TWI394917B - Led lamp assembly - Google Patents

Description

Light-emitting diode lamp

The invention relates to a lighting device, in particular to a light-emitting diode lamp.

As a highly efficient light source, light-emitting diodes have been increasingly used in various fields. However, when the light-emitting diode works, a large amount of heat is generated. If the heat is not released in time, it is easy to cause the light-emitting diode to overheat, which leads to a decrease in luminous efficiency.

The conventional light-emitting diode lamp includes a plate-shaped heat sink and a plurality of light-emitting diodes mounted on one side of the heat sink. The light emitting diodes are evenly arranged on a plurality of straight lines. When the light emitting diode is illuminated, the heat generated by it is dissipated into the surrounding air via the heat sink.

In order to obtain a higher luminous intensity, the light-emitting diodes are concentratedly disposed in a small area, resulting in uneven heat distribution on the heat radiating body, causing heat accumulation, which makes it impossible to effectively dissipate heat. , which in turn affects the heat dissipation efficiency of the heat sink.

An illuminating diode lamp includes a lamp holder, a heat sink on one side of the lamp holder, and a plurality of light source bodies on the opposite side of the lamp holder. The heat sink includes a substrate, and the light source body is disposed under the substrate The surface of each of the light source bodies comprises a heat absorbing plate, a light emitting diode module attached to the lower surface of the heat absorbing plate, and a heat pipe connecting the surface of the heat absorbing plate and the substrate.

Compared with the prior art, the heat absorbing plate attached to the light emitting diode module is connected with the heat pipe in the invention, and the heat generated by the light emitting diode module can be generated faster. Conducted to the heat sink, effectively reducing the temperature of the light-emitting diode lamp.

As shown in FIG. 1 and FIG. 2, the LED lamp of the present invention has a substantially paddle shape, and includes a lamp holder 20, a heat sink 10 mounted on one side of the lamp holder 20, and a plurality of stickers attached to the bottom surface of the heat sink 10. The parallel heat transfer plate 30 and the plurality of light source bodies 40 mounted on the heat transfer plates 30.

Referring to FIG. 3 , the lamp holder 20 includes a fixing frame 21 , a driving circuit module 23 at one end of the fixing frame 21 , and a lamp holder 25 disposed at a middle end of the driving circuit module 23 . The driving circuit module 23 is electrically connected to the light source body 40. The socket 25 is for connection with a light pole (not shown). The fixing frame 21 is substantially in the shape of a paddle, and a rectangular opening 213 is defined in the middle portion thereof, and a plurality of curved edges (not labeled) are formed on the periphery of the opening 213. The heat sink 10 is placed on the upper side of the holder 21.

The heat sink 10 is integrally formed of a material having good thermal conductivity. The heat sink 10 includes an elongated rectangular substrate 11 and a plurality of fins 13 extending vertically upward from the upper surface of the substrate 11. The substrate 11 is disposed on the opening 213 of the fixing frame 21 and the lower surface edge thereof abuts against the edge of the opening 21 of the fixing frame 21.

The heat transfer plates 30 have the same length and are uniformly attached to the middle of the lower surface of the substrate 11 of the heat sink 10 for fixing the light source body 40. Each heat transfer plate 30 is an elongated metal plate body made of a material having good thermal conductivity such as aluminum, copper or the like. The upper surface of each of the heat transfer plates 30 is a flat surface for attaching to the substrate 11, and a central portion of the upper surface opposite to the upper surface defines a receiving groove 31 extending through the front and rear ends.

The light source bodies 40 are spaced apart and symmetrically distributed about a center plane perpendicular to the substrate 11, which is located at the center of the substrate 11 and parallel to the heat sink 13. Each of the light source bodies 40 includes a longitudinal heat absorbing plate 43 at the bottom of the substrate 11, a heat pipe 41 fixed to the upper surface of the heat absorbing plate 43 and connected to the heat transfer plate 30, and a light emitting diode attached to the lower surface of the heat absorbing plate 43. Module 45.

Each heat pipe 41 has a U-shaped structure including two parallel, oppositely disposed heat transfer sections 411 and a connecting section 413 connecting the two heat transfer sections 411. The two heat pipes 41 of each of the light source bodies 40 are oppositely and symmetrically disposed. In the present embodiment, the plane of the heat pipe 41 is perpendicular to the lower surface of the heat transfer plate 30, and is disposed at an angle to the upper surface of the heat absorbing plate 43. One heat transfer section 411 of each heat pipe 41 is fixed to one end of one end of the heat absorbing plate 43 , and the other heat transfer section 411 is fixed in the receiving groove 31 of one end of the heat transfer plate 30 , so that the light source bodies 40 are fixed to the heat sink 10 . Upper, and the heat transfer plate 30 and the heat absorbing plate 43 are spaced apart from each other by a length equal to the height of the connecting portion 413. The height of the connecting portion 413 of the heat pipe 41 gradually decreases from the heat pipe 41 at the center to the other heat pipes 41 on both sides, so that the distance between the heat absorbing plate 43 of the light source body 40 and the heat transfer plate 30 is at the most central position. The light source body 40 gradually decreases toward the opposite sides.

Each of the heat absorbing plates 43 is an elongated plate body, and a longitudinal fixing groove 431 extending through the front and rear ends thereof is formed in a middle portion of the upper surface thereof for connecting with a heat transfer portion 411 of the heat pipe 41, and a lower surface thereof is a flat surface. It is used for affixing with the LED module 45. The upper surface of the central heat absorbing plate 43 is disposed in parallel with the lower surface of the corresponding heat transfer plate 30, and the upper surface of the remaining heat absorbing plate 43 is at an angle with the lower surface of the corresponding heat transfer plate 30, and the angles are self-heating. The center of the device 10 is gradually increased toward the opposite sides, so that the heat absorbing plates 43 substantially form a V-shaped structure.

Each of the LED modules 45 includes a vertically long circuit board 452 and a plurality of LEDs 454 that are uniformly fixed to one side of the circuit board 452. The other side of the circuit board 452 is attached to the lower surface of the heat absorbing plate 43. In this way, the light emitted by the LED module 45 can be radiated to both sides of the heat sink 10, and the illumination range is large.

It can be understood that the angle between the plane of the heat pipe 41 and the heat absorbing plate 43 and the heat transfer plate 30 can be arbitrarily set to meet the needs of different illumination angles of the LED lamp.

Compared with the prior art, the heat absorbing plate 43 for illuminating the LED module 45 is connected to the heat pipe 41, and the heat generated by the LED module 45 can be transmitted to the heat sink 10 more quickly. , thereby effectively reducing the temperature of the light-emitting diode lamp.

In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. The above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be included in the following claims.

10‧‧‧ radiator

11‧‧‧Substrate

13‧‧‧ Heat sink

20‧‧‧Light stand

21‧‧‧ Fixing frame

23‧‧‧Drive Circuit Module

25‧‧‧ lamp holder

30‧‧‧heat transfer plates

31‧‧‧ housing trough

40‧‧‧Light source body

41‧‧‧heat pipe

43‧‧‧Heat plate

45‧‧‧Lighting diode module

213‧‧‧ openings

411‧‧‧heat transfer section

413‧‧‧Connection section

431‧‧‧fixed slot

452‧‧‧ boards

454‧‧‧Lighting diode

1 is a perspective assembled view of a light-emitting diode lamp of the present invention.

2 is an exploded perspective view of the light-emitting diode lamp of FIG. 1.

3 is an inverted view of the light-emitting diode lamp of FIG. 2.

4 is an exploded view of the light source body of the light-emitting diode lamp of FIG. 3.

10‧‧‧ radiator

11‧‧‧Substrate

13‧‧‧ Heat sink

20‧‧‧Light stand

21‧‧‧ Fixing frame

23‧‧‧Drive Circuit Module

25‧‧‧ lamp holder

30‧‧‧heat transfer plates

31‧‧‧ housing trough

40‧‧‧Light source body

41‧‧‧heat pipe

43‧‧‧Heat plate

45‧‧‧Lighting diode module

213‧‧‧ openings

411‧‧‧heat transfer section

413‧‧‧Connection section

431‧‧‧fixed slot

Claims (10)

An illuminating diode lamp includes a lamp holder, a heat sink on one side of the lamp holder, and a plurality of light source bodies on the opposite side of the lamp holder. The heat sink includes a substrate, and the light source body is disposed under the substrate The surface is improved in that each light source body comprises a heat absorbing plate, a light emitting diode module attached to the lower surface of the heat absorbing plate, and a heat pipe connecting the surface of the heat absorbing plate and the substrate, wherein the heat pipe comprises two oppositely disposed lengths. A strip-shaped heat transfer section, wherein one heat transfer section is thermally connected to the substrate along its length, and the other heat transfer section is coupled to the heat absorbing plate along its length. The illuminating diode lamp of claim 1, wherein an upper surface of each of the heat absorbing plates is at a certain angle with a lower surface of the substrate, and the angles are gradually increased from a central portion to an opposite side of the substrate. Therefore, the light emitted by the light emitting diode module attached to the heat absorbing plate can be radiated to the periphery of the heat sink, so that the illumination range of the light emitting diode lamp is wider. The illuminating diode lamp of claim 2, wherein the plurality of parallel fins are formed on the upper surface of the substrate, and the light source bodies are symmetrically distributed with respect to a center plane perpendicular to the substrate, the center plane being located at the center of the substrate Parallel to the heat sink. The illuminating diode lamp of claim 3, wherein the heat absorbing plate is an elongated plate body and has the same length. The illuminating diode lamp of claim 1, further comprising a plurality of heat transfer plates attached to a lower surface of the substrate, wherein the heat transfer section of the heat pipe is connected to the heat transfer section of the heat absorbing plate along the length thereof board. The illuminating diode lamp of claim 5, wherein the plane of the heat pipe is perpendicular to the lower surface of the heat transfer plate. The illuminating diode lamp of claim 1, wherein the heat pipe is U-shaped, and further comprises a connecting section connecting one of the two heat transfer sections. The illuminating diode lamp of claim 7, wherein the heat transfer section of the heat pipe is respectively connected to the middle of the heat transfer plate and the heat absorbing plate, and the heat transfer plate and the heat absorbing plate are spaced apart from each other by a length and a connecting section. The height is equal to the distance. The illuminating diode lamp of claim 8, wherein the height of the connecting portion of the heat pipe gradually decreases from the center of the substrate toward opposite sides thereof. The illuminating diode lamp of the first aspect of the invention, wherein the lamp holder comprises a fixing frame and a driving circuit module on a side of the fixing frame, the heat sink is fixed on the fixing frame and the light source body is worn. Pass the holder.