TWI544175B - Light emitting diode lamp with high efficiency heat dissipation structure - Google Patents

Description

Light-emitting diode lamp with efficient heat dissipation structure

The invention relates to a light-emitting diode lamp, in particular to a high-power light-emitting diode lamp of at least 50 watts. The lampshade of the high-power light-emitting diode lamp can reflect the light-emitting diode of the light-emitting diode. In addition to the brightness, the thermal conductivity of the lampshade is better than that of the heat sink, and the inner and outer sides of the flat plate of one of the tops of the lampshade can be respectively affixed to the heat sink and the light emitting diode thereon. The body plate enables the lampshade to exchange heat with the surrounding cold air to effectively reduce the high temperature generated by the light-emitting diode on the light-emitting diode plate, thereby effectively reducing the light decay of the light-emitting diode, and is effective Extend its service life.

In recent years, as various high-brightness light-emitting diodes have been continuously developed and their manufacturing costs have become increasingly cheap, many lamp manufacturers have begun to use light-emitting diodes as light-emitting elements, which are both environmentally friendly and energy-saving. High-power light-emitting diode lamps, however, since these high-power light-emitting diode lamps are generally at least 50 watts or more, a plurality of light-emitting diodes thereon (if each light-emitting diode is 1 watt) , that is, more than 50), which will produce high heat that is difficult to ignore during the illuminating process. Therefore, once the illuminating diode lamp cannot smoothly discharge the high heat generated by the illuminating diodes, it is bound to cause the illuminating two. The temperature of the polar body itself is high, and in the long-term use of high temperature, it will quickly lead to serious material aging and light decay of the light-emitting diodes, thus greatly shortening the service life. Accordingly, in order to improve the heat dissipation effect of the high-power light-emitting diode lamps and to prolong their service life, the industry has developed various heat-dissipating structures for high-power light-emitting diode lamps, which is in line with the first figure, The most commonly used and simplest heat dissipation structure in conventional light-emitting diode lamps is as follows:

(1) Figures 1 and 2 show a conventional high-power light-emitting diode lamp comprising a lampshade 10, a light-emitting diode plate 20, a heat sink 30 and a drive. The lamp cover 10 is made of a metal material or a plasticized material, and the lamp cover 10 is provided with an accommodation. In the space 11, the bottom end of the lampshade 10 is provided with a lower opening 12, and the top end of the lampshade 10 is provided with an upper opening 13. The lower opening 12 and the upper opening 13 are respectively connected to the accommodating space 11, and the lampshade 10 corresponds to The inner surface of the accommodating space 11 is coated with a reflective layer 18 (not shown). Further, since the accommodating space 11 has a tapered configuration from the top end to the bottom end, the diameter of the lower opening 12 is The bottom surface 21 of the light-emitting diode board 20 is provided with a plurality of light-emitting diodes 22, and the top side 23 of the light-emitting diode board 20 is planar; the heat sink 30 It is made of aluminum extrusion type, and its thermal conductivity is much larger than the thermal conductivity of the metal material or plasticized material. The bottom side 31 of the heat sink 30 is planar, so that the top side 23 of the LED body 20 can The bottom edge 31 of the heat sink 30 is fixed to the bottom side 31 of the heat sink 30, and the light emitting diode board 20 is positioned in the upper opening 13. The light emitting diodes 22 face the lower opening 12, and the rest of the heat sink 30 is convexly disposed with a plurality of pieces The heat dissipating fins 32 are arranged; the driving circuit 40 is mounted on the top side of the heat sink 30, and one end thereof is connected to a power supply end (not shown), and the other end is connected by a wire 41. The light emitting diode board 20 is connected to provide the electric energy required for the light emitting diodes 22 to emit light.

(2) When the driving circuit 40 drives the light-emitting diodes 22 to emit light, the thermal energy generated by the light-emitting diodes 22 is directly transmitted through the top side 23 of the light-emitting diode board 20. The bottom surface 31 of the heat sink 30 is transmitted through the heat sink 30 and the heat dissipating fins 32 thereon to the ambient air. Therefore, the heat sink 30 can reduce the light emitting diodes 22 The operating temperature, in turn, causes the light-emitting diodes 22 to emit a desired color light.

(3) Since the lampshade 10 is locked to the bottom side 31 of the heat sink 30 only by the extremely small area of the top end edge 14, the thermal conductivity of the metal material or plasticized material used is much smaller than that. The thermal conductivity of the heat sink 30 is such that the reflector 10 can only exert the reflection effect on the light-emitting diodes 22 by the reflective layer 18 coated on the inner surface thereof, but the inner and outer surfaces cannot be borrowed at all. It is a pity that the large-area contact area with the surrounding cold air exerts its heat dissipation effect on the thermal energy of the light-emitting diodes 22.

(4) Since the only heat dissipation path of the light-emitting diodes 22 is transmitted through the heat sink 30, when the design power of the high-power light-emitting diode lamps is higher, such as: 100, 200, 300... When the tile is even more than 500 watts, the size of the heat sink 30 and the heat dissipation fins 32 thereon will also become larger and larger, resulting in the total weight of the high-power light-emitting diode lamps often reaching tens of kilograms. Not only is it heavy and outrageous, but it is also difficult for a person to install it; and, because the two corresponding sides of the adjacent fins 32 are spaced apart from each other, and are vertically connected to the heat sink 30 at an angle of 90 degrees. The outer surface of the outer fins causes an air convection angle between the adjacent fins 32 (especially when the size of the fins 32 is increased), and the air in the convection corners receives heat. The temperature gradually rises and accumulates around the heat dissipation fins 32. In addition to causing the heat dissipation fins 32 to generate extremely high temperatures, the temperature difference between the heat dissipation fins 32 and the surrounding air is gradually reduced. The convection efficiency of the air between the heat dissipation fins 32 is inconsistent, and the high thermal energy generated by the light-emitting diodes 22 cannot be effectively dissipated, so that the operating temperature of the light-emitting diodes 22 is always high, and Material aging and light decay occur, large The frame shortens its service life.

(5) Finally, the driving circuit 40 exposed on the top side of the heat sink 30 is also prone to frequent aging of the insulating layer on the outer surface due to frequent dirt and sun exposure, and thus aging due to aging. The crack is broken and the service life is greatly reduced.

In view of the above, how to utilize the large contact area between the inner and outer surfaces of the lampshade 10 and the surrounding cold air to effectively exert the heat dissipation effect of the thermal energy of the light-emitting diodes 22, so that the high-power light-emitting diode lamps When the design power is higher and higher, it is not necessary to particularly increase the size of the heat sink 30 and the heat dissipation fins 32 thereof, so that the high-power light-emitting diode lamps are maintained under the optimal weight condition for easy installation and construction. It is still an important subject to be explored by the present invention to still be able to exert an efficient heat dissipation function.

In view of the above problems and shortcomings, the inventors have finally developed and designed a light-emitting diode lamp with an efficient heat dissipation structure according to the years of practical experience and research experiments, which can effectively improve the heat dissipation efficiency and the aging of the material. The problem of excessive overall weight.

An object of the present invention is to provide a light-emitting diode lamp having a high-efficiency heat-dissipating structure, the light-emitting diode lamp comprising a first lamp cover, a light-emitting diode plate, a heat sink and a driving circuit, wherein The first lamp cover is formed by stamping and forming a heat conductive metal plate, and a first accommodating space is disposed therein. The bottom end of the first lamp cover is provided with a first opening, and the first opening is The first accommodating space is connected to the first illuminating frame, and the first accommodating space has a divergent configuration from the top end to the bottom end, and the first lamp cover corresponds to the first The inner side surface of the accommodating space is a reflecting surface; the bottom side of the illuminating diode board is provided with a plurality of illuminating diodes, and the top side of the illuminating diode board can be flatly attached to the first assembling plate The inner side surface; the heat sink is made of aluminum extrusion type, and the thermal conductivity is smaller than the thermal conductivity of the heat conductive metal plate, and the bottom side of the heat sink can be flatly attached to the outer side of the first assembly plate, the heat sink The remaining portion is provided with a plurality of spaced fins arranged at a distance; one end of the driving circuit is connected to a power supply end, and the other end is connected to the LED board to provide the illumination The electrical energy required for the luminescence of the diode. In this way, the first lamp cover can reflect the light emitted by the light-emitting diodes by the reflective surface of the inner surface of the inner cover, and the heat conductivity of the first lamp cover is better than that of the heat sink, and The inner and outer sides of the first assembly plate at the top of a lamp cover can be respectively affixed to the heat sink and the light emitting diode plate, so that the first lamp cover can effectively utilize a large contact area between the inner and outer surfaces and the surrounding cold air. And fully exerting its efficient heat dissipation effect on the thermal energy of the light-emitting diodes, and in the case where the power of the light-emitting diode lamps is designed to be higher and higher, there is no need to particularly increase the heat sink and the heat sink thereon. The size of the heat dissipating fins can still exert an efficient heat exchange function with the surrounding cold air, thereby effectively reducing the high temperature generated by the light emitting diodes, thereby effectively reducing the light decay of the light emitting diodes, and greatly Extend its service life.

In another aspect of the present invention, the LED lamp further includes at least one second lamp cover, and the second lamp cover is also formed by stamping the heat conductive metal plate, and the second lamp cover is provided with a second accommodating space. a second opening is disposed at a bottom end of the second lamp cover, and the second opening is in communication with the second receiving space. The top end of the second lamp cover is a second assembled plate, and the bottom of the second assembled plate The side surface can be flatly attached to the outer side of the first assembly plate, and the bottom side of the heat sink can be flatly attached to the outer side of the second assembly plate, thereby forming a gap between the second lamp cover and the first lamp cover. It gradually expands from the top to the bottom. In this way, in the case where the power of the light-emitting diode lamps is designed to be higher and higher, only the second light cover needs to be added, that is, the weight of the light-emitting diode lamp can be sufficiently increased without substantially increasing the weight of the light-emitting diode lamp. By utilizing a large contact area between the inner and outer surfaces and the surrounding cold air, the heat dissipation effect of the thermal energy of the light-emitting diodes is fully utilized.

In still another object of the present invention, the outer surface of the first lamp cover or the surface of the second lamp cover is coated with a heat radiation layer made of a diamond-like carbon material, respectively. So that you can increase the first The heat radiation effect of the lampshade or the second lampshade enables the first lampshade or the second lampshade to radiate thermal energy into the cold air more quickly through a large contact area between the inner and outer surfaces thereof and the surrounding cold air.

According to still another object of the present invention, the driving circuit is disposed in the heat sink to ensure that the driving circuit is free from dirt and sun exposure, and can not only prolong the service life of the outer surface insulating protective layer. The overall appearance and visual beauty of the LED light are greatly increased.

For your convenience, the review committee can make a further understanding and understanding of the purpose, structure and efficacy of the present invention. The embodiments are described in conjunction with the drawings, which are described in detail as follows:

[study]

10‧‧‧shade

11‧‧‧ accommodating space

12‧‧‧ opening

13‧‧‧Opening

14‧‧‧shade top edge

18‧‧‧reflective layer

20‧‧‧Lighting diode board

21‧‧‧Bottom side of the light-emitting diode board

22‧‧‧Lighting diode

23‧‧‧Top side of the light-emitting diode board

30‧‧‧ radiator

31‧‧‧ bottom side of the radiator

32‧‧‧Heat fins

40‧‧‧Drive circuit

41‧‧‧Wire

〔this invention〕

A10, B10‧‧‧ lampshade

A11, B11‧‧‧ accommodating space

A12, B12‧‧‧ opening

A15, B15‧‧‧ assembly plate

A16‧‧‧reflecting surface

20‧‧‧Lighting diode board

21‧‧‧Bottom side of the light-emitting diode board

22‧‧‧Lighting diode

23‧‧‧Top side of the light-emitting diode board

A30, B30, C30‧‧‧ radiator

A31, C31‧‧‧ bottom side of the radiator

A32, B32, C32‧‧‧ heat sink fins

A33, B33‧‧‧ grooves

C33‧‧‧through hole

40‧‧‧Drive circuit

41‧‧‧Wire

50‧‧‧Top cover

60‧‧‧thermal radiation layer

C35‧‧‧ side cover

1 is a perspective exploded view of a conventional high-power light-emitting diode lamp; FIG. 2 is a schematic cross-sectional view of a conventional high-power light-emitting diode lamp; FIG. 3 is a first preferred embodiment of the present invention. 3 is an exploded perspective view of a light-emitting diode lamp; FIG. 4 is a schematic cross-sectional view of the light-emitting diode lamp of the first preferred embodiment; and FIG. 5 is a light-emitting diode of a second preferred embodiment of the present invention. A schematic cross-sectional view of a lamp; and Figure 6 is a schematic cross-sectional view of a heat sink in a third preferred embodiment of the present invention.

The present invention provides a light-emitting diode lamp having an efficient heat dissipation structure. In the first preferred embodiment of the present invention, as shown in FIGS. 3 and 4, the LED lamp includes a first lampshade A10. a first LED housing A10, a first heat sink A30, and a driving circuit 40, wherein the first light cover A10 is formed by stamping a heat conductive metal plate, and a first receiving space A11 is disposed therein. The bottom end of the first lampshade A10 is provided with a lower opening A12, and the lower opening A12 is connected to the first accommodating space A11. The top end of the first lampshade A10 is a first assembly plate A15, and the first An accommodating space A11 is formed in a tapered configuration from the top end to the bottom end. The inner surface of the first lamp cover A10 corresponding to the first accommodating space A11 is vacuum plated or anodized to form a reflecting surface A16 (see As shown in FIG. 4, the bottom side 21 of the LED board 20 is provided with a plurality of LEDs 22, and the top side 23 of the LED board 20 can be flat. The first heat sink A30 is made of an aluminum extrusion type, and has a thermal conductivity lower than that of the heat conductive metal plate of the first lamp cover A10, and the bottom of the first heat sink A30 The side surface A31 can be flatly disposed on the outer side of the first assembly panel A15. The remaining portion of the first heat sink A30 is outwardly convexly provided with a plurality of spaced-apart heat dissipation fins A32. One end of the driving circuit 40 is A power supply terminal (not shown) is connected, and the other end is connected to the LED board 20 to provide the electric energy required for the LEDs 22 to emit light.

Thus, as shown in FIG. 4, when the driving circuit 40 drives the light-emitting diodes 22 to emit light, the first lampshade A10 can reflect the light-emitting two by the reflecting surface A16 of the inner surface thereof. The inner and outer sides of the first assembled panel A15 of the first lampshade A10 can be respectively affixed to the first heat sink A30 and the light emitting diode board 20, and The thermal conductivity of the heat conducting metal plate of the lampshade A10 is better than that of the first heat sink A30, so that the first lampshade A10 can effectively utilize the large contact area between the inner and outer surfaces thereof and the surrounding cold air, and fully exerts the The efficient heat dissipation of the thermal energy of the light-emitting diode 22 is obtained. In addition, in the case where the power of the light-emitting diodes 22 is designed to be higher and higher, it is not necessary to particularly increase the size of the first heat sink A30 and the heat-dissipating fins A32 thereon, the first lampshade The A10 can exert its high-efficiency heat exchange function with the surrounding cold air, effectively reducing the high temperature generated by the light-emitting diodes 22, thereby effectively reducing the light decay of the light-emitting diode 22 and greatly prolonging its service life.

In the first preferred embodiment, as shown in FIGS. 3 and 4, the top surface of the first heat sink A30 is recessed with a first recess A33, and the driving circuit 40 can be disposed at the first In the recess A33, the LED lamp further includes a top cover 50 mounted on the top side of the first heat sink A30 for shielding the first recess A33. In this way, the driving circuit 40 can be ensured that the driving circuit 40 is not exposed to dust and dirt and exposed to the rain, which not only can effectively extend the service life of the outer surface insulating protective layer of the driving circuit 40, but can also greatly increase the appearance of the light emitting diode lamp. The overallity and visual beauty.

In the second preferred embodiment of the present invention, as shown in FIG. 5, the LED lamp further includes at least one second lamp cover B10, and the second lamp cover B10 is also stamped by the heat conductive metal plate. The second lamp cover B10 is provided with a second accommodating space B11. The bottom end of the second lamp cover B10 is provided with a lower opening B12. The lower opening B12 and the second accommodating space B11 are formed. The bottom surface of the second lamp cover B10 is a second assembly plate B15. The bottom side of the second assembly plate B15 can be flatly attached to the outer side of the first assembly plate A15, and the first heat sink A30 The bottom side surface can be flatly attached to the outer side of the second assembly plate B15. The second accommodating space B11 is also configured to be gradually expanded from the top end to the bottom end, and is assembled in the second lamp cover B10 and the first lamp cover A10. When integrated, the gap formed between the second lamp cover B10 and the first lamp cover A10 is gradually expanded from the top end to the bottom end.

In this way, in the case where the power of the light-emitting diode lamps is designed to be higher and higher, only the second lampshade B10 needs to be added, that is, without significantly increasing the weight of the light-emitting diode lamp. The wide contact area between the inner and outer surfaces of the second lampshade B10 and the surrounding cold air is utilized to fully utilize the heat dissipation effect of the thermal energy of the light-emitting diodes 22.

In the second preferred embodiment, as shown in FIG. 5, the LED lamp further includes a second heat sink B30, which is made of aluminum extruded type and thermally conductive. The coefficient is smaller than the thermal conductivity of the heat conducting metal plate. The bottom surface of the second heat sink B30 is recessed with a second recess B33, and the remaining portion of the second heat sink B30 is convexly disposed with a plurality of spaced heat dissipation. a fin B32, the bottom side of the second heat sink B30 is integrally connected with the top side of the first heat sink A30, so that the second recess B33 corresponds to the first recess A33 to form a consistent perforation. In order to enable the driving circuit 40 to be disposed in the through hole, the LED lamp further includes two side covers (not shown), and the side covers are respectively mounted on the first heat sink A30 and the first The two sides of the two heat sinks B30 are used to shield the through holes (ie, the two ends of the first groove A33 and the second groove B33) to ensure that the driving circuit 40 is not exposed to the light emitting diode lamp. In addition, the driving circuit 40 is effectively prevented from being contaminated by dust and exposed to the sun.

In the third preferred embodiment of the present invention, as shown in FIGS. 5 and 6, the first heat sink A30 and the second heat sink B30 shown in the second preferred embodiment can also be integrated into one. The third heat sink C30 is made of an aluminum extrusion type, and has a thermal conductivity lower than a thermal conductivity of the heat conductive metal plate. The bottom side surface C31 of the third heat sink C30 can be flat on the first assembly. On the outer side of the flat plate A15 or the second assembled flat plate B15, the remaining portion of the third heat sink C30 is outwardly convexly provided with a plurality of spaced-apart heat radiating fins C32, and the third heat sink C30 is open at the center. Perforating C33, so that the driving circuit 40 can be disposed in the through hole C33, the light emitting diode lamp further includes two side covers C35, and the side covers C35 are respectively installed in the first The two sides of the three heat sinks C30 are used to shield the through holes C33 to ensure that the driving circuit 40 is not exposed outside the light emitting diode lamp, thereby effectively preventing the driving circuit 40 from being contaminated by dirt and rain.

In a preferred embodiment of the foregoing embodiment of the present invention, the thermally conductive metal plate is an aluminum plate which is formed by extrusion molding, and the thermal conductivity is much higher than that of the aluminum extrusion type. The heat transfer coefficient of the heat sink A30, the second heat sink B30, or the third heat sink C30 is high. In addition, as shown in FIGS. 4 and 5, in order to increase the heat radiation effect of the first lampshade A10 and/or the second lampshade B10 itself, the outer surface of the first lampshade A10 or the second lampshade B10 The inner and outer surfaces are respectively coated with a heat radiation layer 60 made of diamond-like carbon material, and the composition of the carbon-like material includes a sp3 tetrahedral structure of a diamond shape and a sp2 plane of a graphite form. Structure, therefore, this type of carbon material can be described as a carbon material containing a part of the diamond structure, with excellent physical properties such as excellent corrosion resistance, excellent adhesion resistance and high thermal conductivity. Accordingly, the first lampshade A10 or the second lampshade B10 can not only utilize the heat radiation layer 60, but also has excellent corrosion resistance and excellent anti-sticking property, and can still pass through the heat radiation layer 60 and its inner and outer surfaces. A large area is exposed to cold air, and the thermal energy of the light-emitting diodes 22 is radiated more quickly into the surrounding cold air. In addition, the bottom side A31 or C31 of the first heat sink A30 or the third heat sink C30 is parallel to the aluminum extrusion direction of the first heat sink A30 or the third heat sink C30. Thus, the first heat sink A30 is added. Or the length of the third heat sink C30 along the direction of the aluminum extrusion, that is, the outer sides of the first assembly plate A15 of the plurality of first lampshades A10 and/or the second assembly plate B15 of the second lampshade B10 can be sequentially assembled to the same The bottom side A31 or C31 of the first heat sink A30 or the third heat sink C30.

The above description is only a preferred embodiment of the present invention and should not be construed as limiting the present invention. Any person skilled in the art to which the present invention pertains can be easily considered according to the technical contents disclosed in the present invention. Other variations or structural modifications, or equivalent changes made with other structures or devices, are intended to be within the scope of the invention.

A10‧‧‧shade

A11‧‧‧ accommodating space

A12‧‧‧ opening

A15‧‧‧ Assembly plate

20‧‧‧Lighting diode board

21‧‧‧Bottom side of the light-emitting diode board

22‧‧‧Lighting diode

23‧‧‧Top side of the light-emitting diode board

A30‧‧‧ radiator

A31‧‧‧ bottom side of the radiator

A32‧‧‧ Heat sink fins

A33‧‧‧ Groove

40‧‧‧Drive circuit

41‧‧‧Wire

50‧‧‧Top cover

Claims (15)

The invention relates to a light-emitting diode lamp with an efficient heat dissipation structure, comprising: a first lamp cover, which is formed by stamping and forming a heat-conducting metal plate, wherein the first lamp cover is provided with a first accommodating space, and the bottom of the first lamp cover The first opening is connected to the first accommodating space, the top end of the first lamp cover is a first assembly plate, and the first accommodating space is from the top of the first lamp cover. The bottom surface is in a diverging configuration, and the first lamp cover has a reflecting surface corresponding to the inner surface of the first receiving space, and the outer surface of the first lamp cover is coated with a diamond-like carbon material. a heat radiation layer; a light emitting diode plate, the bottom side of which is provided with a plurality of light emitting diodes, the top side of which can be flatly attached to the inner side of the first assembly plate; and the first heat sink is extruded by aluminum The heat dissipation coefficient is smaller than the thermal conductivity of the heat conductive metal plate, and the bottom side of the first heat sink can be flatly attached to the outer side of the first assembly plate, and the remaining portion of the first heat sink is convex outward a plurality of fins arranged at intervals; and a driving circuit One end of which is connected to a power supply terminal of which is connected to the other end of the line to the light emitting diode board, to provide the desired power of the light-emitting diodes emit light. The illuminating diode lamp of claim 1 further includes at least one second lamp cover, wherein the second lamp cover is formed by stamping the heat conductive metal plate, and the second lamp cover is provided with a second accommodating space. a second opening is disposed at a bottom end of the second lamp cover, and the second opening is in communication with the second receiving space. The top end of the second lamp cover is a second assembled plate, and the bottom of the second assembled plate The side surface can be flatly attached to the outer side of the first assembly plate, and the bottom side of the heat sink The surface can be flatly attached to the outer side of the second assembly plate, so that the gap formed between the second lamp cover and the first lamp cover is gradually expanded from the top end to the bottom end. The illuminating diode lamp of claim 2, wherein the surface of the second lampshade is coated with a heat radiating layer made of a diamond-like carbon material. The illuminating diode lamp of claim 1 or 2, wherein a top surface of the first heat sink is recessed with a first recess, and the driving circuit is disposed in the first recess. The illuminating diode lamp of claim 4, further comprising a top cover mounted on a top side of the first heat sink for shielding the first recess. The light-emitting diode lamp of claim 5, wherein the heat-conductive metal plate is an aluminum plate, and the aluminum plate is formed by extrusion molding. The illuminating diode lamp of claim 6, wherein the bottom side of the first heat sink is parallel to the aluminum extrusion direction of the first heat sink. The illuminating diode lamp of claim 4, further comprising a second heat sink, the second heat sink being made of an aluminum extruded type, the thermal conductivity of which is smaller than the thermal conductivity of the thermally conductive metal plate, the second heat dissipation The bottom of the bottom of the device is provided with a second recess, and the remaining portion of the second heat sink is convexly disposed with a plurality of fins arranged at intervals, and the bottom side of the second heat sink is coupled to the first The top side of the heat sink is coupled to the integral surface such that the second groove corresponds to the first groove to form a consistent perforation, and the driving circuit is disposed in the through hole. The illuminating diode lamp of claim 8 further includes two side covers respectively mounted on opposite sides of the heat sink for shielding the through holes. The light-emitting diode lamp of claim 9, wherein the heat-conductive metal plate is an aluminum plate, and the aluminum plate is formed by extrusion molding. The light-emitting diode lamp of claim 10, wherein a bottom side of the first heat sink is parallel to an aluminum extrusion direction of the first heat sink. The illuminating diode lamp of claim 1 or 2, wherein the center of the heat sink is provided with a continuous perforation, and the driving circuit is disposed in the through hole. The illuminating diode lamp of claim 12 further includes two side covers respectively mounted on opposite sides of the heat sink for shielding the through hole. The light-emitting diode lamp of claim 13, wherein the heat-conductive metal plate is an aluminum plate, and the aluminum plate is formed by extrusion molding. The light-emitting diode lamp of claim 14, wherein the bottom side of the heat sink is parallel to the aluminum extrusion direction of the heat sink.