TWM446870U - Skiving arcuate assembly LED heat radiator structure - Google Patents

Description

Planing type bendable combined light emitting diode radiator structure

The invention relates to a light-emitting diode, in particular to a heat sink structure of a light-emitting diode.

Lighting is a very important requirement for human society. Whether it is a tungsten light bulb, a fluorescent lamp, a halogen lamp, a fluorescent lamp, a cold cathode tube, a light emitting diode or the like, different light emitting technologies can provide a light source to meet the lighting demand.

Different illuminating modes, which have illuminating characteristics and efficiency, can meet different needs. Among them, for the illuminating diode, the illuminating diode has high energy conversion efficiency and can effectively use energy, under the condition of high energy It has been widely used in various lighting equipment to meet the needs of energy saving and carbon saving.

Although the light-emitting diode has the characteristics of low power consumption and energy-saving use, the illumination of the individual light-emitting diode is actually not large, and the light-emitting diode needs to be assembled for a large number of lighting devices for daily life. The quantity can meet the requirements of actual use and illumination.

When a certain number of light-emitting diodes are assembled, the heat generated by the light-emitting diodes accumulates to form a high-temperature environment, and the light-emitting diodes emit light under a high temperature environment for a long time, and the life thereof is greatly attenuated. It leads to the life expectancy of the light-emitting diodes being less than expected, and greatly reduces the desire of the public to use the light-emitting diodes as the main lighting equipment for daily life.

Therefore, in order to reduce the temperature of the environment in which the light-emitting diode is placed, the density at which the light-emitting diode can be set is limited. In other words, the lighting device made of the light-emitting diode is limited by temperature. The relationship, in practical applications, does not provide a high-illumination illumination source, and when the environment requires high illumination, it cannot meet the actual use requirements.

The main purpose of the present invention is to disclose a planable bendable combination of a light emitting diode heat sink structure to effectively reduce the temperature of the light emitting diode.

In order to achieve the above object, the present invention is a planable bendable combined light emitting diode heat sink structure for providing a circuit board having a plurality of light emitting diodes, comprising a heat conducting column and a planing heat sink a fin set, the planed heat sink fin set has a flexible plate and a plurality of fins integrally formed on the plate, the plate is rounded to form an accommodating space, and the heat conducting column is placed The accommodating space is in close contact with the planing fin group, and an end surface of the heat conducting column is provided for the circuit board.

According to this, when the complex LED emits waste heat and accumulates on the circuit board, the waste heat is quickly carried away by the heat conducting column and is emitted through the plurality of fins, thereby reducing the temperature of the circuit board. That is, the plurality of light-emitting diodes can be placed in a lower temperature environment, and the service life of the plurality of light-emitting diodes is prolonged to meet the demand for use.

The detailed description and technical content of this new model are as follows:

Please refer to FIG. 1 , FIG. 2 and FIG. 3 . The present invention is a planable bendable combined light-emitting diode heat sink structure for providing a plurality of light-emitting diodes 11 . The circuit board 10 includes a heat conducting column 20 and a planing heat sink fin set 30. The planing heat sink fin set 30 has a bendable plate 31 and a plurality of fins integrally formed on the plate 31. a sheet 32, the sheet 31 is rounded to form an accommodating space 40 and the plurality of fins 32 are diverged outwardly, and the heat conducting column 20 is placed in the accommodating space 40 and closely contacts the planing fin The chip group 30, that is, the heat conducting column 20 is in close contact with the plate 31, and an end surface 21 of the heat conducting column 20 is provided for the circuit board 10.

Referring to FIG. 4 , the plurality of fins 32 have a first edge 321 adjacent to the circuit board 10 and a second edge 322 opposite the first edge 321 , and the length of the second edge 322 . Shorter than the first edge 321 , the use of materials can be reduced to save cost and reduce weight, with little impact on heat dissipation.

Referring to FIG. 5, in order to clearly show the structural features, the circuit board 10 is not drawn in this embodiment. The board 31 can also be divided into a left arc piece 311 and a right arc piece 312. The left side piece is shown. The 311 and the right arc piece 312 are respectively disposed on two sides of the heat conducting column 20, and the plurality of fins 32 are diverged outward, which can also reduce the use of materials, save cost, and reduce weight.

Referring to FIG. 6 , in order to clearly show the structural features, the circuit board 10 is not drawn in this embodiment. The present invention also allows the board 31 to be rounded and the plurality of fins 32 to be folded inward. And the heat conducting column 20 is in close contact with the plurality of fins 32, which can increase the structural strength and prevent the plurality of fins 32 from being bent by an external force.

Referring to FIG. 7 , in order to clearly show the structural features, the circuit board 10 is not drawn in this embodiment. The present invention also allows the plurality of fins 32 to have a plurality of divergent branches 323, and the plurality of divergent branches 323 can be added. The heat dissipation area, and the waste heat is dissipated more quickly.

Please refer to FIG. 8 , the present invention also allows the heat conducting column 20 to have a heat conducting space 22 , and the heat conducting space 22 is filled with a heat conducting fluid 50 , which can be formed by the gas and liquid transition of the heat conducting fluid 50 . The quick heat pipe can also be provided with a fan 60 away from the other end face 23 of the circuit board 10 to enhance the heat dissipation capability.

As described above, the present invention allows the heat conducting column to contact the circuit board, thereby allowing the heat conducting column to absorb the waste heat of the circuit board, and the heat conducting column is further connected to the planed heat sink fin group, so that waste heat can pass through the heat dissipation column. The plurality of fins are emitted, which can form an efficient heat dissipation structure, can reduce the use temperature of the plurality of light-emitting diodes, and increase the service life to meet the demand for use.

The present invention has been described in detail above, but the above is only one preferred embodiment of the present invention, and the scope of the present invention is not limited. All changes and modifications made in accordance with the scope of this new application shall remain within the scope of this new patent.

10‧‧‧ boards
11‧‧‧Lighting diode
20‧‧‧thermal column
21, 23‧‧‧ end face
22‧‧‧Heat conduction space
30‧‧‧ Planed fins
31‧‧‧ plates
311‧‧‧Left arc
312‧‧‧Right arc
32‧‧‧Fins
321‧‧‧ first edge
322‧‧‧ second edge
323‧‧‧Differs
40‧‧‧ accommodating space
50‧‧‧ Thermal fluid
60‧‧‧fan

Fig. 1 is a perspective structural view showing a first embodiment of the creation.
Fig. 2 is an exploded perspective view showing the first embodiment of the present invention.
Figure 3 is a cross-sectional view showing the structure of the first embodiment of the present invention.
Figure 4 is a cross-sectional view showing the structure of the second embodiment of the present invention.
Fig. 5 is a plan view showing the structure of the third embodiment of the present invention.
Figure 6 is a plan view showing the structure of the fourth embodiment of the present invention.
Fig. 7 is a plan view showing the structure of a fifth embodiment of the present invention.
Figure 8 is a cross-sectional view showing the structure of a sixth embodiment of the present invention.

10‧‧‧ boards

11‧‧‧Lighting diode

20‧‧‧thermal column

30‧‧‧ Planed fins

31‧‧‧ plates

32‧‧‧Fins

Claims (8)

A planing bendable combination light emitting diode heat sink structure for providing a circuit board having a plurality of light emitting diodes, comprising:
a thermally conductive column;
a planing type heat sink fin set having a bendable plate and a plurality of fins integrally formed on the plate, the plate being rounded to form an accommodation space. The heat conducting column is placed in the accommodating space and closely contacts the planing fin group, and an end surface of the heat conducting column is provided for the circuit board. The light-emitting diode heat sink structure of the planable bendable combination according to claim 1, wherein the plurality of fins have a first edge adjacent to the circuit board and an opposite side of the first edge a second edge, and the length of the second edge is shorter than the first edge. The light-emitting diode heat sink structure of the planable bendable combination according to claim 1, wherein the plate is rounded and the plurality of fins are diverged outward, and the heat-conducting column is in close contact. The plate. The light-emitting diode heat sink structure of the planable bendable combination according to claim 1, wherein the plate is divided into a left arc piece and a right arc piece, the left arc piece and the right arc piece. The sheets are respectively disposed on both sides of the heat conducting column, and the plurality of fins are diverged outward. The planing type bendable combined light emitting diode heat sink structure of claim 1, wherein the plate is rounded and the plurality of fins are folded inward, and the heat conducting column is in close contact. The plurality of fins. The light-emitting diode heat sink structure of the planing bendable combination according to claim 1, wherein the plurality of fins have a plurality of branch branches. The light-emitting diode heat sink structure of the planable bendable combination according to claim 1, wherein the heat-conducting column has a heat-conducting space, and the heat-conducting space is filled with a heat-conducting fluid. The planing type bendable combination light emitting diode heat sink structure of claim 1, wherein the heat conducting column is provided with a fan away from the other end surface of the circuit board.