TWI351493B - - Google Patents

Description

1351493 IX. Description of the Invention: [Technical Field] The present invention relates to a design of a light-emitting diode lighting fixture, in particular to a high-power light-emitting diode lighting fixture and a heat-dissipating module thereof, which can replace an incandescent light bulb and a firefly Light source. [Prior Art] In the Kyoto Conference on Preventing Global Warming held in 1997, Japan was required to reduce its greenhouse gas emissions by 6% from 2008 to 2012, thus accounting for 2% of the energy used for people's livelihood. The above lighting power consumption, the development of its energy-saving lighting technology is extremely important. The light-emitting diode (LED) is an optoelectronic semiconductor device that emits light by applying f-voltage to excite electrons. Because of its low power consumption and long life, all countries are actively researching and developing related technologies. Most of the applications are only used in the low-power indicator range, but in recent years, the technology of high-power LEDs has flourished, the number of watts has gradually increased, and there is a tendency to replace the current traditional white-light bulb illumination, and the LEDs The luminous efficiency is expected to exceed 8G lumens per watt in the near future 'this is about six times the luminous efficiency of traditional incandescent tungsten bulbs. In order to get enough luminous flux for LED lighting equipment: Group-designed luminaires, such as LEDs designed to be assembled in a dozen or hundreds of covers, are widely used for outdoor display and lighting. SUMMARY OF THE INVENTION The technical problem to be solved by the present invention 5 1351493 However, with the development of high-power light-emitting diodes, the heat generated by them is gradually increased, making heat-dissipation technology the most important subject at present. Since the light-emitting point area of the high-power light-emitting diode forms a high-temperature hot spot, the current luminous efficiency of the high-power light-emitting diode cannot be quickly improved, and the biggest bottleneck is that it cannot effectively "dissipate heat". And when the junction temperature exceeds 120 ° C, LED performance degradation, life shortening and even burnout crisis. Therefore, the luminescent material of the high-power light-emitting diode suffers from high temperature damage, resulting in a sudden drop in luminous efficiency, which is caused by excessive temperature. If an effective heat dissipation mechanism is provided, the performance, life and products of the lighting fixture can be improved. Reliability. Accordingly, the main object of the present invention is to provide a high-power light-emitting diode lighting fixture and a heat-dissipating module for quickly and efficiently dissipating thermal energy generated by a high-power light-emitting diode. The technical means for solving the problems of the present invention provides a high-power light-emitting diode lighting fixture and a heat-dissipating module thereof, which comprise an LED heat-transfer base and at least one LED array. At least one heat pipe and one heat dissipation module. The LED heat transfer base has at least one LED arrangement surface and at least one heat pipe sleeve surface, the LED arrangement surface being located on an outer side of the LED heat transfer base. The LED array includes a plurality of LEDs, each LED being disposed on the LED configuration surface at a predetermined projection angle. The heat pipe has a heated section, a condensing section, and a conductive section connected to the heated section and the condensing section, and a working fluid is accommodated therein, and the heated section is disposed on the extension sleeve 6 1351493 LE: D heat transfer base in the heat pipe sleeve hole, the conduction section is the coffee heat transfer base money extension I (four) Qian mold (four) set in (four) tube;; condensation section. The thermal energy generated by the LED will be transmitted through the LED heat transfer base. The upper part of the LED is transferred from the top to the top of the I. From the ''one'' to the toothpick! 1 find the X hot section of the W...g, and the working fluid of the heat pipe is orbited. The base heat conduction section flows to the condensation section of the heat pipe, and is disposed on the heat pipe: the group reabsorbs the heat of the heated evaporation working fluid:: In the preferred embodiment, the heat dissipation module is For the heat sink fins: can be made by simple, casting, injection or machining, the heat pipe or a plurality of heat pipes of different sizes are combined with the heat of the heat, and the thermal stress concentration of the light-emitting diode products in the natural convection is troubled. The power of the present invention is compared with the prior art by the technical means adopted by the present invention.

The heat generated by the polar body is effectively and quickly transmitted to the material which is easy to dissipate heat, and it is dissipated to the outside world, so as to avoid the heat towel A, the singularity of the temperature, or the illuminating diode component Unstable and damaged. ...- and because of the traditional heat pipe and heat sink fins, because of its simple structure, process, group: city: easy to get,. And the use, including the room (four) Ming, street lamps, and the heat dissipation of the diodes, etc., to match the different heat dissipation forms: 1': The invention is not only in line with the novelty and progress of the patent requirements, It is also highly anticipated. DETAILED DESCRIPTION OF THE INVENTION The specific embodiments of the present invention will be further described by the following examples and accompanying drawings. [Embodiment] Referring to the first to third figures, the first figure shows a perspective view of the first embodiment of the high-power light-emitting diode lighting fixture and the heat-dissipating module thereof, and the first figure shows the high power of the present invention. A side view of a first embodiment of a light-emitting diode lighting fixture and a heat-dissipating module thereof, and a third diagram showing a perspective view of the high-power light-emitting diode and the heat-dissipating module of the present invention . The first embodiment 100 of the high-power light-emitting diode lighting fixture and the heat dissipation module thereof comprises an LED heat-transfer base, at least one LED array 2, a heat pipe 3, a heat-dissipating module 4 and a lamp cover 5. The fourth figure shows the disassembled schematic diagram of the components of the high-power light-emitting diode lighting fixture and the heat-dissipating module thereof according to the first embodiment of the present invention. The fifth circular system shows the high-power light-emitting diode lighting of the present invention. The luminaire and its heat dissipation • The first embodiment of the module removes the exploded view of the components after the lampshade, and the sixth figure shows the LED heat transfer pedestal of the high-power light-emitting diode lighting fixture and the heat-dissipating module thereof. The top view of the (four) array, the seventh figure shows the side view of the high-power light-emitting diode lighting fixture and the heat-dissipating module of the present invention after removing the lampshade, and the eighth figure shows the seventh figure. A cross-sectional view of the section 8-8. The S-Xuan LED heat transfer base has at least one LED configuration surface, a heat pipe sleeve hole 2, at least one thermal stress abutting wall structure 14, and an inner ring surface 15. The LED configuration surface π is located on the outer side of the LED heat transfer base 8 1351493. The heat pipe sleeve 12 is formed in the center of the LED heat transfer base and penetrates the top surface and the bottom surface of the LED heat transfer base, thereby forming the inner ring surface 15. The thermal stress abutting wall structure 14 includes a uniform hole 14 丨 and a communication 142. The through hole 141 is defined at a selected position inside the LED heat transfer base i, and the connecting passage 142 is connected to the heat pipe sleeve hole 12 . And the through hole 141, and the thermal stress abutting wall structure 14 is configured to allow at least one electric wire to pass therethrough.

The LED array 2 includes a plurality of LEDs 21 and a circuit board 22. The LEDs 21 are disposed on the circuit board 22, and the circuit board 22 is provided with a hollowed out region 221 such that the bottom surface of each of the LEDs 21 is flat on the LED arrangement surface u of the LED heat transfer base 1. Wherein, the LED configuration surface u is provided with a layer of heat conductive medium to fill the unevenness of the contact surface with the LEDs 21 and reduce the contact thermal resistance, and the LED heat transfer base is made of a heat dissipation material. 'The heat energy generated by the LED 21 can be quickly absorbed, conducted and dissipated.

The LED array 2 is replaceable and can replace high power and south wattage LEDs of different models. The heat officer 3 has a heat receiving section 3 - a condensing section 32 and a conducting section 33 connected to the heated section 31 and the condensing section 32, and a working fluid heat generating section 31 is disposed in the inner valley thereof. And extending through the heat pipe sleeve hole 12 of the LED heat transfer base 1, the conductive section 33 is extended by the LED heat transfer base 1. When the LED heat transfer base 丨 and the heat pipe 3 gradually heat up, the LED heat transfer is increased due to an increase in contact pressure, an increase in the contact area between the inner annular surface 15 of the LED heat transfer pedestal i and the stencil 3 The thermal stress of the pedestal 1 against the wall structure 14 causes the LED heat transfer base 1 to be slid to the heat pipe 3 of 9 1351493 and can reduce the thermal contact resistance between the LED heat transfer pedestal 1 and the heat pipe 3, In the meantime, the heat energy is transmitted. The heat dissipation module 4 is disposed in the condensation section 32 of the heat pipe 3.

When the LED 21 of the LED array 2 is energized, the thermal energy generated by the LED array 2 is conducted to the heated section 31 of the heat pipe 3 through the LED heat transfer base 1 to cause the working fluid located in the heated section 31 to be evaporated by heat. Due to the pressure differential between the heated vaporized working fluid and the liquid working fluid located in the condensing section 32, this pressure differential will rapidly push the heated vaporized working fluid to the condensing section 32 via the conducting section 33. After the thermal evaporation of the working fluid is pushed to the condensation section 32 of the heat pipe 3, the heat dissipation module 4 disposed in the condensation section 32 absorbs the thermal energy carried by the heated evaporation working fluid and dissipates it, and Cooling and condensing the heated liquid 2 into a liquid state, and cooling the condensed liquid working fluid to return to the heated section 3 by the capillary force of the capillary structure of the heat pipe 3 itself, so that the cycle is repeated and quickly and efficiently The thermal energy generated by the LED

The 粒 粒 卓 & 遮 遮 遮 * * * * * * * * * * * * * * * * * * * 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热There are a plurality of heat dissipation openings/the natural light convection of the air to dissipate the demon absorbed by the heat dissipation module 4. The button cover 5 can be connected to the heat-dissipating fish 4, which is connected to: = layout - thermal interface material 'this interface material can be a sticky liquid, a directly adhesive patch, a phase change solid or other interface The material can be passed. The lamp cover 5 can also be kept away from the heat dissipation module 4 by a predetermined distance of 10 1351493, or a fan can be added to enhance the convection of the air to accelerate the escape of thermal energy, and the outer cover of the lamp cover 5 is coated, pasted or bundled. High emissivity materials use their radiation to radiate heat directly into the distance.

And the LED heat transfer base 1 has at least one light source auxiliary structure 13 which is extended from the two sides of the LED arrangement surface u to the outer side L for focusing or diverging the [ED] The light source projected by the LEDs 21 of the array. In the embodiment, the bottom surface of the LeD2 i is flatly attached to the LED arrangement surface η, and the LED arrangement surface u is parallel to the heat=3, so that the projection direction of the light source generated by the LED 21 is perpendicular to the far heat. Officer 3 and projected around it. Alternatively, the LED 21 can be disposed on the LED heat transfer base at a predetermined projection angle by bending the bracket of the bridge, obliquely embedding the circuit board 22 on the LED arrangement surface u, and the like. The led configuration surface u is such that the light source generated by the LED 21 is projected in various directions such as obliquely downward or obliquely upward of the (four) heat transfer base 1. Please refer to the ninth to twelfth drawings. The ninth figure shows the high-light diode lighting fixture of the present invention, the second embodiment of the heat-dissipating module is removed, and the tenth figure shows the high of the present invention. The power illuminating diode, the illuminating lamp and the heat dissipating module of the second embodiment are removed from the lampshade. The eleventh figure shows the high power illuminating diode of the present invention. A side view of the second embodiment after the second embodiment is removed from the lampshade, and the twelfth figure shows a cross-sectional view of the tenth-. The structural design of a second embodiment of a high-power light-emitting diode lighting fixture and a heat-dissipating module thereof is substantially the same as (4) the first embodiment (fourth), and the components of the solid (four) are labeled with the same component number. The top surface and the bottom surface of the 1351493 δ Xuan LED heat transfer base 1 are used for arranging a plurality of heat pipes 3, that is, each heat pipe 3 is arranged in a ring array inside the LED heat transfer base 且 and each heat pipe sleeve The hole 12 is adjacent to each LED arrangement surface u, so that the thermal energy generated by the LED 21 of the LED array 2 is thermally transferred to the heated section 31 of the heat pipe 3 via the LED. Anyone familiar with the art can easily know that in the high-power light-emitting one-pole lighting fixture and the heat-dissipating module provided by the present invention, the heat pipe 3 can be ^

A variety of styles, such as a shape, a rectangle, or a flat shape, the size can be changed according to requirements and made of a material that is thermally conductive; and the heat dissipation module 4 can be in the form of a cross, a cylinder, a Korean sheet, etc. , injection or mechanical addition. fly

It can be seen from the above embodiments that the high-power light-emitting diode lighting fixture and the heat-dissipating module provided by the invention have industrial use value, and therefore the invention has met the requirements of the patent. However, the above description is only for the description of the present invention, and those skilled in the art can make other improvements according to the above description, but these changes still belong to the patent scope defined by the present invention. in. T [Simple diagram of the diagram] The first diagram _ Lin (four) high power Wei diode (four) luminaire and its heat dissipation core group of the first embodiment of the perspective view; the second diagram _ the invention of high-power light-emitting diode (four) luminaire and its thermal model A side view of an embodiment of the present invention; the third figure shows a high-power illumination of the present invention and its heat dissipation 12 1351493. The first embodiment of the module is removed from the lampshade; the fourth figure shows the high power of the present invention. Light-emitting diode lighting fixture and its heat-dissipating module - The embodiment removes the sound-removing diagram of each component after the lampshade; The fifth figure shows the first implementation of the high-power light-emitting diode lighting fixture and the heat-dissipating module thereof An exploded view of the components after removing the lampshade; • The six-figure diagram shows the top view of the LED heat transfer base of the high-power light-emitting diode lamp and its heat-dissipating module of the present invention and the LED array disposed thereon 7 is a side view showing the high-power light-emitting diode lighting fixture of the present invention and the heat-dissipating module of the first embodiment after removing the lampshade; the eighth figure is a cross-sectional view showing the section 8-8 of the seventh circle; Ninth map FIG. 10 is a perspective view showing the high-power light-emitting diode lighting fixture and the heat-dissipating module of the present invention after removing the lampshade; FIG. 11 is a side view showing the disassembling of the components after removing the lampshade; FIG. 11 is a side view showing the second embodiment of the high-power light-emitting diode lamp and the heat-dissipating module of the present invention after removing the lampshade; The second figure shows a cross-sectional view of the 12_12 section in the eleventh figure. [Main component symbol description] 100 high-power light-emitting diode lighting fixture and its heat-dissipation module 13 1351493

1 LED heat transfer base 11 LED configuration surface 12 Heat pipe sleeve hole 13 Light source auxiliary structure 14 Thermal stress abutment wall structure 141 Through hole 142 Connection channel 15 Inner ring surface 2 LED array 21 LED 22 Circuit board 221 Hollow area 3 Heat pipe 31 Heated Section 32 Condensation section 33 Conduction section 4 Heat dissipation module 5 Shade 51 Heat dissipation opening 14

Claims (1)

1351493 X. Patent application scope: 1. A high-power light-emitting diode lighting fixture and its heat-dissipating module, and including - which heat-transfer base has at least - coffee configuration and at least one thermal hole, the LED configuration The facial system is located on the side of the coffee heat transfer base; At least one heat pipe having a heat receiving section, a condensing section, and a conducting section connected to the heated section and the condensing section, and having a working fluid therein, the listening section is extended over the sleeve The conductive section extends from the heat transfer base of the heat pipe base of the LED heat transfer base, wherein the heat pipe hole is opened in the center of the LED heat transfer base and penetrates the LED heat Passing the top surface and the bottom surface of the pedestal to form an inner annular surface of the LED heat transfer base, the heat pipe sleeve hole is for arranging a heat pipe' and the LED heat transfer base has at least a 敎 stress against the wall a structure, the thermal stress abutting wall structure includes a consistent hole and a connecting channel, the through hole is formed at a selected position of the LED heat transfer base (4), the connecting channel is connected to the heat pipe sleeve hole and the through hole, when When the coffee is heated, the base and the heat pipe gradually heat up, the contact area between the inner side surface of the coffee heat transfer base and the (four) tube increases, and the thermal stress abuts against the wall structure, so that the 4 LED heat transfer base is clamped to The heat pipe can reduce the contact thermal resistance between the base and the 4 __ heat officer, and the demon The wall structure is configured to allow at least one wire to be inserted therein; the "force to the LED array" includes a plurality of coffee beans, and each of the coffee sets is disposed on the coffee configuration surface of the LED heat transfer base with a pre-sighing projection angle. Wherein the LED arrangement surface is substantially parallel to the heat pipe, and the bottom surface is flatly attached to the LED arrangement surface; a heat dissipation module is disposed in the condensation section of the heat pipe; the heat energy generated by the LED passes through the coffee The heat transfer pedestal is conducted to the heat of the continuation tube (1 segment ', so that the heat pipe of the heat pipe is heated and evaporated to the condensing section of the heat pipe through the conduction section, and the heat dissipation module disposed in the condensation section of the heat pipe is further Absorbing and dissipating the thermal energy carried by the heated working fluid. 2. The high-power light-emitting diode lighting fixture and the heat-dissipating module of the application of (4) 1 include H. The lampshade is disposed outside the hot word, the LED heat transfer base, the LED array and the heat dissipation module, and the lamp cover is provided with a plurality of heat dissipation openings adjacent to the heat dissipation module to facilitate the edge heat dissipation module. The absorbed heat can escape. 3♦如申The high-power light-emitting diode lighting fixture and the heat-dissipating module thereof, wherein the LED heat-transfer base has at least one light source auxiliary structure, the light source auxiliary structure is adjacent to the two sides of the LED configuration surface. Extending outwardly - a predetermined length to focus or dilute the light source projected by the LED of the LED array. - The high power LED lighting fixture 111351493 and its heat dissipation module according to claim 1 of the patent application scope, wherein The heat pipe sleeve hole is arranged in a selected position inside the LED heat transfer base and penetrates the top surface and the bottom surface of the LED heat transfer base for arranging a plurality of heat pipes, and each heat pipe sleeve hole is adjacent to Each of the LEDs is configured such that thermal energy generated by the LEDs of the LED array is conducted to the heated section of the heat pipe via the LED heat transfer pedestal. 5. The high-power light-emitting diode lighting fixture and the heat-dissipating module thereof according to claim 1, wherein the LED array comprises at least one circuit board, the LED is disposed on the circuit board, and the circuit The board has a hollowed out area to allow the LED to contact the LED configuration surface of the LED heat transfer base and to facilitate replacement of the LED array, and to replace different models.