KR20150009003A - Led lamp - Google Patents

Led lamp Download PDF

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Publication number
KR20150009003A
KR20150009003A KR20130078981A KR20130078981A KR20150009003A KR 20150009003 A KR20150009003 A KR 20150009003A KR 20130078981 A KR20130078981 A KR 20130078981A KR 20130078981 A KR20130078981 A KR 20130078981A KR 20150009003 A KR20150009003 A KR 20150009003A
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KR
South Korea
Prior art keywords
circuit board
printed circuit
led
heat sink
heat
Prior art date
Application number
KR20130078981A
Other languages
Korean (ko)
Inventor
박지훈
박병기
Original Assignee
박지훈
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 박지훈 filed Critical 박지훈
Priority to KR20130078981A priority Critical patent/KR20150009003A/en
Publication of KR20150009003A publication Critical patent/KR20150009003A/en

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/767—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having directions perpendicular to the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2101/00—Point-like light sources

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

The present invention relates to an LED luminaire including a heat sink for emitting heat generated from an LED device. The LED luminaire according to the present invention includes a printed circuit board on which a plurality of LED devices are mounted in a predetermined pattern on one surface, And a heat sink disposed on a back surface of the circuit board to emit heat generated in the LED element, wherein the heat sink includes a plurality of LEDs arranged in a predetermined pattern on one surface of the printed circuit board, A plurality of radiating fins disposed on a back surface of the printed circuit board at least partially overlapping the elements, and a radiating fin supporting portion for supporting the plurality of radiating fins. With such a configuration, the number of heat dissipation fins can be minimized to reduce the production cost of the heat sink, and the weight of the heat sink can be reduced, thereby reducing the weight of the LED lamp.

Description

LED LIGHTS {LED LAMP}

The present invention relates to an LED luminaire, and more particularly, to an LED luminaire including a heat sink that emits heat generated from the LED device.

In recent years, a luminaire using a light emitting diode (LED) as a light source has been widely used. This LED luminaire has excellent power-saving effect due to low power consumption of 20% of normal bulbs and can be used semi-permanently due to the characteristics of LEDs and does not contain harmful substances such as mercury or lead.

However, the LED device generates heat at a high temperature when light is illuminated, and has a problem in that efficiency and life are shortened due to heat generated in the LED device when the LED device is used for a certain period of time.

Therefore, in order to solve the above-mentioned problems, the LED lamp is manufactured such that the printed circuit board on which the LED element is mounted is fixed to the heat sink to discharge the heat to the outside. At this time, the heat sink generally uses aluminum having excellent thermal conductivity, and a plurality of thin and long heat radiating fins are formed on the heat sink to widen the surface area of the heat sink. Examples thereof are disclosed in Korean Patent Publication No. 10-2011-0102746 and Korean Patent Publication No. 10-1034813, respectively.

However, in the case of the conventional heat sink, a plurality of heat dissipating fins are used to rapidly dissipate heat, thereby increasing the production cost of the heat sink. In addition, when the plurality of radiating fins are densely packed, the space between the radiating fins and the radiating fin is narrowed, thereby lowering the heat conduction efficiency due to convection. Also, since the LED luminaire is heavy in weight due to a large number of heat dissipating fins, there is a risk of falling down when the LED luminaire is installed on the ceiling.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a heat sink having the same structure as that of the heat sink, This is to reduce the production cost and lighten the weight.

In addition, a space for allowing air to flow between the radiating fin and the radiating fin can be sufficiently secured by arranging the minimum radiating fin, thereby enhancing the heat conduction efficiency by convection.

According to an aspect of the present invention, there is provided an LED lighting fixture comprising: a printed circuit board on which a plurality of LED elements are mounted in a predetermined pattern; a plurality of LEDs disposed on a back surface of the printed circuit board, And the heat sink is disposed on the back surface of the printed circuit board so as to at least partially overlap with a plurality of LED elements arranged in a predetermined pattern on one surface of the printed circuit board with the printed circuit board interposed therebetween And a plurality of radiating fins supporting the plurality of radiating fins.

A plurality of heat-radiating fins may be provided on the LED element.

The radiating fins are provided in a wing shape with respect to the radiating fin supporting portion.

The radiating fin support portion is formed on the back surface of the printed circuit board along the predetermined pattern.

According to another aspect of the present invention, there is further provided a heat-conducting lamp frame interposed between the heat sink and the printed circuit board to support the printed circuit board.

According to the LED lamp of the present invention configured as described above, the heat radiation fins of the heat sink are provided in the same pattern as the LED elements are arranged, thereby minimizing the number of the heat radiation fins and reducing the production cost of the heat sink .

According to the LED lamp according to the present invention, a minimum heat dissipation fin is disposed in the heat sink to sufficiently secure a space in which air can flow between the heat dissipation fin and the heat dissipation fin, thereby achieving an effect of increasing heat conduction efficiency by convection .

In addition, according to the LED lamp according to the present invention, the number of the heat dissipating fins provided in the heat sink can be minimized, and the weight of the heat sink can be reduced, thereby reducing the weight of the entire LED lamp.

1 is a perspective view schematically showing an LED lamp according to an embodiment of the present invention,
FIG. 2 is an exploded perspective view schematically showing an LED lamp according to an embodiment of the present invention, FIG.
3 is a schematic perspective view illustrating a heat sink according to an embodiment of the present invention,
4 is a plan view schematically showing a printed circuit board of an LED lamp according to another embodiment of the present invention,
5 is a plan view schematically showing a heat sink of an LED lamp according to another embodiment of the present invention,
6 is a plan view schematically showing a heat sink provided on a printed circuit board of an LED lamp according to another embodiment of the present invention.

Hereinafter, an LED lamp according to the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a perspective view showing an LED lamp according to an embodiment of the present invention, and FIG. 2 is an exploded perspective view of FIG. 1. FIG.

1 and 2, an LED lamp 1 according to the present invention includes a lamp frame 20 constituting a body of an LED lamp 1, an LED element 30 for illuminating light, A heat sink 10 for emitting heat generated in the LED element 30; a diffusion plate 50 for diffusing light; And a support portion 70 for supporting the LED lighting fixture 1 on the ceiling.

The luminaire frame 20 has a cylindrical body 21 having one side opened and an extension part 23 extended outward from the end of the opened side. The heat sink 10 is provided on the upper side 22 of the cylindrical body 21 and the printed circuit board 40 is provided on the rear side of the upper side 22. The support portion 70 and the diffusion plate 50 are installed in the extension portion 23. Here, various fastening methods are applied to the method of fastening the respective components, but the present invention is not limited to any one.

The luminaire frame 20 may be made of a metal material such as aluminum or copper having a high thermal conductivity to easily transfer the heat generated when the LED device 30 is driven to the heat sink 10. [ Of course, the present invention is not limited to this, and it can be made of a non-metallic material such as plastic having excellent thermal conductivity.

The printed circuit board 40 has a shape that can be installed on the inner surface of the luminaire frame 20 on which the LED device 30 is installed and is preferably the same as the inner surface of the luminaire frame 20 Shaped plate. A wiring (not shown) is provided so as to supply current to the LED element 30 and is electrically connected to the LED element 30.

The printed circuit board 40 may be made of metal to improve heat dissipation characteristics. At this time, an insulating layer is formed on the surface of the printed circuit board 40, and wiring is formed on the insulating layer. Of course, the printed circuit board 40 may be made of an insulating material such as ceramic, bakelite, epoxy resin or the like in addition to metal.

The LED element 30 has a structure in which a light emitting diode is modularized in the form of a semiconductor chip. Since the LED element 30 is widely known, a detailed description is omitted. The LED element 30 may be supplied with power through a power supply device (SMPS) (not shown).

The LED elements 30 are arranged in a circular pattern with a predetermined radius based on the center of the printed circuit board 40. And may be provided in a plurality of rows in accordance with the output. Of course, the pattern in which the LED elements 30 are arranged is not limited thereto, but may be arranged in various ways depending on the place of use and the method of use.

The heat sink 10 has a cylindrical shape and is installed on the upper surface 22 of the lamp frame 20 to receive heat generated when light is illuminated from the lower LED element 30, Lt; / RTI > The thickness of the heat sink 10 may be variously set corresponding to the output of the LED 30.

The heat sink 10 may be manufactured by extruding aluminum having excellent thermal conductivity. In order to improve heat resistance and oxidation resistance, it may be manufactured by mixing various materials such as beryllium, zirconium, thorium, lithium, and magnesium.

The diffuser plate 50 is installed in an extension portion 23 of the lamp frame 20 and diffuses light generated by the LED element 30 to disperse light in a wide range.

The diffusion plate 50 is preferably made of a material having excellent illuminance and flame resistance such as polyester or polycarbonate and is not deformed or damaged by the heat generated in the LED element 30 Glass, thermosetting plastic and various other materials. At this time, it is preferable to attach a diffusion sheet to improve light diffusion.

The cover 60 is formed in a circular ring shape so as to be installed in the extension portion 23 of the luminaire frame 20. The diffusion plate 50 is installed on the extension part 23 and the cover 60 is installed thereon to hide the installation structure of the diffusion plate 50. In addition, various colors can be provided to enhance the beauty.

The supporting portion 70 is provided in the extension portion 23 of the luminaire frame 20 so as to have a bent portion 71 made of a thin metal material having elasticity.

When the LED lighting fixture 1 is installed on the ceiling, the support 70 is inserted into a mounting groove (not shown) provided in the ceiling corresponding to the body 21 of the lamp frame 20, The bent portion 71 is fixed to the end of the installation groove provided on the ceiling to support the LED lamp 1. At this time, a plurality of support portions 70 may be provided.

3 is a schematic perspective view showing a heat sink 10 according to an embodiment of the present invention. 3, a plurality of identical configurations are provided, and reference numerals are given for only one configuration that represents each configuration.

3, the heat sink 10 includes a base frame 11, a radiating fin support portion 15 formed on the base frame 11, a plurality of radiating fins 16 provided on the radiating fin supporting portion 15, .

The base frame 11 includes a cylindrical central portion 12 and a plurality of cantilevers 13 radially extending from the outer side of the central portion 12 and provided on the inner side of the center portion 12 And a fastening part (14) for fastening with the luminaire frame (20).

The heat radiating fin supporter 15 protrudes from the side surface of the cantilever beam 13 and has the same pattern as that of a plurality of LED elements arranged on the printed circuit board.

The radiating fins (16) are provided on the radiating fin supporting part (15) and are provided in a wing shape having a predetermined curvature to form a wide surface area. Of course, the shape is not limited thereto, and any shape may be provided so as to have a large surface area. The plurality of heat dissipation fins 16 are disposed so as to at least partially overlap the LED elements disposed on one surface of the printed circuit board with the printed circuit board interposed therebetween. At this time, one or a plurality of heat dissipation fins 16 may be arranged on the back surface of the printed circuit board on which the LED elements are installed.

4 to 6 are sectional views of a printed circuit board 400 having a plurality of LED elements 300 and a heat sink corresponding thereto 100 shown in Fig.

4, a plurality of LED elements 300 are provided on a disk-shaped printed circuit board 400 in a circular pattern p having a predetermined radius r from the center of the printed circuit board 400 . At this time, in order to increase the output of the LED lamp, the LED element 300 may further include a circular pattern having a radius larger or smaller than the radius r.

5, the heat sink 100 includes a base frame 110 including a cylindrical central portion 120 and a plurality of cantilevers 130 projecting radially from the outer side of the center portion 120, And a plurality of radiating fins 160 provided on the radiating fin supporter 150. The radiating fin supporter 150 protrudes from a side surface

6 is a plan view schematically showing a heat sink 100 provided on a printed circuit board 400 according to another embodiment of the present invention.

6, the heat dissipating fin supporter 150 of the heat sink 100 protrudes from the side surface of the cantilever beam 130 and has a circular shape having a predetermined radius r from the center of the printed circuit board 400, Is formed so as to have an overlapping pattern with the LED element 300 provided with the pattern (p) of FIG.

The heat dissipation fin 160 is provided on the heat dissipation fin supporter 150 formed to overlap the pattern p of the LED device 300 and is located on the rear surface of the LED device 300, ). At this time, a plurality of heat dissipation fins may be provided on one LED element 300.

With this configuration, the heat generated in one LED element 300 is conducted and discharged through the shortest path to the radiating fins 160 positioned on the rear surface so as to overlap with the LED element 300, thereby maximizing the overall heat radiation efficiency.

Since the heat generated from one LED element 300 is emitted through the heat dissipation fin 160 located on the rear surface through the shortest path, the influence on other LED elements can be minimized.

In addition, the space between the radiating fins and the radiating fins can be sufficiently secured by minimizing the arrangement of the radiating fins. Accordingly, the flow of air passing between the radiating fins and the radiating fins can be smoothly performed, thereby improving the heat conduction efficiency by the convection and improving the heat radiation efficiency of the heat sink 100.

It will be understood by those skilled in the art that the present invention is not limited to the specific preferred embodiments described above and that various changes and modifications may be made by those skilled in the art without departing from the scope of the present invention, Embodiments are possible. Accordingly, the true scope of protection of the present invention should be determined by the technical idea of the invention described in the following claims.

1: LED lamp 10: Heatsink
11: base frame 15: radiating fin supporting part
16: radiating fin 20: luminaire frame
30: LED element 40: printed circuit board
50: diffusion plate 60: cover
70: Support

Claims (5)

1. An LED lighting fixture comprising a printed circuit board on which a plurality of LED elements are mounted in a predetermined pattern and a heat sink disposed on a back surface of the printed circuit board for emitting heat generated from the LED elements,
The heat sink
A plurality of radiating fins disposed on a back surface of the printed circuit board so as to at least partially overlap a plurality of LED elements arranged in a predetermined pattern on one surface of the printed circuit board with the printed circuit board therebetween;
And a radiating fin supporter for supporting the plurality of radiating fins. The method according to claim 1,
And a plurality of heat-dissipating fins are superimposed on one of the LED elements. The method according to claim 1,
And the radiating fins are provided in a wing shape with respect to the radiating fin supporting portion. The method according to claim 1,
Wherein the heat radiating fin supporting portion is formed on the back surface of the printed circuit board along the predetermined pattern. The method according to claim 1,
And a thermally conductive lamp frame interposed between the heat sink and the printed circuit board to support the printed circuit board.
KR20130078981A 2013-07-05 2013-07-05 Led lamp KR20150009003A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR20130078981A KR20150009003A (en) 2013-07-05 2013-07-05 Led lamp

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR20130078981A KR20150009003A (en) 2013-07-05 2013-07-05 Led lamp

Publications (1)

Publication Number Publication Date
KR20150009003A true KR20150009003A (en) 2015-01-26

Family

ID=52572344

Family Applications (1)

Application Number Title Priority Date Filing Date
KR20130078981A KR20150009003A (en) 2013-07-05 2013-07-05 Led lamp

Country Status (1)

Country Link
KR (1) KR20150009003A (en)

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