TWI396811B - Light emitting module and an led lamp using the light source module - Google Patents

Description

Light source module and light emitting diode lamp using the same

The invention relates to a lighting device, in particular to a light source module and a light emitting diode lamp using the light source module.

As a new type of light source, the light-emitting diode has the advantages of long working life, energy saving and environmental protection, and the market prospect is promising. However, the light-emitting diode generates a large amount of heat during operation, and is liable to cause a significant decrease in luminous efficiency due to an increase in temperature, and even causes damage to components. In the field of illumination, the heat dissipation problem of the light-emitting diode is more prominent. Therefore, how to keep the operating temperature of the light-emitting diode within a certain range to avoid the above phenomenon is a problem that must be solved in the application of the light-emitting diode lamp.

The conventional light-emitting diode lamp includes a plate-shaped heat sink and a plurality of light source modules mounted on one side of the heat sink. The light source modules are evenly arranged on the back of the heat sink. When the light-emitting diode is in operation, it generates heat to the heat sink located at the back thereof, and finally passes through the heat sink to radiate heat to the surrounding air. In order to improve the heat dissipation efficiency, the size of the heat sink is generally increased. However, this increases the volume of the light-emitting diode heat sink and the entire illumination device. Especially in the field of indoor lighting, the luminaire not only requires a stable working state, but also requires a compact structure. Traditional light-emitting diode lamps are cumbersome and complicated due to the heat dissipation structure, and obviously do not meet the needs of reality.

A light source module includes a fixing frame and a light emitting diode module attached to the fixing frame, the fixing frame includes a bottom plate and is spaced apart from the bottom plate Providing a mounting plate and a connecting portion of the bottom plate and the mounting plate, the light emitting diode module is attached to the mounting plate, and further comprising a heat pipe disposed on the fixing frame, the heat pipe connecting the bottom plate and Install the board.

A light-emitting diode lamp, comprising a heat sink, a plurality of light source modules mounted on the heat sink, the light source module comprising a fixing frame and a light-emitting diode module attached to the fixing frame, The mounting bracket includes a bottom plate, a mounting plate spaced apart from the bottom plate, and a connecting portion connecting the bottom plate and the mounting plate. The light emitting diode module is attached to the mounting plate, and the light source module further includes a heat pipe on the fixing frame, the heat pipe connecting the bottom plate and the mounting plate.

Compared with the prior art, the light source module of the present invention attaches the light emitting diode module to the mounting plate of the fixing frame, and the heat pipe is thermally connected to the mounting plate and the bottom plate of the fixing frame, thereby achieving better heat dissipation effect. To ensure stable operation of the LED module.

Referring to FIG. 1 to FIG. 2 , the light-emitting diode lamp of the present invention includes a plurality of light source modules 1 and a heat sink 50 for the light source module 1 . The light source module 1 includes a fixing frame 10 and is attached. One of the light-emitting diode modules 20 is mounted on the mounting frame 10 and is thermally coupled to the first and second heat pipes 30 and 40 to the mounting frame 10 and the heat sink 50.

Referring to FIG. 3 , the fixing frame 10 is made of a material with good thermal conductivity, such as copper or aluminum, and includes a bottom plate 12 fixed on the heat sink 50 and a light-emitting diode module 20 attached thereto. The mounting plate 14 and the connecting portion 16 of the bottom plate 12 and the mounting plate 14 are connected. The bottom plate 12 is a substantially rectangular horizontal plate body, and a square notch is formed at four corners thereof (not labeled) The first and second heat pipes 30 and 40 are conveniently disposed on the fixing frame 10. A first trench 120 and a second trench 122 are defined in the bottom surface of the bottom plate 12. The first and second trenches 120 and 122 are parallel and extend along the longitudinal direction of the bottom plate 12. The cross sections of the first and second grooves 120, 122 are curved to respectively receive a portion of the first and second heat pipes 30, 40. A plurality of through holes 124 are respectively defined in the bottom plate 12 adjacent to the opposite edges, and a plurality of fixing members (not shown) are passed through to fix and fix the fixing frame 10. The connecting portion 16 extends vertically upward from the middle of the top surface of the bottom plate 12 and is correspondingly connected to the middle portion of the bottom surface of the mounting plate 14. The mounting plate 14 is a rectangular plate body formed on a top surface of the connecting portion 12. The LED module 20 is attached to the top surface of the mounting board 14 . The mounting plate 14 forms an acute angle (not shown) with respect to the connecting portion 16 , so that the LED module 20 attached to the top surface of the mounting board 14 is at an angle to the bottom plate 12 mounted on the heat sink 50 . The tilting is set to increase the illumination range of the LED module 20. In other embodiments, the mounting plate 14 may be disposed at a different angle from the connecting portion 16 depending on the need for different illumination angles of the LED device. A first groove 140 and a second groove 142 are defined in the bottom surface of the mounting plate 14 . The first and second grooves 140, 142 are parallel and extend along the longitudinal direction of the mounting plate 14. The first groove and the groove 120 , 140 are opposite to one side of the connecting portion 16 , and the second groove and the groove 122 , 142 are opposite to the other side of the connecting portion 16 . The line connecting the first groove, the groove 120, 140 and the second groove and the groove 122, 142 are parallel to the connecting portion 16 and perpendicular to the bottom plate 12. The cross-sections of the first and second recesses 140, 142 are curved, respectively corresponding to the other portions of the first and second heat pipes 30, 40.

The LED module 20 includes a rectangular circuit board 22 and a plurality of LEDs 24 mounted on the top surface of the circuit board 22. The bottom surface of the circuit board 22 is in close contact with the top surface of the mounting board 14 of the mounting frame 10. The light emitting diodes 24 are evenly arranged in a straight line along the longitudinal direction of the circuit board 22 to uniformly transfer heat generated during light emission to the fixing frame 10, and then to the heat sink 50 connected to the fixing frame 10. on.

Referring to FIG. 4 simultaneously, the first heat pipe 30 is U-shaped, and includes a first heat transfer section 32 and a second heat transfer section 34 disposed in parallel and connecting the first and second heat transfer sections 32, 34. A first connecting section 36. The first heat pipe 30 is disposed on the fixing frame 10 and is located on one side of the fixing frame 10 . The first heat transfer portion 32 is correspondingly disposed in the first groove 120 of the bottom plate 12 of the fixing frame 10 . The second heat transfer section 34 is correspondingly disposed in the first recess 140 of the mounting plate 14 of the mounting bracket 10 , and the first connecting section 36 spans between the bottom plate 12 and the mounting plate 14 . The plane (not labeled) of the first and second heat transfer sections 32, 34 of the first heat pipe 30 is perpendicular to the bottom plate 12 of the mounting frame 10, and the plane is parallel to the connecting portion 16.

The second heat pipe 40 has a U shape, and includes a third heat transfer section 42 and a fourth heat transfer section 44 and a second connection section 46 connected to the third and fourth heat transfer sections 42 and 44. . The vertical distance between the third and fourth heat transfer sections 42, 44 of the second heat pipe 40 is greater than the vertical distance between the first and second heat transfer sections 32, 34 of the first heat pipe 30, so that the first The second heat pipe 40 is correspondingly disposed on the other side of the fixing frame 10, wherein the third heat transfer portion 42 is correspondingly inserted into the second groove 122 of the bottom plate 12 of the fixing frame 10, and the second heat transfer portion 44 corresponds to the card. The second connecting portion 46 is disposed between the bottom plate 12 and the mounting plate 14 in the second recess 142 of the mounting plate 14 of the mounting frame 10. The The plane (not labeled) of the third and fourth heat transfer sections 42, 44 of the second heat pipe 40 is perpendicular to the bottom plate 12 of the mount 10, and the plane is parallel to the joint portion 16. The opening direction of the second heat pipe 40 is opposite to the opening direction of the first heat pipe 30 to achieve a uniform heat transfer effect.

Referring to FIG. 5 together, the heat sink 50 is integrally formed of a material having good thermal conductivity. The heat sink 50 includes a rectangular substrate 52 and a plurality of heat dissipation fins 54 extending from the substrate 52. The light source module 1 is mounted on the middle of the top surface of the substrate 52 and disposed along the longitudinal direction of the substrate 52. The number of the light source modules 1 is different in different embodiments. In this embodiment, the number of the light source modules 1 is four, two sets are oppositely disposed, and are symmetrically arranged with respect to the longitudinal vertical line of the substrate 52. The bottom surface of the top surface of the substrate 52 is spaced apart from the bottom of the substrate. The eight positioning slots 56 are adjacent to each other. The two positioning slots 56 are respectively associated with the bottom plate 12 of the fixing frame 10 of the light source module 1. The first and second grooves 122 and 124 are corresponding in shape, and are provided with two accommodating portions (not labeled) for accommodating the first heat transfer portion 32 and the second heat pipe of the first heat pipe 30, respectively. The third heat transfer section 42 of 40 is such that the bottom surface of the bottom plate 12 of the holder 10 is fitted to the top surface of the substrate 52. The heat dissipation fins 54 include a plurality of first heat dissipation fins 542 extending vertically downward from the entire bottom surface of the substrate 52, and a plurality of second heat dissipation fins extending perpendicularly upward from opposite edges of the top surface of the substrate 52. 544. The first and second heat dissipation fins 542, 544 extend in the longitudinal direction of the substrate 52, and a plurality of air flow channels (not shown) are formed therebetween.

When the light source module 1 of the present invention is used, the plurality of light source modules 1 are mounted on the substrate 52 of the heat sink 50 of the light-emitting diode lamp according to a certain arrangement manner, such as horizontal, vertical, and circumferential directions according to a lighting environment. On, where The holder 10 and the first and second heat pipes 30 and 40 are bonded to the substrate 52 of the heat sink 50 at the same time. When the light emitting diode module 20 emits light, heat is generated and transmitted to the substrate 52 of the heat sink 50 via the fixing frame 10 and the first and second heat pipes 30 and 40 that are placed on the fixing frame 10, and then the heat sink fins 54 are passed through the heat sink fins 54. Dissipated into the surrounding air, effectively reducing the operating temperature of the LED module 20, and ensuring stable operation of the LED lamp. Moreover, the mounting plate 14 on which the LED module 20 is attached and the substrate 52 to which the substrate 12 is attached are inclined at an angle to increase the illumination range of the LED module 20, and is suitable for various lighting environments.

In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. The above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be included in the following claims.

1‧‧‧Light source module

10‧‧‧ Fixing frame

12‧‧‧floor

120‧‧‧First trench

122‧‧‧Second trench

124‧‧‧through hole

14‧‧‧Installation board

140‧‧‧first groove

142‧‧‧second groove

16‧‧‧Connecting Department

20‧‧‧Lighting diode module

22‧‧‧ Circuit board

24‧‧‧Lighting diode

30‧‧‧First heat pipe

32‧‧‧First heat transfer section

34‧‧‧second heat transfer section

36‧‧‧First connection segment

40‧‧‧second heat pipe

42‧‧‧ third heat transfer section

44‧‧‧fourth heat transfer section

46‧‧‧Second connection

50‧‧‧ radiator

52‧‧‧Substrate

54‧‧‧Heat fins

542‧‧‧First heat sink fin

544‧‧‧Second heat sink fins

56‧‧‧ positioning slot

1 is a perspective assembled view of a light-emitting diode lamp of the present invention.

2 is an exploded perspective view of the light source module of FIG. 1.

Figure 3 is an inverted view of Figure 2.

4 is a front elevational view of the light source module of FIG. 1.

FIG. 5 is an exploded perspective view of the light-emitting diode lamp of FIG. 1. FIG.

1‧‧‧Light source module

10‧‧‧ Fixing frame

20‧‧‧Lighting diode module

30‧‧‧First heat pipe

40‧‧‧second heat pipe

50‧‧‧ radiator

52‧‧‧Substrate

54‧‧‧Heat fins

542‧‧‧First heat sink fin

544‧‧‧Second heat sink fins

56‧‧‧ positioning slot

Claims (12)

A light source module includes a fixing frame and a light emitting diode module mounted on the fixing frame, wherein the fixing frame comprises a bottom plate, a mounting plate spaced apart from the bottom plate, and connecting the bottom plate a light-emitting diode module is attached to the mounting plate, and further includes a heat pipe disposed on the fixing frame, the heat pipe connecting the bottom plate and the mounting plate, and the mounting plate is formed with the bottom plate Tilt setting at a certain angle. The light source module of claim 1, wherein the connecting portion extends vertically upward from a central portion of the top surface of the bottom plate and is connected to a middle portion of a bottom surface of the mounting plate. The light source module of claim 1 or 2, wherein the heat pipe comprises a first heat transfer section embedded in a bottom surface of the bottom plate, a second heat transfer section embedded in a bottom surface of the mounting plate, and a connection. One of the first and second heat transfer sections is connected to the section. The light source module of claim 3, wherein the bottom plate is provided with a groove for receiving the first heat transfer portion, and the mounting plate is provided with a groove for accommodating the second heat transfer portion . The light source module of claim 3, wherein the first and second heat transfer sections of the heat pipe are perpendicular to the bottom plate and are located on one side of the connecting portion. The light source module according to claim 3, wherein another heat pipe is disposed on the fixing frame in parallel with the heat pipe, and is respectively located at two sides of the fixing frame connecting portion. The light source module of claim 6, wherein the other heat pipe and the heat pipe are U-shaped, and the heat pipe and the other heat pipe have opposite openings. A light-emitting diode lamp comprising a heat sink mounted on the heat sink The light source module comprises a fixing frame and a light emitting diode module attached to the fixing frame, wherein the fixing frame comprises a bottom plate and one of the bottom plates is spaced apart from the bottom plate And a light-emitting diode module is disposed on the mounting plate, the light source module further includes a heat pipe disposed on the fixing frame, the heat pipe is connected to the bottom plate and the connecting plate is connected to the mounting plate A mounting plate that is disposed at an angle to the bottom plate. The light-emitting diode lamp of claim 8, wherein the heat sink comprises a substrate and a plurality of heat-dissipating fins extending from the substrate, wherein the bottom plate of the fixing frame is attached to the top surface of the substrate on. The illuminating diode lamp of claim 9, wherein the heat pipe comprises first and second heat transfer sections respectively embedded in a bottom surface of the bottom plate and a bottom surface of the mounting plate, and connecting the first and second heat transfer sections. A connection segment. The illuminating diode lamp of claim 10, wherein the bottom plate is provided with a groove for receiving the first heat transfer section, and the mounting plate is provided with a recess for accommodating the second heat transfer section. groove. The illuminating diode lamp of claim 11, wherein the groove is formed on a bottom surface of the bottom plate, and a positioning groove is formed on a top surface of the substrate, the positioning groove and the groove A receiving portion is disposed to receive the first heat transfer portion of the heat pipe.