TWI392830B - Led lamp assembly - Google Patents

Description

Light-emitting diode lamp

The invention relates to a lighting device, in particular to a light-emitting diode lamp.

The light-emitting diode source is an emerging third-generation light source, which has many characteristics such as long working life, environmental protection, power saving, and long life. Moreover, the module composed of the light-emitting diode can generate a high-power, high-brightness light source, and thus will widely and revolutionarily replace the conventional light source such as a conventional incandescent lamp, thereby becoming a main light source that meets the theme of energy conservation and environmental protection.

However, as the power and brightness of the LED or its module increase, the amount of heat generated is also increased. If the heating problem of the LED is not solved in time, the operation of the LED lamp is completed. Life expectancy will be severely affected. Therefore, the industry usually installs a heat sink on the LED module to dissipate heat, and the LED module is placed on the bottom of the heat sink to become a planar light source. Due to the single illumination direction of the planar light source, the illumination area of the luminaire is limited.

In view of this, it is necessary to provide a light-emitting diode lamp having a large irradiation range.

A light-emitting diode lamp comprising a plurality of light-emitting diode modules, a light cover covering the light-emitting diode module, and a heat-absorbing body disposed in the light cover for attaching the light-emitting diode module And a heat sink disposed outside the lamp cover and connected to the heat absorbing body, the heat absorbing body having a plurality of differently oriented top plates and a plurality of bottom plates opposite to the top plate, the top plate and the bottom plate A plurality of air flow channels are formed between the light emitting diode modules.

Compared with the conventional technology, since the top plate of the heat absorbing body faces different directions, the light emitting diode module on the top plate faces in different directions, so that the area illuminated by the light emitting diode lamp is wider than that of the conventional light emitting diode lamp. Achieve good lighting effects.

Referring to FIG. 1 and FIG. 3 , the LED device 10 of the present invention includes a plurality of LED modules 20 , a heat absorbing body 30 for illuminating the LED module 20 , and one end of the heat absorbing body 30 . The heat sink 40 connected thereto is disposed on one side of the heat sink 40 and cooperates with the heat sink 40 to cover the light emitting diode module 20 and the heat absorbing body 30 with a lamp cover 50 and a convex heat sink 40. The side end housing 60 and the housing 60 cooperate to receive a drive circuit module 70 therein. A cylindrical joint 90 is mounted on one end of the housing 60 remote from the heat sink 40 for connection to a light pole (not shown). The driving circuit module 70 is electrically connected to the LED module 20 . The two arc-shaped rods 100 are respectively disposed on opposite sides of the light-emitting diode lamp 10, and are kept at a certain distance from the light-emitting diode lamp 10, and a spherical body 102 is respectively disposed at each end of each of the rod bodies 100. To increase its beauty.

Referring to FIG. 2 , each LED module 20 includes a ladder-shaped circuit board 22 and a plurality of LEDs 24 uniformly fixed to one side of the circuit board 22 . The other side of the circuit board 22 is attached to the heat absorbing body 30. The light emitting diodes 24 are arranged in a plurality of rows parallel to the top edge of the circuit board 22, with the ends of each row extending to opposite side edges of the circuit board 22, respectively. The light emitting diodes 24 evenly spread the circuit board 22. The circuits The side edges of the panel 22 are adjacent to each other to form a prismatic shape.

The heat absorbing body 30 is made of a metal having good thermal conductivity such as copper, aluminum or the like. The heat absorbing body 30 is composed of four heat absorbing members 31. Each of the heat absorbing members 31 includes a bottom plate 32 in the shape of a triangular plate, a top plate 34 on the bottom plate 32, and a plurality of connecting plates 36 connecting the top plate 34 and the bottom plate 32.

The top plate 34 has an isosceles trapezoidal shape. The top plate 34 is disposed at an acute angle to the bottom plate 32. The top plate 34 intersects the bottom plate 32 to define a side 342 that is parallel to one of the edges 324 of the bottom plate 32. The edge 342 is spaced from the edge 324 of the bottom plate 32. The edge 342 is one of the longer parallel sides of the trapezoid formed by the top plate 34. The projection of the top plate 34 on the bottom plate 32 overlaps the bottom plate 32.

The connecting plate 36 is perpendicular to the bottom plate 32, and each connecting plate 36 is parallel and spaced to form a plurality of air flow passages (not shown). The height of the connecting plate 36 is gradually increased along the oblique direction of the top plate 34.

Referring to FIG. 3 at the same time, when the four heat absorbing members 31 are combined to form the heat absorbing body 30, the four heat absorbing members 31 are circumferentially symmetrically disposed around the central axis of the heat absorbing body 30. The top of the heat absorbing body 30 forms a space. The four heat absorbing members 31 coincide with the angle 326 of the edge 324 of the bottom plate 32 to form a central apex 33. The bottom plates 32 of the four heat absorbing members 31 are in the same plane and together form a rectangular bottom surface 35. Since the top plate 34 is disposed at an acute angle to the bottom plate 32, the top plates 34 of the four heat absorbing members 31 are respectively oriented in four different directions. Each of the LED modules 20 is placed on the top plate 34 of the corresponding heat absorbing member 31. The area of the circuit board 22 of the LED module 20 is the same as the area of the top plate 34. In other embodiments, , LED module 20 The area of the circuit board 22 may be different from the area of the top board 34. The number of the top plates 34 corresponds to the number of the LED modules 20, and in this embodiment, the number of the LED modules 20 and the top plate 34 are four, and in other embodiments, the LEDs are The body module 20 and the top plate 34 can be of other numbers.

Referring to FIG. 3, the heat sink 40 is made of a high thermal conductivity metal or alloy, such as copper, aluminum or copper-aluminum alloy material, including a circular plate-shaped base 42 and a vertical integral from the bottom of the base 42 A heat sink fin set 44 extending downward. The heat dissipation fin group 44 is composed of a plurality of heat dissipation fins arranged in parallel, and the outer circumferential edges of the heat dissipation fins are substantially in the same circumference, and a plurality of parallel air flow passages (not shown) are formed between the heat dissipation fins. An opening (not labeled) is vertically disposed at a central position of each of the heat dissipation fins, and the openings are aligned and communicated to form a groove 43 perpendicular to the heat dissipation fin and the air flow passage thereof. The heat dissipating fin group 44 is opposite to the groove 43 and is formed with a notch (not shown) near its edge so that one of the casings 60 is received therein. Referring to FIG. 2, a circular boss 46 extends vertically upwardly from the center of the top of the base 42. The periphery of the boss 46 is equidistantly disposed toward the center of the base 42 to provide a plurality of recesses 462 for mounting the lampshade. 50. A substantially rectangular projection 48 extends from the center of the top of the boss 46 in a vertically upward direction. The area of the projection 48 is the same as the area of the bottom surface 35 of the heat absorbing body 30. In other embodiments, The area of the projection 48 may be different from the area of the bottom surface 35. In this embodiment, a heat conducting element 110 having a substantially rectangular plate shape is interposed between the heat sink 40 and the heat absorbing body 30 for transferring heat generated by the light emitting diode module 20 to the heat absorbing body 30. Radiator 40. One side of the heat conducting element 110 is attached to the protruding portion 48 of the heat sink 40, and the other side of the heat conducting element 110 and the bottom The bottom surface 35 formed by the plate 32 is attached. The top surface of the projection 48 needs to be reworked to achieve the flatness required to conform to the thermally conductive element 110. The area of the protruding portion 48 and the bottom surface 35 is the same as the area of the heat conducting element 110. In other embodiments, the area of the protruding portion 48 and the bottom surface 35 may be different from the area of the heat conducting element 110. In other embodiments, the thermally conductive element 110 can be omitted.

The lampshade 50 has an open bowl-like structure that is typically made of clear plastic, glass or other material. The lamp cover 50 is disposed on the top of the heat sink 40, and forms a closed chamber with the heat sink 40 to accommodate the LED module 20 and the heat absorbing body 30, and prevents objects such as dust, insects and the like from entering the lamp cover 50 to affect the illumination. The lighting effect of the diode module 20. A circular gasket 120 is interposed between the lamp cover 50 and the heat sink 40 to increase the sealing of the chamber formed by the lamp cover 50 and the heat sink 40.

During assembly, the heat absorbing body 30 and the light emitting diode module 20 are fixed by screws (not shown). Similarly, the bottom plate 32 of the heat absorbing body 30 is fixed to the heat sink 40 together with the heat conducting element 110 by screws (not shown), so that the heat absorbing body 30, the heat conducting element 110 and the heat sink 40 are combined into one body; The gasket 120 and the lamp cover 50 cooperate with the recessed portion 462 of the heat sink 40 to form the lamp cover 50, the gasket 120 and the heat sink 40 together to form a closed chamber for accommodating the heat absorbing body 30 and the light emitting diode module 20.

The housing 60 is integrally disposed at a side end of the base 42 of the heat sink 40. One portion of the housing 60 is received in a notch (not shown) of the heat sink 40, and another part of the housing 60 Exceeding the base 42.

When in use, the light-emitting diode 24 is energized to emit light for illumination; The heat generated by the LEDs 24 is absorbed by each of the heat absorbing members 31 of the heat absorbing body 30, and is conducted to the heat conducting member 110 through the bottom plate 32 of the heat absorbing member 31, and further conducted to the pedestal of the heat sink 40 by the heat conducting member 110. 42 is then conducted to the heat sink fin set 44 of the heat sink 40 and is radiated into the surrounding air. Thus, the temperature inside the lamp cover 50 is lowered, and the light-emitting diode 24 operates in a normal temperature range to extend the service life of the lamp. At the same time, since the four heat absorbing members 31 are circumferentially symmetrically disposed around the central axis of the heat absorbing body 30, the top plate 34 and the bottom plate 32 of each heat absorbing member 31 are disposed at an acute angle, so that the light emitting diode module is located on the four top plates 34. 20 obliquely outward and facing different directions, so that the area illuminated by the light-emitting diode lamp 10 is wider than that of the conventional light-emitting diode lamp, and the brightness of the lamp can be ensured while achieving better lighting effect.

10‧‧‧Lighting diode lamps

20‧‧‧Lighting diode module

30‧‧‧heat absorber

40‧‧‧heatsink

50‧‧‧shade

60‧‧‧shell

70‧‧‧Drive Circuit Module

80‧‧‧ cover

90‧‧‧Connectors

110‧‧‧thermal element

120‧‧‧Washers

462‧‧‧Depression

22‧‧‧ Circuit board

24‧‧‧Lighting diode

32‧‧‧floor

34‧‧‧ top board

36‧‧‧Connecting board

35‧‧‧ bottom

100‧‧‧ rod body

102‧‧‧ sphere

1 is a perspective assembled view of a light-emitting diode lamp of the present invention.

2 is an exploded perspective view of the light-emitting diode lamp of FIG. 1.

3 is an exploded perspective view of the other direction of the light-emitting diode lamp of FIG. 2.

10‧‧‧Lighting diode lamps

20‧‧‧Lighting diode module

30‧‧‧heat absorber

40‧‧‧heatsink

50‧‧‧shade

60‧‧‧shell

80‧‧‧ cover

90‧‧‧Connectors

100‧‧‧ rod body

102‧‧‧ sphere

Claims (11)

The invention relates to a light-emitting diode lamp, which comprises a plurality of light-emitting diode modules and a lamp cover in which the light-emitting diode module is covered, and the improvement thereof comprises: a light-emitting diode module for light-emitting diode module a heat absorbing body and a heat sink disposed outside the lamp cover and connected to the heat absorbing body, the heat absorbing body having a plurality of differently oriented top plates and a plurality of bottom plates opposite to the top plate, wherein a plurality of air flows are formed between the top plate and the bottom plate a light-emitting diode module is attached to the top plate, the bottom plate has a triangular shape, and the top plate has a trapezoidal shape, and the top plate and the bottom plate intersect to form an edge parallel to one of the bottom plates. The side is spaced apart from the edge of the bottom plate, the edge being one of the longer parallel sides of the trapezoid formed by the top plate. The illuminating diode lamp of claim 1, wherein the heat absorbing body comprises a plurality of heat absorbing members, each of the heat absorbing members comprises the top plate and the bottom plate, and further comprises a plurality of parallel spaced connecting plates, the connecting plate The top and bottom plates are connected. The illuminating diode lamp of claim 2, wherein the bottom plates of the heat absorbing members are in the same plane and together form a bottom surface. The illuminating diode lamp of claim 2, wherein the top plate and the bottom plate of each of the heat absorbing members are disposed at an acute angle. The illuminating diode lamp of claim 2, wherein the heat absorbing member is circumferentially symmetrically disposed around a central axis of the heat absorbing body. The illuminating diode lamp of claim 1, wherein the projection of the top plate on the bottom plate overlaps the bottom plate. The illuminating diode lamp of claim 1, wherein the illuminating diode module has a trapezoidal shape. The illuminating diode lamp according to any one of claims 1 to 7, wherein the heat sink comprises a circular plate-shaped pedestal and a heat sink fin extending vertically downward from the bottom of the base The sheet set has a circular boss extending vertically upwardly from the center of the top of the base. The illuminating diode lamp of claim 8, wherein the periphery of the boss is provided with a plurality of recesses at a distance from the center of the pedestal for mounting a lamp cover, from the top of the boss The center continues to extend vertically upwardly into a generally rectangular projection. The illuminating diode lamp of claim 9, wherein the lampshade cooperates with the recessed portion of the heat sink to form a sealed chamber for accommodating the heat absorbing body and the light emitting diode module. The illuminating diode lamp of claim 9, further comprising a heat conducting component sandwiched between the heat sink and the heat absorbing body, the side of the heat conducting component being convex with the heat sink The outer side of the heat conducting element is attached to the bottom surface formed by the bottom plate.