CN102011971A - LED (light emitting diode) lighting module - Google Patents
LED (light emitting diode) lighting module Download PDFInfo
- Publication number
- CN102011971A CN102011971A CN2010105671269A CN201010567126A CN102011971A CN 102011971 A CN102011971 A CN 102011971A CN 2010105671269 A CN2010105671269 A CN 2010105671269A CN 201010567126 A CN201010567126 A CN 201010567126A CN 102011971 A CN102011971 A CN 102011971A
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- China
- Prior art keywords
- lighting module
- led
- led lighting
- light source
- superconduction base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000919 ceramic Substances 0.000 claims abstract description 25
- 235000012431 wafers Nutrition 0.000 claims abstract description 23
- 239000003822 epoxy resin Substances 0.000 claims abstract description 7
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 7
- 230000000149 penetrating effect Effects 0.000 claims description 9
- 238000009434 installation Methods 0.000 claims description 5
- 230000002035 prolonged effect Effects 0.000 abstract description 3
- 230000017525 heat dissipation Effects 0.000 abstract 2
- 230000005855 radiation Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000000926 separation method Methods 0.000 description 4
- 238000005286 illumination Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
Images
Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
- Y02B20/72—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps in street lighting
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- Led Device Packages (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The invention relates to the field of modular LED (light emitting diode) street lamp lighting, in particular to an LED lighting module which is composed of ceramic radiating fins, a power box, a superconductive base and a light source chamber, wherein a plurality of ceramic radiating fin connecting grooves are arranged on the superconductive base with a plurality of vertically thorough heat dissipation holes, the ceramic radiating fin cavity forms into an whole through an epoxy resin heat conducting layer, and meanwhile, the power box, in which a driving power supply is arranged, is arranged on the superconductive base; and a plurality of LED wafers are arrayed on the bottom part of the superconductive base, and the LED wafers are covered by a light distribution lens to form the light source chamber. Therefore, the light source chamber and power box of the LED lighting module are separated, a radiator and a lamp cover are designed integrally, so that the radiating links are reduced, the heat conduction and heat dissipation performances are improved greatly, and the LED lighting module has the characteristics of improved luminous efficiency, prolonged service life, compact structure, low cost, and the like.
Description
Technical field
The present invention relates to a kind of LED lighting module, be mainly used in high-power LED (Light Emitting Diode) road illuminating, belong to high-power LED light source integral application field.
Background technology
Present high-power LED illumination module, have the following disadvantages: the substrate of (1) a plurality of LED wafer package is little, heat radiation link complexity, the substrate temperature heat radiation is slow, influences the operate as normal of LED wafer greatly; When (2) the LED wafer was luminous, photon, had lowered and has got optical efficiency because the reflection loss that refringence causes is big at the outgoing interface; (3) a plurality of LED wafers are when encapsulation, because support has blocked a part of light, the angle when making the LED wafer luminous diminishes; (4) led light source and radiator and lamp outer casing supporting after, complex structure, cost height, weak effect; Therefore, at present high-power LED illumination module ubiquity substrate accumulated temperature height, working life is short, conversion efficiency is low, lighting angle is little, get low, the photochromic shortcoming such as of poor quality of optical efficiency.
Summary of the invention
For overcoming the deficiency that existing LED lighting module exists, the invention provides a kind of Modular LED street lamp lighting field.It comprises have the ceramic heat-dissipating sheet, power pack, superconduction base and light source chamber form a kind of LED lighting module, described LED lighting module, it is on the superconduction base with a plurality of penetrating louvres up and down, be provided with a plurality of ceramic heat-dissipating sheets and connect groove, ceramic heat-dissipating sheet chamber superconduction base forms an integral body by the epoxy resin heat-conducting layer, is provided with the power pack that driving power is installed simultaneously on the superconduction base; The a plurality of LED wafers of the bottom array of superconduction base, the LED wafer is covered by light-distribution lens, form light source chamber, hence one can see that, and the light source chamber of the invention type and power pack are in the separation state, radiator and lamp housing integrated design, therefore, not only solved the deficiency of existing structure, the first-class existence of heat radiation well, and increased substantially light source life, conversion efficiency and light source light-emitting efficiency improve photochromic quality.
A kind of New LED lighting module, the modular high-power LED street lamp lighting field.It comprises have the ceramic heat-dissipating sheet, power pack, superconduction base and light source chamber form a kind of high-power LED illumination module, described LED lighting module, it is on the superconduction base with a plurality of penetrating louvres up and down, be provided with a plurality of ceramic heat-dissipating sheets and connect groove, ceramic heat-dissipating sheet chamber superconduction base forms an integral body by the epoxy resin heat-conducting layer, is provided with the power pack that driving power is installed simultaneously on the superconduction base; The a plurality of LED wafers of the bottom array of superconduction base, the LED wafer is covered by light-distribution lens, forms light source chamber, and hence one can see that, and the light source chamber of the invention type and power pack are in the separation state, radiator and lamp housing integrated design.
Further, described superconduction base, it is provided with a plurality of penetrating louvres up and down, rectangular, the trapezoidal or arc shape in the cross section of louvre at the superconduction base.
Further, rectangular, the trapezoidal or arc shape in the cross section of described superconduction base.
Further, the both sides of described superconduction base are provided with the installation support plate, and offer installing hole on this installation support plate.
Further, described superconduction base is provided with a plurality of ceramic heat-dissipating sheets connection grooves.
Further, the heat-conducting layer of described ceramic heat-dissipating sheet and chamber superconduction base is an epoxy resin.
Further, the fin on the described superconduction base is the ceramic heat-dissipating sheet, rectangular, the trapezoidal or arc shape in the cross section of ceramic heat-dissipating sheet.
Further, a plurality of LED wafers of the bottom array of described superconduction base, the LED wafer is covered by light-distribution lens, forms light source chamber.
According to above technical scheme, can realize following beneficial effect:
1. the present invention is installed in the driving power of high-power LED light source in the power pack on the metal superconduction base, thereby can be to this driving power waterproof dust-separation, improved the driving power working environment effectively, guarantee the reliably working of this driving power, and prolong its working life, in addition, the LED lighting module, it is provided with a plurality of ceramic heat-dissipating sheets and connects groove on the superconduction base with a plurality of penetrating louvres up and down, and ceramic heat-dissipating sheet chamber superconduction base forms an integral body by the epoxy resin heat-conducting layer, and with a plurality of high-power LED light source chip arrays on the superconduction base, thereby improve area of dissipation effectively, promptly greatly improved radiating effect, reduced high-power LED light source work temperature rise effectively high-power LED light source, prolonged its working life, improved its luminous efficiency, had, high-power LED light source and driving power thereof are divided in the power pack of superconduction base and superconduction base, form monolithic construction, compact conformation then, volume is little, conserve space;
2. LED lighting module of the present invention, it is on the superconduction base with a plurality of penetrating louvres up and down, form Natural Heat Convection up and down, radiating rate is fast, greatly improved radiating effect to high-power LED light source, effectively reduce high-power LED light source work temperature rise, prolonged its working life, improved its luminous efficiency;
3. superconduction base end face both sides are provided with fixedly connected support plate, are convenient to fixedly connected with lamp bracket;
4. the high-power LED light source chip can directly fixedly contact with heat abstractor, has effectively simplified the heat radiation link, has improved radiating efficiency.
Description of drawings
The invention will be further described below in conjunction with drawings and Examples.
Fig. 1 is a vertical view of the present invention;
Fig. 2 is the A-A cutaway view among Fig. 1;
B-B cutaway view among Fig. 3 Fig. 1.
1. epoxy heat-conducting resins wherein, 2. ceramic heat-dissipating sheet, 3. wire hole, 4. ceramic heat-dissipating sheet groove, 5. superconduction base, 6.LED wafer, 7. lens, 8. penetrating louvre 10. installing holes 11. power packs of light source chamber 9..
The specific embodiment
Explain technical scheme of the present invention below in conjunction with accompanying drawing.
Described LED lighting module, it comprise have the ceramic heat-dissipating sheet, power pack, superconduction base and light source chamber.Described LED lighting module, it is on the superconduction base with a plurality of penetrating louvres up and down, be provided with a plurality of ceramic heat-dissipating sheets and connect groove, ceramic heat-dissipating sheet chamber superconduction base forms an integral body by the epoxy resin heat-conducting layer, is provided with the power pack that driving power is installed simultaneously on the superconduction base; The a plurality of LED wafers of the bottom array of superconduction base, the LED wafer is covered by light-distribution lens, forms light source chamber.The light source chamber of the invention type and power pack are in the separation state, radiator and lamp housing integrated design, thus reduce the heat radiation link, heat conduction and heat dispersion are greatly improved, and have the raising luminous efficiency, prolong working life, compact conformation, characteristics such as cost is low.
During use, LED wafer peace array is installed in the superconduction base gets the bottom, installation locating hole by the superconduction base end face, LED wafer and light-distribution lens firmly closely are connected with the superconduction base end face, the thermal source that produces during the work of LED wafer, on the one hand, thermal source is delivered on the ceramic heat-dissipating sheet fast by the superconduction base end face, and heat is evenly distributed on the two dimensional surface, on the other hand, thermal source carries out convection current having a plurality of up and down penetrating louvres and outside air, both acting in conjunction results have greatly improved LED wafer radiating effect, effectively reduce LED wafer work temperature rise, prolong its working life, improved its operating efficiency.
Claims (6)
1. LED lighting module, it comprises ceramic heat-dissipating sheet, power pack, superconduction base and light source chamber, described LED lighting module, it is on the superconduction base, be provided with a plurality of ceramic heat-dissipating sheets and connect groove, ceramic heat-dissipating sheet chamber superconduction base forms an integral body by the epoxy resin heat-conducting layer, is provided with the power pack that driving power is installed simultaneously on the superconduction base, a plurality of LED wafers of the bottom array of superconduction base.
2. big LED lighting module according to claim 1 is characterized in that, described superconduction base is provided with a plurality of penetrating louvres up and down, rectangular, the trapezoidal or arc shape in the cross section of described louvre.
3. LED lighting module according to claim 1 is characterized in that, rectangular, the trapezoidal or arc shape in the cross section of described superconduction base.
4. LED lighting module according to claim 1 is characterized in that the both sides of described superconduction base are provided with the installation support plate, offers installing hole on the described installation support plate.
5. LED lighting module according to claim 1 is characterized in that, rectangular, the trapezoidal or arc shape in the cross section of described ceramic heat-dissipating sheet.
6. according to the described LED lighting module of claim 1, it is characterized in that described LED wafer is covered by light-distribution lens, form light source chamber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105671269A CN102011971A (en) | 2010-11-23 | 2010-11-23 | LED (light emitting diode) lighting module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105671269A CN102011971A (en) | 2010-11-23 | 2010-11-23 | LED (light emitting diode) lighting module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102011971A true CN102011971A (en) | 2011-04-13 |
Family
ID=43842245
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010105671269A Pending CN102011971A (en) | 2010-11-23 | 2010-11-23 | LED (light emitting diode) lighting module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102011971A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103206638A (en) * | 2013-04-24 | 2013-07-17 | 生迪光电科技股份有限公司 | LED (Light Emitting Diode) lamp |
| CN105135389A (en) * | 2015-09-18 | 2015-12-09 | 浙江大邦科技有限公司 | Radiator and LED street lamp using same |
| CN111780005A (en) * | 2020-08-06 | 2020-10-16 | 广东康荣高科新材料股份有限公司 | A detachable modular heat dissipation module and an adjustable modular LED street light |
-
2010
- 2010-11-23 CN CN2010105671269A patent/CN102011971A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103206638A (en) * | 2013-04-24 | 2013-07-17 | 生迪光电科技股份有限公司 | LED (Light Emitting Diode) lamp |
| CN105135389A (en) * | 2015-09-18 | 2015-12-09 | 浙江大邦科技有限公司 | Radiator and LED street lamp using same |
| CN111780005A (en) * | 2020-08-06 | 2020-10-16 | 广东康荣高科新材料股份有限公司 | A detachable modular heat dissipation module and an adjustable modular LED street light |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20110413 |