JP4944221B2 - LED lamp achieved by multi-layer substrate and dissipating heat instantly - Google Patents

Description

  The present invention relates to an LED lamp that is achieved by a multi-layer substrate and dissipates heat immediately.

  Once an LED lamp having a plurality of light emitting diodes (LEDs) is lit, the temperature of the LED or LED module rises rapidly, and heat is accumulated in the lamp. If the heat is not sufficiently dissipated, it causes flashing (flicker) and degrades the lighting quality of the LED lamp. And thereby shortening the useful life of the lamp.

  Further, an LED lamp having a gear support coupled between a cap and a substrate is known (for example, see Patent Document 1). The substrate is arranged as a polyhedron having a flat surface (planar surface), and the gear support is provided with a fan for cooling the substrate and the LED.

US Pat. No. 6,793,374

  However, such prior art has the following disadvantages.

  1. The LED substrate is formed as a polyhedron, which is a hermetically sealed housing, and the heat generated by the LEDs is highly accumulated in the gear struts, making it difficult to dissipate the heat satisfactorily.

  2. It is necessary to install a fan 9 for cooling the LED lamp on the gear support, which increases the cost of equipment, operation and maintenance. Moreover, electric energy for driving the fan is required, and energy is wasted from the viewpoint of environmental protection.

  3. The rotation of the fan causes the LED lamp to vibrate, thus causing damage to the LED circuit of the lamp or a short circuit in the LED circuit of the lamp, and thus can become inoperable.

  The present invention has been made to solve the problems associated with the above-described prior art, and an object thereof is to provide an LED lamp capable of dissipating generated heat immediately and efficiently.

To achieve the above object, the present invention provides:
A plurality of LED modules including an LED array and a multi-chip LED array thermally coupled to a plurality of substrates formed in parallel as a multi-layer;
Each of the substrates includes at least one heat dissipating device, a transparent cover attached to a front portion of the LED lamp, and a lamp shade fixed to a rear portion of the LED lamp and connected to an inner portion of the heat dissipating device. And is thermally connected, and
The plurality of substrates are accommodated between the transparent cover and the lamp shade,
The heat dissipation device includes a plurality of heat transfer blocks, a plurality of horizontal heat pipes, a plurality of vertical heat dissipation fins, a plurality of vertical heat pipes, and a plurality of horizontal heat dissipation plates,
Each of the heat transfer blocks has an outer surface connected to at least one of the substrates and connected to one of the LED modules;
At least one of the horizontal heat pipes is horizontally connected to each of the heat transfer blocks;
The plurality of vertical heat dissipating fins are vertically connected to the horizontal heat pipe,
Each of the plurality of vertical heat pipes is vertically connected to each of the heat transfer blocks,
The plurality of horizontal heat dissipating plates are vertically connected to the vertical heat pipe.

  According to the present invention, the LED lamp has a plurality of substrates arranged in parallel as multi-stage layers. Each of the substrates also has a plurality of light emitting diodes (LEDs) attached. When heat is generated by the LEDs, each of the substrates forms a heat dissipation plate as it is (functions as a heat dissipation plate), so the multi-layer substrate instantly and efficiently transfers the heat from the light emitting diodes of the LED lamp. , Dissipate outward, and prevent the deterioration of the illumination quality of the LED lamp. That is, it is possible to provide an LED lamp that can dissipate the generated heat immediately and efficiently.

FIG. 3 shows an assembled LED lamp according to the present invention. It is sectional drawing of this invention seen from the 2-2 line | wire direction of FIG. It is a side view of the present invention when a transparent cover and a lamp shade are removed. FIG. 4 is a cross-sectional view seen from the direction of line 4-4 in FIG. FIG. 4 is a bottom view of FIG. 3. It is a figure which shows the modification of this invention in which the longitudinal heat dissipation fin was added to embodiment of FIG. FIG. 6 shows another preferred embodiment of the present invention. FIG. 8 is a bottom view of the LED lamp shown in FIG. 7 with the transparent cover removed. It is sectional drawing seen from the line 9-9 direction of FIG. It is sectional drawing seen from the line 10-10 direction of FIG. FIG. 11 is a diagram showing a modification of the present invention in which FIG. 10 is modified.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  1 is a view showing an assembled LED lamp according to the present invention, FIG. 2 is a cross-sectional view of the present invention as seen from the direction of line 2-2 in FIG. 1, and FIG. 3 is a transparent cover and lamp shade. 4 is a side view of the present invention when removed, FIG. 4 is a cross-sectional view taken along line 4-4 of FIG. 3, FIG. 5 is a bottom view of FIG. 3, and FIG. It is a figure showing the modification of the present invention to which the heat dissipation fin was added.

  As shown in FIGS. 1 to 5, an LED lamp (luminaire) 100 according to the present invention includes a plurality of light emitting diodes (LEDs) 1 and a plurality of layers formed in a multi-layered structure. The substrates 2, 2a to 2d, the transparent cover (lens cover) 4 attached to the front portion (light-output side) of the LED lamp 100, and the rear portion (inner portion) of the LED lamp 100, At least one lamp shade 5 is provided. Each of the substrates 2, 2 a-2 d has at least one light emitting diode (LED) 1 attached. At least one heat dissipation device 3 is fixed to one of the plurality of substrates 2 and 2a to 2d.

  The light-emitting diode 1 is fixed or attached to each of the substrates 2, 2a to 2d in an independent LED, an annular array, an LED module or other array arrangement (array layout). It is not limited.

  The number, shape, attachment method or assembly method of the elements according to the present invention are not limited.

  The LED can be electrically connected to an LED circuit, and the LED circuit is formed on a circuit board on which the substrates 2, 2a to 2d according to the present invention are fixed or integrally formed. In addition, it is necessary to consider the electrical insulation between the LED circuit and other elements.

  The plurality of substrates 2 and 2a to 2d are arranged in parallel to each other to have a multi-layer structure. For every two adjacent substrates, an air space is defined between them, increasing the contact area between the substrate and air, increasing the heat dissipation area, and quickly and efficiently heat the outside. It is possible to dissipate.

  The substrate is formed from a heat conductive material having good heat dissipation characteristics, and can be selected from copper, aluminum, aluminum alloys and other composite materials having good heat transfer and heat dissipation characteristics.

  The plurality of substrates 2, 2 a to 2 d are attached to the LED lamps in parallel so as to change stepwise with respect to the longitudinal axis X of the LED lamps, as shown in FIGS. It is multi-tiered. Each of the substrates is formed in an annular shape, and a central opening 21 is defined for each substrate. The inner diameter of the central opening 21 of the annular shaped substrate gradually decreases from the outer (front) substrate toward the inner (rear) substrate (particularly as shown in FIG. 5). Each of the substrates has a plurality of light emitting diodes 1 attached concentrically. Each of the light emitting diodes 1 on the inner substrate projects light outward through the central opening 21 of the outer substrate adjacent to the inner substrate without being disturbed by the output light projection of the light emitting diode 1.

  Every two adjacent substrates are connected by a fastening element 20 such as a bolt. In order to further dissipate heat toward the outside, the heat dissipating device 3 is fixed to the innermost substrate 2d of the plurality of substrates.

  The heat dissipation device 3 can include a plurality of heat dissipation fins.

  The number of substrates 2 and the area of the substrates depend on the watts of the LEDs and can be varied and adjusted. For example, for LED lamps with high power or high wattage, the number of LEDs and the substrate will increase correspondingly.

  The light-emitting diode 1 is attached to the substrate 2 with the help of a heat sink block (slag) in order to promote heat transfer from the LED to the substrate. The heat generated by the LED passes through the heat sink block and is Efficiently dissipates towards

  The LED circuit is printed or formed directly on the outer surface of the substrate 2 and the inner surface of the substrate is formed as a rough surface, thereby increasing the contact area with air and improving its heat dissipation efficiency. ing.

  A plurality of longitudinal heat dissipation fins 3a (FIG. 6) are fixed radially to the plurality of substrates 2, 2a to 2d, and the heat dissipation area and the heat dissipation efficiency can be further increased.

  Such longitudinal heat dissipating fins 3a can also protect against direct contact with the LED, thereby preventing accidental damage caused by the heat of the LED.

  The lamp shade 5 is formed with a plurality of ventilation holes 51 in order to promote ventilation in the LED lamp and assist heat dissipation from the LED.

  The direction of the LED can be matched with the light output direction or straight forward direction, and light can be projected outward in the direction according to practical requirements. However, the present invention is not limited to this. .

  The present invention is superior to the prior art or ordinary LED lamp in the following advantages.

  1. Each of the substrates 2 with attached LEDs 1 constitutes a heat dissipating plate (acting as a heat dissipating plate) for immediate and efficient dissipation of the heat generated by the LEDs in-situ.

  2. The substrates are mounted in a multi-layer and every two adjacent substrates define an air space between them to greatly increase the contact area with ambient air, thereby providing a heat dissipation region and It is possible to increase efficiency.

3. Since the substrates are mounted in parallel as a multi-layer structure, the light emitting diodes are “placed” on multiple substrates and are useful for the layout of LED luminaires in buildings, houses or interiors (upholstery) A space saving factor can be provided.
4). Sufficient heat dissipation of the multi-layer substrate thus makes it possible to eliminate the installation of a cooling fan in the LED lamp and save energy and costs.

  7 is a diagram illustrating another preferred embodiment of the present invention, FIG. 8 is a bottom view of the LED lamp shown in FIG. 7 with the transparent cover removed, and FIG. 9 is a line of FIG. FIG. 10 is a sectional view seen from the direction of line 10-10 in FIG. 9, and FIG. 11 is a diagram showing a modification of the present invention in which FIG. 10 is modified. It is.

  Another preferred embodiment of the present invention is shown in FIGS. 7-10 and is described in detail below.

  The LED lamp 100 includes a plurality of LED modules (for example, an LED array or a multi-chip LED array) 1a. The Each substrate 2 is thermally coupled to at least one heat dissipating device 3, a transparent cover 4 and at least one lamp shade 5. The transparent cover 4 is attached to the front part (outer part) of the LED lamp 100. The lamp shade 5 is fixed to the rear part (inner part) of the LED lamp 100 and is connected to the inner part of the heat dissipation device 3. The plurality of substrates 2 are accommodated between the transparent cover 4 and the lamp shade 5.

  Each of the LED arrays has a desired light output angle or direction and is attached to the substrate 2, but is not limited thereto in the present invention.

  The plurality of substrates 2 are stacked in parallel to define an air space for each two adjacent substrates 2 (FIG. 7), and each of the substrates 2 has at least one LED module 1a attached thereto. .

  The plurality of substrates 2 can be formed as a multi-layer cassette as shown in FIG.

  The heat dissipation device 3 has a plurality of heat transfer blocks 31, a plurality of horizontal heat pipes 32, a plurality of vertical heat dissipation fins 33, a plurality of vertical heat pipes 34, and a plurality of horizontal heat dissipation plates 35. Each of the heat transfer blocks 31 is connected by at least one substrate 2 and has an external surface portion connected to one LED module 1a. At least one of the horizontal heat pipes 32 is horizontally connected to each of the heat transfer blocks 31. The plurality of vertical heat dissipating fins 33 are vertically connected to the horizontal heat pipe 32. Each of the plurality of vertical heat pipes 34 is vertically connected to each of the heat transfer blocks 31. The plurality of horizontal heat dissipation plates 35 are vertically connected to the vertical heat pipe 34.

  The vertical heat dissipation fins 33 are separated from the horizontal heat dissipation plate 35 by a partition wall (diaphragm) 30.

  The horizontal heat pipe 32 or the vertical heat pipe 34 conducts and dissipates heat generated from the LED module 1a, so that the inside thereof is filled with a vaporizable working fluid or heat medium.

  The lamp shade 5 is made of a heat conductive material and has a plurality of ventilation holes 51. The ventilation hole 51 is formed through the lamp shade 5 in order to exhaust the hot air outward. The inner end of the vertical heat pipe 34 is connected to the lamp shade 5 and serves as a large heat dissipation plate for radiating heat outward.

  The lamp shade 5 is further connected to a waterproof shade 5 a arranged in parallel to the lamp shade 5 in order to prevent rainwater or water droplets from entering the LED lamp 100. Further, as shown in FIG. 7, the waterproof shade 5 a is connected to a part of the vertical heat pipe 34 in order to further transfer and dissipate heat outward as heat is transferred from the vertical heat pipe 34. Yes.

  Accordingly, the waterproof shade 5a can also serve as another heat dissipation plate adjacent to the lamp shade 5, as described above.

  This preferred embodiment (as shown in FIGS. 7-10) has the following advantages over the prior art.

  1. Heat dissipation can be achieved in a variety of ways, for example, by longitudinal heat dissipation fins 33 for efficiently dissipating heat and by a horizontal heat dissipation plate 35.

  2. The LED module 1a is disposed on a substrate 2 having a plurality of layers or multiple layers, and the direct heat from each of the substrates is immediately dissipated, so that an expectation on only one substrate or position (location) is expected. It is possible to prevent heat accumulation or “concentration” of heat.

  3. The multi-layer of the substrate 2 sufficiently accommodates the LEDs on the substrate, so that space or capacity can be minimized, so that the space saved is on the building (structure) or on the interior decoration Useful for design.

  4). The lamp shade 5 and the waterproof shade 5a can be speculatively regarded as large “double” heat radiation fins for further dissipating the heat on the rear part (inner part) of the LED lamp 100.

  As shown in FIG. 11, the heat dissipating plate 35a is formed by deforming the horizontal heat dissipating plate 35 of FIG. 10, and each of the heat dissipating plates 35a is formed in a lamp shade (see FIG. 7). It is slightly inclined laterally and outwardly toward the ventilation hole, so that hot air can be smoothly guided upward and outward through the heat dissipation plate 35a. In addition, a plurality of ventilation openings 351 and 301 are formed through the heat dissipation plate 35a and the partition wall 30, and it is possible to promote heat dissipation by assisting thermal convection of hot air passing through the openings. It is.

  The present invention can be used as an LED bulb, an LED street lamp, or other LED lamps, but is not particularly limited thereto.

  The present invention can be modified without departing from the spirit and scope of the present invention. That is, the present invention is not limited to the above-described embodiment, and various modifications can be made within the scope of the claims.

1 light emitting diode (LED),
1a LED module,
2,2a-2d substrate,
3 heat dissipation devices,
3a Longitudinal heat dissipation fin,
4 Transparent cover,
5 Lamp shade,
5a waterproof shade,
20 fastening elements,
21 Central opening,
30 bulkhead,
31 Heat transfer block,
32 horizontal heat pipes,
33 Longitudinal heat dissipation fins,
34 Vertical heat pipe,
35 Horizontal heat dissipation plate,
35a heat dissipation plate,
51 Ventilation holes,
100 LED lamp,
351,301 Ventilation openings,
X Longitudinal axis.

Claims (4)

A plurality of LED modules including an LED array and a multi-chip LED array thermally coupled to a plurality of substrates formed in parallel as a multi-layer;
Each of the substrates includes at least one heat dissipating device, a transparent cover attached to a front portion of the LED lamp, and a lamp shade fixed to a rear portion of the LED lamp and connected to an inner portion of the heat dissipating device. And is thermally connected, and
The plurality of substrates are accommodated between the transparent cover and the lamp shade,
The heat dissipation device includes a plurality of heat transfer blocks, a plurality of horizontal heat pipes, a plurality of vertical heat dissipation fins, a plurality of vertical heat pipes, and a plurality of horizontal heat dissipation plates,
Each of the heat transfer blocks has an outer surface connected to at least one of the substrates and connected to one of the LED modules;
At least one of the horizontal heat pipes is horizontally connected to each of the heat transfer blocks;
The plurality of vertical heat dissipating fins are vertically connected to the horizontal heat pipe,
Each of the plurality of vertical heat pipes is vertically connected to each of the heat transfer blocks,
The plurality of horizontal heat dissipating plates are vertically connected to the vertical heat pipe. The lamp shade is formed of a heat conductive material and has a plurality of ventilation holes formed through the lamp shade to exhaust hot air outward.
The LED lamp according to claim 1, wherein an inner end portion of the vertical heat pipe is connected to the lamp shade in order to dissipate heat outward. The lamp shade is further connected to a waterproof shade arranged in parallel to the lamp shade in order to prevent water from entering the inside of the LED lamp,
The LED lamp according to claim 1, wherein the waterproof shade is connected to a part of the vertical heat pipe and further transfers and dissipates heat outward as heat is transferred from the vertical heat pipe. . Each of the horizontal heat dissipation plates is slightly inclined laterally and outwardly toward a plurality of ventilation holes formed in the lamp shade in order to smoothly guide hot air upward and outward, Also,
2. The LED lamp according to claim 1, wherein a plurality of ventilation openings are formed through the heat dissipating plate to assist heat convection of hot air through the openings to promote heat dissipation. .

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