1364513 101年.02月21日按正替^頁 、發明說明： 【發明所屬之技術領域】 [0001] 本發明涉及一種照明裝置，尤其涉及一種散熱性能較穩 定之照明裝置。 【先前技術】 [0002] 目前，發光二極體（Light Emi tt ing Diode，LED)因 具光質佳及發光效率高等特性而逐漸取代螢光燈 (Fluorescent Lamp)，成為照明裝置中之發光元件， | 具體可參閱Michael S. Shur等人於文獻Proceedings of the IEEE，Vol. 93，No. 1 0 (2005年 10 月）中發 表之 “Solid-State Lighting: Toward Superior Illumination” 一文。 [0003] 發光二極體於使用過程中之穩定性容易受周圍溫度之影 響，例如，當溫度過高時，發光二極體之發光強度容易 發生衰減，從而導致其使用壽命變短。於先前技術中， 發光二極體通常安裝於電路板上，該電路板藉由散熱膠 ^ 、如銀膠等黏附於散熱裝置土並與散熱裝置熱性連接， 發光二極體發光時所發出之熱量藉由電路板、散熱膠傳 ' 導至散熱裝置上進行散熱，從而使發光二極體保持於正 常之溫度下進行工作。惟，由於散熱膠之化學及物理性 質所限，其經由長時間使用後將發生老化現象（ageing phenomenon)，即散熱膠蒸發、流失、彈性缺乏，從而 使得電路板與散熱裝置之間之連接出現鬆動。當該電路 板與該散熱裝置之間由於連接鬆動而出現空氣間隙或氣 泡時，該電路板與該散熱裝置之間之熱性連接將被破壞 09713118^^'^^ A〇101 第3頁/共13頁 1013065981-0 1364513 .101•年.02月21日梭正替换頁 ，發光二極體發出之熱量傳導至電路板上後，其難以進 一步傳導至散熱裝置上進行散熱。 [0004] 有鑒於此，提供一種散熱性能較穩定之照明裝置實為必 要。 【發明内容】 [0005] 下面將以實施例說明一種散熱性能較穩定之照明裝置。 [0006] 一種照明裝置，包括一散熱裝置、一電路板、至少一固 態光源及至少一彈性元件。該散熱裝置包括一本體及複 數個由該本體延伸出來之散熱片。該電路板設置於該散 熱裝置之本體上，並藉由散熱膠與該本體熱性連接。該 至少一固態光源設置於該電路板之遠離該本體之一側。 該至少一彈性元件與該散熱裝置及該電路板相連接，以 使該散熱裝置及該電路板分別與該散熱膠相貼合。 [0007] 相對於先前技術，該照明裝置藉由設置彈性元件連接散 熱裝置及電路板，以使該散熱裝置與該電路板藉由散熱 膠相貼合，其可保證至少一固態光源發出之熱量藉由電 路板、散熱膠傳導至散熱裝置上進行散熱，從而保障照 明裝置之發光特性。， 【實施方式】 [0008] 下面將結合圖式對本發明實施例作進一步之詳細說明。 [0009] 請參閱圖1，本發明第一實施例提供之一種照明裝置10， 其包括至少一固態光源11、一電路板13、一散熱裝置15 及至少一彈性元件17。 [0010] 該至少一固態光源11可為複數個發光二極體，且該複數 1013065981-0 09713118#單编號A〇101 第4頁/共13頁 1364513 101年.02月21日核正齊^頁 個發光二極體可為白色發光二極體或彩色發光二極體， 如紅、綠、藍發光二極體等。 [0011] 該電路板13可為陶瓷電路板、玻璃纖維（FR4)電路板，或 優選地為金屬核心電路板（Metal C〇re pcB，MCPCB)» 該至少一固態光源11設置於該電路板13上，且與該電路 板13形成電性連接。藉由外接電源，該電路板13可對該 至少一固態光源11供電，以點亮該固態光源n ^ [0012] 該散熱裝置15包括一本體150及複數個散熱片152。具體 地’該本體150呈圓柱體結構，該複數個散熱片152由該 本體150之外表面15〇a並沿著圓柱體結構之軸心方向延伸 出來。該本體150包括一第一表面i5〇b、以及一與第一表 面相對150b且遠離該至少一固態光源η之第二表面15〇c ’該外表面150a位於該第一表面i50b及該第二表面150c 之間。 [0013]該電路板13設置於該本體15〇之第一表面150b上，且可 覆蓋該第一表面150b，該本體150與該電路板13之間藉 ，由散熱膠（未標示）’如金屬相變導熱片（phase change metal alloy)、散熱膏（Thermal Grease)、導熱石夕膠 墊（Silicon Gap Filler)或係導熱絕緣膠進行黏合， 從而使該電路板13與該本體150之間形成熱性連接。工作 時，該至少一固態光源11於發光之同時散發熱量，其所 發出之熱量藉由電路板13、散熱膠傳導至散熱裝置15之 本體150上’進而藉由由本體150延伸出來之散熱片152 散發至外界。由此，該至少一固態光源u可保持於正常 之工作溫度下工作，從而有效保障其發光特性，如演色 1013065981-0 09713118#單编號A01〇l 第5頁/共13頁 1364513 101年.02月21日核正替换頁 性等。 [0014] 該至少一彈性元件17用於連接該散熱裝置15及該電路板 13。於本實施例中，該彈性元件17為螺旋彈簧（圖1示出 其數目為四個），每個螺旋彈簧17包括兩個端部170及位 於該兩個端部170之間之一彈性部172。 [0015] 該照明裝置10進一步包括一背板18，該背板18設置於該 本體150之第二表面150c上，且可覆蓋該第二表面150c 〇 [0016] 該電路板13、背板18之面積分別較該本體150沿垂直於其 轴心之橫截面大，且其分別延伸出該本體150。該電路板 13、背板18上開設分別對應於該複數個螺旋彈簧17之複 _ 數個第一通孔130，以及複數個第二通孔180。另，該電 路板13、背板18上分別設置對應於該複數個螺旋彈簧17 之複數個第一凸柱132、以及複數個第二凸柱182。 [0017] 請一起參閱圖2，拉伸該螺旋彈簧17，使其穿過該第一通 孔130及該第二通孔180，其中，該螺旋彈簧17之兩個端 # 部170分別卡扣於與其對應之第一凸柱132及第二凸柱 182上，該彈性部172位於該複數個散熱片152之間之間 隙處，且該螺旋彈簧17之彈性部172處於拉伸狀態。 [0018] 該螺旋彈簧17可對該電路板13及該本體150施加一彈性預 緊力，當該散熱膠蒸發、流失、彈性缺乏時，該螺旋彈 簧17可隨時調節該電路板13及該本體150之間之距離，使 得該電路板13與該本體150藉由該散熱膠相貼合，即該電 路板13與該本體150分別與該散熱膠緊密接觸，從而保證 _3118产單编號A0101 第6頁/共13頁 1013065981-0 1364513 101年.02月21日修正替^頁 固態光源11發出之熱量可藉由電路板13、散熱膠傳導至 該散熱裝置15上進行散熱。 [0019] 當設置於該本體150之第一表面150b上之電路板13較小 ，其未能完全或僅僅剛好覆蓋該第一表面150b時，該背 板18可被省略，作為替換方案，此時該第二通孔180可沿 著本體150之軸心方向開設於該本體150上（圖未示），該 第二凸柱182可對應設置於本體150之第二表面150c上， 當螺旋彈簧17穿過該本體150之第二通孔180，其兩個端 • 部170分別卡扣於該第一、第二凸柱132、182時，同樣 可達到使該電路板13及該本體150藉由該散熱膠相貼合目 的，且此時螺旋彈簧17之彈性部172套設於該第二通孔 180 内。 [0020] 當然，該螺旋彈簧17與該散熱裝置15亦可藉由焊接等其 他固接方式進行連接，另，該彈性元件17除了採用本實 施例之螺旋彈簧17外，還可採用其他彈性元件，如橡皮 筋、彈性夾等進行實施，並不局限於具體實施例。 [0021] 請參閱圖3，本發明第二實施例提供之一種照明裝置30， 其與本發明第一實施例提供之照明裝置10基本相同，差 別僅在於：散熱裝置35之本體350呈板狀結構，複數個散 熱片352由本體350之第二表面350c延伸出來。 [0022] 本實施例中，螺旋彈簧37之其中一端部370與該複數個散 熱片352 —起位於該本體350之同一側，其並不影響本發 明之實施，同樣可實現利用彈性元件37來連接該散熱裝 置35與該電路板33，以使該散熱裝置之本體350與該電路 隱遞^單編號A0101 1013065981-0 第7頁/共13頁 1364513 101年.02月21日梭正替换頁 板33藉由散熱膠36相貼合之目的。 [0023] 綜上所述，本發明確已符合發明專利之要件，遂依法提 出專利申請。惟，以上所述者僅為本發明之較佳實施方 式，自不能以此限制本案之申請專利範圍。舉凡熟悉本 . 案技藝之人士援依本發明之精神所作之等效修飾或變化 ，皆應涵蓋於以下申請專利範圍内。 【圖式簡單說明】 [0024] 圖1係本發明第一實施例提供之照明裝置之分解結構示意 圖 [0025] 圖2係本發明第一實施例提供之照明裝置組裝後之剖面示 意圖。 .1364513 101. On February 21st, the following is a description of the technical field of the invention. [0001] The present invention relates to a lighting device, and more particularly to a lighting device having a relatively stable heat dissipation performance. [Prior Art] [0002] At present, a light-emitting diode (LED) has gradually replaced a fluorescent lamp (Fluorescent Lamp) due to its excellent light quality and high luminous efficiency, and has become a light-emitting element in an illumination device. For more details, see "Solid-State Lighting: Toward Superior Illumination" by Michael S. Shur et al., Proceedings of the IEEE, Vol. 93, No. 10 (October 2005). [0003] The stability of the light-emitting diode during use is susceptible to ambient temperature. For example, when the temperature is too high, the light-emitting intensity of the light-emitting diode is easily attenuated, resulting in a shortened service life. In the prior art, the light-emitting diode is usually mounted on a circuit board, and the circuit board is adhered to the heat sink body by a heat-dissipating glue, such as silver glue, and is thermally connected to the heat-dissipating device, and is emitted when the light-emitting diode emits light. The heat is transferred to the heat sink by the circuit board and the heat sink to dissipate heat, so that the light emitting diode is kept at a normal temperature for operation. However, due to the chemical and physical properties of the heat-dissipating glue, the ageing phenomenon will occur after long-term use, that is, the heat-dissipating glue evaporates, loses, and lacks elasticity, so that the connection between the circuit board and the heat sink appears. Loose. When an air gap or air bubble occurs between the circuit board and the heat sink due to loose connection, the thermal connection between the circuit board and the heat sink device will be destroyed. 97713118^^'^^ A〇101 Page 3 / Total 13 pages 1013065981-0 1364513 .101•Year. On February 21st, the shuttle is replacing the page. After the heat emitted by the LED is conducted to the circuit board, it is difficult to conduct further heat to the heat sink for heat dissipation. In view of the above, it is necessary to provide a lighting device with relatively stable heat dissipation performance. SUMMARY OF THE INVENTION [0005] Hereinafter, an illumination device with relatively stable heat dissipation performance will be described by way of embodiments. A lighting device includes a heat sink, a circuit board, at least one solid state light source, and at least one elastic member. The heat sink comprises a body and a plurality of heat sinks extending from the body. The circuit board is disposed on the body of the heat dissipating device and is thermally connected to the body by a heat dissipating glue. The at least one solid state light source is disposed on a side of the circuit board away from the body. The at least one elastic component is connected to the heat dissipating device and the circuit board, so that the heat dissipating device and the circuit board respectively adhere to the heat dissipating glue. [0007] Compared with the prior art, the illuminating device is connected to the heat dissipating device and the circuit board by providing an elastic component, so that the heat dissipating device and the circuit board are adhered by the heat dissipating glue, which can ensure the heat generated by the at least one solid state light source. The heat dissipation is transmitted to the heat sink by the circuit board and the heat-dissipating glue to ensure the light-emitting characteristics of the lighting device. [Embodiment] [0008] Hereinafter, embodiments of the present invention will be further described in detail with reference to the drawings. Referring to FIG. 1 , a lighting device 10 according to a first embodiment of the present invention includes at least one solid state light source 11 , a circuit board 13 , a heat sink 15 , and at least one elastic member 17 . [0010] The at least one solid-state light source 11 may be a plurality of light-emitting diodes, and the plurality of 1013065981-0 09713118# single number A〇101 4th page/total 13 pages 1364513 101. February 21st nuclear-aligned The page light emitting diodes may be white light emitting diodes or color light emitting diodes, such as red, green, and blue light emitting diodes. [0011] The circuit board 13 can be a ceramic circuit board, a fiberglass (FR4) circuit board, or preferably a metal core circuit board (Metal C〇re pcB, MCPCB). The at least one solid state light source 11 is disposed on the circuit board. 13 and electrically connected to the circuit board 13. The circuit board 13 can supply power to the at least one solid-state light source 11 to illuminate the solid-state light source by an external power source. The heat sink 15 includes a body 150 and a plurality of heat sinks 152. Specifically, the body 150 has a cylindrical structure, and the plurality of fins 152 are extended from the outer surface 15〇a of the body 150 and along the axial direction of the cylindrical structure. The body 150 includes a first surface i5〇b, and a second surface 15〇c that is opposite to the first surface 150b and away from the at least one solid-state light source η. The outer surface 150a is located at the first surface i50b and the second surface. Between the surfaces 150c. The circuit board 13 is disposed on the first surface 150b of the body 15 and covers the first surface 150b. The body 150 and the circuit board 13 are borrowed by a heat-dissipating glue (not labeled). A phase change metal alloy, a Thermal Grease, a Silicon Gap Filler or a thermally conductive insulating adhesive is bonded to form a circuit board 13 and the body 150. Thermal connection. In operation, the at least one solid-state light source 11 emits heat while emitting light, and the heat generated by the solid-state light source 11 is transmitted to the body 150 of the heat sink 15 through the circuit board 13 and the heat-dissipating glue, and further, the heat sink extended by the body 150 152 is distributed to the outside world. Thus, the at least one solid-state light source u can be operated at a normal operating temperature, thereby effectively ensuring its illuminating characteristics, such as coloring 1013065981-0 09713118# single number A01〇l page 5 / total 13 pages 1364513 101 years. On February 21, the nuclear replacement page is replaced. [0014] The at least one elastic member 17 is used to connect the heat sink 15 and the circuit board 13. In the present embodiment, the elastic members 17 are coil springs (the number of which is shown in FIG. 1 is four), and each of the coil springs 17 includes two end portions 170 and one elastic portion between the two end portions 170. 172. [0015] The illuminating device 10 further includes a backing plate 18 disposed on the second surface 150c of the body 150 and covering the second surface 150c. [0016] The circuit board 13 and the back board 18 The area is larger than the cross section of the body 150 perpendicular to its axis, and extends out of the body 150, respectively. The circuit board 13 and the back board 18 are provided with a plurality of first through holes 130 corresponding to the plurality of coil springs 17, and a plurality of second through holes 180. In addition, a plurality of first protrusions 132 corresponding to the plurality of coil springs 17 and a plurality of second protrusions 182 are respectively disposed on the circuit board 13 and the back board 18. [0017] Referring to FIG. 2 together, the coil spring 17 is stretched through the first through hole 130 and the second through hole 180, wherein the two ends #170 of the coil spring 17 are respectively buckled. The elastic portion 172 is located at a gap between the plurality of fins 152 on the first protrusion 132 and the second protrusion 182 corresponding thereto, and the elastic portion 172 of the coil spring 17 is in a stretched state. [0018] The coil spring 17 can apply an elastic preload force to the circuit board 13 and the body 150. When the heat dissipating rubber evaporates, loses, and lacks elasticity, the coil spring 17 can adjust the circuit board 13 and the body at any time. The distance between the circuit board 13 and the body 150 is adhered by the heat dissipating glue, that is, the circuit board 13 and the body 150 are in close contact with the heat dissipating glue respectively, thereby ensuring the number _3118 production number A0101 Page 6 / 13 pages 1013065981-0 1364513 101. On February 21, the heat generated by the solid-state light source 11 can be transferred to the heat sink 15 by the circuit board 13 and the heat sink for heat dissipation. [0019] When the circuit board 13 disposed on the first surface 150b of the body 150 is small, which may not completely or just cover the first surface 150b, the back plate 18 may be omitted, as an alternative, The second through hole 180 can be disposed on the body 150 (not shown) along the axial direction of the body 150. The second protrusion 182 can be correspondingly disposed on the second surface 150c of the body 150. 17 through the second through hole 180 of the body 150, when the two end portions 170 are respectively fastened to the first and second protrusions 132 and 182, the circuit board 13 and the body 150 can also be borrowed. The heat dissipating rubber is adhered to the object, and the elastic portion 172 of the coil spring 17 is sleeved in the second through hole 180 at this time. [0020] Of course, the coil spring 17 and the heat dissipating device 15 can also be connected by other fixing methods such as welding. In addition, the elastic member 17 can adopt other elastic members in addition to the coil spring 17 of the embodiment. The implementation, such as rubber bands, elastic clips, etc., is not limited to the specific embodiment. [0021] Referring to FIG. 3, a lighting device 30 according to a second embodiment of the present invention is substantially the same as the lighting device 10 provided by the first embodiment of the present invention, except that the body 350 of the heat sink 35 has a plate shape. Structure, a plurality of fins 352 extend from the second surface 350c of the body 350. [0022] In this embodiment, one end portion 370 of the coil spring 37 and the plurality of fins 352 are located on the same side of the body 350, which does not affect the implementation of the present invention, and can also be realized by using the elastic member 37. The heat sink 35 and the circuit board 33 are connected such that the body 350 of the heat sink and the circuit are hidden. The number is A0101 1013065981-0. Page 7 / 13 pages 1364513 101. 02. 21 The plate 33 is bonded by the heat-dissipating glue 36. [0023] In summary, the present invention has indeed met the requirements of the invention patent, and the patent application is filed according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by those skilled in the art will be covered by the following claims. BRIEF DESCRIPTION OF THE DRAWINGS [0024] FIG. 1 is a schematic cross-sectional view of a lighting device according to a first embodiment of the present invention. [0025] FIG. 2 is a schematic cross-sectional view of a lighting device according to a first embodiment of the present invention. .
[0026] 圖3係本發明第二實施例提供之照明裝置之剖面示意圖。 【主要元件符號說明】 [0027] 照明裝置：10、30 [0028]背板：183 is a schematic cross-sectional view of a lighting device according to a second embodiment of the present invention. [Main component symbol description] [0027] Lighting device: 10, 30 [0028] Back plate: 18
[0029] 固態光源：11 [0030]散熱片：152、352 [0031]電路板：13、33 [0032]端部：170、370 [0033] 散熱裝置：15、35 [0034] 彈性部：172 [0035] 彈性元件：17、37 311#單编號 A0101 第8頁/共13頁 1013065981-0 1364513 [0036] 第二通孔： 180 [0037] 背板：18 [0038] 第二凸柱： 182 [0039] 第一通孔： 130 [0040] 外表面：15 0 a [0041] 第一凸柱： 132 [0042] 第一表面： 150b [0043] 本體：150 、350 [0044] 第二表面. 150c 101年.02月2Γ日修正替換頁Solid-state light source: 11 [0030] heat sink: 152, 352 [0031] circuit board: 13, 33 [0032] end: 170, 370 [0033] heat sink: 15, 35 [0034] elastic portion: 172 [0035] Elastic element: 17, 37 311# single number A0101 page 8 / total 13 page 1013065981-0 1364513 [0036] second through hole: 180 [0037] back plate: 18 [0038] second stud: 182 [0039] first through hole: 130 [0040] outer surface: 15 0 a [0041] first stud: 132 [0042] first surface: 150b [0043] body: 150, 350 [0044] second surface 150c 101 years. February 2nd 2nd revised replacement page
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