M332162 八、新型說明： 【新型所屬之技術領域】 本新型係有關一種照明裝置結構，特別是一種使用 * 發光二極體作為光源之照明裝置結構。 【先前技術】 目前，一般室内中使用照明裝置，多以曰光燈為主。 傳統的日光燈比白熾燈泡省電75%。然而，即使日光燈管 • 省電，因為含有水銀塗佈，廢棄後不可避免對環境造成影 響。所以，目前已經發展出使用發光二極體來取代傳統之 曰光燈，以做為室内照明裝置。發光二極體之壽命較一般 曰光燈長10倍，並且沒有汞污染的問題，被認為是環保光 源。 但是，其存在一個問題，即在長時間之使用下，照明 裝置的電路板上密集之發光二極體所產生之熱量將無法有 _ 效傳導出去，造成照明裝置受到積聚之熱量影響到使用品 質，使得發光二極體可能發生損毁或減低使用壽命。此外， 發光二極體之數量影響到照明裝置之照明度，在要求提高 照明度之情況下，勢必要增加發光二極體之數量，然而在 / 電路板上增加發光二極體之數量將造成更多熱量產生，所 以在先前技術中亦存在著必須要取得發光二極體數量與熱 量之間平衡點的問題。 如上所述，若能有效改善發光二極體照明裝置的散熱 情況，上述先前技術之問題也將獲得解決。 M332162 【新型内容】 、為了解決上述先前技術中發光二極體所產生之熱量 無法有效料出去而必須要取得發光二_數量與熱量之 間：衡點的問題’本新型提出一種照明裝置結構，其能 夠解決發光二極體照明裝置之散熱問題。 、—種知明I置結構’其包含—外框、—絕緣導熱 曰/複數個放熱片以及—電路板。外框具熱傳導性，並 形成谷置空間。絕緣導熱層係配置於容置空間之底 :。電路板包含複數個發光二極體以通電發光，並且穿 。又有複數個孔洞以導熱。複數個散熱片係配置於電路板 上且銜接於複數個孔洞中。電路板係配置於絕緣導埶声 之上。 …曰 當發光二極體產生熱量時，熱量將由電路板上之孔 洞傳導至散㈣，再由韻ϋ料祕料熱層，再經 由絕緣導熱層傳導至具熱傳導性之外框，有效達成散敎 目的。 …、 絲上所述，藉由本新型之技術手段，得以有效的解 决白知技藝之問題，達到照明裝置之散熱效果。 有關本新型的特徵與實作，茲配合圖示作最佳實施 例詳細說明如下。 【實施方式】 以下為本新型之一實施例。請參考「第1圖」、「第 2圖」、「第3圖」、「第4圖」、「帛5圖」以及「第6 M332162 一種照明裝置結構，包含一外框】00、一絕緣導熱 層no、一電路板120以及複數個散熱片123。 外框100具熱傳導性，並且形成一容置空間。絕緣 導熱層110係配置於容置空間之底面。電路板120包含 複數個發光一極體122以通電發光。電路板〗2〇係配置 於絕緣導熱層110之上。 電路板120上穿設有複數個孔洞121以增加導熱面 積。複數個散熱片123係配置於電路板12〇之上。每一 散熱片123具有複數個延伸管口 124。每一延伸管口〗24 銜接於電路板12〇上之每一孔洞121中。 此外本新型更包含透光罩13 0與兩個密封元件 140 〇 外框100具有一對平行溝槽101。透光罩13〇具有 一對平行延伸部131。透光罩130係利用該對平行延伸 部131銜接於外框100之平行溝槽1〇1中。 透光罩130係包覆電路板12〇。複數個發光二極體 之光線係透過透光罩13〇射出。 岔封元件140具有一對穿孔141 -，，，‘ ▲ ]卞丄叶、 为別配置於外框1〇〇盥雷 …电路板120之兩侧。電路板12( ^兩端個別具有—對電源接腳125，且該對電源接胸 .5係㈣&封疋件140之該對穿孔141伸出以連接電 源。 疋牧毛 外框100之材質為 具熱傳導性之物質，在本實施例 M332162 中是選用鋁，然其並非限定本新型之實施態樣。 外框100之外側更延伸出複數個散熱部1〇2。散熱 部102係用以增加外框100之散熱面積’以提高散埶= 果。 ’、 絕緣導熱層110在本實施例中是選用矽，具有絕緣 性與熱傳導性，然其並非限定本新型之實施態樣。 當複數個發光二極體122發光產生熱量時，熱量將 由電路板12〇上之複數個孔洞121傳導至複數個散熱片 123之延伸管口 124，再由複數個散熱片123傳導至絕 緣導熱層1.10，接著經由絕緣導熱層nG傳導至呈熱傳 導性之外框⑽’最後外框⑽再傳導至複數個散熱部 102 ’因此有效達成散熱目的。 另一方面，電路板120係為可拆卸之元件。當電路 板120故障時，可以取下修復後再裝回照明裝置中。M332162 VIII. New description: [New technical field] The present invention relates to a lighting device structure, in particular to a lighting device structure using a light-emitting diode as a light source. [Prior Art] At present, lighting devices are generally used indoors, and most of them are mainly neon lights. Traditional fluorescent lamps save 75% less energy than incandescent bulbs. However, even if the fluorescent tube is used to save electricity, it will inevitably affect the environment after being discarded because it contains mercury coating. Therefore, it has been developed to replace the conventional neon lamp with a light-emitting diode as an indoor lighting device. The lifetime of the light-emitting diode is 10 times longer than that of a general daylight lamp, and there is no problem of mercury contamination, which is considered to be an environmentally friendly light source. However, there is a problem in that the heat generated by the dense light-emitting diodes on the circuit board of the lighting device cannot be transmitted efficaciously after a long period of use, causing the lighting device to be affected by the accumulated heat. This may cause the LED to be damaged or to reduce its service life. In addition, the number of light-emitting diodes affects the illumination of the illumination device. When it is required to increase the illumination, it is necessary to increase the number of light-emitting diodes. However, increasing the number of light-emitting diodes on the / circuit board will result in More heat is generated, so there is a problem in the prior art that a balance point between the number of light-emitting diodes and heat must be obtained. As described above, if the heat dissipation of the light-emitting diode lighting device can be effectively improved, the problems of the prior art described above will also be solved. M332162 [New content] In order to solve the above-mentioned prior art, the heat generated by the light-emitting diode cannot be efficiently discharged, and it is necessary to obtain a problem between the amount of light and the amount of heat: a point of balance. The present invention proposes a lighting device structure. It can solve the heat dissipation problem of the light-emitting diode lighting device. - A kind of structure I knows that it contains - outer frame, - insulating heat conduction 曰 / a plurality of heat release sheets and - circuit boards. The outer frame is thermally conductive and forms a valley space. The insulating and thermally conductive layer is disposed at the bottom of the accommodating space: The circuit board includes a plurality of light emitting diodes for energizing and illuminating. There are also a plurality of holes to conduct heat. A plurality of heat sinks are disposed on the circuit board and are coupled to the plurality of holes. The board is placed on top of the insulated pilot. ...when the light-emitting diode generates heat, the heat will be transmitted from the hole on the circuit board to the dispersion (4), and then the thermal layer of the secret material is transferred to the heat-conducting outer frame via the insulating heat-conducting layer to effectively achieve the dispersion. Attention. ..., as described above, the technical means of the present invention can effectively solve the problem of white knowing technology and achieve the heat dissipation effect of the lighting device. The features and implementations of the present invention are described in detail below with reference to the preferred embodiment. [Embodiment] The following is an embodiment of the present invention. Please refer to "1st picture", "2nd picture", "3rd picture", "4th picture", "帛5 picture" and "6th M332162 illuminating device structure, including a frame] 00, an insulation The heat conducting layer no, a circuit board 120, and a plurality of heat sinks 123. The outer frame 100 is thermally conductive and forms an accommodating space. The insulating heat conducting layer 110 is disposed on the bottom surface of the accommodating space. The circuit board 120 includes a plurality of light emitting ones. The pole body 122 is electrically light-emitting. The circuit board is disposed on the insulating heat conductive layer 110. The circuit board 120 is provided with a plurality of holes 121 for increasing the heat transfer area. The plurality of heat sinks 123 are disposed on the circuit board 12 Each of the heat sinks 123 has a plurality of extension nozzles 124. Each of the extension nozzles 24 is connected to each of the holes 121 on the circuit board 12. The present invention further comprises a transmissive cover 130 and two The sealing member 140 has a pair of parallel grooves 101. The translucent cover 13 has a pair of parallel extending portions 131. The transmissive cover 130 is coupled to the parallel grooves 1 of the outer frame 100 by the pair of parallel extending portions 131. 〇1. The translucent cover 130 covers the circuit board 12〇. The light of the light-emitting diodes is emitted through the transparent cover 13. The sealing element 140 has a pair of perforations 141 -,,,,,,,,,,,,,,,,,,,,,,,,,, The two sides of the circuit board 12 (the two ends have a pair of power pin 125, and the pair of power supply chests. 5 series (four) & the sealing member 140 of the pair of perforations 141 extend to connect the power supply. The material of 100 is a material having thermal conductivity, and aluminum is selected in the embodiment M332162, which is not limited to the embodiment of the present invention. The outer side of the outer frame 100 further extends a plurality of heat dissipating portions 1〇2. It is used to increase the heat dissipation area of the outer frame 100 to improve the heat dissipation. The insulating heat conduction layer 110 is selected from the present embodiment and has insulation and thermal conductivity, but it does not limit the implementation of the present invention. When a plurality of light-emitting diodes 122 emit heat to generate heat, the heat is conducted from the plurality of holes 121 on the circuit board 12 to the extension nozzles 124 of the plurality of heat sinks 123, and then conducted by the plurality of heat sinks 123 to the insulation heat conduction. Layer 1.10, followed by insulation The thermal layer nG is conducted to the thermal conductive outer frame (10) and the final outer frame (10) is re-conducted to the plurality of heat dissipating portions 102', thereby effectively achieving the purpose of heat dissipation. On the other hand, the circuit board 120 is a detachable component. When the circuit board 120 In the event of a failure, the repair can be removed and replaced in the lighting unit.
藉由本新型之技術手段得以有效解決先前技術之 問題，將使用發光二極體之照明裳置的散熱問題徹底解 決’使得利用發光二極體之照明裝置可以增加發光二極 體之數量而不受到散熱因素之影響，更使得發光二極體 Γ受到積聚之熱量而受損。此外，藉由電路板之可拆卸 性’維修更加便利。 b本新型以前述之較佳實施例揭露如上 非用以限定本新型，任何熟習相像技藝者，在不脫離 新型之精神和範圍内，當可作些許之更動與潤飾，因此 9 M332162 本新型之專利保護範圍須視本說明書所附之申請專利 範圍所界定者為準。 ^ 【圖式簡單說明】 • 第1圖係為本新型之分解圖； 第2圖係為本新型之電路板底面示意圖； 第3圖係為本新型之立體圖； 第4圖係為本新型之外框表面示意圖； | 第5圖係為本新型之俯視圖；以及 第6圖係為本新型之剖面圖。 【主要元件符號說明】 100 外框 101 平行溝槽 102 散熱部 110 絕緣導熱層 120 電路板 121 孔洞 122 發光二極體 123 散熱片 124 延伸管口 125 電源接腳 130 透光罩 131 平行延伸部 140 密封元件 10 M332162 141 穿孔The technical problem of the present invention can effectively solve the problems of the prior art, and completely solve the heat dissipation problem of the illumination device using the light-emitting diodes, so that the illumination device using the light-emitting diode can increase the number of the light-emitting diodes without being subjected to The influence of the heat dissipation factor causes the light-emitting diodes to be damaged by the accumulated heat. In addition, it is more convenient to repair by the detachability of the board. The present invention is not limited to the above-described preferred embodiments, and any skilled person skilled in the art can make some modifications and retouchings without departing from the spirit and scope of the novelty. Therefore, 9 M332162 The scope of patent protection shall be subject to the definition of the scope of the patent application attached to this specification. ^ [Simple diagram of the diagram] • Figure 1 is an exploded view of the new model; Figure 2 is a schematic diagram of the bottom of the circuit board of the new type; Figure 3 is a perspective view of the new type; Figure 4 is a new type of Schematic diagram of the outer frame surface; | Figure 5 is a top view of the present invention; and Figure 6 is a cross-sectional view of the present invention. [Main component symbol description] 100 outer frame 101 parallel groove 102 heat dissipation portion 110 insulating heat conduction layer 120 circuit board 121 hole 122 light emitting diode 123 heat sink 124 extension nozzle 125 power pin 130 light transmissive cover 131 parallel extension 140 Sealing element 10 M332162 141 perforated
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