TWI421437B - Led lamp - Google Patents

Led lamp Download PDF

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Publication number
TWI421437B
TWI421437B TW98115365A TW98115365A TWI421437B TW I421437 B TWI421437 B TW I421437B TW 98115365 A TW98115365 A TW 98115365A TW 98115365 A TW98115365 A TW 98115365A TW I421437 B TWI421437 B TW I421437B
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TW
Taiwan
Prior art keywords
light
heat sink
emitting diode
heat
diode lamp
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TW98115365A
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Chinese (zh)
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TW201040455A (en
Inventor
Qiang Luo
Guang Yu
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Foxconn Tech Co Ltd
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Priority to TW98115365A priority Critical patent/TWI421437B/en
Publication of TW201040455A publication Critical patent/TW201040455A/en
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Publication of TWI421437B publication Critical patent/TWI421437B/en

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  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Description

發光二極體燈具 Light-emitting diode lamp

本發明涉及一種照明裝置,特別係指一種發光二極體燈具。 The invention relates to a lighting device, in particular to a light-emitting diode lamp.

LED(Light Emitting Diode)即發光二極體,係一種半導體固體發光器件。它係利用半導體晶片作為發光器件,在半導體中藉由載流子發生複合放出過剩之能量而引起光子發射,直接發出紅、黃、藍、綠、青、橙、紫、白色之光。 LED (Light Emitting Diode) is a light-emitting diode, which is a semiconductor solid-state light-emitting device. It uses a semiconductor wafer as a light-emitting device, in which a carrier combines excess energy to cause photon emission, and directly emits red, yellow, blue, green, cyan, orange, purple, and white light.

LED照明產品就係利用LED作為光源製造出來之照明器具。低功率之LED已廣泛應用於指示燈及顯示幕幕上,因其功率低,所以傳統LED並沒有太大之散熱問題。但廣泛用於通訊、照明、交通、戶外看板等領域之高亮度、高功率LED則會因溫度之升高而發光效率明顯下將,甚至造成元件之損壞。因此,如何散去LED元件所發出之高熱,成為將LED應用在照明上首先需要解決之重要問題。 LED lighting products are lighting fixtures that are manufactured using LEDs as light sources. Low-power LEDs have been widely used in indicator lights and display screens. Because of their low power, traditional LEDs do not have much heat dissipation. However, high-brightness, high-power LEDs, which are widely used in the fields of communication, lighting, transportation, outdoor billboards, etc., will have obvious luminous efficiency due to the increase of temperature, and even cause damage to components. Therefore, how to dissipate the high heat generated by the LED components has become an important issue that needs to be solved first in the application of LEDs to illumination.

有鑒於此,有必要提供一種具有較佳散熱性能之發光二極體模組。 In view of this, it is necessary to provide a light emitting diode module having better heat dissipation performance.

一種發光二極體燈具,包括一散熱器、貼置於該散熱器底面之複 數發光二極體模組,該散熱器包括一基座,該基座包括一向下弧彎之吸熱部及自該吸熱部一側端水平延伸之安裝部,該弧形吸熱部底面拱起,頂面向上延伸複數散熱鰭片,所述複數發光二極體模組貼置於該吸熱部之底面,該基座之吸熱部之側截面大致呈下彎之弧凸形,該安裝部之頂面接近散熱鰭片之頂面。 A light-emitting diode lamp comprising a heat sink and a surface attached to the heat sink The light-emitting diode module includes a base, the base includes a heat-absorbing portion that is bent downward, and a mounting portion that extends horizontally from a side end of the heat-absorbing portion, and the bottom surface of the curved heat-absorbing portion is arched. a plurality of heat-dissipating fins are attached to the top surface, and the plurality of light-emitting diode modules are placed on the bottom surface of the heat-absorbing portion, and a side cross section of the heat-absorbing portion of the base is substantially curved downward, and the top of the mounting portion The surface is close to the top surface of the heat sink fin.

本發明之散熱器之基座之吸熱部吸收發光二極體模組產生之熱量,並藉由吸熱部頂部之散熱鰭片將熱量散發出去,有利於提升發光二極體燈具之散熱性能。 The heat absorbing portion of the pedestal of the heat sink of the present invention absorbs the heat generated by the illuminating diode module, and dissipates heat through the heat dissipating fins on the top of the heat absorbing portion, thereby facilitating the heat dissipation performance of the illuminating diode lamp.

10‧‧‧散熱器 10‧‧‧ radiator

11‧‧‧基座 11‧‧‧Base

12‧‧‧吸熱部 12‧‧‧Heat Absorption Department

13‧‧‧安裝部 13‧‧‧Installation Department

15‧‧‧散熱鰭片 15‧‧‧ Heat sink fins

20‧‧‧發光二極體模組 20‧‧‧Lighting diode module

21‧‧‧鋁基板 21‧‧‧Aluminum substrate

22‧‧‧發光二極體 22‧‧‧Lighting diode

30‧‧‧驅動電路模組 30‧‧‧Drive Circuit Module

40‧‧‧側蓋 40‧‧‧ side cover

41‧‧‧上邊緣 41‧‧‧ upper edge

42‧‧‧下邊緣 42‧‧‧ lower edge

43‧‧‧凹槽 43‧‧‧ Groove

50‧‧‧反光鏡 50‧‧‧Mirror

60‧‧‧接頭 60‧‧‧Connectors

61‧‧‧中間部 61‧‧‧Intermediate

62‧‧‧水平部 62‧‧‧ horizontal department

63‧‧‧連接桿 63‧‧‧ Connecting rod

64‧‧‧嵌入部 64‧‧‧ embedded department

70‧‧‧面板 70‧‧‧ panel

71‧‧‧透光部 71‧‧‧Transmission Department

72‧‧‧前壁 72‧‧‧ front wall

73‧‧‧後壁 73‧‧‧Back wall

74‧‧‧凹槽 74‧‧‧ Groove

75‧‧‧透光鏡 75‧‧‧Lighting mirror

90‧‧‧螺釘 90‧‧‧ screws

130‧‧‧螺孔 130‧‧‧ screw holes

150‧‧‧通風道 150‧‧‧ ventilation duct

620‧‧‧通孔 620‧‧‧through hole

710‧‧‧開口 710‧‧‧ openings

720‧‧‧穿線孔 720‧‧‧ threading hole

圖1係本發明發光二極體燈具之立體圖。 1 is a perspective view of a light-emitting diode lamp of the present invention.

圖2係圖1中發光二極體燈具之元件分解圖。 2 is an exploded view of the components of the light-emitting diode lamp of FIG. 1.

圖3係圖2中發光二極體燈具之倒視元件分解圖。 3 is an exploded view of the reversed-view component of the light-emitting diode lamp of FIG. 2.

圖4係圖3之發光二極體燈具部分組裝圖。 FIG. 4 is a partial assembly diagram of the LED of FIG. 3 .

如圖1-2所示,本發明發光二極體燈具主要包括一散熱器10、貼置於該散熱器10下表面之複數發光二極體模組20及一驅動電路模組30、罩設於發光二極體模組30上之反光鏡50、安裝於散熱器10底部之面板70、置於散熱器10和面板70相對兩側之二側蓋40、及連接散熱器10前端之接頭60。 As shown in FIG. 1-2, the light-emitting diode lamp of the present invention mainly includes a heat sink 10, a plurality of light-emitting diode modules 20 attached to the lower surface of the heat sink 10, and a driving circuit module 30 and a cover. The mirror 50 on the LED module 30, the panel 70 mounted on the bottom of the heat sink 10, the two side covers 40 disposed on opposite sides of the heat sink 10 and the panel 70, and the joint 60 connecting the front ends of the heat sink 10 .

該散熱器10包括一橫截面呈弧形之基座11及自基座11上表面向上延伸之複數散熱鰭片15。該基座11大致呈方鏟狀,包括一向下凹陷之吸熱部12及置於吸熱部12前端之安裝部13。該吸熱部12之側 截面大致呈下彎之弧凸形,其底面中部大致平整設置。該等散熱鰭片15自吸熱部12向上延伸,該等散熱鰭片15相互平行設置形成橫向之通風道150。該等散熱鰭片15之頂端共面。該安裝部13呈平板狀設置,連接吸熱部12之前端。該安裝部13之底面與吸熱部12之底面相隔一定之高度,以與吸熱部12之前端圍成一收容空間以安裝該驅動電路模組30。同時,該安裝部13之頂面接近散熱鰭片15之頂面。該安裝部13設有複數螺孔130。 The heat sink 10 includes a base 11 having an arc shape in cross section and a plurality of heat dissipation fins 15 extending upward from the upper surface of the base 11. The susceptor 11 has a substantially spade shape and includes a heat absorbing portion 12 recessed downward and a mounting portion 13 disposed at the front end of the heat absorbing portion 12. Side of the heat absorbing portion 12 The cross section is generally curved and convex, and the middle of the bottom surface is substantially flat. The heat dissipation fins 15 extend upward from the heat absorbing portion 12, and the heat dissipation fins 15 are disposed in parallel with each other to form a lateral air passage 150. The top ends of the heat dissipation fins 15 are coplanar. The mounting portion 13 is provided in a flat shape and is connected to the front end of the heat absorbing portion 12. The bottom surface of the mounting portion 13 is spaced apart from the bottom surface of the heat absorbing portion 12 by a certain height to surround the front end of the heat absorbing portion 12 to form a receiving space for mounting the driving circuit module 30. At the same time, the top surface of the mounting portion 13 is close to the top surface of the heat dissipation fins 15. The mounting portion 13 is provided with a plurality of screw holes 130.

請參閱圖3,上述每一發光二極體模組20包括一鋁基板21及裝設於該鋁基板21上之均勻間隔呈線性分佈之複數發光二極體22。該複數發光二極體模組20之發光二極體22在上述基座11之底面上形成一具有複數列、複數行之矩形方陣。其中,該等發光二極體模組20貼設於該散熱器10之基座11底面並沿著與散熱鰭片15平行之方面呈線形排列,以更好地進行散熱。一反光鏡50罩設在發光二極體模組20上以對發光二極體22發出之光進行反射。 Referring to FIG. 3 , each of the LED modules 20 includes an aluminum substrate 21 and a plurality of light-emitting diodes 22 uniformly spaced apart on the aluminum substrate 21 . The LEDs 22 of the plurality of LED modules 20 form a rectangular matrix having a plurality of columns and a plurality of rows on the bottom surface of the susceptor 11. The light-emitting diode modules 20 are attached to the bottom surface of the base 11 of the heat sink 10 and arranged in a line parallel to the heat dissipation fins 15 for better heat dissipation. A mirror 50 is disposed on the LED module 20 to reflect the light emitted by the LEDs 22.

該面板70由金屬材料製成。該面板70大致呈U形設置,其底部與散熱器10之基座11相當。該面板70包括一透光部71及自透光部71相對兩側垂直向上延伸之前壁72、後壁73。該透光部71設有一方形開口710,以對應發光二極體模組20並供其發出之光線穿過。一透光鏡75緊貼在透光部71上覆蓋該方形開口710,以防止灰塵、雜物等進入發光二極體燈具內。上述前壁72和後壁73之頂部與散熱器10之前後端邊緣緊密抵靠結合。該前壁72與透光部71之連接處外部設有一橫向之凹槽74以配合安裝上述接頭60。前壁72中部還設有一穿線孔720。 The panel 70 is made of a metal material. The panel 70 is generally U-shaped with its bottom corresponding to the base 11 of the heat sink 10. The panel 70 includes a light transmitting portion 71 and a front wall 72 and a rear wall 73 extending vertically from opposite sides of the light transmitting portion 71. The light transmitting portion 71 is provided with a square opening 710 to pass through the light emitted by the LED module 20 and emitted therefrom. A light-transmitting mirror 75 is closely attached to the transparent portion 71 to cover the square opening 710 to prevent dust, debris and the like from entering the light-emitting diode lamp. The tops of the front wall 72 and the rear wall 73 are in close contact with the front rear edge of the heat sink 10. A lateral groove 74 is disposed outside the joint between the front wall 72 and the light transmitting portion 71 to fit the joint 60. A threading hole 720 is also provided in the middle of the front wall 72.

上述接頭60由金屬材料一體壓鑄而成。該接頭60包括一豎直之中間部61、自中間部61頂部垂直延伸之水平部62、及自中間部61之前側面垂直延伸之連接桿63。該水平部62上設有複數通孔620以對應散熱器10上之安裝部13之螺孔130。中間部61下邊緣延伸一嵌入部64,以對應安裝在面板70之凹槽74中。上述連接桿63呈圓管狀,以固定連接燈桿(圖未示)。 The joint 60 is integrally die-cast from a metal material. The joint 60 includes a vertical intermediate portion 61, a horizontal portion 62 extending perpendicularly from the top of the intermediate portion 61, and a connecting rod 63 extending perpendicularly from the front side of the intermediate portion 61. The horizontal portion 62 is provided with a plurality of through holes 620 to correspond to the screw holes 130 of the mounting portion 13 on the heat sink 10. The lower edge of the intermediate portion 61 extends an insert portion 64 to be correspondingly mounted in the recess 74 of the panel 70. The connecting rod 63 is circularly shaped to be fixedly connected to the lamp post (not shown).

上述每一側蓋40呈平板狀設置。每一側蓋40之上邊緣41之形狀對應基座11之形狀,其下邊緣42則對應面板70之形狀。每一側蓋40之內側面設有與側蓋40輪廓相似之凹槽43,用以收容一防水密封墊圈45,加強發光二極體燈具之密封性。每一側蓋40於凹槽43之外側設有複數通孔(圖未示)以供螺釘(圖未示)穿過螺合在散熱器10之基座11、面板10及接頭60之側面上。 Each of the side covers 40 described above is provided in a flat shape. The shape of the upper edge 41 of each side cover 40 corresponds to the shape of the base 11, and the lower edge 42 corresponds to the shape of the panel 70. The inner side surface of each side cover 40 is provided with a groove 43 similar in contour to the side cover 40 for receiving a waterproof sealing gasket 45 to enhance the sealing of the light-emitting diode lamp. Each side cover 40 is provided with a plurality of through holes (not shown) on the outer side of the recess 43 for screwing (not shown) through the side of the base 11, the panel 10 and the joint 60 of the heat sink 10. .

請同時參閱圖4,組裝時,將發光二極體模組20、反光鏡50固定在散熱器10之基座11之吸熱部12底面,將驅動電路模組30固定在散熱器10之基座11之安裝部13之底面上;將安裝有透鏡之面板70蓋設在散熱器10之底部,並將接頭60之嵌入部64卡入面板70之凹槽74,接頭60之水平部62與散熱器10之安裝部13藉由複數螺釘90固定連接。最後,藉由側蓋40固定連接散熱器10、面板70以及接頭60。該散熱器10之基座11、面板70、接頭60及二側蓋40共同圍成一封閉之空間以容置該發光二極體模組20及與發光二極體模組電性連接之驅動電路模組30。 Referring to FIG. 4, the LED module 20 and the mirror 50 are fixed on the bottom surface of the heat absorbing portion 12 of the base 11 of the heat sink 10 to fix the driving circuit module 30 to the base of the heat sink 10. 11 is mounted on the bottom surface of the mounting portion 13; the lens-mounted panel 70 is placed over the bottom of the heat sink 10, and the fitting portion 64 of the joint 60 is snapped into the recess 74 of the panel 70, the horizontal portion 62 of the joint 60 and the heat sink The mounting portion 13 of the device 10 is fixedly connected by a plurality of screws 90. Finally, the heat sink 10, the panel 70, and the joint 60 are fixedly connected by the side cover 40. The pedestal 11 , the panel 70 , the connector 60 and the two side covers 40 of the heat sink 10 together form a closed space for accommodating the LED module 20 and the electrical connection with the LED module. Circuit module 30.

當發光二極體模組20在驅動電路模組30之驅動下發光時,發光二極體模組20所產生之熱量首先藉由直接藉由基座11之吸熱部12傳 遞至頂部之散熱鰭片15,以將熱量散發到周圍環境中去。同時,由於散熱器10藉由基座11之安裝部13直接固定連接上述接頭60,整個燈具結構緊湊簡潔,組裝方便快捷;另外,散熱器10之基座11呈弧形設置並具有平板狀之安裝部13,形成一收容空間安置驅動電路模組30,使得燈具結構更加合理。 When the LED module 20 emits light under the driving of the driving circuit module 30, the heat generated by the LED module 20 is first transmitted directly through the heat absorbing portion 12 of the susceptor 11. The fins 15 are delivered to the top to dissipate heat to the surrounding environment. At the same time, since the heat sink 10 is directly fixedly connected to the joint 60 by the mounting portion 13 of the base 11, the whole lamp structure is compact and simple, and the assembly is convenient and quick; in addition, the base 11 of the heat sink 10 is arc-shaped and has a flat shape. The mounting portion 13 forms a receiving space for locating the driving circuit module 30, so that the structure of the lamp is more reasonable.

綜上所述,本發明符合發明專利要件,爰依法提出專利申請。惟,以上所述者僅為本發明之較佳實施例,舉凡熟悉本案技藝之人士,在爰依本發明精神所作之等效修飾或變化,皆應涵蓋於以下之申請專利範圍內。 In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. The above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be included in the following claims.

10‧‧‧散熱器 10‧‧‧ radiator

11‧‧‧基座 11‧‧‧Base

12‧‧‧吸熱部 12‧‧‧Heat Absorption Department

13‧‧‧安裝部 13‧‧‧Installation Department

15‧‧‧散熱鰭片 15‧‧‧ Heat sink fins

20‧‧‧發光二極體模組 20‧‧‧Lighting diode module

30‧‧‧驅動電路模組 30‧‧‧Drive Circuit Module

40‧‧‧側蓋 40‧‧‧ side cover

41‧‧‧上邊緣 41‧‧‧ upper edge

42‧‧‧下邊緣 42‧‧‧ lower edge

43‧‧‧凹槽 43‧‧‧ Groove

50‧‧‧反光鏡 50‧‧‧Mirror

60‧‧‧接頭 60‧‧‧Connectors

61‧‧‧中間部 61‧‧‧Intermediate

62‧‧‧水平部 62‧‧‧ horizontal department

63‧‧‧連接桿 63‧‧‧ Connecting rod

64‧‧‧嵌入部 64‧‧‧ embedded department

70‧‧‧面板 70‧‧‧ panel

71‧‧‧透光部 71‧‧‧Transmission Department

72‧‧‧前壁 72‧‧‧ front wall

73‧‧‧後壁 73‧‧‧Back wall

75‧‧‧透光鏡 75‧‧‧Lighting mirror

90‧‧‧螺釘 90‧‧‧ screws

130‧‧‧螺孔 130‧‧‧ screw holes

150‧‧‧通風道 150‧‧‧ ventilation duct

620‧‧‧通孔 620‧‧‧through hole

710‧‧‧開口 710‧‧‧ openings

Claims (10)

一種發光二極體燈具,包括一散熱器、貼置於該散熱器底面之複數發光二極體模組,其改良在於:該散熱器包括一基座,該基座包括一向下弧彎之吸熱部及自該吸熱部一側端水平延伸之安裝部,該弧形吸熱部底面拱起,頂面向上延伸複數散熱鰭片,該發光二極體模組貼置於該吸熱部之底面,該基座之吸熱部之側截面大致呈下彎之弧凸形,該安裝部之頂面接近散熱鰭片之頂面。 A light-emitting diode lamp includes a heat sink and a plurality of light-emitting diode modules attached to a bottom surface of the heat sink, wherein the heat sink comprises a base, and the base includes a heat absorption of a downward arc And a mounting portion extending horizontally from a side of the heat absorbing portion, the bottom surface of the curved heat absorbing portion is arched, and a plurality of heat radiating fins are extended upwardly from the top surface, and the light emitting diode module is placed on a bottom surface of the heat absorbing portion, The side cross section of the heat absorbing portion of the pedestal is substantially curved downwardly convex, and the top surface of the mounting portion is close to the top surface of the heat dissipating fin. 如申請專利範圍第1項所述之發光二極體燈具,其中該安裝部之底面與吸熱部形成一收容空間以安裝一與該發光二極體模組電性連接之驅動電路模組。 The illuminating diode lamp of the first aspect of the invention, wherein the bottom surface of the mounting portion and the heat absorbing portion form a receiving space for mounting a driving circuit module electrically connected to the light emitting diode module. 如申請專利範圍第1項或第2項所述之發光二極體燈具,其中該安裝部頂面連接一接頭以將發光二極體燈具安裝在一燈桿上。 The light-emitting diode lamp of claim 1, wherein the top surface of the mounting portion is connected to a joint to mount the light-emitting diode lamp on a light pole. 如申請專利範圍第3項所述之發光二極體燈具,其中該接頭包括一中間部、自中間部頂部延伸之水平部、及自中間部背向散熱器之一側面延伸之連接桿,該連接桿連接該燈桿。 The illuminating diode lamp of claim 3, wherein the joint comprises an intermediate portion, a horizontal portion extending from the top of the intermediate portion, and a connecting rod extending from the intermediate portion toward a side of the heat sink. A connecting rod connects the pole. 如申請專利範圍第3項所述之發光二極體燈具,其中還包括一罩設在該散熱器底面之面板及置於散熱器及面板兩側之二側蓋,該散熱器之基座、面板、接頭及二側蓋共同圍成一封閉之空間以容置該發光二極體模組。 The illuminating diode lamp of claim 3, further comprising a panel disposed on a bottom surface of the heat sink and two side covers disposed on two sides of the heat sink and the panel, the base of the heat sink, The panel, the connector and the two side covers together form a closed space for accommodating the LED module. 如申請專利範圍第5項所述之發光二極體燈具,其中該面板呈U形,其底部長寬與散熱器基座相當。 The illuminating diode lamp according to claim 5, wherein the panel has a U shape, and the bottom has a length and a width corresponding to the heat sink base. 如申請專利範圍第6項所述之發光二極體燈具,其中該面板設有 一方形開口對應發光二極體模組,一透光鏡覆蓋該方形開口,該發光二極體發出之光線經由該開口射出。 The illuminating diode lamp of claim 6, wherein the panel is provided A square opening corresponds to the light emitting diode module, and a light transmitting mirror covers the square opening, and the light emitted by the light emitting diode is emitted through the opening. 如申請專利範圍第5項所述之發光二極體燈具,其中每一側蓋分別與散熱器之基板、面板、接頭藉由螺釘固定連接,每一側蓋內側設有凹槽以收容一防水密封墊圈。 The light-emitting diode lamp of claim 5, wherein each of the side covers is fixedly connected to the substrate, the panel and the joint of the heat sink by screws, and each side cover is provided with a groove to receive a waterproof Sealing gasket. 如申請專利範圍第1項所述之發光二極體燈具,其中該等散熱鰭片相互平行設置,該發光二極體模組貼設於該散熱器之基座底面並沿著與散熱鰭片平行之方面呈線形排列。 The light-emitting diode lamp of claim 1, wherein the heat-dissipating fins are disposed in parallel with each other, and the light-emitting diode module is attached to the bottom surface of the heat sink and along the heat-dissipating fins The parallel aspects are arranged in a line. 如申請專利範圍第1項所述之發光二極體燈具,其中該散熱器係一鋁擠型散熱器。 The light-emitting diode lamp of claim 1, wherein the heat sink is an aluminum extruded heat sink.
TW98115365A 2009-05-08 2009-05-08 Led lamp TWI421437B (en)

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM308441U (en) * 2006-05-08 2007-03-21 Yu-Nung Shen Heat sink
US20070086196A1 (en) * 2005-10-18 2007-04-19 National Tsing Hua University Heat dissipation devices for and LED lamp set
US20080089069A1 (en) * 2006-10-11 2008-04-17 Medendorp Nicholas W Methods and Apparatus for Improved Heat Spreading in Solid State Lighting Systems
CN101201154A (en) * 2007-10-24 2008-06-18 东莞市科锐德数码光电科技有限公司 Light fitting of high-power LED street light with external heat sink
TWM349985U (en) * 2008-09-15 2009-02-01 Excellence Optoelectronics Inc Lighting device
CN201232902Y (en) * 2008-07-24 2009-05-06 东莞市邦臣光电有限公司 LED street lamp

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070086196A1 (en) * 2005-10-18 2007-04-19 National Tsing Hua University Heat dissipation devices for and LED lamp set
TWM308441U (en) * 2006-05-08 2007-03-21 Yu-Nung Shen Heat sink
US20080089069A1 (en) * 2006-10-11 2008-04-17 Medendorp Nicholas W Methods and Apparatus for Improved Heat Spreading in Solid State Lighting Systems
CN101201154A (en) * 2007-10-24 2008-06-18 东莞市科锐德数码光电科技有限公司 Light fitting of high-power LED street light with external heat sink
CN201232902Y (en) * 2008-07-24 2009-05-06 东莞市邦臣光电有限公司 LED street lamp
TWM349985U (en) * 2008-09-15 2009-02-01 Excellence Optoelectronics Inc Lighting device

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