KR101033521B1 - Led lamp - Google Patents

Led lamp Download PDF

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KR101033521B1
KR101033521B1 KR1020090019836A KR20090019836A KR101033521B1 KR 101033521 B1 KR101033521 B1 KR 101033521B1 KR 1020090019836 A KR1020090019836 A KR 1020090019836A KR 20090019836 A KR20090019836 A KR 20090019836A KR 101033521 B1 KR101033521 B1 KR 101033521B1
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South Korea
Prior art keywords
led
substrate
heat
present
chassis
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KR1020090019836A
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Korean (ko)
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KR20100101371A (en
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최유진
김병호
이성봉
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티티엠주식회사
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
    • F21V3/049—Patterns or structured surfaces for diffusing light, e.g. frosted surfaces
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/04—Optical design
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

본 발명은 엘이디(LED, Light Emitting Diode) 조명등에 관한 것으로, 더욱 상세하게는 플랙시블 PCB(flexible PCB)를 사용하여 LED소자를 입체적으로 배치할 수 있어서 조명의 각도를 넓힐 수 있고, 히트파이프를 사용하여 LED소자에서 발생하는 열을 효과적으로 방열할 수 있도록 한 엘이디 조명등에 관한 것이다.The present invention relates to an LED (Light Emitting Diode) light, and more particularly, it is possible to use a flexible PCB (PCB) to arrange the LED elements in three dimensions to widen the angle of illumination, heat pipes The present invention relates to an LED lamp for effectively radiating heat generated by an LED device.

본 발명은 일반적인 LED조명등에 있어서, 기판이 플렉시블피시비로 형성되어 LED소자의 배열이 입체적으로 형성될 수 있도록 하여 조명각도를 넓히고, 히트파이프를 방열매체로 사용한 것을 특징으로 한다.The present invention is characterized in that in the general LED lighting, the substrate is formed of a flexible PCB so that the arrangement of the LED elements can be formed three-dimensionally to widen the illumination angle, using a heat pipe as a heat radiating medium.

본 발명의 엘이디 조명등에 의하면 기판을 입체적으로 형성할 수 있어서 조명각도를 넓힐 수 있고, 기판이 입체적으로 형성되어 LED소자간 경로가 증가하여도 히트파이프에 의해서 방열이 효과적으로 이루어져서 광효율이 증가하는 효과가 발생한다.According to the LED lighting of the present invention, the substrate can be three-dimensionally formed to widen the illumination angle, the substrate is formed three-dimensionally, even if the path between the LED elements is increased, the heat radiation is effectively effected by the heat pipe to increase the light efficiency Occurs.

엘이디, 조명, 소자, 방열, 히트파이프, 열유체. LED, lighting, element, heat dissipation, heat pipe, heat fluid.

Description

엘이디 조명등{LED LAMP}LED lighting lamp {LED LAMP}

본 발명은 엘이디(LED, Light Emitting Diode) 조명등에 관한 것으로, 더욱 상세하게는 플랙시블 PCB(flexible PCB)를 사용하여 LED소자를 입체적으로 배치할 수 있어서 조명의 각도를 넓힐 수 있고, 히트파이프를 사용하여 LED소자에서 발생하는 열을 효과적으로 방열할 수 있도록 한 엘이디 조명등에 관한 것이다. The present invention relates to an LED (Light Emitting Diode) light, and more particularly, it is possible to use a flexible PCB (PCB) to arrange the LED elements in three dimensions to widen the angle of illumination, heat pipes The present invention relates to an LED lamp for effectively radiating heat generated by an LED device.

야간이나 실내에서 사용되는 조명등은 전기에너지를 빛에너지로 변환시킬 수 있도록 형성된 백열등이나 형광등 등이 있다. Lighting lamps used at night or indoors include incandescent lamps and fluorescent lamps formed to convert electrical energy into light energy.

상기 백열등은 색감이 따듯하고 점등에 부속장치가 필요 없어서 많이 사용되고, 형광등은 백열등에 비해 수명이 오래가고 전력소모가 적은 특징이 있다. The incandescent lamp is used in many colors because it is warm and does not need an accessory device for lighting, and the fluorescent lamp has a long life and low power consumption compared to an incandescent lamp.

그러나, 상기 백열등이나 형광등은 그 수명이 짧고 전력소모가 비교적 많아서 최근에는 전력소모가 낮은 엘이디(LED)소자를 광원으로 사용하기 위한 시도가 많이 있어왔다.However, the incandescent and fluorescent lamps have a short lifespan and relatively high power consumption, and thus, there have been many attempts to use LED devices having low power consumption as light sources.

상기 LED소자를 광원으로 사용하는 엘이디 조명등에 관한 기술은 대한민국특허청 등록특허공보 제847875호, 874609호 등에 개시된 바 있다.LED lighting using the LED element as a light source has been disclosed in the Republic of Korea Patent Publication No. 847875, 874609.

그러나, 종래의 엘이디 조명등은 다음과 같은 문제점이 있었다. However, the conventional LED lighting had the following problems.

(1) 기판이 평평하게 형성되므로 배열되는 LED소자에 의한 조명각도가 좁다.(1) Since the substrate is formed flat, the illumination angle by the arranged LED elements is narrow.

(2) 적절한 방열부재가 사용되지 않아서 LED소자에서 발생하는 열을 효과적으로 제거하지 못한다.(2) The proper heat radiation member is not used to effectively remove heat generated from LED device.

상기한 문제점을 해결하기 위해서, 본 발명은 전원공급부가 형성되고, 하단에 전원기판이 형성된 새시가 형성되며, 다수개의 LED소자가 형성된 기판이 상기 전원기판과 연결되고, 상기 기판에 하단으로 이격되도록 확산커버가 형성된 일반적인 LED조명등에 있어서,In order to solve the above problems, the present invention is a power supply unit is formed, the chassis is formed with a power substrate at the bottom is formed, the substrate on which a plurality of LED elements are formed is connected to the power substrate, so that the substrate is spaced apart to the bottom In general LED lighting with a diffusion cover,

상기 기판은 플렉시블피시비로 형성되어 LED소자의 배열이 입체적으로 형성될 수 있도록 하고, 커넥터가 형성된 모듈형태로 형성되어 전원기판의 소켓에 다수개가 결합하여 구성되며, The substrate is formed of a flexible PCB so that the arrangement of the LED elements can be formed in three dimensions, formed in the form of a module with a connector is formed by combining a plurality of sockets of the power substrate,

상기 기판의 상단에 LED소자에 의해서 발생하는 열을 효과적으로 방열할 수 있도록 히트파이프를 형성한 것을 특징으로 구성된다.The heat pipe is formed on the upper end of the substrate to effectively dissipate heat generated by the LED element.

본 발명의 엘이디 조명등에 의하면 다음과 같은 효과가 발생한다.According to the LED lamp of the present invention the following effects occur.

(1) 기판을 입체적으로 형성할 수 있어서 조명각도를 넓힐 수 있다.(1) Since the substrate can be formed three-dimensionally, the illumination angle can be widened.

(2) 기판이 입체적으로 형성되어 LED소자간 경로가 증가하여도 히트파이프에 의해서 방열이 효과적으로 이루어져서 광효율이 증가한다.(2) Even though the substrate is formed three-dimensionally and the path between the LED elements is increased, heat dissipation is effectively performed by the heat pipe, thereby increasing the light efficiency.

본 발명은 전원공급부(110)가 형성되고, 다수개의 소켓(122)이 형성된 전원기판(120)이 형성된 새시(100)와; According to the present invention, a power supply unit 110 is formed, and a chassis 100 having a power substrate 120 having a plurality of sockets 122 formed therein;

상기 새시(100)의 하단에 양측면이 고정되는 반사판(240)이 형성되고, 상기 반사판(240)의 상면에는 하면에 다수개의 LED소자(220)가 형성된 기판(210)이 형성되고, 상기 기판(210)의 상면에는 다수개의 열전달체(230)가 형성되며, 상기 기판(210)의 일측상단에는 커넥터(205)가 형성된 다수개의 엘이디모듈(200)과; Reflecting plate 240 is fixed to both sides of the lower surface of the chassis 100 is formed, a substrate 210 having a plurality of LED elements 220 is formed on the lower surface of the reflecting plate 240, the substrate ( A plurality of heat transfer members 230 are formed on an upper surface of the 210, and a plurality of LED modules 200 on which connectors 205 are formed on one side of the substrate 210;

상기 엘이디모듈(200)의 하단에 엘이디모듈(200)과 이격되도록 새시(100)와 결합되는 확산커버(300)로 구성된다.It is composed of a diffusion cover 300 coupled to the chassis 100 to be spaced apart from the LED module 200 at the bottom of the LED module 200.

상기 새시(100)는 알루미늄 등의 재료로 형성되어 열전도도가 높고 가벼운 것을 사용한다. The chassis 100 is formed of a material such as aluminum, so that the thermal conductivity is high and light.

상기 새시(100)의 외측에는 전원공급부(110)가 형성되어 전원기판(120)에 전기를 공급할 수 있도록 형성된다.The power supply unit 110 is formed outside the chassis 100 to supply electricity to the power substrate 120.

상기 엘이디모듈(200)의 기판(210)의 상단 일측에는 커넥터(205)가 형성되는데, 상기 커넥터(205)는 전원기판(120)의 소켓(122)에 결합한다.A connector 205 is formed at one side of the upper end of the board 210 of the LED module 200, and the connector 205 is coupled to the socket 122 of the power substrate 120.

상기 전원기판(120)의 소켓(122)은 엘이디모듈(200)의 개수에 따라서 정해진다.The socket 122 of the power substrate 120 is determined according to the number of the LED module 200.

상기 기판(210)은 플렉시블피시비(flexible PCB)로 형성되어, 적어도 하나의 각을 갖도록 입체적으로 꺾여서 형성된다.The substrate 210 is formed of a flexible PCB, and is formed by bending three-dimensionally to have at least one angle.

상기 기판(210)은 적어도 한 개 이상의 각으로 꺾여서 입체적으로 형성되되, 바람직하게는 길이방향으로 두 개의 각으로 꺾여서 가운데의 하단평탄부(243)를 중심으로 양측에 상단으로 경사진 두 개의 경사부(242)가 형성된다.The substrate 210 is three-dimensionally formed by bending at least one or more angles, preferably two inclined portions that are bent at two angles in the longitudinal direction and inclined upward on both sides about the lower flat portion 243 in the center. 242 is formed.

상기 기판(210)의 하면에는 다수개의 LED소자(220)가 형성되는데, 상기 기판(210)이 한 개 이상의 각으로 꺾여서 생길 수 있는 면에 각각 길이방향으로 일정하게 이격되어서 형성된다.A plurality of LED elements 220 are formed on the bottom surface of the substrate 210, and the substrate 210 is formed at regular intervals in the longitudinal direction on surfaces that may be formed by bending at least one angle.

상기 기판(210)이 두 개의 각으로 꺾여서 형성될 경우에는 두개의 경사부(242)와 하단평탄부(243)에 각각 길이방향으로 일정하게 이격되어서 형성된다.When the substrate 210 is formed by bending at two angles, the substrate 210 is formed to be uniformly spaced apart in the longitudinal direction from the two inclined portions 242 and the lower flat portion 243, respectively.

상기 엘이디모듈(200)의 반사판(240)은 가운데가 기판(210)의 형상과 대응하도록 형성되고, 양측 끝단에는 상기 새시(100)의 하단 주연부에 나사로 결합되도록 평평하게 형성된다.The reflecting plate 240 of the LED module 200 is formed so that the center thereof corresponds to the shape of the substrate 210, and both ends thereof are formed flat so as to be screwed to the lower peripheral edge of the chassis 100.

상기 반사판(240)에는 다수개의 홀(245)이 형성되어, 각각의 홀(245)에 LED소자(220)가 하단으로 돌출되어 삽입된다.A plurality of holes 245 are formed in the reflective plate 240, and the LED elements 220 protrude downward from each hole 245 to be inserted therein.

상기 기판(210)의 상면에는 다수개의 열전달체(230)가 형성되는데, 기판(210)의 LED소자(220)가 형성된 바로 후면에 폭방향으로 부착된다.A plurality of heat transfer members 230 are formed on the upper surface of the substrate 210, and are directly attached to the rear surface of the substrate 210 in the width direction.

상기 열전달체(230)는 가운데가 기판(210)의 형상과 동일하게 형성되고, 양측면에는 평평하게 형성되어 반사판(240)의 양측면과 새시(100)의 하단주연부 사이에 위치한다.The heat transfer member 230 has a center in the same shape as the shape of the substrate 210 and is formed flat on both sides thereof, and is located between both side surfaces of the reflecting plate 240 and the lower peripheral portion of the chassis 100.

상기 열전달체(230)는 기판(210)의 형상과 동일하게 형성된 가운데 부분은 기판의 상단과 열계면재료로 부착되고, 바람직하게는 방열본드를 사용한다.The heat transfer member 230 has a center portion formed in the same shape as that of the substrate 210, and is attached to the upper end of the substrate and a thermal interface material. Preferably, a heat radiation bond is used.

상기 열전달체(230)는 작동유체가 포함된 히트파이프가 적당한데, 기판(210)이 입체형상으로 형성되어서 LED소자간 경로가 길어져서 열저항이 증가하므로, 발생하는 열을 새시(100)로 빠르게 전달할 수 있도록 하기 위해서 히트파이프를 사용하고, 바람직하게는 평판형 히트파이프를 사용한다.The heat transfer member 230 is a heat pipe containing a working fluid is suitable, since the substrate 210 is formed in a three-dimensional shape, the path between the LED elements are long, so that the heat resistance is increased, the heat generated to the chassis 100 In order to be able to transfer quickly, a heat pipe is used, Preferably a flat heat pipe is used.

상기 기판(210)의 LED소자(220)의 개수는 두 개의 경사부(242)에 각각 2 ~ 4개, 하단평탄부(243)에 2 ~ 4개가 형성되는 것이 적당하다.The number of LED elements 220 of the substrate 210 is suitably formed in two to four on the two inclined portion 242, two to four in the lower flat portion 243.

상기 열전달체(230)는 LED소자(220)가 길이방향으로 형성된 개수와 동일하게 형성된다.The heat transfer member 230 is formed to have the same number of LED elements 220 formed in the longitudinal direction.

상기 확산커버(300)는 LED소자(220)의 빛을 분산하여 고루 퍼질 수 있도록 형성하고, 사용자의 눈부심을 방지하기 위해서 설치한다.The diffusion cover 300 is formed to spread the light of the LED device 220 evenly, and is installed to prevent glare of the user.

이하, 본 발명의 바람직한 실시예로 형성된 엘이디 조명등의 설치 및 작동방법을 설명하면 다음과 같다.Hereinafter, the installation and operation method of the LED lamp formed in a preferred embodiment of the present invention.

기판(210)을 적어도 하나의 각으로 꺾어서 형성하고, 상기 꺾인 각으로 발생하는 면에 길이방향으로 다수개의 LED소자(220)를 형성한 후에, 상기 열전달체(230)를 LED소자(220)가 장착된 기판(210)의 바로 뒷면에 부착하고, 반사판(240)을 LED소자(220)가 홀(245)에서 각각 돌출하도록 하여 기판(210)의 하부에 장착하여 제작한다.After the substrate 210 is formed by bending at least one angle, and the plurality of LED elements 220 are formed in the longitudinal direction on the surface generated at the angles of bending, the heat transfer member 230 is formed by the LED elements 220. It is attached directly to the back of the substrate 210, and the reflecting plate 240 is mounted to the lower portion of the substrate 210 so that the LED element 220 protrudes from the hole 245, respectively.

상기와 같이 종래의 평평하게 형성된 기판(210)을 플렉시블피시비로 형성하 여 적어도 한 개의 각 이상으로 꺾어서 입체적인 면으로 형성하고, 상기 각각의 면에 LED소자(220)를 형성함으로써 조명각도가 넓은 효과가 발생한다.As described above, the conventional flatly formed substrate 210 is formed into a flexible PC, and is formed into a three-dimensional surface by folding at least one or more angles, and by forming the LED elements 220 on the respective surfaces, the illumination angle is wide. Occurs.

그러나, 상기 기판(210)을 입체적으로 형성하여 LED소자(220)을 형성하기 때문에 LED소자(220) 간의 길이가 길어져서 열저항이 커지게 되는데, 이러한 열저항을 줄이기 위해서 작동유체를 포함하는 히트파이프를 열전달체(230)로 사용하여 신속하게 방열함으로써 광효율을 증가시킬 수 있다.However, since the substrate 210 is formed three-dimensionally to form the LED device 220, the length between the LED devices 220 is increased so that the thermal resistance is increased. In order to reduce the thermal resistance, the heat containing the working fluid is reduced. By using the pipe as the heat transfer member 230, the heat dissipation can be increased to increase the light efficiency.

본 발명은 첨부된 도면을 참조하여 바람직한 실시예를 중심으로 기술되었지만 당업자라면 이러한 기재로부터 후술하는 특허청구범위에 의해 포괄되는 본 발명의 범주를 벗어남이 없이 다양한 변형이 가능하다는 것은 명백하다.Although the present invention has been described with reference to the accompanying drawings, it will be apparent to those skilled in the art that various modifications may be made therein without departing from the scope of the invention, which is covered by the following claims.

도 1은 본 발명의 바람직한 실시예로 형성된 엘이디 조명등의 분리 사시도.1 is an exploded perspective view of the LED lamp formed in a preferred embodiment of the present invention.

도 2는 본 발명의 바람직한 실시예로 형성된 엘이디 조명등의 엘이디모듈의 사시도.Figure 2 is a perspective view of the LED module of the LED lamp formed in a preferred embodiment of the present invention.

도 3은 본 발명의 바람직한 실시예로 형성된 엘이디 조명등의 측단면도.Figure 3 is a side cross-sectional view of the LED lamp formed in a preferred embodiment of the present invention.

**<도면의 주요부분에 대한 부호의 설명>**** <Description of the symbols for the main parts of the drawings> **

100 : 새시 110 : 전원공급부100: chassis 110: power supply

120 : 전원기판 122 : 소켓120: power substrate 122: socket

200 : 엘이디모듈 205 : 커넥터200: LED module 205: connector

210 : 기판 220 : 엘이디210: substrate 220: LED

230 : 열전달체 240 : 반사판230: heat carrier 240: reflector

241 : 평탄부 242 : 경사부241: flat portion 242: inclined portion

243 : 하단평탄부 245 : 홀243: lower flat portion 245: hole

300 : 확산커버300: diffusion cover

Claims (6)

삭제delete 삭제delete 전원공급부(110)가 형성되고, 적어도 하나의 소켓(122)이 형성된 전원기판(120)이 형성된 새시(100)와; A chassis 100 having a power supply unit 110 formed thereon and a power substrate 120 having at least one socket 122 formed thereon; 상기 새시(100)의 하단에 양측면이 고정되는 반사판(240)이 형성되고, 상기 반사판(240)의 상면에는 하면에 적어도 하나의 LED소자(220)가 형성된 기판(210)이 형성되고, 상기 기판(210)의 상면에는 적어도 하나의 열전달체(230)가 형성되며, 상기 기판(210)의 일측에는 상단으로 커넥터(205)가 형성된 적어도 하나의 엘이디모듈(200)과; Reflecting plate 240 is fixed to both sides of the lower surface of the chassis 100 is formed, a substrate 210 having at least one LED device 220 is formed on the lower surface of the reflecting plate 240, the substrate At least one heat carrier 230 is formed on an upper surface of the 210, and at least one LED module 200 having a connector 205 formed at an upper end thereof on one side of the substrate 210; 상기 엘이디모듈(200)의 하단에 엘이디모듈(200)과 이격되도록 새시(100)와 결합되는 확산커버(300)로 구성되는 것을 특징으로 하는 엘이디 조명등.LED light, characterized in that consisting of a diffusion cover 300 coupled to the chassis 100 to be spaced apart from the LED module 200 at the bottom of the LED module 200. 삭제delete 제 3항에 있어서,The method of claim 3, wherein 상기 기판(210)의 상면에는 적어도 하나의 열전달체(230)가 형성되는데, 상기 기판(210)의 LED소자(220)가 형성된 후면에 폭방향으로 부착되고, 양측면이 평평하게 형성되어 반사판(240)의 양측과 함께 새시(100)의 하단주연부에 결합하는 것을 특징으로 하는 엘이디 조명등.At least one heat carrier 230 is formed on an upper surface of the substrate 210, and is attached to the rear surface on which the LED element 220 of the substrate 210 is formed in a width direction, and both sides are formed flat so that the reflecting plate 240 is formed. LED lights, characterized in that coupled to both sides of the lower periphery of the chassis (100). 삭제delete
KR1020090019836A 2009-03-09 2009-03-09 Led lamp KR101033521B1 (en)

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JP2013519993A (en) 2010-02-17 2013-05-30 ネクスト ライティング コーポレイション Illumination unit having an illumination strip having a light emitting element and a remote light emitting material
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KR200396825Y1 (en) 2005-07-04 2005-09-27 한국반도체(주) Lighting lamp using led
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KR20080108203A (en) * 2008-10-17 2008-12-12 최상호 Heat pipe heat dissipation LED luminaire and method
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KR200396825Y1 (en) 2005-07-04 2005-09-27 한국반도체(주) Lighting lamp using led
KR20080066635A (en) * 2008-05-15 2008-07-16 엄기인 Led lighting apparatus for openair
KR100883345B1 (en) 2008-08-08 2009-02-12 김현민 Line type led illuminating device
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