TWI401395B - Lighting device - Google Patents

Description

Lighting device

The invention relates to a lighting device, in particular to a lighting device for an LED lamp.

LED lamps in lighting devices have been used in various fields due to their high efficiency and low energy consumption. Generally, high-power LED lamps need to be equipped with a heat sink to dissipate the high heat generated by the LED to the outside to achieve the purpose of improving the life of the LED. However, at present, the arrangement of the heat-dissipating heat-dissipating tubes or the heat-dissipating fins of the illuminating device is an array arrangement having a plurality of column alignments and having the same height. Such an array is disposed on the inner edge of the heat pipe or the heat dissipation fins of the heat dissipation fins are blocked by the outer edge, so that the heat dissipation of the outer edge heat pipe is better than the inner edge heat pipe, so that the inner and outer edges of the heat dissipation device have a heat dissipation effect. Different, so that its heat dissipation performance is reduced.

In view of this, it is necessary to provide a lighting device having a good heat dissipation function.

A lighting device includes a lamp housing, an LED lamp base substrate and a heat sink. The lamp housing has a light emitting surface and a heat dissipating surface opposite to the light emitting surface. The LED lamp base substrate includes a circuit board and a plurality of LED chips disposed in the lamp housing. The circuit board is adjacent to the heat dissipating surface, and the light emitting surface of the LED chip faces the light emitting surface of the lamp housing. The heat dissipating device includes a plurality of heat dissipating tubes which are spaced apart from each other and are arranged in a staggered manner on the heat dissipating surface. The heat pipes have different heights.

The plurality of heat pipes of the lighting device of the present invention are adopted by each other Separated and staggered, and the heat pipes have different heights, so that the heat dissipation effect of the inner and outer edges of the heat sink is uniform and the air flow is increased, which can effectively improve the heat dissipation performance.

The present invention will be specifically described below with reference to the accompanying drawings.

Please refer to FIG. 1 , which is a schematic diagram of a lighting device according to the present invention. The lighting device 10 includes a lamp housing 12 , an LED lamp base 14 and a heat sink 16 (shown in FIG. 2 ). The LED socket substrate 14 and the heat sink 16 are correspondingly disposed on both sides of the globe housing 12 .

The lamp housing 12 has a light emitting surface 122 and a heat dissipating surface 124 opposite to the light emitting surface 122. A recess 1222 is defined in the light emitting surface 122 of the lamp housing 12 . The LED socket base 14 is disposed within the recess 1222 of the shade housing 12. The heat sink 16 is disposed on the heat dissipation surface 124 of the LED lamp housing 12 . The lamp housing 12 further includes a lens 1224 disposed on one side of the light emitting face 122 of the lamp housing 12 and facing the recess 1222.

The LED base substrate 14 includes a circuit board 142 and a plurality of LED chips 144 disposed on the circuit board 142. The circuit board 142 and the plurality of LED chips 144 are disposed within the lamp housing 12. The circuit board 142 is adjacent to the heat dissipation surface 124 . The LED chip 144 is electrically connected to the circuit board 142 , and the light emitting side thereof faces the light emitting surface 122 of the lamp housing 12 . The circuit board 142 has a good thermal conductivity for the heat dissipation substrate for conducting heat generated by the LED chip 144. Preferably, the circuit board 142 is a metal-based circuit board (Metal Core PCB referred to as MCPCB). The plurality of LED chips 144 are arranged in an array on the circuit board 142 for generating high-power illumination functions. .

The heat sink 16 has a plurality of heat pipes 162 disposed. The plurality of heat dissipating tubes 162 are spaced apart from each other and staggered on the heat dissipating surface 124 of the lampshade housing 12, so that the interval between the heat dissipating tubes 162 is increased, which contributes to the flow of air, improves heat exchange efficiency, and enables The heat dissipation effect of the inner and outer edge heat pipes 162 of the array can be approached. In addition, the plurality of heat dissipation tubes 162 have different heights relative to the heat dissipation surface 124 of the lamp housing 12, that is, the top ends of the heat dissipation tubes 162 are located on different planes with respect to the heat dissipation surface 124 of the lamp housing 12. Specifically, the heights of the heat dissipation tubes 162 are alternately arranged to be arranged relative to the array of LED chips. The height of the heat dissipation tubes 162 is higher at a position opposite to the LED chips 144 because the temperature is higher. The height of the heat pipe 162 is lower at a position corresponding to the position between the adjacent two rows of LED chips 144. Because the temperature of the position is low, the heat dissipation performance is different due to the difference in height of the heat pipe 162 to correspond to the LED chip 144. The positions of the arrays are arranged such that the heat sink 16 can obtain a relatively uniform heat dissipating surface.

In use, the high heat generated by the array of LED chips 144 in the array arrangement is conducted to the heat dissipating surface 124 through the circuit board 142, and then arranged by the heat dissipating device 16 in a plurality of rows of heat pipes 162 spaced apart from each other. The heat is evenly distributed to the surface, and the heat of the surrounding air is effectively exchanged to reduce the temperature of the lighting device, which can solve the problem of poor heat dissipation efficiency of the heat sink and improve the heat dissipation performance.

It should be noted that the above-described embodiments are merely preferred embodiments of the present invention, and those skilled in the art can make other changes within the spirit of the present invention. These Variations made in accordance with the spirit of the invention are intended to be included within the scope of the invention as claimed.

10‧‧‧Lighting device

12‧‧‧shade housing

122‧‧‧Lighting surface

1222‧‧‧ Groove

1224‧‧‧ lens

124‧‧‧heating surface

14‧‧‧LED lamp holder substrate

142‧‧‧ circuit board

144‧‧‧LED chip

16‧‧‧heating device

162‧‧‧heat pipe

BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a schematic view of an embodiment of a lighting device of the present invention.

Figure 2 is a side elevational view of the heat sink of the lighting device of Figure 1.

3 is a top plan view of a heat sink of the lighting device of FIG. 1.

10‧‧‧Lighting device

12‧‧‧shade housing

122‧‧‧Lighting surface

124‧‧‧heating surface

16‧‧‧heating device

162‧‧‧heat pipe

Claims (5)

A lighting device comprising: a lamp housing, an LED lamp base substrate and a heat dissipating device, the lamp housing having a light emitting surface and a heat dissipating surface opposite to the light emitting surface, wherein the LED lamp base substrate comprises a circuit board and a plurality of LED chips in the lamp housing, the circuit board is adjacent to the heat dissipating surface, and the light emitting surface of the LED chip faces the light emitting surface of the lamp housing, the heat dissipating device includes a plurality of heat dissipating tubes, and the heat dissipating tubes are spaced apart from each other and interlaced Arranging on the heat dissipating surface, the heat dissipating tubes have different heights, wherein the heights of the heat dissipating tubes are alternately arranged, which are arranged relative to the array of the LED chips, and the height of the heat dissipating tube is at a position facing the LED chip. Higher, and the height of the heat pipe is lower at a position corresponding to the position between adjacent two columns of LED chips. The illuminating device of claim 1, wherein a recess is formed in the light-emitting surface of the lamp housing, and the LED base substrate is disposed in the recess. The lighting device of claim 1, wherein the lamp housing comprises a lens disposed on one side of the light emitting surface of the lamp housing and facing the recess. The illuminating device of claim 1, wherein the circuit board is a heat dissipating substrate, and the plurality of LED chips are arranged in an array on the circuit board. The lighting device of claim 4, wherein the circuit board is a metal based circuit board.