此該複數 個發光二極體122工作時產生之熱量由該基板121傳給該 ¥背板133，從而避免了大量之熱量聚集於該基板121上，而 造成溫度過高而影響該複數個發光二極體122之正常工 作。該背板133由具有良好之導熱性能之鋁等金屬製成， 其將吸收之熱量均勻傳送給與該背板133熱連接之該複數 個熱管132之蒸發端132a。 該複數個熱管132之工作流體於蒸發端132a吸收上述 熱量而變成氣態，氣態之工作流體到達冷凝端132b釋放所 0吸收之熱量並轉變成液態，再經由毛細結構層流回蒸發端 132a。該冷凝端132b嵌於該組散熱鰭片131内並與該組散 熱鰭片131形成熱連接，該組散熱鰭片131直接與空氣進 行熱交換，大大增加了散熱面積，使散熱速度快，達到散 熱之目之。同時，該固定座11不僅能依據實際需要固定該 發光二極體照明裝置100之各個元件並確定各元件之間之 位置關係及間距，且該固定座11可由散熱性能較好之材料 製成，能輔助該散熱模組13進行散熱，因此該發光二極體 照明裝置100能有效地提高散熱效率。 200940887 ，上所述，本發明確已符合發明專利之要件，遂依法 出專利申凊。但以上所述者僅為本發明之較佳實施方 式’自不能以此限制本案之申請專利範圍。舉凡熟悉本案 技β之人士援依本發明之精神所作之等效修飾或變化，皆 應涵蓋於以下申請專利範圍内。 【圖式簡單說明】200940887 IX. Description of the Invention: [Technical Field of the Invention] The present invention relates to a light-emitting diode lighting device. [Prior Art] At present, Light Emitting Diode (LED) has been widely used in many fields, especially in street lamps. Here, a novel light-emitting diode can be found in Daniel A. Steigerwald et al., IEEE Journal on Selected Topics in Quantum ❹ Electronics, Vol. 8, No. 2, March/April 2002, Illumination With Solid State Lighting Technology. Text. Since the working hours of street lamps are generally longer, they generate more heat. When the temperature reaches a certain level, it will result in a low internal quantum effect and a significant shortening of its life. In order to avoid this, a heat dissipating component such as a heat dissipating fan, a heat pipe, etc., is generally provided to the light emitting body. However, in the existing illuminating diode illuminating device, the relative positional relationship between the respective components and the thermal conductivity of the material are generally not ideal. The heat generated by the operation of the illuminating diode under the operation of the south power Can't disperse in time' and thus affect the normal operation of the entire lighting device. SUMMARY OF THE INVENTION A light-emitting diode lighting device with high heat dissipation efficiency will be described below by way of example. A light emitting diode lighting device includes: a fixing base, a light emitting diode light source and a heat dissipation module. The fixing base has a fixing groove. The light emitting diode light source is disposed in the fixing groove of the fixing base. The light emitting diode includes a 'plate and a plurality of light-emitting diodes disposed on the substrate. The heat dissipation module is located on a side of the light-emitting diode light source facing away from the light-emitting side thereof, the heat dissipation module includes a plurality of heat pipes and a set of heat-dissipating fins, and the evaporation ends of the plurality of heat pipes are thermally connected to the substrate The condensation ends of the plurality of heat pipes are away from the substrate and are thermally connected to the set of heat dissipation fins. Compared with the prior art, the evaporation end of the plurality of heat pipes in the light-emitting diode lighting device is thermally connected to the substrate provided with the plurality of light-emitting diodes, and can quickly transfer the heat generated by the plurality of light-emitting diodes to The heat pipes are transferred to the air by the set of fins. The illuminating diode device has a fixing base. The fixing seat can not only fix the components of the illuminating diode illuminating device according to actual needs, but also determine the positional relationship and spacing between the components, and can assist the heat dissipating module. The heat dissipation is performed, so that the light-emitting diode lighting device can effectively improve the heat dissipation efficiency. [Embodiment] Referring to FIG. 1 and FIG. 2, an embodiment of the present invention provides a light-emitting diode lighting device having a higher heat dissipation efficiency, comprising: a fixing base 11 and a light emitting diode light source. 12 and a heat dissipation module 13. "忒 fixing seat 11 is used to place the light emitting diode illumination device, the diode light source 12 and the heat dissipation module 13. The fixing base 11 has a first fixing groove U1, a second fixing groove 112 and a third fixing groove 113. The three fixing grooves are arranged in a stepped manner, and the first fixing groove 111 is located in the second fixing groove 112 and Between the two fixing grooves 113. The holder 11 can be made of metal such as aluminum, has good thermal conductivity, and is light in weight. The light-emitting diode light source 12 is disposed on the first fixed 200940887 slot 111 of the fixed base n. The light-emitting diode light source 12 includes a substrate 121, a plurality of light-emitting diodes 122 and a reflecting plate 123. The substrate 121 has a first surface 121a and a second surface 121b opposite the first surface 121a. The plurality of light emitting diodes 122 are disposed on the first surface 121a of the substrate 121. The reflector 123 is disposed on the third fixing groove 113 of the fixing base 11. The reflecting plate 123 has a first surface 123a and a second surface 1231 opposite to the first surface 123a. The first surface 123a is thermally connected to the first surface 121a of the substrate 121. The reflecting plate 123 has a plurality of truncated-shaped through holes 124 extending through the first surface 123a and the second surface 123b. Each of the truncated-shaped through holes 124 forms two on the first surface 123a and the second surface 123b. The opening of the circular opening, and the opening radius of each of the circular-plate-shaped through holes 124 formed on the first surface 123a is smaller than the radius of the opening formed on the second surface 123b. A light-emitting diode 122 is disposed in each of the truncated-shaped through holes 124. Please refer to FIG. 3 together. The heat dissipation module 13 includes a plurality of heat dissipation fins 131, a plurality of heat pipes 132 and a back plate 133. The back plate 133 is disposed on the second fixing groove 112 of the fixing base 11. The back plate 133 has a first The surface 133a and a second surface 133b opposite the first surface 133a. The first surface 133a of the backing plate 133 is thermally connected to the second surface 121b of the substrate 121. The second surface 133b of the backing plate 133 is thermally connected to the evaporation end 132a of the plurality of heat pipes 132. The condensation of the plurality of heat pipes 132 The end 132b is away from the back plate 133 and embedded in the heat dissipating fins 131 and is thermally connected thereto. The plurality of heat pipes 132 are parallel and spaced apart from each other. The light emitted by each of the light-emitting diodes 122 is emitted through the truncated-shaped through hole ία 200940887, and a part of the light line which is emitted to the side surface 124a of the truncated-shaped through-hole 124 is reflected and concentrated on the side surface 124a, effectively The light is prevented from being scattered around, so that the light intensity of the light-emitting diode 122 is concentrated and the brightness is high. In general, the plurality of light-emitting diodes 122 have an electro-optical conversion efficiency of about 40%, and about 60% of the remaining electrical energy is converted into heat. Since the substrate 121 is a metal core printed circuit board and has good thermal conductivity, heat generated by the plurality of LEDs 122 is transmitted from the substrate 121 to the backplane 133, thereby avoiding a large amount of heat. It is concentrated on the substrate 121, causing the temperature to be too high to affect the normal operation of the plurality of LEDs 122. The backing plate 133 is made of a metal such as aluminum having good thermal conductivity, and uniformly transfers the absorbed heat to the evaporation end 132a of the plurality of heat pipes 132 thermally connected to the backing plate 133. The working fluid of the plurality of heat pipes 132 absorbs the heat at the evaporation end 132a to become a gaseous state, and the gaseous working fluid reaches the condensation end 132b to release the absorbed heat and convert into a liquid state, and then flows back to the evaporation end 132a via the capillary structure layer. The condensing end 132b is embedded in the heat dissipation fins 131 and is thermally connected to the heat dissipation fins 131. The heat dissipation fins 131 directly exchange heat with the air, thereby greatly increasing the heat dissipation area and enabling the heat dissipation speed to be fast. The purpose of heat dissipation. At the same time, the fixing base 11 can not only fix the components of the LED illumination device 100 according to actual needs, but also determine the positional relationship and spacing between the components, and the fixing base 11 can be made of a material with better heat dissipation performance. The heat dissipation module 13 can be assisted in heat dissipation, so that the light-emitting diode illumination device 100 can effectively improve heat dissipation efficiency. 200940887, as described above, the invention has indeed met the requirements of the invention patent, and the patent application is filed according to law. However, the above description is only a preferred embodiment of the present invention, which is not intended to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by those skilled in the art of the present invention in accordance with the spirit of the present invention are intended to be included in the scope of the following claims. [Simple description of the map]
圖1係本發明實施例提供之發光二極體照明裝置之立 體示意圖。 圖2係圖1中發光二極體照明裝置之結構分解圖。 圖3係圖1中沿ΙΙΙ-ΙΙΙ線之剖面示意圖。 【主要元件符號說明】 發光二極體照明裝置 100 固定座 11 發光二極體光源 12 散熱模組 13 第一固定槽 111 第二固定槽 112 第三固定槽 113 基板 121 發光二極體 122 反射板 123 第一表面 121a 、 123a 、 133a 第二表面 121b、 123b 、 133b 圓台形通孔 124 〇 200940887 散熱鰭片 131 熱管 132 背板 133 蒸發端 132a 冷凝端 132b 側面 124a 111 is a schematic perspective view of a light-emitting diode lighting device according to an embodiment of the present invention. 2 is a structural exploded view of the light-emitting diode lighting device of FIG. 1. Figure 3 is a schematic cross-sectional view along the ΙΙΙ-ΙΙΙ line in Figure 1. [Description of main component symbols] LED illuminating device 100 Fixing seat 11 Light-emitting diode light source 12 Heat-dissipating module 13 First fixing groove 111 Second fixing groove 112 Third fixing groove 113 Substrate 121 Light-emitting diode 122 Reflecting plate 123 First surface 121a, 123a, 133a Second surface 121b, 123b, 133b Rectangular through hole 124 〇200940887 Heat sink fin 131 Heat pipe 132 Back plate 133 Evaporation end 132a Condensing end 132b Side 124a 11